JP2010147402A - Method of manufacturing electronic component, and tool for holding electronic component element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently manufacture an electronic component small in dispersion of length of a folded-back part of an external electrode from an end face to a side face of an electronic component element, thickness of an end face part and the like, and high in dimensional accuracy. <P>SOLUTION: The tool 3 for holding an electronic component element on which an adhesive layer 2 having a central part 2a thicker than peripheral parts 2b is arranged on a base member 1 is used; a solvent is supplied to the central part of the adhesive part to swell the adhesive layer to bring the thickness of the central part close to that of the peripheral part; respective one-side end faces 11a of a plurality of electronic component elements 11 are stuck to the swollen adhesive layer to hold the plurality of electronic component elements to the adhesive layer; and in that state, the other-side end faces 11b of the electronic component elements are immersed in paste (conductive paste) 15 to stick the paste to the other end faces of the electronic component elements. When the solvent is supplied to the central region of the adhesive layer to swell the adhesive layer, the adhesive layer is swollen by supplying the solvent to the central part of the adhesive layer by wiping the central part of the adhesive layer with a cloth material soaked with the solvent. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing an electronic component and an electronic component element holding jig used therefor, and more specifically, formed by applying a conductive paste for forming an external electrode to an end portion of the electronic component element and baking it. The present invention relates to a method for manufacturing an electronic component provided with external electrodes and an electronic component element holding jig used therefor.

  For example, like the chip type multilayer ceramic capacitor shown in FIG. 9, the internal electrodes 12a and 12b led out to the end faces 11a and 11b are provided at both ends of the electronic component element (capacitor element) 11 having the internal electrodes 12a and 12b. Chip-type electronic components having a structure in which external electrodes 13a and 13b are disposed so as to be electrically connected to each other are widely used.

By the way, as a method of forming an external electrode in the process of manufacturing such a chip-type electronic component, an adhesive member (silicone) supported by a base member 21 is used as shown in FIGS. One end face 11a of the electronic component element 11 is attached to and held on the rubber (20) (FIG. 10A), and the other end face 11b of the electronic component element 11 is immersed in the conductive paste 15 (FIG. 10B). A method of applying the conductive paste 15 to the other end surface 11b of the electronic component element 11 (FIG. 10C) is widely known (see Patent Document 1). Although not particularly illustrated, after the conductive paste 15 applied to the other end surface 11b of the electronic component element 11 is dried, the other end surface 11b side of the electronic component element 11 is attached to an adhesive member and held, and the above-described method is performed. In the same manner, the conductive paste is also applied to the opposite end face (one end face 11a).
In addition, the adhesive member which affixes the other end surface 11b side of the electronic component element 11 may be another prepared adhesive member, and the conductive paste 15 is applied to the other end surface 11b of the electronic component element 11 as described above. After applying, the electronic component element may be removed, and the other end face 11b may be attached to the same adhesive member.

  However, in the case of the conventional method described above, the other end surface 11b is immersed in the conductive paste 15 for the external electrode while the one end surface 11a of the electronic component element 11 is adhered and held by the adhesive member (silicone rubber) 20, for example. Then, in the step of drying, the adhesive member 20 absorbs the solvent that volatilizes from the conductive paste 15 and swells (see FIG. 11), and the thickness increases.

  In particular, since electronic component elements are densely arranged in the central portion 20a of the adhesive member (silicone rubber) 20, the central portion 20a of the adhesive member 20 absorbs much solvent and becomes thick.

As a result, when the electronic component element is immersed in the conductive paste and the conductive paste is applied, the immersion depth of the electronic component element held in the central portion of the adhesive member in the conductive paste is long, The immersion time is also increased. Therefore, when compared with an electronic component element that is held at the peripheral edge of the adhesive member and applied with a conductive paste, for example, referring to FIG. 9, from the end surfaces 11a and 11b of the electronic component element 11 to the side surface, The length L of the wraparound portions (folded portions) 13a1 and 13b1 of the external electrodes 13a and 13b is increased, and the thickness T of the portions (end surface portions) 13a2 and 13b2 applied to the end surfaces 11a and 11b is increased. As a result, there is a problem that variations in the dimensions of the electronic parts themselves and the external electrodes become large.
JP 2007-266208 A

  The present invention solves the above-mentioned problem, and applies a conductive paste for forming an external electrode to an end portion of an electronic component element, and forms a side surface from the end surface of the electronic component element of an external electrode formed through a firing process. An electronic component manufacturing method and an electronic component element holding jig used for the electronic component manufacturing method capable of efficiently manufacturing an electronic component with high dimensional accuracy with a small variation in the length of the folded portion and the thickness of the end surface portion. The purpose is to do.

In order to solve the above problems, a method for manufacturing an electronic component of the present invention includes:
A first step of preparing an electronic component element holding jig in which an adhesive layer made of an adhesive elastic material having a thickness of a central portion thinner than a thickness of a peripheral portion on a base member;
Supplying a solvent to the central portion of the adhesive layer, swelling the adhesive layer, and bringing the thickness of the central portion closer to the thickness of the peripheral portion; and
A third step of adhering one end face of a plurality of electronic component elements to the swollen adhesive layer and holding the plurality of electronic component elements on the adhesive layer;
And a fourth step of immersing the other end face of the electronic component element in a paste and attaching the paste to the other end face.

  Further, in the second step, a solvent is supplied to the central region of the adhesive layer, and when the adhesive layer is swollen, by wiping the central portion of the adhesive layer with a cloth material containing the solvent, A solvent is supplied to the central portion of the adhesive layer to swell.

  Further, the paste is a conductive paste containing an organic solvent.

  The method further comprises a step of drying the paste attached to the other end surface of the electronic component element while the one end surface of the electronic component element is adhered and held on the adhesive layer.

  Further, the adhesive elastic material constituting the adhesive layer is an adhesive rubber.

The electronic component element holding jig of the present invention is
An electronic component element holding jig in which an adhesive layer made of an adhesive elastic material is formed on a base member,
The thickness of the central portion of the adhesive layer is smaller than the thickness of the peripheral portion, and the thickness of the central portion can be made close to the thickness of the peripheral portion by supplying a solvent to swell. Yes.

  Moreover, the thickness of the center part of the said adhesion layer is 30-50 micrometers thinner than the thickness of a peripheral part, It is characterized by the above-mentioned.

  Further, the adhesive elastic material constituting the adhesive layer is an adhesive rubber.

  The method of manufacturing an electronic component according to the present invention provides an electronic component element holding jig in which an adhesive layer made of an adhesive elastic material having a central portion thinner than a peripheral portion is disposed on a base member. The solvent is supplied to the central part of the adhesive layer, the adhesive layer is swollen, the thickness of the central part is brought close to the thickness of the peripheral part, and one end face of each of the plurality of electronic component elements is brought into the swollen adhesive layer In this state, the other end face of the electronic component element is immersed in the paste, and the paste is attached to the other end face of the electronic component element. Therefore, since the thickness of the central portion of the adhesive layer is close to the thickness of the peripheral portion and becomes substantially flat, the height positions of the end surfaces immersed in the paste of each electronic component element held in the adhesive layer are substantially the same. Can be.

  Therefore, it is possible to efficiently manufacture an electronic component with a high dimensional accuracy of the external electrode with small dimensional variations such as the length of the folded portion of the external electrode from the end surface to the side surface of the electronic component element and the thickness of the end surface portion. Become.

  In the present invention, to make the thickness of the central part close to the thickness of the peripheral part, the thickness of the central part of the adhesive layer is made close to the thickness of the peripheral part regardless of whether it is smaller or larger than the thickness of the peripheral part. It is a concept that means that.

  In the present invention, when the solvent is supplied to the central region of the adhesive layer and the adhesive layer is swollen, the central portion of the adhesive layer is efficiently swollen by wiping the central portion of the adhesive layer with a cloth containing a solvent. This makes it possible to clean the adhesive layer, which is desirable.

  Further, when a conductive paste containing an organic solvent is used as the paste, external electrodes can be efficiently formed on the electronic component element.

  In addition, when the paste attached to the other end surface of the electronic component element is dried with the one end surface of the electronic component element being adhered and held on the adhesive layer, the second electronic component element holding jig is left as it is after the paste is dried. Thus, the electronic component element is transferred to the end surface, and the paste can be efficiently applied to the end surface to which the paste has not yet been applied, and the present invention can be implemented more effectively.

  Further, when an adhesive rubber is used as the adhesive elastic material constituting the adhesive layer, it is possible to reliably hold the electronic component element without preparing a special material, which is meaningful.

  Moreover, the electronic component element holding jig of the present invention is obtained by forming an adhesive layer made of an adhesive elastic material on a base member, and making the thickness of the central portion of the adhesive layer thinner than the thickness of the peripheral portion. Since the thickness of the central part can be brought close to the thickness of the peripheral part by supplying the solvent and swelling, the external electrode can be suitably used in the method of manufacturing the electronic component of the present invention. Thus, it is possible to efficiently manufacture an electronic component having a high dimensional accuracy of the external electrode with small variations such as the length of the folded portion from the end surface to the side surface of the electronic component element and the thickness of the end surface portion.

  In addition, by making the thickness of the central portion of the adhesive layer 30 to 50 μm thinner than the thickness of the peripheral portion, when the solvent is supplied, the adhesive layer can be made almost flat, and the present invention is It can be more effective.

  Further, when an adhesive rubber is used as the adhesive elastic material constituting the adhesive layer, the holding member of the present invention can be formed without preparing a special material, which is meaningful.

  Hereinafter, the features of the present invention will be described in more detail with reference to examples of the present invention.

In this embodiment, both ends of an electronic component element (capacitor element) 11 having internal electrodes 12a and 12b shown in FIG. 9 are electrically connected to the internal electrodes 12a and 12b drawn to the end faces 11a and 11b. A case where a multilayer ceramic capacitor having a structure in which the external electrodes 13a and 13b are disposed will be described as an example.
The dimensions of the electronic component element 11 are 0.4 mm in length, 0.2 mm in width, and 0.2 mm in thickness. However, the present invention can be sufficiently applied to a material having a length of 1.0 mm, a width of 0.5 mm, a thickness of 0.5 mm, or more.

  First, as an electronic component element holding jig used when applying a conductive paste for external electrodes to the electronic component element 11, the thickness of the central portion 2a is set on the metal base member 1 as shown in FIG. An electronic component element holding jig (first holding jig) 3 provided with an adhesive layer 2 made of an adhesive elastic material that is thinner than the thickness of the portion 2b is prepared.

In this embodiment, a metal plate is used as the base member 1. Further, a sheet-like material made of silicone rubber was used as the adhesive layer 2.
An adhesive layer with a thinner central part than the peripheral part should be made by molding using a mold corresponding to the shape and dimensions of the adhesive layer with a thinner central part, or by adjusting the molding conditions of rubber. Can do.

Then, the central portion 2 a of the adhesive layer 2 is wiped with a cloth material (not shown) containing a solvent, and the solvent is supplied to the central portion 2 a of the adhesive layer 2.
Thereby, as shown in FIG. 2, the center 2a part of the adhesive layer 2 supplied with the solvent swells, the thickness of the central part 2a approaches the thickness of the peripheral edge part 2b, and the entire adhesive layer 2 has substantially the same thickness. It becomes the flat shape which has. At this time, the surface of the pressure-sensitive adhesive layer 2 is cleaned with the cloth material.

  In this state, as shown in FIG. 3, the one end surface 11 a of each of the plurality of electronic component elements 11 is adhered to the adhesive layer 2 of the electronic component element holding jig 3, thereby the plurality of electronic component elements. 11 is held in the adhesive layer 2.

Then, as shown in FIG. 4, the other end surface 11b of the electronic component element 11 is immersed in the conductive paste 15 for forming the external electrode, and the conductive paste 15 is attached to the other end surface 11b.
At this time, since the thickness of the central portion 2a of the adhesive layer 2 is substantially the same as the thickness of the peripheral edge portion 2b, the adhesive layer 2 becomes flat, and the other of the electronic component elements 11 immersed in the conductive paste 15 The positions of the end surfaces 11b in the height direction are substantially the same, and each electronic component element 11 can be immersed in the conductive paste 15 by the same depth.

  Next, the electronic component element 11 is pulled up (FIG. 5), and the conductive paste 15 applied to the other end surface 11b of the electronic component element 11 is adhered and held on the adhesive layer 2 on the one end surface 11a of the electronic component element 11. dry.

  Then, the second end surface 11b to which the conductive paste 15 of the electronic component element 11 is applied has a second adhesive layer having a stronger adhesive force than the adhesive layer 2 (adhesive layer of the first holding jig 3) 2 made of silicone rubber. By pressing against the adhesive layer 32 of the holding jig 33 (FIG. 6), the first holding jig 3 is transferred to the second holding jig 33 (FIG. 6).

  As the second holding jig 33, as in the first holding jig 3, the central portion 32a is made of silicone rubber on the metal base member 31, the thickness of the central portion 32a being smaller than the thickness of the peripheral portion 32b. An electronic component element holding jig 33 provided with an adhesive layer 32 was used. Then, the central portion 32a of the adhesive layer 32 is wiped with a cloth material (not shown) containing a solvent, and the solvent is supplied to the central portion 32a of the adhesive layer 32 to swell the central portion 32a of the adhesive layer 32. Thus, the thickness of the central portion 32a was made substantially the same as the thickness of the peripheral edge portion 32b so that the entire adhesive layer 32 had a flat shape having substantially the same thickness, and the surface of the adhesive layer 32 was cleaned. In this state, the electronic component element 11 was transferred from the first holding jig 3 to the second holding jig 33.

  At this time, since the adhesive layer 2 of the first holding jig 3 and the adhesive layer 32 of the second holding jig 33 are both flat, each electronic component element 11 held by the adhesive layer 2 Since the electronic component element 11 is pressed against the layer 32 with a substantially equal pressing force, the electronic component element 11 is applied to the adhesive layer 32 of the second holding jig 33 having a higher adhesive force than the adhesive layer 2 of the first holding jig 3. Can be transferred reliably.

  Then, as shown in FIG. 7, the one end surface 11a of the electronic component element 11 is immersed in the conductive paste 15 for forming an external electrode, and the conductive paste 15 is attached to the one end surface 11a.

  At this time, since the thickness of the central portion 32a of the adhesive layer 32 is substantially the same as the thickness of the peripheral edge portion 32b and the adhesive layer 32 is flat, one end face 11a of each electronic component element 11 immersed in the conductive paste 15 is used. Accordingly, the electronic component elements 11 are immersed in the conductive paste 15 by the same depth.

Then, the electronic component element 11 is pulled up (FIG. 8), and the conductive paste 15 applied to the one end face 11a is dried, followed by degreasing and firing.
Thereby, the length L (refer FIG. 9) of the folding | returning part 13a1, 13b1 from the one end surface 11a of the electronic component element 11, and the end surface 11b to the side surface of the external electrodes 13a, 13b, and the thickness T (see FIG. 9) Thus, a multilayer ceramic capacitor with high dimensional accuracy of the external electrodes 13a and 13b could be efficiently manufactured.

  In the case of the conventional method, the variation per application of the length L of the folded portions 13a1 and 13b1 of the external electrodes 13a and 13b is 3σ, and per application of the thickness T of the end face portions 13a2 and 13b2. In contrast, according to the present invention, the variation per length L of the folded portions 13a1 and 13b1 of the external electrodes 13a and 13b is 6σ and the thicknesses of the end face portions 13a2 and 13b2. The variation per application of T could be 3σ.

  In the above-described embodiment, the case where the multilayer ceramic capacitor is manufactured has been described as an example. However, the present invention is not limited to the multilayer ceramic capacitor, and various electronic components including external electrodes at the end of the element are manufactured. It can be widely applied to.

  Moreover, in the said Example, although the case where an electronic component element holding jig was used when apply | coating a conductive paste was demonstrated as an example, the electronic component element holding jig of this invention is a case where a conductive paste is apply | coated. The present invention is not limited to this, and can be applied when various pastes such as ceramic paste, resistance paste, and magnetic paste are applied to the electronic component element.

  Moreover, in the said Example, although silicone rubber is used as an adhesive elastic material which comprises an adhesion layer, it is also possible to use another material.

  The present invention is not limited to the above embodiments in other points, and various applications and modifications can be made within the scope of the invention.

It is a figure which shows the structure of the electronic component element holding jig concerning the Example of this invention. It is a figure which supplies the solvent to the adhesion layer which comprises the electronic component element holding jig of FIG. 1, swells, and shows the state which brought the thickness of the center part close to the thickness of a peripheral part. It is a figure which shows the state which carried out adhesion holding of the one end surface of an electronic component element to the adhesion layer of the electronic component element holding jig of FIG. It is a figure which shows the state which immersed the other end surface of the electronic component element in the electrically conductive paste in the state which carried out adhesion holding of the one end surface of the electronic component element to the adhesion layer of the electronic component element holding jig. It is a figure which shows the state which pulled up the electronic component element from the electrically conductive paste, after immersing the other end surface of an electronic component element in the electrically conductive paste. It is a figure which shows the state which, after drying the apply | coated electrically conductive paste, pressed and transferred the end surface (other end surface) to which the electrically conductive paste was applied to the adhesion layer of the 2nd holding jig. It is a figure which shows the state which immersed the one end surface of the electronic component element in the electrically conductive paste. It is a figure which shows the state which pulled up the electronic component element from the electrically conductive paste, after immersing the one end surface of an electronic component element in the electrically conductive paste. It is a figure which shows the electronic component (multilayer ceramic capacitor) manufactured by the method of this invention. It is a figure which shows the application | coating method of the conventional electrically conductive paste. It is a figure explaining the problem of a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base member 2 Adhesive layer 2a Center part of adhesive layer 2b Peripheral part of adhesive layer 3 Electronic component element holding jig (1st holding jig)
11 Electronic component elements (capacitor elements)
11a One end surface of electronic component element 11b Other end surface of electronic component element 12a, 12b Internal electrode 13a, 13b External electrode 13a1, 13b1 Folded portion to side surface 13a2, 13b2 End surface portion 15 Conductive paste 31 Base member 32 Second holding jig Adhesive layer 32a central portion of adhesive layer 32b of second holding jig 32b peripheral edge portion of adhesive layer of second holding jig 33 second holding jig L length of portion folded back to side surface T of end surface portion Thickness

Claims (8)

A first step of preparing an electronic component element holding jig in which an adhesive layer made of an adhesive elastic material having a thickness of a central portion thinner than a thickness of a peripheral portion on a base member;
Supplying a solvent to the central portion of the adhesive layer, swelling the adhesive layer, and bringing the thickness of the central portion closer to the thickness of the peripheral portion; and
A third step of adhering one end face of a plurality of electronic component elements to the swollen adhesive layer and holding the plurality of electronic component elements on the adhesive layer;
And a fourth step of immersing the other end face of the electronic component element in a paste and adhering the paste to the other end face.   In the second step, the solvent is supplied to the central region of the adhesive layer, and the adhesive layer is swollen by wiping the central portion of the adhesive layer with a cloth material containing the solvent. 2. The method of manufacturing an electronic component according to claim 1, wherein a solvent is supplied to the center of the layer to swell.   3. The method of manufacturing an electronic component according to claim 1, wherein the paste is a conductive paste containing an organic solvent.   4. The method according to claim 1, further comprising a step of drying the paste attached to the other end surface of the electronic component element while the one end surface of the electronic component element is adhered and held on the adhesive layer. Manufacturing method for electronic parts.   The method for producing an electronic component according to claim 1, wherein the adhesive elastic material constituting the adhesive layer is an adhesive rubber. An electronic component element holding jig in which an adhesive layer made of an adhesive elastic material is formed on a base member,
The thickness of the central portion of the adhesive layer is smaller than the thickness of the peripheral portion, and the thickness of the central portion can be made close to the thickness of the peripheral portion by supplying a solvent to swell. Electronic component element holding jig.   The thickness of the center part of the said adhesion layer is 30-50 micrometers thinner than the thickness of a peripheral part, The electronic component element holding jig of Claim 6 characterized by the above-mentioned.   The electronic component element holding jig according to claim 6 or 7, wherein the adhesive elastic material constituting the adhesive layer is an adhesive rubber.

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