JP2006351482A - Connecting element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connecting element which improves the ruggedness of a conductor, offers low load and stable electrical resistance characteristics, and minimizes the conductor breakage. <P>SOLUTION: The connecting element comprises an intermediary layer 13 which is arranged on a substrate 11 and is made up of a sticky material or an adhesive, a reinforcing film 15 arranged on this intermediary layer 13, and a conductor 17 arranged on this reinforcing film 15. In connection with these connecting objects, the conductor 17 is depressed with an elastic force that the intermediary layer 13 has. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a connection member that is mechanically connected to a connection object.

  As a conventional technique, the conductor pattern is brought into contact with the wiring to be connected to the wiring board to connect the wiring, and the exposed portion of the adhesive adheres to the board surface of the wiring board and is mechanically coupled. Structured connectors are known.

  The conductive pattern is formed by forming a metal thin film on a mold having a convex portion corresponding to the arrangement, and bringing one surface of the base material into close contact with the metal thin film on the convex portion, and then pulling up the metal thin film on the convex portion. Is formed by being transferred onto the adhesive (see, for example, Patent Document 1).

  As a conventional technique, there is known a thermocompression bonding connecting member made of a base material formed on one side of a conductive line in which a connection portion with a circuit board to be connected is covered with an adhesive film.

  In the thermocompression bonding member, a reinforcing agent is applied and formed on a portion of the surface opposite to the surface on which the conductive line is formed, which is not involved in the connection with the circuit board to be connected (see, for example, Patent Document 2).

JP 2001-210933 A Japanese Utility Model Publication No. 6-13061

  In the connector in Patent Document 1, when the adhesive is deformed due to the adhesion of the adhesive and its deformation amount or due to an external force, the metal thin film that is the conductor pattern is easily disconnected, so that the durability of the conductor pattern is inferior. There's a problem.

  Moreover, in the connector in patent document 1, since a contact part is thick, in order to stabilize resistance value, there exists a problem that the load more than 0.2N (Newton) / core is required.

  Furthermore, since the reinforcing agent of the thermocompression bonding member in Patent Document 2 is on the base material, there is a problem that when the adhesive material is deformed, the conductor line is also deformed.

  Therefore, an object of the present invention is to provide a connection member that can improve the durability of the conductor, has a stable electrical resistance characteristic at a low load, and is difficult to break the conductor, and a method for manufacturing the connection member. .

  The present invention relates to a connection member connected to a connection object, a base material, a mediator layer made of an adhesive or an adhesive disposed on the base material, and a reinforcement disposed on the mediator layer. A film and a conductor disposed on the reinforcing film, and the conductor is pressed by the elastic force of the mediator layer when connected to the connection object, and the connection object The main feature is that the connecting member is characterized in that it is connected in a mechanical manner.

  Moreover, the present invention excludes the step of forming a metal thin film on the reinforcing film, the step of forming a wiring pattern on the metal thin film, and the reinforcing film on which the wiring pattern is formed, in the method for manufacturing a connection member A step of removing the reinforcing film, and a step of fixing the reinforcing film processed by the processing step to a mediator layer made of an adhesive or an adhesive disposed on the substrate. The main feature is that it is a method of manufacturing a connecting member.

  According to the connecting member of the present invention, since the conductor is fixed to the reinforcing film and the reinforcing film is not easily stretched even when the mediator layer is deformed, the durability of the conductor is improved even if the conductor is a thin film. There is an advantage of doing.

  According to the connection member of the present invention, since the thin conductor has durability and the conductor adapts to the connection object, specifically, the conductor does not break even at a low load of 0.02 N (Newton). Since the contact resistance can be made almost zero by taking a large area of the contact surface, it has a stable electric resistance characteristic at a low load.

  Further, according to the connection member of the present invention, since the conductor is fixed on the reinforcing film that is difficult to stretch, there is an advantage that the conductor is hardly broken even when the mediator layer is deformed.

  In addition, according to the method for manufacturing a connection member of the present invention, by selecting a material that can be easily processed for the reinforcing film, only the reinforcing film is removed without damaging the conductor and changing the dimensions of the wiring pattern. In addition, the mediator layer can be easily moved between the wiring patterns at the time of connection by pressing, and can be fixed to the connection object.

  Furthermore, according to the method for manufacturing a connection member of the present invention, the conductor is fixed to the reinforcing film, and even if the mediator layer is deformed, the reinforcing film is not easily stretched, so that the durability of the conductor is improved.

  The connecting member of the present invention is a connecting member for connecting to a connection object, a base material, a mediator layer made of an adhesive or an adhesive disposed on the base material, and disposed on the mediator layer. And a conductor disposed on the reinforcement film, the conductor being pressed by the elastic force of the mediator layer when connected to the connection object, the connection object Realized by being electrically connected to the object.

  The method for manufacturing a connecting member according to the present invention includes a step of forming a metal thin film on a reinforcing film, a step of forming a wiring pattern on the metal thin film, and the wiring pattern being formed in the method of manufacturing a connecting member. A processing step of removing the reinforcing film excluding the reinforcing film, and a step of fixing the reinforcing film processed by the processing step to a mediator layer made of an adhesive or an adhesive disposed on the substrate. It was realized by that.

  Hereinafter, Embodiment 1 of the connecting member according to the present invention will be described with reference to the drawings. FIG. 1 shows a connecting member in the first embodiment.

  Referring to FIG. 1, the connecting member includes a base material 11, a mediator layer 13 disposed on the base material 11, a reinforcing film 15 disposed on the mediator layer 13, and a reinforcing film. 15 and a conductor 17 disposed on the substrate 15.

  The base material 11 is a film having flexibility and insulation. The mediator layer 13 is an adhesive layer having elasticity using an adhesive. The reinforcing film 15 is a metal thin film. The conductor 17 is a conductive foil made of a metal alloy. The conductor 17 is a part connected to the connection object.

  The substrate 11 and the reinforcing film 15 are attached to each other by the adhesive force of the adhesive as the mediator layer 13. On the mediating agent layer 13, each of the reinforcing film 15 and the conductor 17 disposed on the reinforcing film 15 has a strip shape that is long in one direction. The reinforcing film 15 and each of the conductors 17 disposed on the reinforcing film 15 are arranged in parallel at intervals in a direction perpendicular to one direction. The conductor 17 serves as a wiring pattern, an electrode, a terminal, or the like that contacts a connection target (not shown).

  Further, each of the reinforcing film 15 and the conductor 17 disposed on the reinforcing film 15 is patterned inwardly with the reinforcing film 15 and the conductor 17 positioned on both sides in the width direction orthogonal to one direction. The plurality of reinforcing films 15 and the conductor 17 on the reinforcing film 15 have a width dimension larger than the dimension in the width direction.

  Furthermore, specifically, in Example 1, the mediator layer 13 is a pressure-sensitive adhesive layer having a layer thickness dimension of 20 μm or more. The thickness dimension of the reinforcing film 15 is 10 μm or less. The conductor 17 is a copper foil having a film thickness dimension of 10 μm or less. The adhesion strength between the reinforcing film 15 and the conductor 17 is set larger than the adhesion strength between the reinforcing film 15 and the mediator layer 13.

  The mediator layer 13 can be an adhesive layer that bonds the base material 11 and the reinforcing film 15 by adhesion. Even when the mediator layer 13 is an adhesive layer, the thickness dimension of the layer is set to 20 μm or more. At this time, the thickness dimension of the reinforcing film 15 is 10 μm or less. The conductor 17 is a copper foil having a film thickness dimension of 10 μm or less. The adhesion strength between the reinforcing film 15 and the conductor 17 is set larger than the adhesion strength between the reinforcing film 15 and the mediator layer 13.

  Here, the above-mentioned adhesive refers to a state in which the adhesive can be repeatedly pasted by mediating an adhesive and pressing the workpiece (connection object) at room temperature. The term “adhesion” refers to a state in which two surfaces are bonded by a chemical or physical force or a chemical and physical force through an adhesive.

  When the conductor 17 is connected to the connection object, it is mechanically held and fixed to the connection object by the mediator layer 13. As an example, the connection member bends the central portion in one direction in a substantially U shape with the conductor 17 on the outside, and provides workpieces on the inside of the bent portion, so that both end portions of the conductor 17 are different connection objects. They can be connected by pressing each other.

  When the mediator layer 13 is pressed between the base material 11 and the conductor 17, it appears on the surface of the connected portion of the connection object from between the conductor 15 and the reinforcing film 15. At this time, the mediator layer 13 that appears so as to face the surface of the connected portion of the connection object is mechanically connected to the connection object.

  The conductor 17 can be fixed on the reinforcing film 15 by sputtering, electroless plating, vapor deposition, electrolytic plating, or the like. Further, when the conductor 17 is a rolled copper foil or an electrolytic copper foil, it can be fixed to the reinforcing film 15 via a binder by heating. Furthermore, when the conductor 17 is a rolled copper foil or an electrolytic copper foil, it can be fixed to the reinforcing film 15 via a binder without heating. Furthermore, when the conductor 17 is rolled copper foil or electrolytic copper foil, it can be fixed to the reinforcing film 15 by lamination or the like without using a binder.

FIG. 2 shows an example in which, on the conductor 15 shown in FIG. 1, the conductors 15 on both sides orthogonal to one direction are peeled off and the reinforcing film 15 is exposed on both sides orthogonal to one direction. The conductor 15 on both sides is peeled off, and the surface of the reinforcing film 15 becomes a peeling allowance for exposing the reinforcing film.

  Below, the manufacturing method of a connection member is demonstrated. FIG. 3A to FIG. 7 show each step in the method for manufacturing the connection member.

  In the manufacturing method of the connecting member, as shown in FIG. 3 (A), the metal thin film 17a is formed on the reinforcing film 15 by sputtering as shown in FIG. 3 (B) as the first step. As shown in C), the metal thin film 17b is thickened on the metal thin film 17a by plating.

  As shown in FIG. 4A, the metal thin films 17a and 17b are etched to form a wiring pattern shape as shown in FIG. 4A. Then, as shown in FIG. The body 17 is assumed.

  Next, as shown in FIG. 4C, a hole 19 is formed by drilling the exposed portion of the reinforcing film 15 where the wiring pattern is not formed as the next step. At this time, as the reinforcing film 15, a film material having a laser absorption efficiency of 20% or more in a certain region having a wavelength of 1000 nm or more is adopted, and a wiring pattern composed of the reinforcing film 15 and the conductor 17 by the laser having a wavelength of 1000 nm or more. The holes 19 are formed by performing the hole processing between them from the surface of the conductor 17.

  Therefore, the conductor 17 is damaged by using a laser having a wavelength of 1000 nm or more with poor absorption efficiency (nearly zero) to the metal and using a material that can be easily processed (eased to absorb) for the reinforcing film 15. In addition, only the reinforcing film can be removed without changing the dimension of the wiring pattern.

  Then, as shown in FIG. 5A, the reinforcing film 15 processed by perforation is fixed to the mediator layer 13 disposed on the substrate 11 as the next step. Further, as shown in FIG. 5 (B) as a next process, a part of the outer shape indicated by the dotted line p in FIG. 5 (B) after attaching the release film 31 so as to cover the conductor 17 and the hole 19. And then the release film 31 is peeled off to complete the connecting member shown in FIG.

  In addition, when the thickness of the reinforcing film 15 and the conductor 17 formed in the steps of FIGS. 4A and 4B is thin and weak, the reinforcing film 15 and the conductor 17 are simultaneously punched, In the process shown in FIG. 4C to the process shown in FIG. 5A, handling may be facilitated.

  At this time, in the step of FIG. 4 (C) in which the hole 19 is formed from the step of FIG. 4 (B) to form the conductor 17 by plating the wiring pattern, the metal thin film side is formed. A reinforcing member is attached, and the reinforcing film 15 and the conductor 17 are simultaneously punched.

  The connection member and the method for manufacturing the connection member according to the present invention can also be applied to uses such as a wiring member, a connector, a flexible wiring board, and an anisotropic conductive member that connect objects to be connected.

It is a perspective view which shows Example 1 of the connection member which concerns on this invention. It is a perspective view which shows the connection member which concerns on this invention. It is process drawing for demonstrating the manufacturing method of the connection member which concerns on this invention, (A) is a perspective view which shows a reinforcement film, (B) is a perspective view which shows the state which fixed the metal thin film to the reinforcement film, ( C) is a perspective view showing a state in which the plating is thickened. It is process drawing for demonstrating the manufacturing method of the connection member which concerns on this invention, (A) is a perspective view which shows the process of setting the metal thin film on a reinforcement film as a wiring pattern, (B) is plating on a wiring pattern. The perspective view which shows the process to perform, (C) is a perspective view which shows the process of forming a hole in a reinforcement member from the process of (B). It is process drawing for demonstrating the manufacturing method of the connection member which concerns on this invention, (A) is a perspective view which shows the process of adhering a reinforcement film to a mediator layer from the process of FIG.4 (C), (B) is ( It is a perspective view which shows the state before sticking a peeling film and cutting an external shape as the next process of A).

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Base material 13 Mediator layer 15 Reinforcing film 17 Conductor

Claims (2)

  In a connection member connected to an object to be connected, a base material, a mediator layer made of an adhesive or an adhesive disposed on the base material, a reinforcing film disposed on the mediator layer, A conductor disposed on the reinforcing film, and the conductor is pressed by the elastic force of the mediator layer when connected to the connection object, and is electrically connected to the connection object. The connection member characterized by the above-mentioned. In the method for manufacturing a connecting member, a step of forming a metal thin film on the reinforcing film, a step of forming a wiring pattern on the metal thin film, and a process of removing the reinforcing film excluding the reinforcing film on which the wiring pattern is formed And a step of fixing the reinforcing film processed by the processing step to a mediator layer made of an adhesive or an adhesive disposed on the substrate. .

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