JP2000077124A - Connecting method for film board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connecting method for a film board capable of enlarging a retention force of a connecting terminal retaining a film board. SOLUTION: In a film board 3, a conductive layer 3c is provided between insulating films 3a, 3b affixed to each other. A connecting terminal 2 is connected to the film board 3 such that a crimp part 2b of the connecting terminal 2 is crimped to the conductive layer 3c in a connection part 3d of the film board 3. In this connecting method for the film board 3, the crimp part 2b of the connecting terminal 2 is crimped to the conductive layer 3c in the connection part 3d with a reinforcing sheet 4 partially interposed between them.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a method for connecting connection terminals to a film substrate constituting an electric circuit.

[0002]

2. Description of the Related Art A conventional method for connecting a connection terminal to a film substrate will be described with reference to FIGS. The film substrate 1
For example, as shown in FIG. 3A, a conductive layer 1c is provided between insulating films 1a and 1b made of a flexible insulating plastic film such as PET (polyethylene terephthalate).
And insulating films 1a and 1b are bonded together with an adhesive. The conductive layer 1c is formed by forming a thin metal plate so as to form a circuit pattern, or by printing a conductive paint on the insulating film 1a so as to form a circuit pattern. At the terminal portion of the film substrate 1, one side of the insulating film 1b is removed to expose the conductive layer 1c, and, for example, two connection portions 1d having a predetermined size and shape are formed.

As shown in FIG. 3 (b), the connection terminal 2 has an elastic tongue at one end and is shaped like a box, and is connected to a mating male terminal (not shown). A fitting portion 2a to be fitted is formed. At the other end of the connection terminal 2, a crimp portion 2b for making an electrical connection and a mechanical connection with the film substrate 1 is formed. The crimping portion 2b has a U-shape, and a plurality of saw teeth 2c are provided on both sides.

FIG. 4 shows a connection terminal 2 on the film substrate 1.
It is a perspective view of the state which connected. As shown in FIG. 4, the connecting portion 1d of the film substrate 1 is arranged between the opposed sawtooth 2c of the connecting terminal 2, and the tip of each sawtooth 2c is bent inward to be pressed or slightly cut into the connecting portion 1d. Then, the connection portion 1d is firmly held by the crimping portion 2b. Thus, the connection terminal 2 and the conductive layer 1c of the film substrate 1 are electrically and mechanically connected. 3 and 4, one connection terminal 2 is connected to the film substrate 1, but the number of necessary connection circuits from the film substrate 1 to the outside depends on the number of connection portions 1d of the film substrate 1. A desired number of connection terminals are attached to the film substrate 1 according to the above.

[0005]

The sawtooth 2c has a sharply pointed thin metal plate, and the tip of the sawtooth 2c is connected to the conductive layer 1c or the insulating film 1c constituting the connection portion 1d.
When a is easily damaged or when the pressure is excessively strong, the conductive layer 1c or the insulating film 1a penetrates. Then, when an external force (for example, a force in the direction A shown in FIG. 4) in the direction of separating the film substrate 1 from the connection terminal 2 is applied, the film substrate 1 is connected to the sawtooth 2c of the connection portion 1d.
There is a risk that the tip may be torn or cut with a small external force starting from the damaged or pierced part. On the other hand, if the crimping is insufficient and the tip of the sawtooth 2c is touching the surface of the connection portion 1d with a very small pressure, the connection terminal 2
However, the holding force for holding the film substrate 1 is reduced. As described above, in the conventional connection method between the connection portion 1 d of the film substrate 1 and the connection terminal 2, depending on the strength of the film substrate 1,
There is a problem that the holding force of the connection terminal 2 is reduced.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has a conductive layer between insulating films, and a conductive layer at a connecting portion of a film substrate formed by bonding the insulating films together. Then, crimp the crimping part of the connection terminal,
In the method for connecting a film substrate to connect a connection terminal to a film substrate, a crimping portion of the connection terminal is crimped to a conductive layer of the connection portion partially via a reinforcing sheet.

As described above, when the crimping portion of the connection terminal is partially crimped to the conductive layer of the connection portion of the film substrate via the reinforcing sheet, the reinforcing sheet is made sufficiently thick.
It is possible to prevent the conductive layer in the portion covered with the reinforcing sheet from being damaged by pressure bonding. Therefore, by strongly crimping the crimping portion of the connection terminal to the reinforcing sheet, the holding force of the connection terminal to the film substrate can be improved.

[0008]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view illustrating one embodiment of a method for connecting a film substrate according to the present invention. In FIG. 1, a film substrate 3 has a conductive layer 3c (for example, a thin metal plate such as copper) placed between two flexible insulating films 3a and 3b (for example, a plastic film such as PET (polyethylene terephthalate)) and is bonded. It is a thing. The connection terminal 2 has an elastic tongue inside at one end, and a fitting portion 2a shaped like a box.
Is formed at the other end, and a crimping portion 2b for making electrical and mechanical connection with the film substrate 3 is formed.
The crimping portion 2b has a U-shape and has four saw teeth 2 on each side.
c is provided as a pair.

The present embodiment is different from the conventional example in that a relatively thick reinforcing sheet 4 such as PET is adhered so as to partially cover the exposed conductive layer 3c of the connecting portion 3d of the film substrate 3. It is that you are. Then, the connection terminal 2
Of the four pairs of saw teeth 2c of the crimping portion 2b are directly press-bonded to the exposed conductive layer 3c to make an electrical connection, and the other two pairs are strongly pressed onto the reinforcing sheet 4 to be mechanically pressed. Connection. In the present embodiment, since the two pairs of saw teeth 2c can be strongly pressed from above the reinforcing sheet 4, the conventional case in which the saw teeth are pressure-bonded to the connection portion composed of only one insulating film and the conductive layer. The holding power is improved as compared with. Although the number of saw teeth 2c in direct contact with the conductive layer 3c is smaller than in the related art, there is no particular problem with the current capacity of the film substrate 3.

FIG. 2 is a perspective view for explaining another embodiment. As shown in FIG. 2, in the present embodiment, in the connection portion 3d of the film substrate 3, one surface on the tip side of the conductive layer 3c is partially exposed, and the other portion is covered with the insulating film 3b. Then, of the four pairs of sawtooth 2c of the connection terminal 2, 2
The pair is directly press-bonded to the exposed portion of the conductive layer 3c to make an electrical connection, and the other two pairs use the insulating film 3b as a reinforcing sheet and are press-bonded from above to make a mechanical connection. In this embodiment, since the insulating film 3b is used as a reinforcing sheet, the effect is inferior to the above-described embodiment in which a reinforcing sheet having a desired thickness can be used, but the holding force is improved as compared with the conventional case. .

[0011]

As described above, according to the present invention, there is an excellent effect that the holding force for holding the film substrate of the connection terminal is improved.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating one embodiment of a method for connecting a film substrate according to the present invention.

FIG. 2 is a perspective view illustrating another embodiment.

FIGS. 3A and 3B are perspective views of a film substrate and a connection terminal, respectively.

FIG. 4 is a perspective view illustrating a conventional method for connecting a connection terminal to a film substrate.

[Explanation of symbols]

 2 connection terminal 2a fitting part 2b crimping part 2c sawtooth 3 film substrate 3a, 3b insulating film 3c conductive layer 3d connecting part 4 reinforcing sheet

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Claims (1)

[Claims] A conductive layer is provided between insulating films, and a crimping portion of a connecting terminal is crimped to a conductive layer of a connecting portion of a film substrate obtained by bonding the insulating films together, and the connecting terminal is connected to the film substrate. In the method for connecting a film substrate, a crimping portion of a connection terminal is partially crimped to a conductive layer of the connection portion via a reinforcing sheet.