JPH0521317B2 - - Google Patents

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention is applicable to electrical connection terminals such as electrical connectors, switches, and relays, particularly metals with high conductivity (hereinafter referred to as "conductive materials") and metals with excellent spring properties. The present invention relates to the structure of the contact portion of an electrical connection terminal made of a laminated material with plastic interposed therebetween (hereinafter referred to as "spring material").

(Prior Art) Electrical connection terminals used in connectors, relays, switches, etc. are required to have both high conductivity and high springiness due to their characteristics. but,
At present, no metal material is known that satisfies these two requirements at the same time. Therefore, the present inventors proposed an electrical connection terminal forming material in which a conductive metal layer with high conductivity and a spring metal layer with excellent spring properties are laminated with an insulating plastic layer interposed therebetween (for example, (See Japanese Patent Application No. 139499/1983).

(Problems to be Solved by the Invention) The miniaturization of electronic devices accompanying the recent advances in electronic technology has also required miniaturization of connection terminals. However, the connection terminals of electronic devices or parts thereof, such as connectors, switches, and relays,
As the size of the connection terminal decreases, the contact pressure of the contact portion also decreases, so the connection reliability of the contact terminal using spring pressure, which is influenced by the contact pressure, tends to decrease as the connection terminal becomes smaller.

(Objects of the invention and means for achieving the same) The present invention has been made in view of the above points, and even if the connecting terminal is downsized, the contact pressure per unit contact area can be maintained at the same level or higher than that of the conventional one. A conductive metal layer and a spring metal layer are interposed with an insulating plastic layer to make contact with the other connection terminal of a pair of electrical connection terminals. An electrical connection terminal with a multilayer structure in which layers are stacked and a contact portion is formed,
By configuring the electrical connection terminal to be in contact with the other connection terminal such that a convex portion is formed at the contact portion of the conductive metal layer, the contact of the connection terminal contact portion This is achieved by increasing the contact pressure per unit contact area by reducing the area.

The details will be explained below based on the drawings. Fig. 1 is a side view showing the state in which the connecting terminal of the connector is in contact with the terminal of the printed circuit board, and Fig. 2 is a side view showing the state in which the connecting terminal of the connector is in contact with the terminal of the printed circuit board. FIGS. 3 and 4 are sectional views each showing an embodiment of the present invention, and FIGS. FIGS. 6 a to l are perspective views of examples of connecting terminals as single poles, and FIGS. FIG. 3 is a perspective view of an example of a multipolar connection terminal.

FIG. 1 shows the connection terminal 1 in contact with the terminal 7 of the printed circuit board 6. In FIG.
It was connected to by soldering 11 or the like. An electrical connection between an electric wire 9 connected to an electric circuit or a power source (not shown) and the printed circuit board 6 is established by printing a conductive metal layer 3 via the connecting terminal 1 using the spring pressure of the connecting terminal 1. This is done by pressing against the terminals 7 of the circuit board 6.

In the example shown in FIG. 1, the connecting terminal 1 has a flat plate shape bent in the longitudinal direction to form the arc-shaped contact portion 5. Therefore, the contact between the connecting terminal 1 and the printed circuit board 6 is made in the arc-shaped shape. At the contact point of the contact portion 5 with the printed circuit board 6, a linear contact is formed with the width of the contact portion 5 being the maximum length. FIG. 2 is a perspective view of a multilayered connecting terminal, showing an example of a connecting terminal in which the spring metal layer 4 is not bonded to the insulating plastic layer 2 at the contact portion of the connecting terminal. In other words, the connection terminal 1 is made of polyester, polyimide, etc. with a thickness of 10~
A conductive metal layer 3 of 5 to 50 μm thick such as gold foil, copper foil, silver foil, or aluminum foil is bonded to the 100 μm insulating plastic layer 2 over the entire surface, and then the insulating plastic layer 2 of this laminate is bonded. on the face,
Thickness 50~300μ made of stainless steel, copper alloy, etc.
The spring metal layer 4 of m is bonded with the contact portion 5 of the connecting terminal 1 remaining. Insulating plastic layer 2 and conductive metal layer 3 or insulating plastic layer 2
The bonding between the spring metal layer 4 and the spring metal layer 4 can be performed by fusion using heat, ultrasonic waves, or the like, or by using various adhesives such as a heat-fusible adhesive. Furthermore, the bending of the contact portion 5 of the connection terminal 1 may be performed individually before bonding the laminate of the conductive metal layer 3 to the insulating plastic layer 2 and the spring metal layer 4, or after the bonding. You can go.

FIG. 3 is a sectional view of an embodiment of the present invention, in which a hemispherical convex portion 10 is provided on both the conductive metal layer 3 and the spring metal layer 4 at the center of the contact portion 5. The contact between the connecting terminal 1 and the printed circuit board can be made at a point.

FIG. 4 is a sectional view of another embodiment of the present invention, in which the protrusion 10 is provided only on the spring metal layer 4 side, but in the case of FIG. Since it is provided in the conductive metal layer 3 of the material,
On the other hand, the protruding part 10 is rapidly worn out when it is attached to and detached from a printed circuit board etc., and there is a risk that it will become essentially useless as the protruding part 10 even after only a small number of attachments and detachments.In contrast, in the case of FIG. There is no risk of this happening, and the convex portion 10 provided on the spring metal layer 4 forms a convex portion on the conductive metal layer 4 through the thin plastic layer 2, thereby effectively creating a point on a printed circuit board or the like. It is possible to make contact in a very small area close to . Note that there is a gap between the spring metal layer 4 and the insulating plastic layer 2 at the contact portion 5 as shown, but this serves to facilitate the installation of the protrusion 10 in this portion. Of course.

Note that the protruding portion 10 provided on the spring metal layer 4
In addition to being semicircular, the shape may be any desired shape, such as a cone, polygonal pyramid, triangular shape, etc., or a bent end, as shown in Fig. 5b to f. can. Further, the shape of the tip of the protruding portion 10 is not necessarily limited to an acute angle, and the tip may be rounded or provided with a flat portion as necessary. Further, the protrusions 10 can be provided in the required number at the required locations on the spring metal layer 4.

In addition, in the embodiment shown in FIG. 4, the spring metal layer 4 is bonded to the insulating plastic layer 2 leaving the contact portion 5 to form an integral connection terminal 1, but the spring metal layer 4
The connecting terminals can be formed by simply overlapping them on the insulating plastic layer 2 without gluing them together, or by folding a part of the overlapping layers to integrate them, or by providing holes or notches that pass through the connecting terminals 1. 1 can be integrated by fitting it into a protrusion provided in the case in which it is to be incorporated.

In addition to the example shown in FIG. 2, there are various types of connection terminals 1, such as multi-pole terminals shown in FIGS. 6 a to 1 and FIGS. It goes without saying that it can be done.

Furthermore, the connecting terminal of the present invention can be incorporated into a plastic part etc. molded into a desired shape.
Of course, it can be used as a connection terminal for electrical equipment such as connectors, switches, and relays.

(Operations and Effects of the Invention) As is clear from the above description, according to the present invention, when the contact terminal is in contact with the other connecting terminal of the pair, the conductive metal layer is contacted by the convex portion formed at the contact portion of the conductive metal layer. Since the contact area can be reduced, it is possible to not only prevent a decrease in contact pressure per unit area, but also increase it.
Therefore, it is possible to easily prevent the connection reliability from decreasing due to the miniaturization of the multilayer electrical connection terminal, that is, the connection reliability depending on the contact pressure.

[Brief explanation of drawings]

Fig. 1 is a side view showing the connection terminal of the connector in contact with the terminal of the printed circuit board, Fig. 2 is a perspective view of the electrical connection terminal with a multilayer structure, and Figs. 3 and 4 are each according to the present invention. 5th sectional view of the embodiment of
Figures a to f are perspective views of embodiments of protrusions provided on the contact portions of connection terminals, Figures 6 a to l are examples of single-pole contacts, and Figures m to n are examples of multi-pole contacts. FIG. DESCRIPTION OF SYMBOLS 1... Electrical connection terminal, 2... Insulating plastic layer, 3... Conductive metal layer, 4... Spring metal layer, 5... Contact portion, 6... Printed circuit board, 7...
... Terminal of printed circuit board, 8 ... Tail portion of contactor, 9 ... Electric wire, 10 ... Projection provided at contact portion of conductive metal layer 3 or spring metal layer 4, 1
1... Solder adhesion.

Claims (1)

[Scope of Claims] A conductive metal layer and a spring metal layer are laminated with an insulating plastic layer interposed therebetween to be brought into contact with the other connection terminal of a pair of electrical connection terminals,
and an electrical connection terminal having a multilayer structure in which a contact portion is formed, the electrical connection terminal having a convex state in which the state of contact with the other connection terminal is a point contact at the contact portion of the conductive metal layer. 1. An electrical connection terminal having a multilayer structure, characterized in that it is configured such that a portion is formed. 2. The multilayer structure according to claim 1, wherein the convex portion is formed by a convex portion provided at a contact portion between the conductive metal layer and the spring metal layer. electrical connection terminals. 3. The electrical connection terminal having a multilayer structure according to claim 1, wherein the convex portion is formed by a convex portion provided at a contact portion of the spring metal layer. 4. The spring metal layer and the insulating plastic layer are not bonded to each other at the contact portion for a short period of time.
2. An electrical connection terminal having a multilayer structure according to claim 1, characterized in that the electrical connection terminal has a multilayer structure. 5. The multilayer electrical connection terminal according to claim 1, which is incorporated as an electrical connection terminal for a connector, switch, or relay.