JP3692074B2 - Electrical component manufacturing method and bonding apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing an electrical component for attaching an electrical component such as an IC chip to a tape substrate (bonding) and a bonding apparatus.
[0002]
[Prior art]
For example, in a bonding apparatus for attaching (bonding) an electrical component such as an IC chip (semiconductor element) to a tape substrate, the tape substrate is usually provided with holes (referred to as perforations) with a predetermined pitch.
The tape substrate fed from the supply reel is transported, and when it reaches a predetermined position, it is stopped and a bonding process is performed. After the bonding process is completed, the next IC chip mounting portion is conveyed so as to enter the processing point, for example.
[0003]
Initially, the means for transporting the tape substrate targeted the hole. Specifically, a plurality of sprockets are arranged along the transport path of the tape substrate, and a drive motor is connected to the sprocket on the tip side.
In this system, the claw of the sprocket is hung on the hole of the tape substrate, and the sprocket is rotationally driven to convey the tape substrate. At this time, the thickness of the tape substrate was about 40 μm, and although it took time to replace the sprocket according to the pitch and shape of the holes, it was transported with almost no trouble.
[0004]
By the way, one of the recent trends is to reduce the thickness of the tape substrate, and the thickness is reduced to about 25 μm. For such an ultra-thin tape substrate, even if the sprocket is made of a soft material (synthetic resin material or the like), there is a high possibility that the periphery of the hole is damaged by the claw provided in the sprocket.
Therefore, instead of sprocket conveyance, the both sides of the tape substrate are sandwiched by rollers from the top and bottom surfaces, and a predetermined roller is driven to rotate, so that the roller conveyance system that conveys the tape substrate with its frictional force is changed. became.
[0005]
However, in the roller conveyance method using the frictional force, the roller may slip with respect to the tape substrate. When transported at a high speed based on the drive amount of the motor, the slippage deteriorates the transport accuracy.
In Japanese Patent Laid-Open No. 3-9542, as a countermeasure, a detection unit that detects the hole portion during conveyance of a tape substrate (tab tape) by a roller is provided, and a roller driving unit is provided based on the detection result of the detection unit. Techniques for controlling are disclosed.
Even if slip occurs during roller conveyance, the tape substrate can be stopped at the target position and the bonding process can be started. It is a transport system.
[0006]
[Problems to be solved by the invention]
In this case, the number of holes in the tape substrate is set in advance, and conveyance is started. The number of holes is counted along with the conveyance, and the conveyance of the tape substrate is stopped while the set number is detected. After the tape substrate is stopped, correction processing such as tape substrate recognition by the camera and position correction is performed.
A conveyance speed profile for such a tape substrate is shown in FIG. 10, where the horizontal axis represents time and the vertical axis represents the conveyance speed. In the change A, immediately after the start, the speed is increased to a predetermined speed as quickly as possible to enable high-speed feeding.
[0007]
On the other hand, there is a strong demand for shortening tact due to an increase in production volume on the user side of a bonding apparatus that produces electrical components, and it is required to further increase the transport speed of the tape substrate.
Therefore, as shown as a change B in FIG. 10, the feeding is performed at a higher speed, the conveyance is stopped in a shorter time, and the bonding process can be started.
However, even if a stop signal is issued from the control unit to the drive motor during high-speed conveyance, it is extremely difficult to actually stop the tape substrate at the stop position. In this way, as the tape substrate is conveyed at a high speed, a new problem arises that the tape stop accuracy with respect to the target position is lowered.
[0008]
Further, in the case of a tape substrate on which a plurality of types are mounted or a tape substrate managed in block units, the IC chip position on the tape substrate may deviate from the hole reference position.
That is, in addition to the so-called pitch conveyance of conveying from a hole to a predetermined number of holes, it is necessary to perform a decimal pitch conveyance such as a 4.5 pitch conveyance that conveys a predetermined hole plus one pitch or less from the hole. It has become.
[0009]
Even in the case of such decimal point pitch conveyance conditions, conventionally, since the sensor as the detecting means for detecting the hole is only installed in a fixed state, the pitch after the decimal point (for example, 4. In the case of 5 pitch conveyance, the movement amount for 0.5 pitch) is set as an offset.
That is, after detecting the final hole of the set number of holes (in the case of 4.5 pitch conveyance, the number of set holes is 4), the offset drive is performed to move by the pitch below the decimal point, and any decimal point pitch conveyance is performed. It was realized.
[0010]
However, since conveyance at such a decimal point pitch is performed as offset driving and is performed after detection of the final hole, there is a problem in that the conveyance time increases and the tact time increases.
And since the above-mentioned offset drive is performed with the feed amount of the motor instead of the hole reference so far, the stop accuracy is reduced due to the occurrence of tape slip during the offset drive.
[0011]
The present invention has been made in view of the above-described circumstances, and a first object of the present invention is to improve the accuracy of stopping the target position after feeding the tape substrate at a high speed and to improve the reliability. A manufacturing method and a bonding apparatus are to be provided.
[0012]
The second object is to provide a bonding apparatus that can feed the decimal point pitch of the tape substrate at a high speed without deteriorating the stop accuracy with respect to the target stop position of the tape substrate. is there.
[0013]
[Means for Solving the Problems]
In order to satisfy the first object, the present invention is configured to frictionally drive a tape substrate in which holes are provided at a predetermined pitch in the length direction, and to perform positioning at a predetermined position with reference to the holes. A method of manufacturing an electrical component that repeats a process of attaching a component to a tape substrate that has been performed, wherein the tape substrate is transported at a first speed by feeding the tape substrate by a predetermined length; A search conveying step of sending the tape substrate at a second speed slower than the speed of 1; Through high-speed transfer process and search transfer process Provided on the tape substrate All of Detecting the hole Count the number of holes, and when this count reaches a predetermined number And a stop step for stopping the conveyance of the tape substrate.
[0015]
Further, the present invention is a bonding method in which a tape substrate having holes provided at a predetermined pitch in the length direction is conveyed by friction drive and positioned at a predetermined position, and components are attached to the positioned tape substrate. A device,
Detection means for detecting a hole passing through a predetermined area and generating a detection signal, counting means for counting the number of the holes based on the detection signal by the detection means, and tape at a first speed from a stopped state Feed the substrate by a predetermined length, then switch to a second speed slower than the first speed, The first speed and Control means for stopping the tape substrate conveyance in accordance with the number of holes counted by the counting means during conveyance of the tape substrate at the second speed.
[0016]
The present invention for satisfying the second object is to convey a tape substrate having holes in the length direction at a predetermined pitch by friction drive, and to set the tape substrate to a set pitch position and 1 pitch or less. Is a bonding apparatus that attaches components to the positioned tape substrate and is arranged in the hole pitch position and decimal point pitch position in the number corresponding to the conveyance pattern, A plurality of detection means for detecting a hole passing through a predetermined region and generating a detection signal; a counting means for counting the number of the holes in each detection means based on detection signals from the plurality of detection means; and a stopped state The tape substrate is fed at a first speed by a predetermined length, and then switched to a second speed that is slower than the first speed. And and control means for stopping the transport of the tape substrate according to the number of holes in a predetermined detection means for counting by the counting means during the transport of the tape substrate by the second speed.
[0017]
Furthermore, the present invention provides a first detection means that is disposed opposite to the set hole pitch position and detects a hole that passes through a predetermined region and generates a detection signal in the bonding apparatus. A second detecting means which is arranged displaceably at a decimal point pitch position and detects a hole passing through a predetermined region and generates a detection signal; and the number of holes based on the detection signals from the first and second detecting means Counting means for counting the tape substrate, the tape substrate is fed by a predetermined length at the first speed from the stopped state, then switched to the second speed slower than the first speed, and the tape at the second speed is fed. And a control unit for stopping the tape substrate conveyance in accordance with the number of holes counted by the counting unit during conveyance of the substrate.
[0018]
Further, the present invention provides the above bonding apparatus, wherein a displacement signal is arranged within a range of one pitch of the hole and displaceable at a set decimal point pitch position, and detects a hole passing through a predetermined area and issues a detection signal. A detecting means, a counting means for counting the number of holes based on a detection signal from the detecting means, and a tape substrate is fed by a predetermined length at a first speed from a stopped state, and then more than the first speed. And a control means for stopping the transport of the tape substrate according to the number of holes counted by the counting means during the transport of the tape substrate at the second speed.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic configuration diagram of the bonding apparatus, and FIG. 2 is a schematic configuration diagram of a tape transport unit constituting a part of the bonding apparatus.
[0020]
In the figure, reference numeral 1 denotes a bonding head (bonding means) configured to move up and down by the pressure unit 1A. A bonding stage 2 is disposed opposite to the bonding head 1.
Between the bonding head 1 and the bonding stage 2, a tape transport section (transport means) 4 is disposed that transports a tape substrate 3 configured as described later at a high speed and a search speed.
[0021]
Reference numeral 5 denotes a chip / tape recognition camera that images the IC substrate (electrical component) 6 that is disposed between the bonding head 1 and the tape transport unit 4 so as to freely enter and exit and is sucked and held by the bonding head 1. It is.
An IC chip supply unit 7 is disposed adjacent to the tape transport unit 4. The IC chip supply unit 7 takes out the IC chip 6 formed on the wafer 8 and supplies it to the bonding head 1.
[0022]
The base supporting the pressurizing unit 1A and the like is provided with a control unit (control means) 10 composed of a personal computer, which receives a detection signal from the chip / tape recognition camera 5 and is required for the tape transport unit 4. The control signal is sent.
As shown in FIG. 2, the tape substrate 3 is made of a long tape having a predetermined width, and its thickness is extremely thin (about 25 μm). An IC chip mounting portion 11 to which an IC chip (electrical component) 6 is bonded is formed at the central portion along the width direction of the tape substrate 3. Therefore, the IC chip mounting portions 11 are provided with a predetermined pitch along the longitudinal direction of the tape substrate 3.
[0023]
In addition, holes 12 are opened on both sides in the width direction of the tape substrate 3 with a predetermined pitch (pitch P: about 4.75 mm) in the longitudinal direction. These holes 12 are also called perforations, and here have a rectangular shape with one side of about 1.42 to 1.98 mm.
The tape transport unit 4 includes a rail 13 for transporting the tape substrate 3, a transport roller 14 that is in rolling contact with the tape substrate 3 from the upper and lower surfaces of the tape substrate 3, and a drive motor that controls driving of the transport roller 14. 15 and a tension roller 16 for preventing the tape substrate 3 from being loosened during conveyance.
[0024]
In addition, a hole detection sensor (detection means) 17 is disposed on the transported tape substrate 3, in particular, at a position above the hole 12 on the one row side. The hole detection sensor 17 is connected to the tape substrate 3 to be conveyed. All provided in The passage of the hole 12 is detected, and the detection signal is transmitted to the control unit 10.
The number of holes 12 is set and stored in advance in the control unit 10. The control unit 10 also serves as a counting unit that counts the number of the holes 12 and adds each time a hole detection signal is received from the hole detection sensor 17 and compares it with the set number. When the predetermined number of holes is reached, a control signal is sent to the drive motor 15.
For example, the number of the holes 12 to be set and stored in the control unit 10 is eight. The number of holes 12 is counted from the start of conveyance, and a control signal to be described later is sent when the number immediately before the set number, that is, when 7 is counted and when the set number is counted.
[0025]
In the bonding apparatus configured as described above, the tape transport unit 4 transports the tape substrate 3 and the IC chip mounting unit 11 stops transporting the tape substrate 3 at a position facing the bonding head 1.
At this time, the chip / tape recognition camera 5 detects the position of the tape substrate 3 and the position of the IC chip 6 and sends the signal to the controller 10. The control unit 10 controls related devices to correct the position of the tape substrate 3 and the IC chip 6 based on the detection signal of the chip / tape recognition camera 5.
[0026]
After accurate positioning, the pressure unit 1A is operated to lower the bonding head 1 and bond the IC chip 6 onto the tape substrate 3. Thereafter, the conveyance of the tape substrate 3 is resumed, and stops when the next IC chip mounting portion 11 faces the bonding head 1. Thereafter, the above-described steps are repeated.
A flowchart of the conveyance control in the tape conveyance unit 4 is shown in FIG. When a conveyance start signal is input, a speed profile to be described later is generated and driving of the drive motor 15 is started.
The transport roller 14 rotates and transports at a high first transport speed with the tape substrate 3 being sandwiched. Such a high-speed transport process is referred to herein as a first transport process. Although the conveyance is performed by friction driving of the conveyance roller 14 while being high-speed conveyance, only the hole 12 of the tape substrate 3 is not burdened, and there is no damage around the hole 12.
[0027]
Simultaneously with the start of conveyance, the hole detection sensor 17 starts detection (search) of the hole 12. Along with the conveyance, the hole 12 provided in the tape substrate 3 passes through a lower portion of the hole detection sensor 17, and the sensor detects the hole 12 and sends a detection signal to the control unit 10.
The control unit 10 adds and counts the number of holes 12 that have passed based on the detection signal, and compares it with the number of holes set and stored. When the count of the number of holes is the number (seven) immediately before the number of set holes 12 (eight), the control unit 10 sends a control signal to the drive motor 15. In response to this control signal, the conveyance speed of the tape substrate 3 is switched to the second conveyance speed which is extremely slower than the first conveyance process, and the conveyance is continued. Such a search conveyance process after speed switching is referred to herein as a second conveyance process, and the second conveyance speed is referred to as a search speed.
[0028]
For example, if the conveyance speed in the first conveyance process is set to 150 mm / sec at the maximum, the conveyance speed in the second conveyance process, that is, the search speed is 1/10 or less of the maximum value of the high-speed conveyance speed. It is set to 10 mm / sec.
It should be noted that if it can be sufficiently decelerated in one pitch, it may be decelerated one time before. However, if the decelerating cannot be performed instantaneously, the number of counts for decelerating can be appropriately changed.
[0029]
After switching to the low search speed, the control unit 10 counts the detection signal from the hole detection sensor 17 and confirms that the count number is a predetermined count number. It is determined that the final hole) is detected, and the drive motor 15 is stopped. The search speed is set to a speed at which misalignment hardly occurs during the stop process.
In a state where the conveyance of the tape substrate 3 is stopped, the next IC chip mounting portion 11 on the tape substrate 3 faces the bonding position, and the bonding process described above is started.
[0030]
The search speed is lower than the first transport speed, but the transport at the search speed is continued as described above. Form In this case, there is only one pitch from detection of the hole immediately before the set hole (final hole) 12 to detection of the set hole.
Therefore, the time from the start of transport to the stop of transport is shortened compared with the conventional simple high-speed feed as previously described with reference to line B in FIG. 10, and so-called tact shortening is obtained.
[0031]
Furthermore, since the search speed is low, no overshoot occurs, until the hole detection sensor 17 detects the set hole 12 and the control unit 10 sends a stop signal to the drive motor 15 to stop the conveyance. The settling time is very short.
Therefore, the IC chip mounting portion 11 of the tape substrate 3 is not displaced with respect to the bonding head 1, and the tape substrate 3 stops at an accurate position. That is, after realizing high-speed conveyance of the tape substrate 3, this stopping accuracy is improved, and thus reliability can be improved.
[0032]
FIG. 4 shows a conveyance speed profile for the tape substrate 3. For example, the number of set holes is set to 8 and immediately after the start of conveyance, the high-speed feed that is the first conveyance speed starts and the number of holes 12 is counted.
When the seventh hole 12 immediately before the set hole 12 is counted, the search feed is performed by switching to the second transport process. This search feed is at a low speed, and the search feed is continued while the eighth hole 12 is detected.
When the eighth hole 12 is detected, the conveyance of the tape substrate 3 is stopped. As described above, the conveyance at the search speed is continued only during the pitch of one hole, the entire conveyance is performed at high speed, and the stop accuracy is not deteriorated.
[0033]
In the above-described embodiment, the number of holes 12 provided in the tape substrate 3 is counted and the switching of the conveyance speed is controlled based on the number. However, the present invention is not limited to this. Instead, since the mutual pitch (pitch) P of the holes 12 is a standard value, the conveyance speed may be switched by calculating the pitch length and performing the conveyance speed switching stop control. Alternatively, the encoder output of the motor driving the conveyance roller 14 may be counted and controlled.
[0034]
For example, every time the control unit 10 receives a detection signal from the hole detection sensor 17, the control unit 10 performs an operation of multiplying the number by one pitch length of the hole 12. Further, the control unit 10 stores a predetermined pitch length in advance.
The tape substrate 3 is transported at a high transport speed (first transport process) from the start of transport, and the control unit 10 calculates the pitch length based on the signal from the hole detection sensor 17.
[0035]
When the result of this calculation is a value less than the predetermined pitch length by one pitch length, a control signal for switching to the search speed is sent to the drive motor 15 to perform search feed (second transport step). . There is no change in setting the first transport speed to 150 mm / sec and the search speed to 10 mm / sec.
After switching to the search speed and carrying, the hole detection sensor 17 detects the next hole 12. When the control unit 10 receives the detection signal, the control unit performs a drive stop process for the drive motor 15.
[0036]
The predetermined IC chip mounting portion 11 faces the position on the bonding stage 2, and the conveyance of the tape substrate 3 is stopped. Then, the process proceeds to a bonding process in which the bonding head 1 is lowered.
Therefore, the time from the start of transport to the stop of transport is high-speed transport that is shortened compared to the conventional simple high-speed feed described above with reference to FIG. 10B, and so-called tact shortening is obtained. .
[0037]
Further, since the search transport speed is low, the IC chip mounting portion 11 of the tape substrate 3 stops at an accurate position without being displaced with respect to the bonding head 1 when the transport is stopped. It is completely the same here that after stopping the tape substrate 3 at a high speed, the stopping accuracy can be improved and the reliability can be improved.
[0038]
Next, another embodiment will be described.
Depending on the specifications of the other party, there are cases where electrical parts such as IC chips attached to the tape substrate are not only positioned at an integral multiple of the hole pitch, but also mounted at positions between the holes.
[0039]
That is, the position between one pitch of the holes is set and conveyed, and such positioning conveyance is called decimal pitch conveyance. As the decimal point pitch conveyance, there are the following three conveyance methods.
[0040]
1. The sensors corresponding to the number of conveyance patterns are provided as detection means, and the sensors are fixedly arranged at positions separated by the decimal point pitch distance, and the decimal point pitch conveyance is performed by the detection (count) of each sensor. Standard transport method.
[0041]
2. Two sensors as detection means are provided. One sensor is fixed at a position with respect to the hole, and the other sensor is movable between the holes, and the decimal point pitch to be conveyed is changed each time. A transport method in which the position of the other sensor is displaced and decimal point pitch transport is performed with reference to the hole.
[0042]
3. A conveying method in which only one sensor is used as a detecting means, the sensor is movable within a range of one pitch of the hole, the sensor position is displaced according to the set pitch, and decimal point pitch is conveyed based on the hole.
[0043]
Hereinafter, the first transport method will be described in detail with reference to FIGS. FIG. 5 is a schematic diagram of a transport unit of the bonding apparatus and an explanatory diagram of processing of the control means. FIG. 6 is a flowchart of conveyance control. 7 and 8 are diagrams for explaining the actual counting of holes. FIG. 9 is a flowchart of a specific count number check process.
[0044]
As the tape transport section 4A, a rail 13 for transporting the tape substrate 3A, a transport roller 14 that is in rolling contact with the tape substrate from the upper and lower surfaces of the tape substrate 3A, and a drive motor 15 that controls the drive of the transport roller 14 And a tension roller 16 for preventing the tape substrate 3A from loosening during conveyance.
[0045]
For example, the hole 12 is added to 2 pitches on the tape substrate 3A, and transported at 0.5 pitch, that is, transported at 2.5 pitch.
Since the reference pitch between the holes 12 is standardized to 4.75 mm, the half pitch is 2.375 mm. In the case of 2.5 pitch conveyance, conveyance at 11.875 mm pitch is performed.
[0046]
In this way, the tape substrate 3A provided with the holes 12 at a predetermined pitch in the length direction is conveyed by friction drive and positioned at every 2.5 pitches of the holes 12, and the tape substrate with respect to the positioned tape substrate is positioned. Attach electrical parts 6 such as IC chips.
Here, the detecting means for detecting the hole 12 passing through the predetermined area and generating a detection signal includes two sensors, a first sensor 17A and a second sensor 17B, each of which has a counting means. It is electrically connected to the control unit (control means) 10A provided.
[0047]
The first sensor 17A is disposed at a position where the edge of the hole 12 is detected, the second sensor 17B is on the upstream side of the conveyance of the first sensor 17A, and 1. It is arranged at a position separated by 5 pitches.
In such a transport unit 4A, the tape substrate 3A is sandwiched between the transport rollers 14, and the drive motor 15 is driven to perform friction transport. The first sensor 17A and the second sensor 17B detect the hole 12 that passes through the predetermined region, and send the detection signal to the control unit 10A.
[0048]
Although the set number of holes is different, the conveyance speed for the drive motor 15 is controlled in the same manner as described above with reference to FIG. That is, the tape substrate 13A is fed by a predetermined length from the stop state at a high speed (first speed), and then switched to a search speed that is a low speed (second speed) slower than the high speed.
During the transport of the tape substrate 3A at the search speed, the control unit 10A counts the number of holes detected by the first sensor 17A and the second sensor 17B, and the holes 12 in the sensors 17A and 17B as described later. The conveyance of the tape substrate 3A is stopped according to the counted number.
[0049]
For example, before conveyance, the conveyance method of integer pitch feed or decimal point pitch feed is judged, the count number of each sensor 17A, 17B is set, and the sensor for final hole detection is determined. Then, the detection of the final hole set during the search feed operation is performed by the designated sensor.
The specific control flow is shown in FIG. 6, and the drive processing of the drive motor 15, the count processing of the number of holes by the detection of the first sensor 17A and the second sensor 17B, and the count number check processing are performed in parallel. Done.
[0050]
Count processing of the number of holes of the first sensor 17A and the second sensor 17B is performed in the order of FIG. 7 (A) to FIG. 7 (B) to FIG. 8 (A) to FIG. 8 (B).
In the figure, the tape substrate 3A is continuously transported with a hole 12 represented by a rectangular shape, but for ease of explanation, the moving position of the hole 12 every 0.5 pitch transported, The detection states of the first sensor 17A and the second sensor 17B are shown. The numbers entered in the holes 12 are provisional numbers.
[0051]
It is assumed that the uppermost stage in FIG. 7A is the start of conveyance, and the hole {circle around (1)} is located between the first sensor 17A and the second sensor 17B. When the tape substrate 3A is conveyed by 0.5 pitch from here, the hole {circle around (2)} reaches the detection position of the second sensor 17B and is counted as shown in the next stage.
Further, when the tape substrate 3A moves by 0.5 pitch and is transported by 1 pitch from the start of transport, the hole (1) reaches the detection position of the first sensor 17A and is detected and counted. Since the second sensor 17B does not count, the accumulated count remains one.
[0052]
Furthermore, when it moves 0.5 pitches and is transported 1.5 pitches from the transport start position, the hole {circle around (3)} reaches the detection position of the second sensor 17B and is detected and counted. Accordingly, the cumulative count number of the second sensor 17B is 2, but the cumulative count number of the first sensor 17A remains one.
Furthermore, when it moves 0.5 pitches and is transported 2 pitches from the start of transport, the hole (2) reaches the detection position of the first sensor 17A and is detected and counted. The cumulative count number of the first sensor 17A is 2, which is the same as the cumulative count number of the second sensor 17B.
[0053]
Further, when the sheet moves by 0.5 pitch and is transported 2.5 pitches from the transport start position, the hole (4) reaches the detection position of the second sensor 17B and is detected and counted. Therefore, the cumulative count number of the second sensor 17B is 3.
Under the above-described conveyance setting condition, when the cumulative count number of one of the sensors 17A and 17B is 3, the control unit 10A controls the drive motor 15 to stop, and the tape conveyance is stopped.
[0054]
Then, the IC chip 6 is placed above the bonding stage 2 via the tape substrate 3A, and the bonding head 1 is lowered from the upper part to perform the bonding process.
Next, as shown in FIG. 7B, the conveyance of the tape substrate 3A is started again. The state of the substrate tape 3A at the start of the conveyance coincides with the state when the conveyance is stopped in FIG.
The hole (3) is detected by the first sensor 17A at the 0.5 pitch transfer position, and the hole (5) is detected by the second sensor 17B at the 1 pitch transfer position. At the 1.5 pitch conveying position, the hole (4) is detected by the first sensor 17A, and the cumulative count number of this sensor becomes 2.
[0055]
The hole (6) is detected by the second sensor 17B at the 2.0 pitch conveying position, and the cumulative count number of this sensor becomes 2. At the 2.5 pitch transfer position, the hole (5) is detected by the first sensor 17A, and the accumulated count of this sensor becomes 3, so the transfer is stopped and the bonding process is performed.
Subsequently, the conveyance shown in FIG. While the first sensor 17A detects the holes (6) and (7) from the start of conveyance to 2.5 pitch conveyance, the second sensor 17B detects the holes (7), (7), When (8) and (9) are detected, the cumulative count number becomes 3, and the conveyance is stopped.
[0056]
Further, in the conveyance shown in FIG. 8B, the second sensor 17B detects the round holes 10 and 11 between the start of conveyance and the 2.5-pitch conveyance, but the first sensor At 17A, holes {circle over (8)}, {circle over (9)}, and circle 10 are detected, the cumulative count becomes 3, and the conveyance is stopped.
Hereinafter, although a specific description of transport of the tape substrate 3A is omitted, the cumulative count number is alternately 3 by the first sensor 17A and the second sensor 17B along with the transport. That is, the conveyance of the tape substrate 3A is stopped and controlled while the final hole 12 is detected.
[0057]
A specific flow of the count number check process in this case is as shown in FIG. In step 1, tape substrate conveyance is started, and in step 2, the previous conveyance method is determined and the count number in each sensor 17A, 17B is determined.
That is, it is determined whether the state in which the previous conveyance is completed is the state of (A) or (B) in FIGS. 7 and 8, and the count number of each sensor is determined according to the number of conveyances. In the state of (A), the first sensor 17A is 2 and the second sensor 17B is 3, and in the state of (B), the first sensor is 3 and the second sensor is 2.
[0058]
In addition, the sensor for counting the final hole 12 is determined. In the state of FIG. 7 and FIG. 8A, it is the 2nd sensor 17B, and in the state of (B), it is the 1st sensor 17A.
Next, in step 3, an end check of the hole count number of each sensor 17A, 17B is performed. That is, the control unit 10A monitors the count number of the hole 12 detected by the first sensor 17A and the second sensor 17B, and whether the sensor that counts the final hole detects the set number of holes. To check.
[0059]
For example, it is checked whether or not the cumulative count number of the second sensor 17B has become 3, but in order to prevent erroneous detection, the count numbers of both the first sensor and the second sensor are checked.
In the case of Yes in step 3, it is determined that the count number end determination has been obtained, the process proceeds to step 4 to stop control of the drive motor 15, and in step 5, the hole number counting process is stopped and reset. Then, the process ends at step 6.
[0060]
Since the decimal point pitch conveyance, which differs from the tape pitch reference such as the above half pitch feed, is performed based on the hole portion, the stop accuracy can be improved compared to the case where the offset drive is performed by the search speed feed, for example, Decimal point pitch conveyance that maintains high-precision conveyance at high speed is possible without extending the time.
The offset driving will be further described. For example, at the high feed rate of 600 m / s and the search speed of 30 m / s, after the final hole is detected, the distance corresponding to the half pitch (2.375 mm) is sent as the offset drive at the search speed. In this case, the feeding time is 79 ms.
[0061]
On the other hand, the transport time when the distance corresponding to the harp pitch is sent at a high feed rate is only about 3.96 ms. By performing the above-described offset driving, the conveyance time is extended by about 75 ms.
In a normal bonding apparatus, since the tape substrate recognition operation is started after the completion of the conveyance operation, the start of the next recognition operation is affected by the increase in the conveyance time. As a result, the increase in the conveyance time directly affects the tact time. In addition, since the offset drive is performed by the feed amount of the motor, there is a decrease in stop accuracy due to the occurrence of slippage of the tape substrate.
[0062]
On the other hand, in the transport method of the present invention, since the transport is based on the hole 12, it is possible to transport any decimal point pitch without causing a decrease in stop accuracy with respect to the tape-based target stop position.
In the above-described embodiment, since the half pitch feed is performed, there are two mounting positions of the electrical component, that is, the 1 pitch position and the half pitch position of the hole, but the present invention is not limited to this.
[0063]
Depending on the bonding specifications, there are three or four transport patterns. In such conveyance, the number of sensors for detecting the hole 12 may be provided corresponding to the number of conveyance patterns.
Further, in the second transport method described above, when the decimal point pitch changes complicatedly, the position of the second sensor is made movable within the range of one pitch of the hole portion, and the immediately preceding transport method and the current transport method are made. The number of holes detected by each sensor and the sensor for detecting the final hole are determined from the method, and the position of the second sensor is calculated and moved.
[0064]
As a result, even if there are a plurality of transport patterns, two sensors can be used to transport the decimal point pitch on the basis of the hole without adding a sensor as in the first transport method.
Furthermore, in the third conveying method described above, one sensor is used to detect the hole, and the sensor position is movable within a range of one pitch. Then, by setting the number of holes to be detected from the immediately preceding conveyance method and the current conveyance method, and calculating and moving the position of the sensor, it is possible to convey the decimal point pitch with the hole reference by one sensor. .
[0065]
Regardless of whether the second transport method or the third transport method is adopted, the offset movement is eliminated by the search speed corresponding to the decimal point pitch, as in the first transport method. Decimal point pitch conveyance is possible while maintaining conveyance.
[0066]
【The invention's effect】
As described above, according to the present invention, it is possible to perform highly accurate bonding at a high speed and to provide highly reliable electrical components.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a bonding apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic configuration diagram of a tape transport unit in the bonding apparatus according to the embodiment.
FIG. 3 is a flowchart of transport control in a tape transport unit according to the embodiment.
FIG. 4 is a diagram showing a conveyance speed profile in a tape conveyance unit according to the embodiment.
FIG. 5 is a schematic configuration diagram of a tape transport unit and a control unit in a bonding apparatus according to another embodiment.
FIG. 6 is a flowchart of various transport controls in the tape transport unit according to the embodiment.
FIG. 7 is a diagram for explaining the actual counting of holes in the embodiment;
FIG. 8 is a diagram for explaining the actual counting of the hole portion subsequent to FIG. 7 in the embodiment;
FIG. 9 is a flowchart of count number check processing according to the embodiment;
FIG. 10 is a diagram showing a conventional conveyance speed profile of different tape substrates.
[Explanation of symbols]
12 ... hole,
3, 3A ... tape substrate,
14 ... Conveying roller,
6 ... IC chip (electric part),
4, 4A ... Tape transport section (transport means),
17, 17A, 17B ... hole detection sensor (detection means),
10, 10A ... control section (control means),
1 ... Bonding head (bonding means).

Claims (5)

The tape substrate in which holes are provided at predetermined pitches in the length direction is frictionally driven, and is positioned at a predetermined position with reference to the holes, and the process of attaching components to the positioned tape substrate is repeated. A method of manufacturing a component,
Transport of the tape substrate is
A high-speed conveyance step of sending the tape substrate by a predetermined length at a first speed;
A search conveyance step of sending the tape substrate at a second speed slower than the first speed;
All the holes provided in the tape substrate are detected through the high-speed transport process and the search transport process to count the number of holes, and when the count reaches a predetermined number, the tape substrate And a stopping step of stopping the conveyance of the electric component. A bonding apparatus that conveys a tape substrate having holes at a predetermined pitch in the length direction by friction drive and positions the tape substrate at a predetermined position, and attaches components to the positioned tape substrate,
Detection means for detecting a hole passing through the predetermined region and emitting a detection signal;
Counting means for counting the number of the holes based on the detection signal by the detecting means;
From the stop state, the tape substrate is fed by a predetermined length at a first speed, then switched to a second speed slower than the first speed, and the tape substrate is fed by the first speed and the second speed. A bonding apparatus comprising: a control unit that stops the tape substrate conveyance in accordance with the number of holes counted by the counting unit during conveyance. The tape substrate having holes provided at a predetermined pitch in the length direction is conveyed by friction drive, and the tape substrate is positioned at a set pitch position and a decimal point pitch position of 1 pitch or less, and this positioning is performed. A bonding apparatus for attaching components to a tape substrate,
A plurality of detection means that are arranged in the number corresponding to the conveyance pattern at the pitch position and the decimal point pitch position of the hole, each detecting a hole that passes through a predetermined region, and generating a detection signal;
Based on detection signals from the plurality of detection means, a counting means for counting the number of the holes in each detection means,
From the stop state, the tape substrate is fed by a predetermined length at a first speed, then switched to a second speed that is slower than the first speed, and the tape substrate is conveyed during the transfer of the tape substrate at the second speed. A bonding apparatus comprising: a control unit that stops conveyance of the tape substrate in accordance with the number of holes in the predetermined detection unit that counts by the counting unit. The tape substrate having holes provided at a predetermined pitch in the length direction is conveyed by friction drive, and the tape substrate is positioned at a set pitch position and a decimal point pitch position of 1 pitch or less, and this positioning is performed. A bonding apparatus for attaching components to a tape substrate,
A first detection means arranged opposite to the set hole pitch position and detecting a hole passing through a predetermined region and generating a detection signal;
A second detection means that is movably disposed at a set decimal point pitch position and detects a hole passing through a predetermined area and generates a detection signal;
Counting means for counting the number of the holes based on the detection signals from the first and second detection means;
From the stop state, the tape substrate is fed by a predetermined length at a first speed, then switched to a second speed that is slower than the first speed, and the tape substrate is conveyed during the transfer of the tape substrate at the second speed. And a control means for stopping the conveyance of the tape substrate in accordance with the number of holes counted by the counting means. The tape substrate having holes provided at a predetermined pitch in the length direction is conveyed by friction drive, and the tape substrate is positioned at a set pitch position and a decimal point pitch position of 1 pitch or less, and this positioning is performed. A bonding apparatus for attaching components to a tape substrate,
Detecting means for detecting a hole portion that is disposed within a range of one pitch of the hole portion and is freely displaceable at a set decimal point pitch position and that passes through a predetermined region;
Counting means for counting the number of the holes based on the detection signal by the detecting means;
From the stop state, the tape substrate is fed by a predetermined length at a first speed, then switched to a second speed that is slower than the first speed, and the tape substrate is conveyed during the transfer of the tape substrate at the second speed. And a control means for stopping the conveyance of the tape substrate in accordance with the number of holes counted by the counting means.

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