JP2008041733A - Electronic component mounting apparatus, and substrate heating method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and a substrate heating method capable of preventing overheating of a substrate. <P>SOLUTION: The electronic component mounting apparatus is provided with a component housing unit for housing electronic components; a substrate holding unit for holding a substrate; a mounting head for mounting an electronic component picked up from the component housing unit on a substrate held on the substrate holding unit; a substrate heating unit 7 for heating the substrate held on the substrate holding unit; a heating operation control unit 30 for controlling a substrate heating operation by the substrate heating unit; a specific operation registering unit 33 for previously registering a specific operation among operations to be performed in a mounting operation for mounting electronic components on the substrate held on the substrate holding unit; and a specific operation detecting unit 34 for detecting start of the specific operation registered in the specific operation registering unit 33. Heating the substrate is interrupted at the time point when a predetermined time elapses after the detecting unit 34 detects the start of the operation registered in the registering unit 33. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and a substrate heating method for mounting electronic components on a substrate.

An electronic component mounting apparatus having a plurality of mounting systems is known for the purpose of improving the mounting efficiency of electronic components. For example, in the electronic component mounting apparatus disclosed in Patent Document 1, two mounting heads are provided for one wafer sheet in which a plurality of electronic components are arranged, and each electronic component picked up by each mounting head is provided. It is configured to be mounted in parallel on a plurality of substrates arranged corresponding to the mounting head. Since the resin adhesive for joining electronic components is previously given to the board | substrate, the state which can exhibit the adhesive force of the resin adhesive can be maintained by applying heat to the board | substrate from the outside.
JP 2005-72444 A

  Resin adhesives have the property of deteriorating due to long-time heating and lowering the adhesive force, so if mounting is performed after a long time has elapsed since the start of heating to the substrate, the desired adhesive force will not be demonstrated. However, there is a problem that the mounting quality is deteriorated. In particular, in the electronic component mounting apparatus disclosed in Patent Document 1, since mounting is performed on a plurality of substrates with one mounting head, other substrates wait for mounting when mounting on a certain substrate. The heating time was longer as the waiting time was longer.

  Therefore, an object of the present invention is to provide an electronic component mounting apparatus and a substrate heating method that prevent overheating of the substrate.

  The electronic component mounting apparatus according to claim 1, wherein a component storage unit that stores electronic components, a substrate holding unit that holds a substrate, and a substrate in which an electronic component picked up from the component storage unit is held by the substrate holding unit. Mounted on the substrate, a substrate heating unit for heating the substrate held by the substrate holding unit, a heating operation control unit for controlling the heating operation of the substrate by the substrate heating unit, and held by the substrate holding unit A specific operation registration unit that registers in advance a specific operation among the operations performed in the mounting operation of mounting the electronic component on the substrate, and a specific operation detection unit that detects the start of the operation registered in the specific operation registration unit. And the heating operation control unit performs control to interrupt heating of the substrate when a predetermined time has elapsed since the start of the operation registered in the specific operation registration unit is detected by the specific operation detection unit.

  An electronic component mounting apparatus according to a second aspect is the electronic component mounting apparatus according to the first aspect, wherein an error stop that occurs during the mounting operation is registered in the specific operation registration unit.

  The substrate heating method according to claim 3 is the substrate heating method in the electronic component mounting apparatus according to claim 1, wherein the specific operation registration unit is heating the substrate held by the substrate holding unit. When the start of the registered operation is detected, the heating of the substrate is interrupted when a predetermined time has elapsed.

The substrate heating method according to claim 4 is the substrate heating method in the electronic component mounting apparatus according to claim 2, wherein an error stop occurs when the substrate held by the substrate holding part is heated. When the predetermined time has elapsed, the heating of the substrate is interrupted.

  According to the present invention, since the heating is interrupted after a predetermined time has elapsed since the start of the specific operation for waiting the substrate being heated to suppress excessive heating of the substrate, it is possible to prevent a reduction in mounting quality and production efficiency. it can.

  Embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 3 is an electronic component mounting apparatus according to the embodiment of the present invention. FIG. 4 is a graph showing the substrate heating operation of the electronic component mounting apparatus according to the embodiment of the present invention in time series.

  First, the configuration of the electronic component mounting apparatus will be described with reference to FIG. 1 and FIG. The electronic component mounting apparatus 1 is a dual head type mounting apparatus that includes two independent mounting heads and that has a plurality of substrates arranged corresponding to the mounting heads. On one end side of the electronic component mounting apparatus 1, conveyance rails 3 and 4 that convey and hold the substrate 2 are extended in one direction. In the middle of the transport path by the transport rails 3 and 4, the first substrate holding places 3 a and 4 a that hold the substrate 2 on the downstream side with respect to the transport direction of the substrate (see arrow A), and the substrate 2 on the upstream side. Second substrate holding portions 3b and 4b for holding are provided. The transport rails 3 and 4 not only transport the substrate 2, but also function as a substrate holder that holds the substrate 2 at the first substrate holding locations 3a and 4a and the second substrate holding locations 3b and 4b. The board 2 carried into the electronic component mounting apparatus 1 is temporarily stopped at the board holding places 3a, 3b, 4a and 4b by the board stopper 5 and held at the board holding places 3a, 3b, 4a and 4b. After the electronic component is mounted, the electronic component is unloaded from the electronic component mounting apparatus 1. The substrate stopper 5 is movable between a position where the conveyance of the substrate 2 is allowed and a position where the substrate 2 is restricted, and stops the substrate 2 at each of the substrate holding locations 3a, 3b, 4a, 4b when the substrate stopper 5 is in the restricted position.

  A substrate sensor 6 is provided corresponding to each substrate holding location 3a, 3b, 4a, 4b, and detects the substrate 2 held in each substrate holding location 3a, 3b, 4a, 4b. A substrate heating unit is provided corresponding to each substrate holding location 3a, 3b, 4a, 4b, and heats the substrate 2 held in each substrate holding location 3a, 3b, 4a, 4b. The substrate heating unit includes a substrate heating stage 7 having a heat generating unit such as a sheath heater or a ceramic heater, and a substrate heating stage elevating mechanism 8. The substrate heating stage 7 is located at the substrate holding locations 3a, 3b, 4a, and 4b. By moving up and down below the substrate 2, it is brought into contact with and separated from the lower surface of the substrate 2. Heating of the substrate 2 is started by bringing the substrate heating stage 7 into contact with the lower surface of the substrate 2, and heating of the substrate 2 is interrupted or stopped by moving the substrate heating stage 7 away from the lower surface of the substrate 2. By heating the substrate 2 from the lower surface side, the resin adhesive applied to the upper surface of the substrate 2 is heated and maintained in an adhesive state that exerts an adhesive force for joining the electronic components.

  The other end side of the electronic component mounting apparatus 1 serves as a component storage unit, and a wafer sheet 9 is disposed apart from the transport rails 3 and 4. A plurality of electronic components 10 are attached to the upper surface of the wafer sheet 9 and stored in a regularly arranged state. The wafer sheet 9 is set on a wafer sheet holding table 11 that can reciprocate in the same direction as the extending direction of the transport rails 3 and 4 (see arrow B). An ejector 12 is disposed on the lower surface side of the wafer sheet 9. The ejector 12 includes an ejector head 12 a that protrudes upward and downward. The ejector 12 can move in synchronization with the movement of the wafer sheet holding table 11, and can be moved below any electronic component 10. When picking up the electronic component 10, the ejector head 12 a protrudes below the arbitrary electronic component 10, and the electronic component 10 is pushed up from the wafer sheet 9 side, so that the electronic component adhered to the upper surface of the wafer sheet 9. 10 peeling is promoted.

  The electronic component mounting apparatus 1 can be set on the wafer sheet holding table 11 while exchanging a plurality of wafer sheets 9 prepared in advance. A plurality of wafer sheets 9 storing electronic components 10 of a desired type are stored in a wafer sheet holding unit (not shown), and the wafer sheet 9 set on the wafer sheet holding table 11 is converted into a wafer sheet by a wafer sheet changing unit (not shown). The wafer sheet 9 is temporarily returned to the storage section, and instead, the wafer sheet 9 storing the desired type of electronic component 10 is set on the wafer sheet holding table 11. As a result, the electronic component mounting apparatus 1 can mount a variety of electronic components on the substrate 2, and can smoothly replace the wafer sheet 9 that has run out of components with a new wafer sheet 9.

  The electronic component mounting apparatus 1 includes two mounting heads, a first mounting head 13 and a second mounting head 14. The first mounting head 13 is mounted on the first orthogonal robot 15 and can be moved horizontally above the two substrates 2 held by the component storage portion and the first substrate holding locations 3a and 4a. ing. The second mounting head 14 is mounted on the second orthogonal robot 16 and can be moved horizontally above the two substrates 2b held by the component storage portion and the second substrate holding locations 3b and 4b. It has become. Since only one wafer sheet 9 is provided for the two mounting heads 13 and 14 in the component storage unit, the pickup is moved to a position close to any of the mounting heads 13 and 14. To do. The first mounting head 13 and the second mounting head 14 are provided with a plurality of nozzles 17 and 18 for picking up the electronic component 10 from the wafer sheet 9.

  The electronic component mounting apparatus 1 includes a plurality of cameras that capture images of predetermined objects. Mounting accuracy is improved by analyzing the image of the object imaged by each camera and recognizing the exact position of the object. The first substrate recognition camera 19 and the second substrate recognition camera 20 are respectively mounted on the first orthogonal robot 15 and the second orthogonal robot 16 and integrated with the first mounting head 13 or the second mounting head 14. It is possible to move horizontally. The first substrate recognition camera 19 and the second substrate recognition camera 20 image position recognition marks (not shown) at a plurality of mounting locations set in advance on each substrate 2. Thereby, the electronic component attracted | sucked by each nozzle 17 and 18 can be correctly positioned and mounted in each mounting location.

  The first component recognition camera 21 is disposed at a position above the movement path of the wafer sheet 9. The first component recognition camera 21 is mounted on a component recognition camera moving table 22 and is horizontally movable in a direction (see arrow C) perpendicular to the moving direction of the wafer sheet 9 (see arrow B). By combining the movement of the wafer sheet 9 orthogonal to the movement of the first component recognition camera 21, all the electronic components 10 attached to the upper surface of the wafer sheet 9 are imaged by the first component recognition camera 21. . Thereby, each nozzle 17 and 18 can be correctly positioned and adsorbed to an arbitrary electronic component 10.

  The second component recognition camera 23 is disposed in the middle of the movement path when the first mounting head 13 that picks up the electronic component 10 from the wafer sheet 9 moves to the substrate 2. The second component recognition camera 23 is fixed to the electronic component mounting apparatus 1 and picks up an image of the electronic component 10 picked up by the first mounting head 13 passing therethrough from below. Thereby, the amount of positional deviation of the electronic component 10 with respect to the central axis of each nozzle 17 and 18 is recognized. This recognized positional deviation amount is corrected when the electronic component 10 is mounted on the mounting location of the substrate 2. The third component recognition camera 24 is disposed in the middle of the movement path of the second mounting head 14 and has the same function as the second component recognition camera 23.

Next, the configuration of the control system related to the heating operation in the electronic component mounting apparatus will be described with reference to FIG. The substrate sensor 6 is provided corresponding to each substrate holding location 3a, 3b, 4a, 4b, detects the substrate held at each substrate holding location 3a, 3b, 4a, 4b, and heats the detection signal. It transmits to the control part 30. The substrate heating stage 7 is provided corresponding to each substrate holding location 3a, 3b, 4a, 4b, and is maintained in a heat generation state or a non-heat generation state by the heating operation control unit 30. The substrate heating stage elevating mechanism 8 is provided corresponding to each substrate heating stage 7. When a heating start command is received from the heating operation control unit 30, the substrate heating stage 7 is raised and brought into contact with the lower surface of the substrate 2. . When a heating interruption or stop command is received from the heating operation control unit 30 or when a preset heating time has elapsed, the substrate heating stage 7 is lowered and separated from the lower surface of the substrate 2. Since the substrate heating stage 7 requires time from the start of heat generation until it reaches a certain temperature, the substrate heating stage 7 is always maintained in a heat generation state while the electronic component mounting apparatus 1 is in operation.

  In the same figure, the heating mode memory | storage part 31 memorize | stores the some heating mode regarding the timing of the heating start in heating operation. Among these, the first heating mode is a heating mode in which heating is started from the time when the substrate 2 carried into the electronic component mounting apparatus 1 is held in each of the substrate holding locations 3a, 3b, 4a, and 4b, and the heating operation control is performed. When receiving the detection signal from the substrate sensor 6, the unit 30 transmits a substrate heating command to the substrate heating stage elevating mechanism 8 without interruption. The second heating mode is a heating mode in which heating is started from the time when the electronic component is mounted after the substrate 2 carried into the electronic component mounting apparatus 1 is held in each of the substrate holding locations 3a, 3b, 4a, and 4b. It is. In the second heating mode, the heating operation control unit 30 does not transmit a substrate heating command to the substrate heating stage elevating mechanism 8 even when a detection signal is received from the substrate sensor 6, for example, the first mounting head 13. When the mounting target is transferred from the substrate 2 held at the first substrate holding location 4a to the first substrate holding location 3a, that is, before the electronic component 10 is mounted on the substrate 2 to be mounted next. When the operation is performed, a substrate heating command is transmitted. Note that the mounting operation in the electronic component mounting apparatus 1 is controlled by the mounting operation control unit 24, and the operation signal of each driving unit provided in the electronic component mounting apparatus 1 and the error stop signal generated in the electronic component mounting apparatus 1 are: It is transmitted from the mounting operation control unit 24 to the heating operation control unit 30.

  As the heating mode in the heating operation, the heating mode changing unit 32 can select either the first heating mode or the second heating mode. When the first heating mode is selected, heating is started from the time when the substrate 2 is held by the substrate holding locations 3a, 3b, 4a, and 4b, so that an adhesive state in which the electronic component 10 can be mounted is maintained at any time. Accordingly, the time required for mounting the electronic component 10 on the substrate 2 is determined only by the time required for the mounting heads 13 and 14 to repeat the operation of picking up the electronic component 10 from the wafer sheet 9 and mounting it on the substrate 2. Thus, it is not necessary to consider the time required for bringing the resin adhesive into an adhesive state. As a result, the number of electronic components mounted per unit time increases, and the production efficiency can be improved.

  On the other hand, when the second heating mode is selected, the heating is started after the operation in the previous stage of mounting the electronic component 10 is performed. Therefore, depending on the operation timing of the mounting heads 13 and 14, the resin adhesive may be bonded. There may be a waiting time until However, since the resin adhesive has the property that when it is heated more than necessary, it changes in quality and the adhesive force decreases, so that when the electronic component 10 is mounted on the substrate 2 after a long time has elapsed since the start of heating, a desired adhesion is achieved. There is a problem that the mounting quality deteriorates without exerting power. In particular, in the case of a device that mounts on a plurality of substrates 2 with one mounting head 13, 14 as in the electronic component mounting device 1, when mounting on one substrate 2, another substrate 2 Is in a state of waiting for mounting, the heating time becomes longer as the waiting time becomes longer. In such a case, in the second mounting mode, since heating is started for the first time before mounting on a certain substrate 2, excessive heating of the substrate 2 can be suppressed, and the mounting quality is reduced. Can be prevented.

In the electronic component mounting apparatus 1, in addition to pure production operation related to mounting of the electronic component 10,
Maintenance, parts replacement operation, camera calibration operation, mounting load confirmation operation, error solution operation, etc. may be performed. When operations other than these pure production operations are performed, the mounting operation is temporarily interrupted. Therefore, the operation that causes the mounting operation to be interrupted is registered in advance in the specific operation registering unit 33 as the specific operation, and when the specific operation is performed in the electronic component mounting apparatus 1, the control for interrupting the heating of the substrate 2 is performed. Excessive heating when the mounting operation is interrupted can be suppressed.

  For example, when exchanging the wafer sheet 9 at the time of component breakage or product type exchange, it is necessary to stop the operation of the mounting heads 13 and 14, so that production temporarily stops. Therefore, when the wafer sheet replacement operation registered in the specific operation registration unit 33 is performed during the heating of the substrate 2, a specific operation detection signal is transmitted from the specific operation detection unit 34 to the heating operation control unit 30, and the specific operation detection unit The heating operation control unit 30 that has received the specific operation detection signal from 34 transmits a substrate heating interruption command to the substrate heating stage elevating mechanism 8. The substrate heating stage elevating mechanism 8 that has received the substrate heating interruption command lowers the substrate heating stage 7 and separates it from the lower surface of the substrate 2. When the wafer sheet replacement operation is completed, the substrate heating stage 7 is raised and the heating of the substrate 2 is resumed. Thereby, while the specific operation such as the exchange operation of the wafer sheet 9 is being performed, the heating of the substrate 2 is interrupted, so that the excessive heating of the substrate 2 is suppressed and the deterioration of the mounting quality can be prevented. it can.

  The specific operation duration measuring unit 35 measures the elapsed time from the time when the specific operation registered in the specific operation registration unit 33 is started. The specific operation continuation allowable time storage unit 36 stores a continuation time allowed for each specific operation registered in the specific operation registration unit 33 in advance. The measured duration value by the specific operation duration measurement unit 35 is transmitted to the heating operation control unit 30 and compared with the allowable time stored in the specific operation continuous allowable time storage unit 36. When the measured value of the continuous time exceeds the allowable time, a substrate heating interruption command is transmitted from the heating operation control unit 30 to the substrate heating stage elevating mechanism 8, and the heating of the substrate 2 is interrupted.

  When the allowable time is set to zero, the heating operation control unit 30 transmits a substrate heating interruption command to the substrate heating stage elevating mechanism 8 when the specific operation detection signal is received from the specific operation detection unit 34. If the specific operation is completed without reaching the set allowable time, the heating operation control unit 30 does not transmit a substrate heating interruption command, and heating of the substrate 2 is not interrupted. Although it is desirable to set the allowable time to a value close to zero from the viewpoint of preventing a reduction in mounting quality, the heating operation is frequently interrupted, which is not preferable from the viewpoint of production efficiency. On the contrary, if the allowable time is set longer, the number of times the heating is interrupted decreases, but the problem of overheating occurs. Therefore, in view of the balance between quality and efficiency required for production in consideration of the occurrence rate of specific operation and specific operation duration time assumed in the electronic component mounting apparatus 1, it is desirable that an arbitrary allowable time for each specific operation. Set.

  For example, since the electronic component electronic component mounting apparatus 1 includes a plurality of drive units, it is assumed that an error stop due to an operation failure of each drive unit may occur, but depending on the content of the error, it can be solved immediately. There is also. Therefore, it is possible to maintain the balance between quality and efficiency by setting the allowable time so that heating is interrupted only in the case of an error stop that requires time to resolve, and the heating is not interrupted for other error stops. .

Next, the substrate heating operation in the electronic component mounting apparatus will be described with reference to FIG. This figure is a graph showing the heating status of the substrate held at the substrate holding location in time series. At time t1, the substrate is held at the substrate holding location. When the first heating mode is selected, heating is started from the time when the substrate is held at the substrate holding position at time t1, but when the second heating mode is selected, mounting is performed. The heating operation is started from time t2 when the operation starts (FIG. 4 shows a heating state when the second heating mode is selected). When the wafer sheet is exchanged at time t3 after the start of heating, since the wafer sheet exchange operation is registered as a specific operation, heating of the substrate is interrupted during the exchange. Since the allowable time for wafer sheet exchange is set to zero, the heating of the substrate is interrupted from the time when the exchange is started. When the exchange of the wafer sheet is completed at time t4, the heating of the substrate is resumed. Although an error has occurred between time t5 and time t6, since the error stop time T1 does not exceed the allowable time T3, the heating is not interrupted. On the other hand, in the case of an error that occurred between time t7 and time t9, the error stop time T2 exceeds the allowable time T3. Interrupted.

  As described above, by controlling the heating operation of the substrate in the electronic component mounting apparatus and interrupting the operation according to the situation, excessive heating of the substrate can be suppressed and deterioration of the mounting quality can be prevented. Conditions such as timing for interrupting the heating operation can be arbitrarily set from the viewpoint of the balance between quality and efficiency required for production.

  According to the present invention, there is an advantage in that heating is interrupted after a predetermined time has elapsed since the start of a specific operation for waiting the substrate being heated, and excessive heating of the substrate is suppressed. This is useful in the field of electronic component mounting.

The top view of the electronic component mounting apparatus of embodiment of this invention The side view of the electronic component mounting apparatus of embodiment of this invention Configuration diagram of a control system of an electronic component mounting apparatus according to an embodiment of the present invention The graph which shows the board | substrate heating operation of the electronic component mounting apparatus of embodiment of this invention in time series

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Board | substrate 3, 4 Conveyance rail 7 Substrate heating stage 9 Wafer sheet 10 Electronic component 13 1st mounting head 14 2nd mounting head 30 Heating operation control part 32 Heating mode change part 33 Specific operation | movement registration part 34 Specific motion detector

Claims (4)

A component storage unit that stores electronic components, a substrate holding unit that holds a substrate, a mounting head that mounts an electronic component picked up from the component storage unit on a substrate held by the substrate holding unit, and a substrate holding unit It is performed in a mounting operation for mounting an electronic component on a substrate held by the substrate holding unit that heats the held substrate, a heating operation control unit that controls the heating operation of the substrate by the substrate heating unit, and the substrate holding unit. A specific operation registration unit that pre-registers a specific operation among the operations, and a specific operation detection unit that detects the start of the operation registered in the specific operation registration unit,
An electronic component mounting apparatus that performs control for interrupting heating of a substrate when a predetermined time has elapsed after the heating operation control unit detects the start of an operation registered in the specific operation registration unit by the specific operation detection unit.   The electronic component mounting apparatus according to claim 1, wherein an error stop that occurs during the mounting operation is registered in the specific operation registration unit. A method for heating a substrate in the electronic component mounting apparatus according to claim 1,
A substrate heating method in which heating of a substrate is interrupted when a predetermined time elapses when the start of an operation registered in the specific operation registration unit is detected while heating the substrate held by the substrate holding unit. A substrate heating method in the electronic component mounting apparatus according to claim 2,
A substrate heating method in which heating of a substrate is interrupted when a predetermined time elapses when an error stop occurs when the substrate held by the substrate holding unit is heated.

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