JPH0294530A - Positioning method of semiconductor part - Google Patents

Abstract

PURPOSE:To mount a semiconductor part at a normal position on a substrate with high accuracy by computing the quantity of the positional displacement of the semiconductor part actually sucked to a suction nozzle and correcting a position on the basis of the quantity of the positional displacement. CONSTITUTION:The position of a semiconductor part 1A actually sucked to a suction nozzle 5 is recognized by comparing an image sensing pattern 11 with a normal-place pattern 12, and the quantities of the positional displacement (x), (y) of the semiconductor part are computed. The suction nozzle 5 is moved onto a substrate 7. The substrate 7 is placed onto a heater block 10 into which a heater 9 is buried, and adhesives 8 are attached at the required location of the substrate. The locations of the suction nozzle 5 and the semiconductor part 1A on the substrate 7 are corrected to reference positions on the basis of the quantities of positional displacement (x), (y) acquired by a rear recognition device 6, and the suction nozzle 5 is lowered and the semiconductor part 1A is loaded on the substrate 7. Accordingly, positional displacement at the time of the suction of the suction nozzle 5 can be corrected, thus loading the semiconductor part 1A at the normal location 13 of the substrate 7.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for positioning semiconductor components during die bonding of semiconductor components.

(Prior art) In general, in bonding of semiconductor components, in which semiconductor components cut into small die shapes from a semiconductor wafer are adsorbed and mounted on the substrate of a semiconductor device, the semiconductor components are accurately positioned and mounted on the substrate. Therefore, conventionally, a bonding method shown in FIG. 5 has been used.

That is, a semiconductor wafer 1 cut into small die shapes is adhered to an adhesive tape 3 attached to a ring 2, and each cut semiconductor component IA is sucked by a suction nozzle 5. At this time, the surface of the semiconductor component IA is photographed using the recognition device 4, its position is calculated, and the position of the semiconductor component IA and the position of the suction nozzle 5 are matched. Suction nozzle 5
The semiconductor component IA that has been sucked is transported onto a substrate 7 placed on a heater block 10 having a heater 9, and is bonded to the substrate 7 using an adhesive 8.

[Problem to be solved by the invention]

In the conventional positioning method described above, since the semiconductor component IA picked up by the suction nozzle 5 is mounted on the substrate 7 in that state, it is difficult to correct the position of the semiconductor component IA during this period. Therefore, if a positional deviation occurs during position recognition and suction by the suction nozzle 5 when picking up the semiconductor component IA, this positional deviation will directly result in misalignment of the mounting position on the board 7, which will cause defective products in the semiconductor device. It became.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for positioning semiconductor components that can prevent the occurrence of defective semiconductor devices by preventing misalignment of semiconductor components.

(Means for Solving the Problems) The semiconductor component positioning method of the present invention involves sucking semiconductor components cut into small die shapes from a semiconductor wafer using a suction nozzle, and transporting and mounting the semiconductor components on a substrate. A back side recognition device that recognizes the back side of the semiconductor component is installed between the suction point of the semiconductor component and the substrate, and the amount of positional deviation of the semiconductor component from the normal position is calculated during the transportation of the semiconductor component, and this position is calculated. Based on the amount of deviation, the amount of positional deviation of the semiconductor component when mounted on the board is corrected.

[Effect]

In the method described above, the amount of positional deviation of the semiconductor component actually picked up by the suction nozzle is calculated in the backside recognition device, and the position is corrected based on this amount of positional deviation, so the semiconductor component is placed in the correct position on the board with high precision. can be implemented.

〔Example] Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a schematic diagram for implementing the method of the invention. As shown in a plan view in FIG. 2, a semiconductor wafer 1 cut into small die shapes is adhered to an adhesive tape 3 attached to a ring 2. In this state, the recognition device 4 is used to recognize the position of the semiconductor component IA to be mounted, and the suction nozzle 5 suctions it.

Then, while the semiconductor component IA is being transported toward the substrate by the suction nozzle 5, the suction nozzle 5 is temporarily stopped. A backside recognition device 6 is provided directly below this stop position, and the backside of the semiconductor component IA is photographed here. Then, as shown in FIG. 3(a), by comparing this imaged pattern 11 with the normal position pattern 12, the position of the semiconductor component IA actually sucked by the suction nozzle 5 can be recognized, and the positional deviation can be detected. Calculate the quantities x and y.

After that, the suction nozzle 5 is moved onto the substrate 7. The substrate 7 is placed on a heater block 10 in which a heater 9 is embedded, and an adhesive 8 is provided at required locations. and,
Based on the positional deviation amounts x and y determined by the back side recognition device 6,
After correcting the positions of the suction nozzle 5 and the semiconductor component IA on the substrate 7 with respect to the reference position, the semiconductor component IA is mounted on the substrate 7 by lowering the suction nozzle 5.

As described above, the positional deviation of the suction nozzle 5 during suction can be corrected, and the semiconductor component IA can be mounted at the normal position 13 on the substrate 7. Note that it goes without saying that the rotation direction can be corrected.

FIG. 2 is a schematic diagram for explaining another embodiment of the present invention.

In this embodiment, the amount of positional shift of the semiconductor component 1A sucked by the suction nozzle 5 is calculated by the back surface recognition device 6 in the same way as in the previous embodiment. Then, when the suction nozzle 5 is moved to a position on the substrate 7, the heater block 1o is moved in the plane XY force direction based on the positional deviation amounts x and y, and the positional deviation of the heater block 10 and the substrate 7 with respect to the suction nozzle 5 is adjusted. Correct the amount.

In this embodiment, since the correction is made by moving the heater block 10 side, rather than making the correction on the suction nozzle side,
This has the advantage of simplifying the mechanism.

[Effects of the Invention] As explained above, the present invention calculates the amount of positional deviation of the semiconductor component from the normal position during the transportation of the semiconductor component,
Based on this amount of positional deviation, the amount of positional deviation of semiconductor components when mounted on the board is corrected, so it is possible to mount semiconductor components in the correct position on the board with high precision, reduce the number of defective semiconductor devices, and This has the effect that the manufacturing yield of devices can be improved and semiconductor products can be provided at low cost.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram for explaining an embodiment of the method of the present invention, FIG. 2 is a plan view of a semiconductor wafer fixed to a ring,
FIG. 3(a) is a monitor diagram showing the positional deviation calculation state in the recognition device, FIG. 3(b) is a plan view showing the positional correction amount of the semiconductor component with respect to the board, and FIG. 4 is another embodiment of the present invention. FIG. 5 is a schematic diagram for explaining a conventional positioning method. 1... Semiconductor wafer, IA... Semiconductor parts, 2...
・Ring, 3... Adhesive tape, 4... Recognition device, 5
. . . Suction nozzle, 6 . Back surface recognition device, 7 . Substrate, 8 . Adhesive, 9 . - Regular position pattern, 13... regular position. Figure 3 (a) 11 to 14'', Haboon (b) 1st 2nd 5th

Claims (1)

[Claims] 1. Semiconductor components cut into small die shapes from a semiconductor wafer are sucked by a suction nozzle, and then transported and mounted on a substrate. During bonding of semiconductor components, there is a gap between the pickup location of the semiconductor component and the substrate. A backside recognition device that recognizes the backside of a semiconductor component is installed, and the backside recognition device calculates the amount of positional deviation of the semiconductor component from its normal position during the transportation of the semiconductor component, and the amount of positional deviation of the semiconductor component from the normal position is determined based on this amount of positional deviation. A method for positioning a semiconductor component, characterized by correcting the amount of positional deviation of the semiconductor component during mounting.