JP3658401B2 - 固体撮像装置及びそれを用いたカメラ - Google Patents
固体撮像装置及びそれを用いたカメラ Download PDFInfo
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- JP3658401B2 JP3658401B2 JP2003285888A JP2003285888A JP3658401B2 JP 3658401 B2 JP3658401 B2 JP 3658401B2 JP 2003285888 A JP2003285888 A JP 2003285888A JP 2003285888 A JP2003285888 A JP 2003285888A JP 3658401 B2 JP3658401 B2 JP 3658401B2
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- 238000003384 imaging method Methods 0.000 title claims description 61
- 230000003287 optical effect Effects 0.000 claims description 9
- 238000012546 transfer Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- 230000015654 memory Effects 0.000 description 52
- 238000010586 diagram Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 208000009989 Posterior Leukoencephalopathy Syndrome Diseases 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000011514 reflex Effects 0.000 description 2
- 101000622137 Homo sapiens P-selectin Proteins 0.000 description 1
- 102100023472 P-selectin Human genes 0.000 description 1
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- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005375 photometry Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/767—Horizontal readout lines, multiplexers or registers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
2a、2b 水平走査回路
3 垂直走査回路
4a、4b CTメモリブロック
5a、5b 固体撮像装置のパッド
6a、6b アンプ
10 チップ(固体撮像装置)
11 フォトダイオード
12 転送MOSトランジスタ
13 リセットMOSトランジスタ
14 ソースフォロワ入力MOSトランジスタ
15 セレクトMOSトランジスタ
20 垂直信号線
21 ゲート線
22 リセット線
23 セレクト線
41〜44 MOSトランジスタ
61 バリア
62 レンズ
63 絞り
64 固体撮像装置
66 A/D変換器
67 信号処理部
68 タイミング発生部
69 全体制御・演算部
70 メモリ部
71 記録媒体制御I/F部
72 記録媒体
73 外部I/F部
100 パッケージ
101 固体撮像素子
102 画素領域
103 ダイパッド
104 ガラス板
105、固体撮像装置のパッド
106 端子
107 パッケージのパッド
201 フォトダイオード
202 垂直走査回路
203 ゲート線
204 垂直スイッチ
205 水平走査回路
206 水平スイッチ
207 増幅回路
208 垂直信号線
Claims (7)
- 第1の走査手段と、駆動周波数が前記第1の走査手段より遅い第2の走査手段とが、それぞれチップの異なる辺部に隣接して配置される固体撮像装置であって、
前記チップ上に、画素領域と前記画素領域から前記第1および第2の走査手段によって読み出された信号電荷を増幅するアンプとを有し、
前記アンプに電圧を与えるパッド、及び前記アンプの出力を前記チップの外部へ出力するパッドが設けられ、前記パッドは前記第1の走査手段が配置されていない辺部に配置されていることを特徴とする固体撮像装置。 - 前記画素領域には、能動素子を有する画素が2次元状に配置されており、前記能動素子に電圧または接地電位を与えるためのパッドは、前記第1の走査手段が配置されていない辺部に配置されていることを特徴とする請求項1に記載の固体撮像装置。
- 前記能動素子は、転送MOSトランジスタ、リセットMOSトランジスタ、ソースフォロワ入力MOSトランジスタ、セレクトMOSトランジスタ、の内の少なくともいずれか一つであることを特徴とする請求項2に記載の固体撮像装置。
- 前記画素領域は長方形であり、
前記第1の走査手段は、前記画素領域の長辺側に配置されていることを特徴とする請求項1又は2に記載の固体撮像装置。 - 前記第1の走査手段は、前記画素領域を挟むように複数配置されていることを特徴とする請求項4に記載の固体撮像装置。
- 前記第1の走査手段は、水平シフトレジスタよりなり、前記第2の走査手段は、垂直シフトレジスタよりなることを特徴とする請求項1又は2に記載の固体撮像装置。
- 請求項1に記載の固体撮像装置と、
被写体の光学像を結像させるレンズと、
前記固体撮像装置からの信号を処理する信号処理部と、を有することを特徴とするカメラ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003285888A JP3658401B2 (ja) | 2002-09-20 | 2003-08-04 | 固体撮像装置及びそれを用いたカメラ |
US10/664,918 US20040057719A1 (en) | 2002-09-20 | 2003-09-22 | Solid state image pick-up device and camera using the solid state image pick-up device |
US12/061,846 US20080211952A1 (en) | 2002-09-20 | 2008-04-03 | Solid state image pick-up device and camera using the solid state image pick-up device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002275950 | 2002-09-20 | ||
JP2003285888A JP3658401B2 (ja) | 2002-09-20 | 2003-08-04 | 固体撮像装置及びそれを用いたカメラ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004134752A JP2004134752A (ja) | 2004-04-30 |
JP3658401B2 true JP3658401B2 (ja) | 2005-06-08 |
Family
ID=31996211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003285888A Expired - Fee Related JP3658401B2 (ja) | 2002-09-20 | 2003-08-04 | 固体撮像装置及びそれを用いたカメラ |
Country Status (2)
Country | Link |
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US (2) | US20040057719A1 (ja) |
JP (1) | JP3658401B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5247007B2 (ja) * | 2005-06-09 | 2013-07-24 | キヤノン株式会社 | 撮像装置及び撮像システム |
EP2988492B1 (en) * | 2013-04-18 | 2017-12-13 | Olympus Corporation | Image-capturing element, image-capturing device, and endoscope system |
JP6210119B2 (ja) * | 2016-03-23 | 2017-10-11 | 株式会社ニコン | 撮像素子、及び撮像装置 |
JP6451811B2 (ja) * | 2017-09-14 | 2019-01-16 | 株式会社ニコン | 撮像素子、及び撮像装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6316659A (ja) * | 1986-07-09 | 1988-01-23 | Fuji Photo Film Co Ltd | 固体撮像装置 |
JPH05137072A (ja) * | 1991-11-15 | 1993-06-01 | Toshiba Corp | 固体撮像装置 |
JP3179595B2 (ja) * | 1992-11-12 | 2001-06-25 | 株式会社日立製作所 | 半導体集積回路装置およびその製造方法 |
DE69427952T2 (de) * | 1993-11-17 | 2002-04-04 | Canon Kk | Festkörperbildaufnahmevorrichtung |
US5841126A (en) * | 1994-01-28 | 1998-11-24 | California Institute Of Technology | CMOS active pixel sensor type imaging system on a chip |
KR970072990A (ko) * | 1996-04-10 | 1997-11-07 | 이데이 노부유끼 | 고체 화상 장치 |
US6452632B1 (en) * | 1997-01-31 | 2002-09-17 | Kabushiki Kaisha Toshiba | Solid state image sensor and video system using the same |
US6037577A (en) * | 1997-03-11 | 2000-03-14 | Kabushiki Kaisha Toshiba | Amplifying solid-state image pickup device and operating method of the same |
JP3673620B2 (ja) * | 1997-07-18 | 2005-07-20 | キヤノン株式会社 | 光電変換装置 |
JP3445121B2 (ja) * | 1997-10-24 | 2003-09-08 | キヤノン株式会社 | マトリクス基板と液晶表示装置及びこれを用いるプロジェクター |
JPH11125834A (ja) * | 1997-10-24 | 1999-05-11 | Canon Inc | マトリクス基板及び液晶表示装置と投写型液晶表示装置 |
JP4011818B2 (ja) * | 2000-02-29 | 2007-11-21 | キヤノン株式会社 | 半導体固体撮像装置 |
US6653617B2 (en) * | 2000-07-03 | 2003-11-25 | Canon Kabushiki Kaisha | Photoelectric conversion device |
JP2002125156A (ja) * | 2000-08-11 | 2002-04-26 | Nikon Corp | 固体撮像素子及び電子カメラ |
US7139028B2 (en) * | 2000-10-17 | 2006-11-21 | Canon Kabushiki Kaisha | Image pickup apparatus |
US20040223064A1 (en) * | 2002-10-24 | 2004-11-11 | Canon Kabushiki Kaisha | Image pickup element, image pickup device, and differential amplifying circuit |
-
2003
- 2003-08-04 JP JP2003285888A patent/JP3658401B2/ja not_active Expired - Fee Related
- 2003-09-22 US US10/664,918 patent/US20040057719A1/en not_active Abandoned
-
2008
- 2008-04-03 US US12/061,846 patent/US20080211952A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20080211952A1 (en) | 2008-09-04 |
JP2004134752A (ja) | 2004-04-30 |
US20040057719A1 (en) | 2004-03-25 |
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