JP3657386B2 - 半導体製造装置及び半導体製造方法 - Google Patents
半導体製造装置及び半導体製造方法 Download PDFInfo
- Publication number
- JP3657386B2 JP3657386B2 JP11752697A JP11752697A JP3657386B2 JP 3657386 B2 JP3657386 B2 JP 3657386B2 JP 11752697 A JP11752697 A JP 11752697A JP 11752697 A JP11752697 A JP 11752697A JP 3657386 B2 JP3657386 B2 JP 3657386B2
- Authority
- JP
- Japan
- Prior art keywords
- ring
- reaction chamber
- detection
- furnace
- semiconductor manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11752697A JP3657386B2 (ja) | 1997-04-21 | 1997-04-21 | 半導体製造装置及び半導体製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11752697A JP3657386B2 (ja) | 1997-04-21 | 1997-04-21 | 半導体製造装置及び半導体製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH10294286A JPH10294286A (ja) | 1998-11-04 |
| JPH10294286A5 JPH10294286A5 (enExample) | 2005-02-24 |
| JP3657386B2 true JP3657386B2 (ja) | 2005-06-08 |
Family
ID=14713977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11752697A Expired - Lifetime JP3657386B2 (ja) | 1997-04-21 | 1997-04-21 | 半導体製造装置及び半導体製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3657386B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4680350B2 (ja) * | 2000-06-26 | 2011-05-11 | 東京エレクトロン株式会社 | 枚葉式処理装置 |
-
1997
- 1997-04-21 JP JP11752697A patent/JP3657386B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10294286A (ja) | 1998-11-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100246115B1 (ko) | 감압처리장치 및 감압처리방법 | |
| KR100491128B1 (ko) | 기판 처리장치 및 반도체 장치의 제조방법 | |
| US5997651A (en) | Heat treatment apparatus | |
| JPH08195354A (ja) | 半導体製造装置の熱処理炉 | |
| JP2001250787A (ja) | 基板処理装置および基板処理方法 | |
| JP2007242791A (ja) | 基板処理装置 | |
| US5445521A (en) | Heat treating method and device | |
| CN113053785B (zh) | 半导体加工设备 | |
| JP2001015440A (ja) | 半導体製造方法及び装置 | |
| JP3657386B2 (ja) | 半導体製造装置及び半導体製造方法 | |
| JP3449636B2 (ja) | 半導体製造装置 | |
| JP3181308B2 (ja) | 熱処理装置 | |
| JP2002009010A (ja) | 熱処理装置及びその方法 | |
| JP3269881B2 (ja) | 半導体製造装置 | |
| JP2007073746A (ja) | 基板処理装置 | |
| JP3305817B2 (ja) | 半導体製造装置及びウェーハ処理方法 | |
| JP3785247B2 (ja) | 半導体製造装置 | |
| JP2691159B2 (ja) | 縦型熱処理装置 | |
| JP3320505B2 (ja) | 熱処理装置及びその方法 | |
| JP2009016532A (ja) | 基板処理装置及び半導体装置の製造方法 | |
| JP2003209064A (ja) | 半導体製造装置 | |
| JP4364962B2 (ja) | 基板処理装置及び基板処理方法 | |
| JP4490636B2 (ja) | 半導体製造装置および半導体装置の製造方法 | |
| WO2025112883A1 (zh) | 电镀夹具、电镀装置及电镀夹具检测方法 | |
| TW202335086A (zh) | 洩漏檢測裝置，半導體裝置的製造方法，基板處理方法及程式 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040324 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040324 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20041111 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20041124 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050119 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20050301 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20050309 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080318 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090318 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100318 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100318 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110318 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120318 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120318 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130318 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130318 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140318 Year of fee payment: 9 |
|
| EXPY | Cancellation because of completion of term |