JP3642062B2 - 高周波スイッチ - Google Patents
高周波スイッチ Download PDFInfo
- Publication number
- JP3642062B2 JP3642062B2 JP2003191342A JP2003191342A JP3642062B2 JP 3642062 B2 JP3642062 B2 JP 3642062B2 JP 2003191342 A JP2003191342 A JP 2003191342A JP 2003191342 A JP2003191342 A JP 2003191342A JP 3642062 B2 JP3642062 B2 JP 3642062B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- transmission
- reception
- electrode
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
- H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
- H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Waveguide Switches, Polarizers, And Phase Shifters (AREA)
- Transceivers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003191342A JP3642062B2 (ja) | 2003-07-03 | 2003-07-03 | 高周波スイッチ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003191342A JP3642062B2 (ja) | 2003-07-03 | 2003-07-03 | 高周波スイッチ |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07323499A Division JP2002064301A (ja) | 1999-03-18 | 1999-03-18 | トリプルバンド用高周波スイッチモジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004007756A JP2004007756A (ja) | 2004-01-08 |
| JP2004007756A5 JP2004007756A5 (https=) | 2004-10-28 |
| JP3642062B2 true JP3642062B2 (ja) | 2005-04-27 |
Family
ID=30438417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003191342A Expired - Lifetime JP3642062B2 (ja) | 2003-07-03 | 2003-07-03 | 高周波スイッチ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3642062B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1873923A4 (en) | 2005-04-18 | 2013-12-04 | Murata Manufacturing Co | HIGH FREQUENCY MODULE |
| JP5168505B2 (ja) * | 2009-04-30 | 2013-03-21 | 株式会社村田製作所 | 高周波複合部品 |
| JP2011072013A (ja) * | 2010-11-15 | 2011-04-07 | Hitachi Metals Ltd | 高周波回路部品およびこれを用いた通信装置 |
-
2003
- 2003-07-03 JP JP2003191342A patent/JP3642062B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004007756A (ja) | 2004-01-08 |
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