JP3642062B2 - 高周波スイッチ - Google Patents

高周波スイッチ Download PDF

Info

Publication number
JP3642062B2
JP3642062B2 JP2003191342A JP2003191342A JP3642062B2 JP 3642062 B2 JP3642062 B2 JP 3642062B2 JP 2003191342 A JP2003191342 A JP 2003191342A JP 2003191342 A JP2003191342 A JP 2003191342A JP 3642062 B2 JP3642062 B2 JP 3642062B2
Authority
JP
Japan
Prior art keywords
circuit
transmission
reception
electrode
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003191342A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004007756A (ja
JP2004007756A5 (enExample
Inventor
茂 釼持
光弘 渡辺
裕之 但井
剛志 武田
俊彦 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP2003191342A priority Critical patent/JP3642062B2/ja
Publication of JP2004007756A publication Critical patent/JP2004007756A/ja
Publication of JP2004007756A5 publication Critical patent/JP2004007756A5/ja
Application granted granted Critical
Publication of JP3642062B2 publication Critical patent/JP3642062B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Waveguide Switches, Polarizers, And Phase Shifters (AREA)
  • Transceivers (AREA)
JP2003191342A 2003-07-03 2003-07-03 高周波スイッチ Expired - Lifetime JP3642062B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003191342A JP3642062B2 (ja) 2003-07-03 2003-07-03 高周波スイッチ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003191342A JP3642062B2 (ja) 2003-07-03 2003-07-03 高周波スイッチ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP07323499A Division JP2002064301A (ja) 1999-03-18 1999-03-18 トリプルバンド用高周波スイッチモジュール

Publications (3)

Publication Number Publication Date
JP2004007756A JP2004007756A (ja) 2004-01-08
JP2004007756A5 JP2004007756A5 (enExample) 2004-10-28
JP3642062B2 true JP3642062B2 (ja) 2005-04-27

Family

ID=30438417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003191342A Expired - Lifetime JP3642062B2 (ja) 2003-07-03 2003-07-03 高周波スイッチ

Country Status (1)

Country Link
JP (1) JP3642062B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101160733B (zh) 2005-04-18 2011-10-05 株式会社村田制作所 高频模块
JP5168505B2 (ja) * 2009-04-30 2013-03-21 株式会社村田製作所 高周波複合部品
JP2011072013A (ja) * 2010-11-15 2011-04-07 Hitachi Metals Ltd 高周波回路部品およびこれを用いた通信装置

Also Published As

Publication number Publication date
JP2004007756A (ja) 2004-01-08

Similar Documents

Publication Publication Date Title
KR100503647B1 (ko) 멀티밴드용 고주파 스위치 모듈
JP4257481B2 (ja) 高周波スイッチモジュール
JP2983016B2 (ja) マルチバンド用高周波スイッチモジュール
JP3191213B2 (ja) 高周波スイッチモジュール
JP3903456B2 (ja) マルチバンド用高周波スイッチモジュール
JPH11168303A (ja) 高周波スイッチモジュール
JP4120902B2 (ja) マルチバンド用高周波スイッチモジュール
JP3925771B2 (ja) 高周波スイッチモジュール
JP3642062B2 (ja) 高周波スイッチ
JP4247722B2 (ja) 高周波スイッチモジュール
JP3925804B2 (ja) トリプルバンド用高周波スイッチモジュール
JP3824230B2 (ja) マルチバンド用高周波スイッチモジュール
JP2002064400A (ja) 高周波スイッチモジュール
JP2000049651A (ja) マルチバンド用高周波スイッチモジュール
JP4135015B2 (ja) 高周波スイッチモジュール
JP4174779B2 (ja) 高周波スイッチモジュール
JP2004007756A5 (enExample)
JP3550668B2 (ja) 高周波スイッチモジュール
JP3824231B2 (ja) スイッチ回路
JP3824229B2 (ja) マルチバンド用高周波スイッチモジュール
JP2002064401A (ja) 高周波スイッチモジュール
JP4565368B2 (ja) 高周波スイッチモジュール
JP2005237019A (ja) 高周波スイッチ
JP2001352202A (ja) 高周波スイッチモジュール
JP4210861B2 (ja) 高周波スイッチモジュール

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20031027

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20031027

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20031027

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20040115

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20040130

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040323

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20050104

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20050117

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080204

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090204

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100204

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110204

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120204

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130204

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140204

Year of fee payment: 9

EXPY Cancellation because of completion of term