JP3641193B2 - 縦型熱処理装置及び熱処理方法並びに保温ユニット - Google Patents

縦型熱処理装置及び熱処理方法並びに保温ユニット Download PDF

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JP3641193B2
JP3641193B2 JP2000199992A JP2000199992A JP3641193B2 JP 3641193 B2 JP3641193 B2 JP 3641193B2 JP 2000199992 A JP2000199992 A JP 2000199992A JP 2000199992 A JP2000199992 A JP 2000199992A JP 3641193 B2 JP3641193 B2 JP 3641193B2
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unit
heating element
heat
temperature
heat treatment
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Japanese (ja)
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JP2002025994A5 (cg-RX-API-DMAC7.html
JP2002025994A (ja
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敏幸 牧谷
孝規 斎藤
長栄 長内
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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JP2000199992A 2000-06-30 2000-06-30 縦型熱処理装置及び熱処理方法並びに保温ユニット Expired - Fee Related JP3641193B2 (ja)

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JP2000199992A JP3641193B2 (ja) 2000-06-30 2000-06-30 縦型熱処理装置及び熱処理方法並びに保温ユニット

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JP2002025994A JP2002025994A (ja) 2002-01-25
JP2002025994A5 JP2002025994A5 (cg-RX-API-DMAC7.html) 2004-12-16
JP3641193B2 true JP3641193B2 (ja) 2005-04-20

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7203588B2 (ja) * 2018-12-17 2023-01-13 東京エレクトロン株式会社 熱処理装置
JP7189345B2 (ja) 2019-06-27 2022-12-13 株式会社Kokusai Electric 断熱構造体、基板処理装置、半導体装置の製造方法、基板処理方法およびプログラム

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* Cited by examiner, † Cited by third party
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JPH084000Y2 (ja) * 1991-03-28 1996-01-31 信越化学工業株式会社 複層セラミックスヒ−タ−
JP3449630B2 (ja) * 1993-07-15 2003-09-22 株式会社日立国際電気 半導体製造装置
JP3423131B2 (ja) * 1995-11-20 2003-07-07 東京エレクトロン株式会社 熱処理装置及び処理装置
JPH10208855A (ja) * 1997-01-23 1998-08-07 Toshiba Ceramics Co Ltd 面状ヒータ

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