JP3623896B2 - Sheet material grooving machine - Google Patents

Sheet material grooving machine Download PDF

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Publication number
JP3623896B2
JP3623896B2 JP18804599A JP18804599A JP3623896B2 JP 3623896 B2 JP3623896 B2 JP 3623896B2 JP 18804599 A JP18804599 A JP 18804599A JP 18804599 A JP18804599 A JP 18804599A JP 3623896 B2 JP3623896 B2 JP 3623896B2
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Prior art keywords
plate material
head
insertion table
clamp
groove
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JP18804599A
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Japanese (ja)
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JP2000343313A (en
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功 吉田
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功 吉田
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Description

【0001】
【発明の属する技術分野】
本発明は、薄い板材、例えばプリント配線されたプリント基板に分割用の溝(V形溝)を形成する板材の溝加工機に関するものである。
【0002】
【従来の技術】
従来の技術として特公平7−12575号公報に記載されたものがあった。即ち、機台の前部側に板材を支持するテーブル、及び該板材の前端部をクランプにより挾持して左右方向に移動させる横移動装置を設け、機台の後部側にコラムを前後方向に移動可能に設け、このコラムに上下軸心を中心として旋回する上下一対の回転加工ヘッドを設け、板材に左右方向のV形の溝を形成する際には、上記回転加工ヘッドをその軸心が前後方向に向く如く旋回させ、該回転加工ヘッドを回転させた状態で上記横移動装置を介して板材をテーブル上で左右方向に移動させ、該板材に左右方向の溝を形成する。また、板材に前後方向の溝を形成する際には、上記回転加工ヘッドをその軸心が左右方向に向く如く旋回させ、該回転加工ヘッドを回転させた状態で上記コラムを介して回転加工ヘッドを前後方向に移動させ、該板材に前後方向の溝を形成するようにしたものがあった。
【0003】
【発明が解決しようとする課題】
上記従来のものは、クランプによる板材の挾持精度を高くする際に手数を要するものであった。また、テーブル側に板材を挾持するクランプを設けるようにしていたので、板材の溝加工が完了するまで、次の板材をテーブル供給することができず、加工能率を上げることが困難であった。本発明は上記問題点を解消した新規な板材の溝加工機を得ることを目的とする。
【0004】
【課題を解決するための手段】
本発明は、上記目的を達成するために、以下の如く構成したものである。即ち請求項1の発明は、機台の前部側に板材が載置される挿入テーブルを前後動可能に設けるとともに、該挿入テーブルの上面に該挿入テーブルに載置された板材の反前進端と当接可能の係止ガイドを設け、機台の後部側に前記挿入テーブルによって後方に送られる板材の前進端を受け止めてこれを挾持するクランプ装置と、該クランプ装置を後方に向けて間欠的に移動させるクランプ移動装置とを設け、前記挿入テーブルと前記クランプ装置との間に、機台に対して左右方向に移動される横移動体を設け、該横移動体に前記挿入テーブルに載置された板材の少なくとも一方の面に溝を形成する加工ヘッドを設ける構成にし、これにより、クランプによる板材の挾持精度を高くするとともに、板材の溝加工の途中であっても次の板材がテーブルに供給できるようにしたものである。
また、請求項2の発明は、前記クランプ装置の下方に排出コンベヤを設け、これにより、クランプ装置から離脱した加工品を円滑に排出できるようにしたものである。
また、請求項3の発明は、前記加工ヘッドに、該加工ヘッドで形成された板材の溝の底部に接触可能な測定子を設け、これにより、加工直後に溝部の残厚が計測できるようにしたものである。
また、請求項4の発明は、前記加工ヘッドを上下動させるヘッド昇降装置、及び該ヘッド昇降装置を制御する昇降制御部を設け、前記測定子の位置を検出して前記板材の溝部の残厚を演算する残厚演算部を設け、該残厚演算部のデータに基づいて前記昇降制御部に補正データを出力して加工ヘッドの加工位置を補正する補正部を設け、これにより、加工ヘッドによる溝の加工精度が高くなるようにしたものである。
【0005】
【発明の実施の形態】
以下本発明の実施例を図面に基づいて説明する。図において、図1は本発明による溝加工機の略画した斜視図、図2は本発明による溝加工機の略画した側面図、図3は本発明による加工ヘッド支持部の斜視図である。図1、図2において、1は機台であり、この機台1の前部側にプリント基板Wが載置される挿入テーブル2を前後動可能に取付け、Y軸シリンダ3からなる前後駆動装置によって所定の範囲で前後方向(図2において左右方向)に移動される。
【0006】
上記挿入テーブル2の上面に係止ガイド4を取り付ける。この係止ガイド4は、左右方向に細長くして上記挿入テーブル2の左右幅に略対応させ、前後方向に移動調節して小ねじ等の止め具5により挿入テーブル2に固定する。この係止ガイド4は、図2に示すように、挿入テーブル2に載置されたプリント基板Wの反前進端(左端)に当接し、該プリント基板Wの前進端(右端)を挿入テーブル2の前進端(右端)から所定量右方に突出させるためのものである。
【0007】
上記機台1の後部側に門型のクランプ移動装置7を前後動可能に取付け、機台1の後部の上方で左右方向に延びるクランプ移動装置7のクロスバー8に多数のクランプ装置10を左右に所定の間隔をおいて取り付ける。このクランプ装置10は、図2に示すように、上記クロスバー8に固定された下爪10aの左端上面にプリント基板Wの前進端(右端)が係止する規制段部を形成し、下爪10aの上部に上爪10bをその右端側でピン10cにより回動可能に取付け、この上爪10bを下方に回動させて上記規制段部で係止したプリント基板Wの前進端を挾持するようになっている。上記クランプ移動装置7は、上記クランプ装置10が挿入テーブル2側のプリント基板Wを受ける前進位置から後方(図1において右方)に向けて所定のピッチ、即ち、プリント基板Wに形成される溝Hのピッチに対応して間欠的に移動されるようになっている。
【0008】
上記挿入テーブル2と上記クランプ装置10との間に、機台1に対して左右方向に移動される横移動体13を設け、該横移動体13に上記挿入テーブル2に載置されたプリント基板Wの上下面に溝Hを形成する一対の加工ヘッド20を取り付ける。上記横移動体13は、機台1に取り付けた支持ケース14にX軸モータ15によって正逆回転される送りねじ16を取付け、この送りねじ16を介して左右方向に移動される。また、上記横移動体13の上下の中間部には、プリント基板Wとの衝突を防止する左右に細長い逃げ孔13aが形成されている。
【0009】
上記加工ヘッド20は、前後方向の軸心を中心として回転するヘッドモータ21の回転軸に山形の刃を有する円板状のカッター22を取付けてなり、上記横移動体13の右端部の上下部に逃げ孔13aを挟んで対向状に取付け、各加工ヘッド20はヘッド昇降装置をなすZ軸モータ23によって接離方向に移動調節される。このZ軸モータ23は昇降制御部40からの信号を受けて制御されるようになっており、上記カッター22の加工位置(溝の深さ)は、上記昇降制御部40に入力設定された加工位置データによって設定される。なお、プリント基板Wの片面にV形の溝を形成する場合には、上記加工ヘッド20は上下のうちの一方にのみ取り付ける。
【0010】
上記各加工ヘッド20の右側部に、図3に示すように、一対の測定装置25を取り付ける。この測定装置25は、プリント基板Wに形成されたV形の溝Hの底部に接触可能な測定子26を上下動装置27によって接離方向に移動させ、各測定子26が上記溝Hの底部に接触した際の位置(移動量)を検出してプリント基板Wに形成された溝部の残厚(実寸)を演算するようになっている。また、上記昇降制御部40に入力設定された加工位置データは、補正部42によって上記測定装置25で演算した残厚演算部41のデータと比較され、これが所定値以上異なった際に、上記加工位置データが補正されるようになっている。
【0011】
図2において、30は挿入テーブル2の前部側に取り付けたリフト装置であり、堆積された未加工のプリント基板Wを所定の高さ位置に保持するものである。このリフト装置30に堆積された未加工のプリント基板Wは、投入装置31の吸着パット32により上部側から順次持ち上げられて挿入テーブル2の所定位置に載置(供給)される。33は加工ヘッド20の直前部側に設けた板状の加工クランプであり、プリント基板Wを溝加工する際に該プリント基板Wの溝加工部の直前部を上方から押圧して機台1側の固定テーブルに固定するものである。また、34はクランプ装置10の下方に設けたベルトコンベヤからなる排出コンベヤであり、クランプ装置10から離脱・落下されたプリント基板(加工品)Wを受けて後方に向けて移送し、機台1後部に設けた堆積リフト35に排出する。
【0012】
次に、上記実施例の作動態様について説明する。上記挿入テーブル2に未加工のプリント基板Wが載置されると、Y軸シリンダ3が伸長作動して挿入テーブル2、係止ガイド4を介して該挿入テーブル2上のプリント基板Wを後方に移動させ、その前進端部を前進移動したクランプ装置10に供給する。この場合、上記クランプ装置10は、上爪10bが開かれており、上記プリント基板Wの前進端部は下爪10bの前部上面に形成した規制段部に衝突してその前進位置が決定される、次いで、上爪10bが下方に回動して上記プリント基板Wの前進端を挾持する。
【0013】
次いで、クランプ移動装置7が後方に所定量移動して上記プリント基板Wを第1回目の溝加工位置に移動させた後、加工クランプ33を作動させて該プリント基板Wを固定する。次いで、昇降制御部40でZ軸モータ23を駆動制御して各加工ヘッド20を加工位置に移動させるとともに、該加工ヘッド20を起動させ、この状態でX軸モータ15、送りねじ16を介して横移動装置13を図1において右方に移動させ、上記プリント基板Wの上下面に第1回目のV形の溝Hを加工する。
【0014】
次いでZ軸モータ23を介して各加工ヘッド20を離間させ、横移動装置13を所定位置に移動させた後、測定装置25の上下動装置27を作動させ、測定子26を上記プリント基板Wの上下面の溝底に接触させ、測定装置25の残厚演算部41で上記溝部の残厚(実寸)を確認する。この残厚のデーターは補正部42に入力され、該補正部42によって昇降制御部40に入力設定された加工位置データと比較され、これが所定値以上異なった際には、上記加工位置データが補正され、各加工ヘッド20の加工位置が補正される。
【0015】
上記第1の加工工程が終了すると、加工クランプ33が開作動(上動)され、クランプ移動装置7が次段の後部位置に移動して上記プリント基板Wを第2回目の溝加工位置に移動させた後、加工クランプ33を作動させて該プリント基板Wを固定する。次いで、横移動装置13を介して各加工ヘッド20を再び図1において右方に移動させ、上記プリント基板Wの上下面に第2回目の溝Hを加工した後、前述と同様にしてプリント基板Wの溝部の残厚(実寸)を確認、補正部42による各加工ヘッド20の加工位置の確認(補正)を行う。以下同様にして上記プリント基板Wの上下面に順次溝加工し、該溝加工が完了すると、クランプ装置を開作動させて上記プリント基板Wを排出コンベヤ34に落下させ、この排出コンベヤ34によって機台1後部の堆積リフト35に排出する。
【0016】
【発明の効果】
以上の説明から明らかな如く、請求項1の発明は、前後動する挿入テーブルに板材を載置し、この挿入テーブルによって板材を後部側のクランプ装置に向けて移送するとともに、挿入テーブルに設けた係止ガイドで板材の反前進端を押圧して該板材を上記クランプ装置に挿入するようにしたので、クランプ装置による板材の挾持精度が高くなる。また、後部側に設けたクランプ装置により板材を後方に引き出しながら溝加工するようにしたので、プリント基板の如く薄い板材であっても後方へ移動させる際に曲がらなくなり、溝の形成位置が狂わなくなり、高精度に加工することができる。また、溝加工の途中であっても次の板材を挿入テーブルに供給することができ、加工効率が高くなる。
また、請求項2の発明は、加工品をクランプ装置から落下させて排出コンベヤにより所定箇所に排出するようにしたので、高い移動精度を要するクランプ移動装置を小型にすることができる。
また、請求項3の発明は、加工直後に溝部の残厚を確認して不良品の発生を未然に防止することができる。
また、請求項4の発明は、加工ヘッドの加工位置が高精度に維持され、溝の加工精度が高くなる。
【図面の簡単な説明】
【図1】本発明による溝加工機の略画した斜視図である。
【図2】本発明による溝加工機の略画した側面図である。
【図3】本発明による加工ヘッド支持部の斜視図である。
【符号の説明】
1 機台
2 挿入テーブル
3 Y軸シリンダ(前後駆動装置)
4 係止ガイド
5 止め具
7 クランプ移動装置
8 クロスバー
10 クランプ装置
10a 下爪
10b 上爪
10c ピン
13 横移動装置
14 支持ケース
15 X軸モータ
16 送りねじ
20 加工ヘッド
21 ヘッドモータ
22 カッター
23 Z軸モータ(ヘッド昇降装置)
25 測定装置
26 測定子
27 上下動装置
30 リフト装置
31 投入装置
32 吸着パット
33 加工クランプ
34 排出コンベヤ
35 積載リフト
40 昇降制御部
41 残厚演算部
42 補正部
W 板材(プリント基板)
H 溝
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a groove processing machine for a thin plate material, for example, a plate material for forming a dividing groove (V-shaped groove) on a printed wiring board.
[0002]
[Prior art]
As a conventional technique, there is one described in Japanese Patent Publication No. 7-12575. In other words, a table that supports the plate material on the front side of the machine base and a lateral movement device that holds the front end of the plate material by a clamp and moves it in the left-right direction are provided, and the column is moved in the front-rear direction on the rear side of the machine base. When this column is provided with a pair of upper and lower rotary processing heads that pivot about the vertical axis, and when forming a V-shaped groove in the left-right direction on the plate material, the rotary processing head is centered forward and backward. The plate material is turned in the horizontal direction and the plate is moved in the horizontal direction on the table through the lateral movement device with the rotary processing head rotated, thereby forming a horizontal groove in the plate material. Further, when the longitudinal groove is formed in the plate material, the rotary processing head is turned through the column in a state where the rotary processing head is turned so that the axial center thereof is directed in the left-right direction and the rotary processing head is rotated. Has been moved in the front-rear direction to form grooves in the front-rear direction in the plate material.
[0003]
[Problems to be solved by the invention]
The above-described conventional device requires a lot of work to increase the holding accuracy of the plate material by the clamp. Further, since the clamp for holding the plate material is provided on the table side, the next plate material cannot be supplied to the table until the groove processing of the plate material is completed, and it is difficult to increase the processing efficiency. It is an object of the present invention to obtain a novel plate material grooving machine which solves the above problems.
[0004]
[Means for Solving the Problems]
In order to achieve the above object, the present invention is configured as follows. That is, the invention of claim 1 is provided with an insertion table on which the plate material is placed on the front side of the machine base so as to be movable back and forth, and an anti-advance end of the plate material placed on the insertion table on the upper surface of the insertion table. And a clamping device for receiving and holding the forward end of the plate material fed backward by the insertion table on the rear side of the machine base, and intermittently facing the clamping device to the rear A clamp moving device that is moved in a horizontal direction, a horizontal moving body that is moved in the left-right direction with respect to the machine base is provided between the insertion table and the clamp device, and the horizontal moving body is placed on the insertion table. In this configuration, a processing head for forming a groove is provided on at least one surface of the formed plate material, so that the holding accuracy of the plate material by the clamp is increased, and the next plate material can be transferred to the table even during the groove processing of the plate material. It is obtained by allowing the supply to the.
According to a second aspect of the present invention, a discharge conveyor is provided below the clamp device, so that a processed product detached from the clamp device can be discharged smoothly.
According to a third aspect of the present invention, the processing head is provided with a probe capable of contacting the bottom of the groove of the plate material formed by the processing head, so that the remaining thickness of the groove can be measured immediately after processing. It is a thing.
According to a fourth aspect of the present invention, there is provided a head elevating device that moves the machining head up and down, and an elevating control unit that controls the head elevating device, detecting the position of the measuring element, and the remaining thickness of the groove portion of the plate material And a correction unit that outputs correction data to the elevation control unit based on the data of the remaining thickness calculation unit and corrects the processing position of the processing head. The groove processing accuracy is increased.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. 1 is a schematic perspective view of a grooving machine according to the present invention, FIG. 2 is a schematic side view of the grooving machine according to the present invention, and FIG. 3 is a perspective view of a processing head support according to the present invention. . In FIG. 1 and FIG. 2, reference numeral 1 denotes a machine base. A front / rear drive device comprising a Y-axis cylinder 3 is attached to an insertion table 2 on which a printed circuit board W is placed on the front side of the machine base 1 so as to be movable back and forth. Is moved in the front-back direction (left-right direction in FIG. 2) within a predetermined range.
[0006]
A locking guide 4 is attached to the upper surface of the insertion table 2. The locking guide 4 is elongated in the left-right direction so as to substantially correspond to the left-right width of the insertion table 2, and is moved and adjusted in the front-rear direction to be fixed to the insertion table 2 with a stopper 5 such as a machine screw. As shown in FIG. 2, the locking guide 4 abuts against the counter-advance end (left end) of the printed board W placed on the insertion table 2, and the advance end (right end) of the printed board W is inserted into the insertion table 2. For projecting a predetermined amount to the right from the forward end (right end).
[0007]
A gate-shaped clamp moving device 7 is attached to the rear side of the machine base 1 so as to be movable back and forth, and a number of clamp devices 10 are mounted on the crossbar 8 of the clamp moving device 7 extending in the left-right direction above the rear portion of the machine base 1. Attach with a predetermined interval. As shown in FIG. 2, the clamp device 10 forms a regulation step portion on which the forward end (right end) of the printed circuit board W is locked on the upper surface of the left end of the lower claw 10 a fixed to the cross bar 8. An upper claw 10b is rotatably attached to the upper portion of 10a by a pin 10c on the right end side, and the upper claw 10b is rotated downward so as to hold the forward end of the printed circuit board W locked by the restriction step portion. It has become. The clamp moving device 7 has a predetermined pitch, that is, a groove formed in the printed circuit board W, from the forward position where the clamp apparatus 10 receives the printed circuit board W on the insertion table 2 side to the rear (right side in FIG. 1). It is moved intermittently corresponding to the pitch of H.
[0008]
Between the insertion table 2 and the clamping device 10, a lateral moving body 13 that is moved in the left-right direction with respect to the machine base 1 is provided, and a printed circuit board placed on the insertion table 2 on the lateral moving body 13. A pair of processing heads 20 that form grooves H are attached to the upper and lower surfaces of W. The lateral moving body 13 is attached to a support case 14 attached to the machine base 1 with a feed screw 16 that is rotated forward and backward by an X-axis motor 15, and is moved in the left-right direction via the feed screw 16. Further, in the upper and lower intermediate portions of the laterally movable body 13, left and right escape holes 13a that prevent a collision with the printed circuit board W are formed.
[0009]
The machining head 20 has a disk-shaped cutter 22 having a chevron blade attached to the rotating shaft of a head motor 21 that rotates about a longitudinal axis, and the upper and lower portions of the right end portion of the lateral moving body 13. The machining heads 20 are moved and adjusted in the contact / separation direction by a Z-axis motor 23 that forms a head lifting device. The Z-axis motor 23 is controlled by receiving a signal from the elevation control unit 40, and the machining position (groove depth) of the cutter 22 is input to the elevation control unit 40. Set by position data. When forming a V-shaped groove on one side of the printed circuit board W, the processing head 20 is attached to only one of the upper and lower sides.
[0010]
As shown in FIG. 3, a pair of measuring devices 25 is attached to the right side of each processing head 20. In this measuring device 25, a measuring element 26 that can contact the bottom of a V-shaped groove H formed on the printed circuit board W is moved in the contact / separation direction by a vertical movement device 27, and each measuring element 26 is moved to the bottom of the groove H. The remaining thickness (actual size) of the groove formed on the printed circuit board W is calculated by detecting the position (movement amount) at the time of contact. Further, the machining position data input and set in the elevation control unit 40 is compared with the data of the remaining thickness calculation unit 41 calculated by the measurement device 25 by the correction unit 42. The position data is corrected.
[0011]
In FIG. 2, reference numeral 30 denotes a lift device attached to the front side of the insertion table 2, which holds the deposited unprocessed printed board W at a predetermined height position. The unprocessed printed circuit board W deposited on the lift device 30 is sequentially lifted from the upper side by the suction pad 32 of the input device 31 and placed (supplied) at a predetermined position on the insertion table 2. Reference numeral 33 denotes a plate-shaped processing clamp provided on the front side of the processing head 20, and when the printed board W is grooved, the front side of the printed circuit board W is pressed from above to the machine base 1 side. It is fixed to the fixed table. Reference numeral 34 denotes a discharge conveyor including a belt conveyor provided below the clamp device 10. The discharge conveyor 34 receives a printed circuit board (processed product) W that has been detached and dropped from the clamp device 10, and transfers it to the rear. It discharges | emits to the deposition lift 35 provided in the rear part.
[0012]
Next, the operation mode of the above embodiment will be described. When an unprocessed printed circuit board W is placed on the insertion table 2, the Y-axis cylinder 3 extends and the printed circuit board W on the insertion table 2 is moved backward via the insertion table 2 and the locking guide 4. The forward end is supplied to the clamp device 10 that has moved forward. In this case, the upper claw 10b of the clamping device 10 is opened, and the advance end of the printed circuit board W collides with a regulation step formed on the front upper surface of the lower claw 10b to determine its advance position. Next, the upper claw 10b rotates downward to grip the forward end of the printed circuit board W.
[0013]
Next, the clamp moving device 7 moves backward by a predetermined amount to move the printed board W to the first groove machining position, and then the machining clamp 33 is operated to fix the printed board W. Next, the Z-axis motor 23 is driven and controlled by the elevation controller 40 to move each machining head 20 to the machining position, and the machining head 20 is activated. In this state, the X-axis motor 15 and the feed screw 16 are used. The lateral movement device 13 is moved rightward in FIG. 1 to process the first V-shaped groove H on the upper and lower surfaces of the printed board W.
[0014]
Next, the machining heads 20 are separated via the Z-axis motor 23 and the lateral movement device 13 is moved to a predetermined position. Then, the vertical movement device 27 of the measurement device 25 is operated, and the measuring element 26 is moved to the printed circuit board W. The remaining thickness (actual size) of the groove is confirmed by the remaining thickness calculator 41 of the measuring device 25 in contact with the groove bottoms of the upper and lower surfaces. The remaining thickness data is input to the correction unit 42 and compared with the processing position data input and set to the elevation control unit 40 by the correction unit 42. When the difference is more than a predetermined value, the processing position data is corrected. Then, the machining position of each machining head 20 is corrected.
[0015]
When the first processing step is completed, the processing clamp 33 is opened (moved upward), the clamp moving device 7 is moved to the rear position of the next stage, and the printed board W is moved to the second groove processing position. After that, the processing clamp 33 is operated to fix the printed board W. Next, each processing head 20 is again moved to the right in FIG. 1 via the lateral movement device 13 to process the second groove H on the upper and lower surfaces of the printed circuit board W, and then the printed circuit board in the same manner as described above. The remaining thickness (actual size) of the groove portion of W is confirmed, and the processing position of each processing head 20 is confirmed (corrected) by the correction unit 42. In the same manner, the upper and lower surfaces of the printed circuit board W are sequentially grooved. When the groove processing is completed, the clamping device is opened to drop the printed circuit board W onto the discharge conveyor 34. 1 Discharge to the rear deposition lift 35.
[0016]
【The invention's effect】
As is apparent from the above description, the invention of claim 1 places the plate material on the insertion table that moves back and forth, and transfers the plate material toward the clamping device on the rear side by the insertion table and is provided on the insertion table. Since the plate member is inserted into the clamp device by pressing the counter-advance end of the plate material with the locking guide, the holding accuracy of the plate material by the clamp device is increased. In addition, because the plate material is pulled out backward by the clamping device provided on the rear side, even if it is a thin plate material such as a printed circuit board, it will not bend when moved backward, and the groove formation position will not go out of order. Can be processed with high accuracy. Further, the next plate material can be supplied to the insertion table even during the groove processing, and the processing efficiency is increased.
According to the second aspect of the present invention, since the processed product is dropped from the clamp device and discharged to a predetermined location by the discharge conveyor, the clamp moving device requiring high movement accuracy can be reduced in size.
Further, the invention of claim 3 can prevent the occurrence of defective products by checking the remaining thickness of the groove immediately after processing.
In the invention of claim 4, the machining position of the machining head is maintained with high accuracy, and the machining accuracy of the groove is increased.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of a grooving machine according to the present invention.
FIG. 2 is a schematic side view of a grooving machine according to the present invention.
FIG. 3 is a perspective view of a processing head support according to the present invention.
[Explanation of symbols]
1 Machine base 2 Insertion table 3 Y-axis cylinder (front-rear drive device)
4 Locking guide 5 Stopper 7 Clamp moving device 8 Cross bar 10 Clamping device 10a Lower claw 10b Upper claw 10c Pin 13 Lateral moving device 14 Support case 15 X-axis motor 16 Feed screw 20 Processing head 21 Head motor 22 Cutter 23 Z-axis Motor (head lifting device)
25 Measuring device 26 Measuring element 27 Vertical movement device 30 Lifting device 31 Loading device 32 Suction pad 33 Processing clamp 34 Discharge conveyor 35 Loading lift 40 Lift control unit 41 Remaining thickness calculation unit 42 Correction unit W Plate material (printed circuit board)
H groove

Claims (4)

機台(1)の前部側に板材(W)が載置される挿入テーブル(2)を前後動可能に設けるとともに、該挿入テーブル(2)の上面に該挿入テーブル(2)に載置された板材(W)の反前進端と当接可能の係止ガイド(4)を設け、機台(1)の後部側に前記挿入テーブル(2)によって後方に送られる板材(W)の前進端を受け止めてこれを挾持するクランプ装置(10)と、該クランプ装置(10)を後方に向けて間欠的に移動させるクランプ移動装置(7)とを設け、前記挿入テーブル(2)と前記クランプ装置(10)との間に、機台(1)に対して左右方向に移動される横移動体(13)を設け、該横移動体(13)に前記挿入テーブル(2)に載置された板材(W)の少なくとも一方の面に溝(H)を形成する加工ヘッド(20)を設けたことを特徴とする板材の溝加工機。An insertion table (2) on which the plate (W) is placed is provided on the front side of the machine base (1) so as to be movable back and forth, and placed on the insertion table (2) on the upper surface of the insertion table (2). A locking guide (4) that can come into contact with the counter-advance end of the plate (W) is provided, and the plate (W) that is fed backward by the insertion table (2) is provided on the rear side of the machine base (1). A clamp device (10) for receiving and holding the end; and a clamp moving device (7) for intermittently moving the clamp device (10) rearwardly, the insertion table (2) and the clamp A laterally movable body (13) that is moved in the left-right direction with respect to the machine base (1) is provided between the apparatus (10) and placed on the insertion table (2) on the laterally movable body (13). Machining head (20) for forming grooves (H) on at least one surface of the plate material (W) Grooving machine of the plate material, characterized in that provided. 前記クランプ装置(10)の下方に排出コンベヤ(34)を設けたことを特徴とする請求項1記載の板材の溝加工機。2. The plate material grooving machine according to claim 1, wherein a discharge conveyor (34) is provided below the clamping device (10). 前記加工ヘッド(20)に、該加工ヘッド(20)で形成された板材(W)の溝(H)の底部に接触可能な測定子(26)を設けたことを特徴とする請求項1又は2記載の板材の溝加工機。The measuring head (20) is provided with a probe (26) capable of contacting the bottom of the groove (H) of the plate (W) formed by the processing head (20). 2. The plate material grooving machine according to 2. 前記加工ヘッド(20)を上下動させるヘッド昇降装置(23)、及び該ヘッド昇降装置(23)を制御する昇降制御部(40)を設け、前記測定子(26)の位置を検出して前記板材(W)の溝部の残厚を演算する残厚演算部(41)を設け、該残厚演算部(41)のデータに基づいて前記昇降制御部(40)に補正データを出力して加工ヘッド(20)の加工位置を補正する補正部(42)を設けたことを特徴とする請求項3記載の板材の溝加工機。A head lifting device (23) for moving the machining head (20) up and down, and a lifting control unit (40) for controlling the head lifting device (23) are provided, and the position of the probe (26) is detected to detect the position of the probe (26). A remaining thickness calculating section (41) for calculating the remaining thickness of the groove of the plate material (W) is provided, and correction data is output to the elevation control section (40) based on the data of the remaining thickness calculating section (41). 4. A plate material grooving machine according to claim 3, further comprising a correction section (42) for correcting the machining position of the head (20).
JP18804599A 1999-05-29 1999-05-29 Sheet material grooving machine Expired - Lifetime JP3623896B2 (en)

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US11406791B2 (en) 2009-04-03 2022-08-09 Scientia Vascular, Inc. Micro-fabricated guidewire devices having varying diameters
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