JP2000343313A - Grooving machine for plate material - Google Patents

Grooving machine for plate material

Info

Publication number
JP2000343313A
JP2000343313A JP11188045A JP18804599A JP2000343313A JP 2000343313 A JP2000343313 A JP 2000343313A JP 11188045 A JP11188045 A JP 11188045A JP 18804599 A JP18804599 A JP 18804599A JP 2000343313 A JP2000343313 A JP 2000343313A
Authority
JP
Japan
Prior art keywords
plate
groove
processing
clamp
plate material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11188045A
Other languages
Japanese (ja)
Other versions
JP3623896B2 (en
Inventor
Isao Yoshida
功 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP18804599A priority Critical patent/JP3623896B2/en
Publication of JP2000343313A publication Critical patent/JP2000343313A/en
Application granted granted Critical
Publication of JP3623896B2 publication Critical patent/JP3623896B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To heighten the working accuracy and efficiency in forming a groove in a plate material. SOLUTION: An inserting table 2 is installed in the front part of a machine frame 1 in such a way as movable longitudinally, and an engagement guide 4 capable of abutting to the counter-advancing end of a plate material W placed on the table 2 is provided on the oversurface of the table 2, and the machine frame 1 is equipped in its rear part with a clamp device 10 to hold pinchedly the advancing end of the plate fed backward by the table 2 and a clamp moving device 7 to move the clamp device 10 backward intermittently. A transversely moving body 13 moving in the lateral direction relative to the machine frame 1 is installed between the table 1 and clamp device 10 and is furnished with a working head 20 to form a groove in at least one surface of the plate placed on the table 2.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、薄い板材、例えば
プリント配線されたプリント基板に分割用の溝(V形
溝)を形成する板材の溝加工機に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a groove processing machine for forming a groove (V-shaped groove) for dividing a thin plate material, for example, a printed wiring board.

【0002】[0002]

【従来の技術】従来の技術として特公平7−12575
号公報に記載されたものがあった。即ち、機台の前部側
に板材を支持するテーブル、及び該板材の前端部をクラ
ンプにより挾持して左右方向に移動させる横移動装置を
設け、機台の後部側にコラムを前後方向に移動可能に設
け、このコラムに上下軸心を中心として旋回する上下一
対の回転加工ヘッドを設け、板材に左右方向のV形の溝
を形成する際には、上記回転加工ヘッドをその軸心が前
後方向に向く如く旋回させ、該回転加工ヘッドを回転さ
せた状態で上記横移動装置を介して板材をテーブル上で
左右方向に移動させ、該板材に左右方向の溝を形成す
る。また、板材に前後方向の溝を形成する際には、上記
回転加工ヘッドをその軸心が左右方向に向く如く旋回さ
せ、該回転加工ヘッドを回転させた状態で上記コラムを
介して回転加工ヘッドを前後方向に移動させ、該板材に
前後方向の溝を形成するようにしたものがあった。
2. Description of the Related Art As a conventional technique, Japanese Patent Publication No. 7-12575
There was one described in the official gazette. That is, a table for supporting the plate material is provided on the front side of the machine base, and a lateral movement device for moving the front end of the plate material in the right and left direction by clamping it with the clamp, and moving the column in the front and rear direction on the rear side of the machine base. The column is provided with a pair of upper and lower rotary processing heads that pivot about the vertical axis, and when forming a V-shaped groove in the left and right direction on the plate, the rotary processing head is moved back and forth. The plate is moved in the left-right direction on the table through the lateral moving device while the rotary processing head is rotated, so that a groove in the left-right direction is formed in the plate. When forming a groove in the front-rear direction on the plate material, the rotary processing head is turned so that the axis thereof is directed in the left-right direction, and the rotary processing head is rotated through the column in a state where the rotary processing head is rotated. Has been moved in the front-rear direction to form a groove in the front-rear direction in the plate material.

【0003】[0003]

【発明が解決しようとする課題】上記従来のものは、ク
ランプによる板材の挾持精度を高くする際に手数を要す
るものであった。また、テーブル側に板材を挾持するク
ランプを設けるようにしていたので、板材の溝加工が完
了するまで、次の板材をテーブル供給することができ
ず、加工能率を上げることが困難であった。本発明は上
記問題点を解消した新規な板材の溝加工機を得ることを
目的とする。
In the above-mentioned prior art, it is troublesome to increase the accuracy of clamping the plate by the clamp. Further, since a clamp for holding the plate material is provided on the table side, the next plate material cannot be supplied to the table until the groove processing of the plate material is completed, and it has been difficult to increase the processing efficiency. SUMMARY OF THE INVENTION An object of the present invention is to provide a new plate material grooving machine that solves the above problems.

【0004】[0004]

【課題を解決するための手段】本発明は、上記目的を達
成するために、以下の如く構成したものである。即ち請
求項1の発明は、機台の前部側に板材が載置される挿入
テーブルを前後動可能に設けるとともに、該挿入テーブ
ルの上面に該挿入テーブルに載置された板材の反前進端
と当接可能の係止ガイドを設け、機台の後部側に前記挿
入テーブルによって後方に送られる板材の前進端を受け
止めてこれを挾持するクランプ装置と、該クランプ装置
を後方に向けて間欠的に移動させるクランプ移動装置と
を設け、前記挿入テーブルと前記クランプ装置との間
に、機台に対して左右方向に移動される横移動体を設
け、該横移動体に前記挿入テーブルに載置された板材の
少なくとも一方の面に溝を形成する加工ヘッドを設ける
構成にし、これにより、クランプによる板材の挾持精度
を高くするとともに、板材の溝加工の途中であっても次
の板材がテーブルに供給できるようにしたものである。
また、請求項2の発明は、前記クランプ装置の下方に排
出コンベヤを設け、これにより、クランプ装置から離脱
した加工品を円滑に排出できるようにしたものである。
また、請求項3の発明は、前記加工ヘッドに、該加工ヘ
ッドで形成された板材の溝の底部に接触可能な測定子を
設け、これにより、加工直後に溝部の残厚が計測できる
ようにしたものである。また、請求項4の発明は、前記
加工ヘッドを上下動させるヘッド昇降装置、及び該ヘッ
ド昇降装置を制御する昇降制御部を設け、前記測定子の
位置を検出して前記板材の溝部の残厚を演算する残厚演
算部を設け、該残厚演算部のデータに基づいて前記昇降
制御部に補正データを出力して加工ヘッドの加工位置を
補正する補正部を設け、これにより、加工ヘッドによる
溝の加工精度が高くなるようにしたものである。
Means for Solving the Problems The present invention has the following configuration to achieve the above object. That is, according to the invention of claim 1, an insertion table on which a plate is placed is provided at the front side of the machine base so as to be able to move back and forth, and a counter-advancing end of the plate placed on the insertion table is provided on the upper surface of the insertion table. And a clamp device for receiving the forward end of the plate material fed rearward by the insertion table at the rear side of the machine base and holding the same, and intermittently moving the clamp device rearward. And a horizontal moving body that is moved in the left-right direction with respect to the machine base is provided between the insertion table and the clamping apparatus, and the horizontal moving body is mounted on the insertion table. A machining head for forming a groove on at least one surface of the plate material provided is provided, so that the clamping accuracy of the plate material by the clamp is increased, and the next plate material is tapered even during the groove processing of the plate material. It is obtained by allowing the supply to the.
According to a second aspect of the present invention, a discharge conveyor is provided below the clamp device so that a workpiece detached from the clamp device can be smoothly discharged.
Further, the invention according to claim 3 provides the working head with a measuring element capable of contacting the bottom of the groove of the plate material formed by the working head, so that the remaining thickness of the groove can be measured immediately after the working. It was done. Further, the invention according to claim 4 is provided with a head elevating device for moving the processing head up and down, and an elevating control unit for controlling the head elevating device, and detecting the position of the tracing stylus to measure the remaining thickness of the groove of the plate material. Is provided, and a correction unit that outputs correction data to the elevation control unit based on the data of the remaining thickness calculation unit to correct the processing position of the processing head is provided. The processing accuracy of the groove is increased.

【0005】[0005]

【発明の実施の形態】以下本発明の実施例を図面に基づ
いて説明する。図において、図1は本発明による溝加工
機の略画した斜視図、図2は本発明による溝加工機の略
画した側面図、図3は本発明による加工ヘッド支持部の
斜視図である。図1、図2において、1は機台であり、
この機台1の前部側にプリント基板Wが載置される挿入
テーブル2を前後動可能に取付け、Y軸シリンダ3から
なる前後駆動装置によって所定の範囲で前後方向(図2
において左右方向)に移動される。
Embodiments of the present invention will be described below with reference to the drawings. In the drawings, FIG. 1 is a schematic perspective view of a grooving machine according to the present invention, FIG. 2 is a schematic side view of a grooving machine according to the present invention, and FIG. 3 is a perspective view of a machining head support according to the present invention. . 1 and 2, reference numeral 1 denotes a machine base;
An insertion table 2 on which a printed circuit board W is mounted is mounted on the front side of the machine base 1 so as to be movable back and forth.
In the left and right directions).

【0006】上記挿入テーブル2の上面に係止ガイド4
を取り付ける。この係止ガイド4は、左右方向に細長く
して上記挿入テーブル2の左右幅に略対応させ、前後方
向に移動調節して小ねじ等の止め具5により挿入テーブ
ル2に固定する。この係止ガイド4は、図2に示すよう
に、挿入テーブル2に載置されたプリント基板Wの反前
進端(左端)に当接し、該プリント基板Wの前進端(右
端)を挿入テーブル2の前進端(右端)から所定量右方
に突出させるためのものである。
A locking guide 4 is provided on the upper surface of the insertion table 2.
Attach. The locking guide 4 is elongated in the left-right direction so as to substantially correspond to the left-right width of the insertion table 2, and is moved and adjusted in the front-rear direction, and is fixed to the insertion table 2 by a stopper 5 such as a small screw. As shown in FIG. 2, the locking guide 4 abuts on the non-advancing end (left end) of the printed board W placed on the insertion table 2, and pushes the advanced end (right end) of the printed board W onto the insertion table 2. To project rightward from the forward end (right end) by a predetermined amount.

【0007】上記機台1の後部側に門型のクランプ移動
装置7を前後動可能に取付け、機台1の後部の上方で左
右方向に延びるクランプ移動装置7のクロスバー8に多
数のクランプ装置10を左右に所定の間隔をおいて取り
付ける。このクランプ装置10は、図2に示すように、
上記クロスバー8に固定された下爪10aの左端上面に
プリント基板Wの前進端(右端)が係止する規制段部を
形成し、下爪10aの上部に上爪10bをその右端側で
ピン10cにより回動可能に取付け、この上爪10bを
下方に回動させて上記規制段部で係止したプリント基板
Wの前進端を挾持するようになっている。上記クランプ
移動装置7は、上記クランプ装置10が挿入テーブル2
側のプリント基板Wを受ける前進位置から後方(図1に
おいて右方)に向けて所定のピッチ、即ち、プリント基
板Wに形成される溝Hのピッチに対応して間欠的に移動
されるようになっている。
A gate-type clamp moving device 7 is mounted on the rear side of the machine base 1 so as to be able to move back and forth, and a large number of clamp devices are mounted on a cross bar 8 of the clamp moving device 7 extending in the left-right direction above the rear portion of the machine base 1. 10 are mounted on the left and right at predetermined intervals. As shown in FIG.
A regulating step is formed on the upper surface of the left end of the lower claw 10a fixed to the cross bar 8 to lock the forward end (right end) of the printed circuit board W, and the upper claw 10b is pinned on the upper end of the lower claw 10a at the right end. The upper pawl 10b is pivoted downward by 10c so as to clamp the forward end of the printed circuit board W locked by the regulating step. The clamp moving device 7 is configured such that the clamp device 10
A predetermined pitch, that is, a pitch of a groove H formed in the printed circuit board W, is intermittently moved backward (rightward in FIG. 1) from an advanced position for receiving the printed circuit board W on the side. Has become.

【0008】上記挿入テーブル2と上記クランプ装置1
0との間に、機台1に対して左右方向に移動される横移
動体13を設け、該横移動体13に上記挿入テーブル2
に載置されたプリント基板Wの上下面に溝Hを形成する
一対の加工ヘッド20を取り付ける。上記横移動体13
は、機台1に取り付けた支持ケース14にX軸モータ1
5によって正逆回転される送りねじ16を取付け、この
送りねじ16を介して左右方向に移動される。また、上
記横移動体13の上下の中間部には、プリント基板Wと
の衝突を防止する左右に細長い逃げ孔13aが形成され
ている。
The insertion table 2 and the clamping device 1
0, a horizontal moving body 13 that is moved in the left-right direction with respect to the machine base 1 is provided.
A pair of processing heads 20 for forming grooves H on the upper and lower surfaces of the printed circuit board W mounted on the substrate are mounted. The horizontal moving body 13
The X-axis motor 1 is mounted on the support case 14 attached to the machine base 1.
A feed screw 16 which is rotated forward and reverse by 5 is attached, and is moved in the left-right direction via the feed screw 16. Further, in the upper and lower middle portions of the horizontal moving body 13, left and right long escape holes 13a for preventing collision with the printed circuit board W are formed.

【0009】上記加工ヘッド20は、前後方向の軸心を
中心として回転するヘッドモータ21の回転軸に山形の
刃を有する円板状のカッター22を取付けてなり、上記
横移動体13の右端部の上下部に逃げ孔13aを挟んで
対向状に取付け、各加工ヘッド20はヘッド昇降装置を
なすZ軸モータ23によって接離方向に移動調節され
る。このZ軸モータ23は昇降制御部40からの信号を
受けて制御されるようになっており、上記カッター22
の加工位置(溝の深さ)は、上記昇降制御部40に入力
設定された加工位置データによって設定される。なお、
プリント基板Wの片面にV形の溝を形成する場合には、
上記加工ヘッド20は上下のうちの一方にのみ取り付け
る。
The processing head 20 is provided with a disk-shaped cutter 22 having a mountain-shaped blade mounted on a rotation shaft of a head motor 21 which rotates about an axis in the front-rear direction. The processing heads 20 are attached to the upper and lower portions in opposition with the escape hole 13a interposed therebetween. The Z-axis motor 23 is controlled by receiving a signal from the lifting / lowering control unit 40.
The processing position (depth of the groove) is set by the processing position data input to the elevation control unit 40. In addition,
When forming a V-shaped groove on one side of the printed circuit board W,
The processing head 20 is attached to only one of the upper and lower sides.

【0010】上記各加工ヘッド20の右側部に、図3に
示すように、一対の測定装置25を取り付ける。この測
定装置25は、プリント基板Wに形成されたV形の溝H
の底部に接触可能な測定子26を上下動装置27によっ
て接離方向に移動させ、各測定子26が上記溝Hの底部
に接触した際の位置(移動量)を検出してプリント基板
Wに形成された溝部の残厚(実寸)を演算するようにな
っている。また、上記昇降制御部40に入力設定された
加工位置データは、補正部42によって上記測定装置2
5で演算した残厚演算部41のデータと比較され、これ
が所定値以上異なった際に、上記加工位置データが補正
されるようになっている。
As shown in FIG. 3, a pair of measuring devices 25 are mounted on the right side of each processing head 20. This measuring device 25 is provided with a V-shaped groove H formed on a printed circuit board W.
The probe 26 that can contact the bottom of the groove H is moved in the contact / separation direction by the vertical movement device 27, and the position (movement amount) when each probe 26 comes into contact with the bottom of the groove H is detected, and The remaining thickness (actual size) of the formed groove is calculated. The processing position data input and set to the elevation control unit 40 is corrected by the correction unit 42 to the measurement device 2.
The data is compared with the data of the remaining thickness calculating section 41 calculated in step 5, and when the difference is not less than a predetermined value, the processing position data is corrected.

【0011】図2において、30は挿入テーブル2の前
部側に取り付けたリフト装置であり、堆積された未加工
のプリント基板Wを所定の高さ位置に保持するものであ
る。このリフト装置30に堆積された未加工のプリント
基板Wは、投入装置31の吸着パット32により上部側
から順次持ち上げられて挿入テーブル2の所定位置に載
置(供給)される。33は加工ヘッド20の直前部側に
設けた板状の加工クランプであり、プリント基板Wを溝
加工する際に該プリント基板Wの溝加工部の直前部を上
方から押圧して機台1側の固定テーブルに固定するもの
である。また、34はクランプ装置10の下方に設けた
ベルトコンベヤからなる排出コンベヤであり、クランプ
装置10から離脱・落下されたプリント基板(加工品)
Wを受けて後方に向けて移送し、機台1後部に設けた堆
積リフト35に排出する。
In FIG. 2, reference numeral 30 denotes a lift device mounted on the front side of the insertion table 2 for holding the unprocessed printed circuit board W at a predetermined height. The unprocessed printed circuit boards W deposited on the lift device 30 are sequentially lifted from the upper side by the suction pad 32 of the input device 31 and placed (supplied) at a predetermined position on the insertion table 2. Reference numeral 33 denotes a plate-shaped processing clamp provided immediately before the processing head 20. When a groove is formed in the printed board W, the front part of the grooved portion of the printed board W is pressed from above to press the machine base 1 side. Is fixed to the fixed table. Reference numeral 34 denotes a discharge conveyor comprising a belt conveyor provided below the clamp device 10, and a printed circuit board (processed product) detached from the clamp device 10 and dropped.
After receiving W, it is transported backward and discharged to a deposition lift 35 provided at the rear of the machine base 1.

【0012】次に、上記実施例の作動態様について説明
する。上記挿入テーブル2に未加工のプリント基板Wが
載置されると、Y軸シリンダ3が伸長作動して挿入テー
ブル2、係止ガイド4を介して該挿入テーブル2上のプ
リント基板Wを後方に移動させ、その前進端部を前進移
動したクランプ装置10に供給する。この場合、上記ク
ランプ装置10は、上爪10bが開かれており、上記プ
リント基板Wの前進端部は下爪10bの前部上面に形成
した規制段部に衝突してその前進位置が決定される、次
いで、上爪10bが下方に回動して上記プリント基板W
の前進端を挾持する。
Next, the operation of the above embodiment will be described. When the unprocessed printed circuit board W is placed on the insertion table 2, the Y-axis cylinder 3 extends to move the printed circuit board W on the insertion table 2 rearward through the insertion table 2 and the locking guide 4. The clamp device 10 is moved and its forward end is supplied to the clamp device 10 which has moved forward. In this case, in the clamp device 10, the upper claw 10b is opened, and the forward end of the printed circuit board W collides with a regulating step formed on the front upper surface of the lower claw 10b to determine the forward position. Then, the upper claws 10b rotate downward to rotate the printed circuit board W
The forward end of the

【0013】次いで、クランプ移動装置7が後方に所定
量移動して上記プリント基板Wを第1回目の溝加工位置
に移動させた後、加工クランプ33を作動させて該プリ
ント基板Wを固定する。次いで、昇降制御部40でZ軸
モータ23を駆動制御して各加工ヘッド20を加工位置
に移動させるとともに、該加工ヘッド20を起動させ、
この状態でX軸モータ15、送りねじ16を介して横移
動装置13を図1において右方に移動させ、上記プリン
ト基板Wの上下面に第1回目のV形の溝Hを加工する。
Next, after the clamp moving device 7 moves backward by a predetermined amount to move the printed board W to the first groove processing position, the work clamp 33 is operated to fix the printed board W. Next, the elevation control unit 40 controls the drive of the Z-axis motor 23 to move each machining head 20 to the machining position, and activates the machining head 20;
In this state, the lateral movement device 13 is moved rightward in FIG. 1 via the X-axis motor 15 and the feed screw 16 to form the first V-shaped groove H on the upper and lower surfaces of the printed circuit board W.

【0014】次いでZ軸モータ23を介して各加工ヘッ
ド20を離間させ、横移動装置13を所定位置に移動さ
せた後、測定装置25の上下動装置27を作動させ、測
定子26を上記プリント基板Wの上下面の溝底に接触さ
せ、測定装置25の残厚演算部41で上記溝部の残厚
(実寸)を確認する。この残厚のデーターは補正部42
に入力され、該補正部42によって昇降制御部40に入
力設定された加工位置データと比較され、これが所定値
以上異なった際には、上記加工位置データが補正され、
各加工ヘッド20の加工位置が補正される。
Next, the processing heads 20 are separated from each other via the Z-axis motor 23, and the horizontal moving device 13 is moved to a predetermined position. Then, the vertical moving device 27 of the measuring device 25 is operated, and the measuring element 26 is printed. The substrate W is brought into contact with the bottom of the groove on the upper and lower surfaces, and the remaining thickness (actual size) of the groove is confirmed by the remaining thickness calculator 41 of the measuring device 25. The data of the remaining thickness is corrected by the correction unit 42.
Is compared with the processing position data input and set to the elevation control unit 40 by the correction unit 42, and when this differs by a predetermined value or more, the processing position data is corrected,
The processing position of each processing head 20 is corrected.

【0015】上記第1の加工工程が終了すると、加工ク
ランプ33が開作動(上動)され、クランプ移動装置7
が次段の後部位置に移動して上記プリント基板Wを第2
回目の溝加工位置に移動させた後、加工クランプ33を
作動させて該プリント基板Wを固定する。次いで、横移
動装置13を介して各加工ヘッド20を再び図1におい
て右方に移動させ、上記プリント基板Wの上下面に第2
回目の溝Hを加工した後、前述と同様にしてプリント基
板Wの溝部の残厚(実寸)を確認、補正部42による各
加工ヘッド20の加工位置の確認(補正)を行う。以下
同様にして上記プリント基板Wの上下面に順次溝加工
し、該溝加工が完了すると、クランプ装置を開作動させ
て上記プリント基板Wを排出コンベヤ34に落下させ、
この排出コンベヤ34によって機台1後部の堆積リフト
35に排出する。
When the first machining step is completed, the machining clamp 33 is opened (moved upward) and the clamp moving device 7 is opened.
Moves to the rear position of the next stage, and
After moving to the second groove processing position, the processing clamp 33 is operated to fix the printed circuit board W. Next, each processing head 20 is moved rightward again in FIG.
After processing the groove H for the first time, the remaining thickness (actual size) of the groove of the printed circuit board W is confirmed and the processing position of each processing head 20 is confirmed (corrected) by the correction unit 42 in the same manner as described above. In the same manner, grooves are sequentially formed on the upper and lower surfaces of the printed circuit board W, and when the groove processing is completed, the clamp device is opened to drop the printed circuit board W onto the discharge conveyor 34,
The paper is discharged to the deposition lift 35 at the rear of the machine 1 by the discharge conveyor 34.

【0016】[0016]

【発明の効果】以上の説明から明らかな如く、請求項1
の発明は、前後動する挿入テーブルに板材を載置し、こ
の挿入テーブルによって板材を後部側のクランプ装置に
向けて移送するとともに、挿入テーブルに設けた係止ガ
イドで板材の反前進端を押圧して該板材を上記クランプ
装置に挿入するようにしたので、クランプ装置による板
材の挾持精度が高くなる。また、後部側に設けたクラン
プ装置により板材を後方に引き出しながら溝加工するよ
うにしたので、プリント基板の如く薄い板材であっても
後方へ移動させる際に曲がらなくなり、溝の形成位置が
狂わなくなり、高精度に加工することができる。また、
溝加工の途中であっても次の板材を挿入テーブルに供給
することができ、加工効率が高くなる。また、請求項2
の発明は、加工品をクランプ装置から落下させて排出コ
ンベヤにより所定箇所に排出するようにしたので、高い
移動精度を要するクランプ移動装置を小型にすることが
できる。また、請求項3の発明は、加工直後に溝部の残
厚を確認して不良品の発生を未然に防止することができ
る。また、請求項4の発明は、加工ヘッドの加工位置が
高精度に維持され、溝の加工精度が高くなる。
As is apparent from the above description, claim 1
According to the invention, a plate is placed on an insertion table that moves back and forth, and the plate is transported toward a rear clamping device by the insertion table, and a non-advancing end of the plate is pressed by a locking guide provided on the insertion table. Then, since the plate is inserted into the clamp device, the clamping accuracy of the plate by the clamp device is increased. Also, since the groove is processed while pulling the plate material backward by the clamp device provided on the rear side, even if it is a thin plate material such as a printed circuit board, it will not bend when moving backward, and the position of the groove will not be disturbed. , Can be processed with high precision. Also,
The next plate material can be supplied to the insertion table even during the groove processing, and the processing efficiency is increased. Claim 2
According to the invention, the workpiece is dropped from the clamp device and discharged to a predetermined location by the discharge conveyor, so that the clamp moving device requiring high moving accuracy can be reduced in size. Further, according to the third aspect of the invention, it is possible to confirm the remaining thickness of the groove immediately after processing, thereby preventing the occurrence of defective products. According to the invention of claim 4, the processing position of the processing head is maintained with high accuracy, and the processing accuracy of the groove is increased.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明による溝加工機の略画した斜視図であ
る。
1 is a schematic perspective view of a grooving machine according to the present invention.

【図2】本発明による溝加工機の略画した側面図であ
る。
FIG. 2 is a schematic side view of a grooving machine according to the present invention.

【図3】本発明による加工ヘッド支持部の斜視図であ
る。
FIG. 3 is a perspective view of a processing head support according to the present invention.

【符号の説明】[Explanation of symbols]

1 機台 2 挿入テーブル 3 Y軸シリンダ(前後駆動装置) 4 係止ガイド 5 止め具 7 クランプ移動装置 8 クロスバー 10 クランプ装置 10a 下爪 10b 上爪 10c ピン 13 横移動装置 14 支持ケース 15 X軸モータ 16 送りねじ 20 加工ヘッド 21 ヘッドモータ 22 カッター 23 Z軸モータ(ヘッド昇降装置) 25 測定装置 26 測定子 27 上下動装置 30 リフト装置 31 投入装置 32 吸着パット 33 加工クランプ 34 排出コンベヤ 35 積載リフト 40 昇降制御部 41 残厚演算部 42 補正部 W 板材(プリント基板) H 溝 DESCRIPTION OF SYMBOLS 1 Machine stand 2 Insertion table 3 Y-axis cylinder (front-rear drive) 4 Locking guide 5 Stopper 7 Clamp moving device 8 Cross bar 10 Clamping device 10a Lower claw 10b Upper claw 10c Pin 13 Lateral moving device 14 Support case 15 X-axis Motor 16 Feed screw 20 Processing head 21 Head motor 22 Cutter 23 Z-axis motor (head elevating device) 25 Measuring device 26 Measuring element 27 Vertical moving device 30 Lifting device 31 Input device 32 Suction pad 33 Processing clamp 34 Discharge conveyor 35 Loading lift 40 Elevation control unit 41 Remaining thickness calculation unit 42 Correction unit W Plate (printed circuit board) H Groove

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】機台(1)の前部側に板材(W)が載置さ
れる挿入テーブル(2)を前後動可能に設けるととも
に、該挿入テーブル(2)の上面に該挿入テーブル
(2)に載置された板材(W)の反前進端と当接可能の
係止ガイド(4)を設け、機台(1)の後部側に前記挿
入テーブル(2)によって後方に送られる板材(W)の
前進端を受け止めてこれを挾持するクランプ装置(1
0)と、該クランプ装置(10)を後方に向けて間欠的
に移動させるクランプ移動装置(7)とを設け、前記挿
入テーブル(2)と前記クランプ装置(10)との間
に、機台(1)に対して左右方向に移動される横移動体
(13)を設け、該横移動体(13)に前記挿入テーブ
ル(2)に載置された板材(W)の少なくとも一方の面
に溝(H)を形成する加工ヘッド(20)を設けたこと
を特徴とする板材の溝加工機。
An insert table (2) on which a plate (W) is placed is provided at the front side of the machine base (1) so as to be movable back and forth, and the insert table (2) is provided on the upper surface of the insert table (2). A plate (2) is provided with a locking guide (4) that can be brought into contact with the non-advancing end of the plate (W) placed on the plate (2). (W) receives the forward end and clamps it (1).
0) and a clamp moving device (7) for intermittently moving the clamp device (10) rearward, and a machine base is provided between the insertion table (2) and the clamp device (10). A horizontal moving body (13) that is moved in the left-right direction with respect to (1) is provided, and the horizontal moving body (13) is provided on at least one surface of a plate (W) placed on the insertion table (2). A groove processing machine for a plate material, comprising a processing head (20) for forming a groove (H).
【請求項2】前記クランプ装置(10)の下方に排出コ
ンベヤ(34)を設けたことを特徴とする請求項1記載
の板材の溝加工機。
2. A grooving machine according to claim 1, wherein a discharge conveyor (34) is provided below said clamping device (10).
【請求項3】前記加工ヘッド(20)に、該加工ヘッド
(20)で形成された板材(W)の溝(H)の底部に接
触可能な測定子(26)を設けたことを特徴とする請求
項1又は2記載の板材の溝加工機。
3. The processing head (20) is provided with a tracing stylus (26) that can contact the bottom of the groove (H) of the plate (W) formed by the processing head (20). 3. The grooving machine according to claim 1, wherein
【請求項4】前記加工ヘッド(20)を上下動させるヘ
ッド昇降装置(23)、及び該ヘッド昇降装置(23)
を制御する昇降制御部(40)を設け、前記測定子(2
6)の位置を検出して前記板材(W)の溝部の残厚を演
算する残厚演算部(41)を設け、該残厚演算部(4
1)のデータに基づいて前記昇降制御部(40)に補正
データを出力して加工ヘッド(20)の加工位置を補正
する補正部(42)を設けたことを特徴とする請求項3
記載の板材の溝加工機。
4. A head elevating device (23) for moving the processing head (20) up and down, and the head elevating device (23).
A lifting / lowering control unit (40) for controlling the measuring element (2)
6) a remaining thickness calculating section (41) for detecting the position and calculating the remaining thickness of the groove of the plate (W);
4. A correction unit (42) for outputting correction data to the elevation control unit (40) based on the data of (1) and correcting the processing position of the processing head (20).
A groove processing machine for the plate material as described.
JP18804599A 1999-05-29 1999-05-29 Sheet material grooving machine Expired - Lifetime JP3623896B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18804599A JP3623896B2 (en) 1999-05-29 1999-05-29 Sheet material grooving machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18804599A JP3623896B2 (en) 1999-05-29 1999-05-29 Sheet material grooving machine

Publications (2)

Publication Number Publication Date
JP2000343313A true JP2000343313A (en) 2000-12-12
JP3623896B2 JP3623896B2 (en) 2005-02-23

Family

ID=16216728

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3623896B2 (en)

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JP2008130650A (en) * 2006-11-17 2008-06-05 Isao Yoshida Cutter for printed board
JP2015171758A (en) * 2008-12-08 2015-10-01 サイエンティア バスキュラー エルエルシー Micro-cutting apparatus for forming cuts in products
US9662798B2 (en) 2008-12-08 2017-05-30 Scientia Vascular Llc Micro-cutting systems for forming cuts in products
JP2017148935A (en) * 2008-12-08 2017-08-31 サイエンティア バスキュラー エルエルシー Micro-cutting system for forming cuts along length direction of catheter or guidewire stock material to form catheter or guidewire product
US10980968B2 (en) 2008-12-08 2021-04-20 Scientia Vascular, Llc Micro-cutting systems for forming cuts in products
US10232141B2 (en) 2008-12-08 2019-03-19 Scientia Vascular, Llc Micro-cutting systems for forming cuts in products
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US9950137B2 (en) 2009-04-03 2018-04-24 Scientia Vascular, Llc Micro-fabricated guidewire devices formed with hybrid materials
JP2014176929A (en) * 2013-03-14 2014-09-25 Ricoh Co Ltd Blade interval adjusting device, cutting device, and blade interval adjusting method
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CN106975777A (en) * 2015-12-18 2017-07-25 徐勤凤 Taper bolt milling open device
CN105397160B (en) * 2015-12-18 2017-12-12 泰州市华丰科技设备有限公司 Taper bolt milling open device
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US10953203B2 (en) 2016-07-18 2021-03-23 Scientia Vascular, Llc Guidewire devices having shapeable polymer tips
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US11452541B2 (en) 2016-12-22 2022-09-27 Scientia Vascular, Inc. Intravascular device having a selectively deflectable tip
US11369351B2 (en) 2017-05-26 2022-06-28 Scientia Vascular, Inc. Micro-fabricated medical device having a non-helical cut arrangement
US11305095B2 (en) 2018-02-22 2022-04-19 Scientia Vascular, Llc Microfabricated catheter having an intermediate preferred bending section
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