JP3583868B2 - ボンディング装置 - Google Patents

ボンディング装置 Download PDF

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Publication number
JP3583868B2
JP3583868B2 JP21392296A JP21392296A JP3583868B2 JP 3583868 B2 JP3583868 B2 JP 3583868B2 JP 21392296 A JP21392296 A JP 21392296A JP 21392296 A JP21392296 A JP 21392296A JP 3583868 B2 JP3583868 B2 JP 3583868B2
Authority
JP
Japan
Prior art keywords
bonding
semiconductor element
pressure head
support
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP21392296A
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English (en)
Japanese (ja)
Other versions
JPH1064958A5 (enExample
JPH1064958A (ja
Inventor
治 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP21392296A priority Critical patent/JP3583868B2/ja
Publication of JPH1064958A publication Critical patent/JPH1064958A/ja
Publication of JPH1064958A5 publication Critical patent/JPH1064958A5/ja
Application granted granted Critical
Publication of JP3583868B2 publication Critical patent/JP3583868B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Wire Bonding (AREA)
JP21392296A 1996-08-13 1996-08-13 ボンディング装置 Expired - Fee Related JP3583868B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21392296A JP3583868B2 (ja) 1996-08-13 1996-08-13 ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21392296A JP3583868B2 (ja) 1996-08-13 1996-08-13 ボンディング装置

Publications (3)

Publication Number Publication Date
JPH1064958A JPH1064958A (ja) 1998-03-06
JPH1064958A5 JPH1064958A5 (enExample) 2004-08-19
JP3583868B2 true JP3583868B2 (ja) 2004-11-04

Family

ID=16647273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21392296A Expired - Fee Related JP3583868B2 (ja) 1996-08-13 1996-08-13 ボンディング装置

Country Status (1)

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JP (1) JP3583868B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3300102A4 (en) * 2015-05-22 2018-05-30 Fuji Machine Mfg. Co., Ltd. Electronic component pressure-bonding device and electronic component mounting machine

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW587296B (en) * 1998-10-28 2004-05-11 Matsushita Electric Industrial Co Ltd Working method and apparatus
KR100605313B1 (ko) * 1999-12-13 2006-07-28 삼성전자주식회사 반도체 디바이스 제조용 다이 본딩 설비
JP2002231768A (ja) * 2001-02-01 2002-08-16 Shinkawa Ltd インナーリードボンディング装置
JP4517533B2 (ja) * 2001-04-27 2010-08-04 ソニー株式会社 部品実装方法および部品実装装置
JP4694928B2 (ja) * 2005-09-21 2011-06-08 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装装置の清掃方法
JP4773207B2 (ja) * 2006-01-12 2011-09-14 パナソニック株式会社 部品圧着装置
JP4773208B2 (ja) * 2006-01-12 2011-09-14 パナソニック株式会社 部品圧着方法
KR100888825B1 (ko) 2007-10-01 2009-03-17 주식회사 여의시스템 다이 소터의 픽커 구동장치
KR101949591B1 (ko) * 2017-05-24 2019-02-19 주식회사 프로텍 경사 리드를 구비한 연성 소재 부품 본딩 장치
CN117080127B (zh) * 2023-10-11 2024-01-05 江苏快克芯装备科技有限公司 芯片吸取异常检测装置及检测方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3300102A4 (en) * 2015-05-22 2018-05-30 Fuji Machine Mfg. Co., Ltd. Electronic component pressure-bonding device and electronic component mounting machine
US10462950B2 (en) 2015-05-22 2019-10-29 Fuji Corporation Electronic component bonding device and electronic component mounter

Also Published As

Publication number Publication date
JPH1064958A (ja) 1998-03-06

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