JP3550393B2 - 直線ストリップ部及びｕ字型ストリップ部を有する一体式熱放散フィンストリップユニット - Google Patents

直線ストリップ部及びｕ字型ストリップ部を有する一体式熱放散フィンストリップユニット Download PDF

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Publication number
JP3550393B2
JP3550393B2 JP2002156179A JP2002156179A JP3550393B2 JP 3550393 B2 JP3550393 B2 JP 3550393B2 JP 2002156179 A JP2002156179 A JP 2002156179A JP 2002156179 A JP2002156179 A JP 2002156179A JP 3550393 B2 JP3550393 B2 JP 3550393B2
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Japan
Prior art keywords
strip
heat
unit
base plate
fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002156179A
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English (en)
Japanese (ja)
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JP2003098283A (ja
Inventor
建 榮 鄭
Original Assignee
建 榮 鄭
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Publication date
Application filed by 建 榮 鄭 filed Critical 建 榮 鄭
Publication of JP2003098283A publication Critical patent/JP2003098283A/ja
Application granted granted Critical
Publication of JP3550393B2 publication Critical patent/JP3550393B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Measuring And Other Instruments (AREA)
JP2002156179A 2001-07-18 2002-05-29 直線ストリップ部及びｕ字型ストリップ部を有する一体式熱放散フィンストリップユニット Expired - Fee Related JP3550393B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW090117535 2001-07-18
TW90117535A TW475052B (en) 2001-07-18 2001-07-18 Heat-dissipating blade device

Publications (2)

Publication Number Publication Date
JP2003098283A JP2003098283A (ja) 2003-04-03
JP3550393B2 true JP3550393B2 (ja) 2004-08-04

Family

ID=21678796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002156179A Expired - Fee Related JP3550393B2 (ja) 2001-07-18 2002-05-29 直線ストリップ部及びｕ字型ストリップ部を有する一体式熱放散フィンストリップユニット

Country Status (4)

Country Link
JP (1) JP3550393B2 (de)
DE (1) DE10226654B4 (de)
FR (1) FR2827666A1 (de)
TW (1) TW475052B (de)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1062197B (it) * 1976-03-18 1983-07-28 Piemontese Radiatori Scambiatore di calore..particolarmente evaporatore o condensatore per impianti di condizionamento di autoveicoli
JP3305460B2 (ja) * 1993-11-24 2002-07-22 昭和電工株式会社 熱交換器
US5603159A (en) * 1994-09-29 1997-02-18 Zexel Corporation Method of producing heat exchangers
JP4117429B2 (ja) * 1999-02-01 2008-07-16 株式会社デンソー 熱交換器用フィン

Also Published As

Publication number Publication date
DE10226654B4 (de) 2004-07-22
JP2003098283A (ja) 2003-04-03
DE10226654A1 (de) 2003-02-06
FR2827666A1 (fr) 2003-01-24
TW475052B (en) 2002-02-01

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