JP3520415B2 - Piezoelectric vibrating piece, method for manufacturing piezoelectric vibrating piece, piezoelectric vibrator using the same, and piezoelectric oscillator - Google Patents
Piezoelectric vibrating piece, method for manufacturing piezoelectric vibrating piece, piezoelectric vibrator using the same, and piezoelectric oscillatorInfo
- Publication number
- JP3520415B2 JP3520415B2 JP2001140631A JP2001140631A JP3520415B2 JP 3520415 B2 JP3520415 B2 JP 3520415B2 JP 2001140631 A JP2001140631 A JP 2001140631A JP 2001140631 A JP2001140631 A JP 2001140631A JP 3520415 B2 JP3520415 B2 JP 3520415B2
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- Japan
- Prior art keywords
- piezoelectric
- piezoelectric vibrating
- vibrating piece
- wafer
- side end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、圧電材料からなる
ウェハを利用して構成する圧電振動子の製造方法とそれ
を用いた振動子に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a piezoelectric vibrator formed by using a wafer made of a piezoelectric material and a vibrator using the same.
【０００２】[0002]
【従来の技術】従来、圧電材料からなるウェハから、フ
ォトレジストやエッチング等の技術を用いて複数の圧電
振動片を一括して製造する方法が知られている。すなわ
ち上記製造方法では、まず圧電材料からなるウェハの表
面を研磨し、次いでこのウェハ表面に耐食膜を形成した
り、配線用のパターンをフォトレジストによって形成す
る。そしてこれら成膜工程とともに、外形フォトレジス
ト工程や外形エッチング工程を前記ウェハに対して行
い、圧電振動片の外形を形成するようにしている。2. Description of the Related Art Conventionally, there is known a method of collectively manufacturing a plurality of piezoelectric vibrating pieces from a wafer made of a piezoelectric material by using a technique such as photoresist or etching. That is, in the above manufacturing method, the surface of a wafer made of a piezoelectric material is first polished, and then a corrosion resistant film is formed on the surface of the wafer or a wiring pattern is formed by a photoresist. In addition to these film forming steps, an outer shape photoresist step and an outer shape etching step are performed on the wafer to form the outer shape of the piezoelectric vibrating piece.
【０００３】図５は、圧電材料からなるウェハに複数の
圧電振動片を形成した状態を示す説明図であり、同図
（１）はウェハ全体図を示し、同図（２）は、同図
（１）における要部拡大図を示す。なお本図で説明する
圧電振動片は、逆メサ型と称されるものであり、圧電振
動片の中央部分をハーフエッチングにて薄肉に形成して
おり、これにより高周波振動を得られるようになってい
る。FIG. 5 is an explanatory view showing a state in which a plurality of piezoelectric vibrating reeds are formed on a wafer made of a piezoelectric material. FIG. 5A is an overall view of the wafer, and FIG. The principal part enlarged view in (1) is shown. The piezoelectric vibrating piece described in this figure is called an inverted mesa type, and the central portion of the piezoelectric vibrating piece is thinly formed by half etching so that high frequency vibration can be obtained. ing.
【０００４】同図（１）に示すように、圧電材料からな
るウェハ１には、複数の圧電振動片２が形成されてお
り、これらは同図（２）に示すように連結部３によって
ウェハ１と接続されている。そして前記圧電振動片２
は、前記ウェハ１より外形抜きがされた状態で、薄肉部
（いわゆる励振部）の厚み調整等が行われ、所定の工程
を通過した後、圧電振動片２に外力を加え、連結部３を
折る（図中、破線を参照）ことで圧電振動片２を、ウェ
ハ１より取り出すようにしている。As shown in FIG. 1A, a plurality of piezoelectric vibrating pieces 2 are formed on a wafer 1 made of a piezoelectric material, and these are vibrated by a connecting portion 3 as shown in FIG. It is connected to 1. And the piezoelectric vibrating piece 2
In the state where the outer shape is removed from the wafer 1, the thickness adjustment of the thin portion (so-called excitation portion) is performed, and after passing through a predetermined process, an external force is applied to the piezoelectric vibrating reed 2 to connect the connecting portion 3. The piezoelectric vibrating piece 2 is taken out from the wafer 1 by folding (see the broken line in the figure).
【０００５】なお前記ウェハより折り取られた圧電振動
片は、その後、ベース基板の表面に導電性接着剤を用い
て接続され、前記ベース基板に設けられた端子電極と電
気的導通が図られる。そして電気的導通が図られた後
は、前記ベース基板の上方よりカバーを被せ、前記圧電
振動片を封止して圧電振動子を形成する。The piezoelectric vibrating reed cut off from the wafer is then connected to the surface of the base substrate with a conductive adhesive to establish electrical conduction with the terminal electrodes provided on the base substrate. After electrical conduction is achieved, a cover is placed over the base substrate and the piezoelectric vibrating piece is sealed to form a piezoelectric vibrator.
【０００６】[0006]
【発明が解決しようとする課題】しかしウェハ１に複数
の圧電振動片２を形成する際には、下記に示すような問
題点があった。すなわちウェハ１と圧電振動片２を接続
する連結部３は、圧電振動片２の側端面から突出する形
態となっている。このため前記圧電振動片２に必要な一
辺の長さは、圧電振動片２の辺長さに連結部３の長さを
加えた寸法となり、一個あたりの圧電振動片２の専有面
積が増大し、ウェハ１からの取り個数が低減するという
問題点があった。However, when forming a plurality of piezoelectric vibrating pieces 2 on the wafer 1, there are the following problems. That is, the connecting portion 3 that connects the wafer 1 and the piezoelectric vibrating piece 2 is configured to project from the side end surface of the piezoelectric vibrating piece 2. For this reason, the length of one side required for the piezoelectric vibrating piece 2 is a dimension obtained by adding the length of the connecting portion 3 to the side length of the piezoelectric vibrating piece 2, and the area occupied by each piezoelectric vibrating piece 2 increases. The problem is that the number of wafers taken from the wafer 1 is reduced.
【０００７】またウェハ１から取り出される圧電振動片
２の側端面には、（圧電振動片の特性に寄与しない）連
結部３の折り取り残部が存在している。そしてこの折り
取り残部が存在することにより、圧電振動片２の小型化
が阻害される要因になっていた。On the side end surface of the piezoelectric vibrating reed 2 taken out from the wafer 1, there is an unfolded portion of the connecting portion 3 (which does not contribute to the characteristics of the piezoelectric vibrating reed). The existence of the unfolded portion has been a factor that hinders the size reduction of the piezoelectric vibrating piece 2.
【０００８】さらに圧電振動片の電極に導電性接着剤を
塗布し、圧電振動片をベース基板に押し付けると、導電
性接着剤が圧電振動片とベース基板との間で広がってし
まい、異なる電極間で短絡が生じるおそれがあった。Further, when a conductive adhesive is applied to the electrodes of the piezoelectric vibrating piece and the piezoelectric vibrating piece is pressed against the base substrate, the conductive adhesive spreads between the piezoelectric vibrating piece and the base substrate, and the difference between different electrodes. There was a risk of short circuit.
【０００９】ところで上述した導電性接着剤の広がりに
より短絡が生じるのを防止するために、特開平９−２３
２９０２号公報や、特開平８−３１６７７１号公報、あ
るいは特開平７−７４５７６号公報に示される内容が開
示されている。By the way, in order to prevent the occurrence of a short circuit due to the spread of the above-mentioned conductive adhesive, Japanese Patent Application Laid-Open No. 9-23
The contents disclosed in Japanese Patent No. 2902, Japanese Patent Laid-Open No. 8-316771, and Japanese Patent Laid-Open No. 7-74576 are disclosed.
【００１０】しかし特開平９−２３２９０２号公報にお
いては、圧電振動片と電気的導通をなす台座間の側壁に
窪みを形成し、この窪みに導電性接着剤を取り込むこと
で、短絡防止を図っているものの、この窪みを形成する
ためには、３層の絶縁層をあらかじめ積層させなければ
ならず、その製造過程は困難なものになっていた。However, in Japanese Unexamined Patent Publication No. 9-232902, a recess is formed in a side wall between a pedestal that is in electrical communication with the piezoelectric vibrating piece, and a conductive adhesive is incorporated into the recess to prevent short circuit. However, in order to form this depression, three insulating layers had to be laminated in advance, which made the manufacturing process difficult.
【００１１】また特開平８−３１６７７１号公報におい
ては、電極を有した支持台に、ベースと接する溝部と、
この溝部に貫通する穴が設けられており、圧電素子を接
する側に塗布された導電性ペーストは、前記穴を通じて
溝部へと入り込み、電極間の短絡を防止するようにして
いる。しかし本公報においては、支持台自体に溝部と、
この溝部に貫通する穴を別途形成しなくてはならず、製
造工程が複雑化する問題があった。Further, in Japanese Unexamined Patent Publication No. 8-316771, a supporting base having electrodes, a groove portion in contact with the base,
A hole penetrating the groove portion is provided, and the conductive paste applied to the side in contact with the piezoelectric element enters the groove portion through the hole to prevent a short circuit between the electrodes. However, in this publication, a groove is formed on the support base itself,
There has been a problem in that a hole penetrating the groove must be separately formed, which complicates the manufacturing process.
【００１２】さらに特開平７−７４５７６号公報におい
ても、支持部の間に切欠部を形成し、この切欠部によっ
て支持部間の導電性接着剤が交わるのを防止するように
しているが、切欠部を形成するため別途工程が必要とな
り、上記公報と同様、製造工程が複雑化する問題があっ
た。Further, in Japanese Unexamined Patent Publication No. 7-74576, notches are formed between the support portions, and the notches prevent the conductive adhesive between the support portions from crossing each other. Since a separate step is required to form the portion, there is a problem that the manufacturing process is complicated as in the above-mentioned publication.
【００１３】また上述したこれら公報において、導電性
接着剤の流れ込み防止対策は、全て圧電振動子を取り付
けるベース側で行われており、圧電振動片自体に接着剤
の流れ防止の構造を持たせたものはない。このため圧電
振動片を他の容器に適用しようとすると、導電性接着剤
の広がりによって短絡が生じてしまうおそれがあった。Further, in the above-mentioned publications, the measures for preventing the inflow of the conductive adhesive are all performed on the base side to which the piezoelectric vibrator is attached, and the piezoelectric vibrating piece itself has a structure for preventing the inflow of the adhesive. There is nothing. Therefore, when the piezoelectric vibrating piece is applied to another container, there is a possibility that a short circuit may occur due to the spread of the conductive adhesive.
【００１４】本発明は、上記従来の問題点に着目し、既
存の工程を大幅に変更させることなく圧電振動片の小型
化を図ることが可能で、さらに圧電振動片を導電性接着
剤を用いて他部材に密着させる際、前記導電性接着剤の
広がりによって電極間で短絡が生じるのを防止すること
のできる圧電振動片と圧電振動片の製造方法、それを用
いた圧電振動子、ならびに圧電発振器を提供することを
目的とする。In the present invention, focusing on the above-mentioned conventional problems, it is possible to reduce the size of the piezoelectric vibrating reed without significantly changing the existing process. Further, the piezoelectric vibrating reed is made of a conductive adhesive. A piezoelectric vibrating reed and a method for manufacturing the piezoelectric vibrating reed, which can prevent a short circuit from occurring between the electrodes due to the spread of the conductive adhesive when it is brought into close contact with another member, a piezoelectric vibrator using the same, and a piezoelectric vibrator. The purpose is to provide an oscillator.
【００１５】[0015]
【課題を解決するための手段】本発明は、圧電振動片の
外形をエッチングによって形成する際、圧電振動片本体
の側端部に凹部を形成し、この凹部からウェハとの接続
をなす連結部を形成すれば、ウェハ圧電振動子と連結部
を加えた長さを短縮させることができ、ウェハあたりの
取り個数を増加させることができるという知見に基づい
てなされたものである。According to the present invention, when an outer shape of a piezoelectric vibrating reed is formed by etching, a concave portion is formed at a side end portion of the piezoelectric vibrating reed main body, and a connecting portion for connecting to the wafer from the concave portion. This is based on the knowledge that the length of the wafer piezoelectric vibrator and the connecting portion can be shortened and the number of wafers taken per wafer can be increased.
【００１６】すなわち本発明に係る圧電振動子は、圧電
材料からなるウェハより取り出される圧電振動片であっ
て、振動片本体の側端面に凹部と、この凹部側面から突
出し前記ウェハとの接続をなす連結部の折り取り残部と
を有し、この折り取り残部が前記側端面より内側に収ま
るよう、前記折り取り残部の高さを設定するよう構成し
た。That is, the piezoelectric vibrator according to the present invention is a piezoelectric vibrating piece that is taken out from a wafer made of a piezoelectric material, and has a concave portion on the side end surface of the vibrating piece main body and a protrusion that protrudes from the side surface of the concave portion to connect to the wafer. The connecting portion has a remaining portion to be folded, and the height of the remaining portion to be folded is set so that the remaining portion to be folded is set inside the side end surface.
【００１７】また本発明に係る圧電振動子の製造方法
は、圧電材料からなるウェハより圧電振動片を形成する
ための製造方法であって、前記ウェハからエッチングに
より前記圧電振動片の外形を形成する際に、前記圧電振
動片の側端面に凹部と、この凹部側面から突出し前記ウ
ェハへの接続をなす連結部を形成し、前記圧電振動片を
前記ウェハから取り出す際、前記連結部の折り取り残部
が前記圧電振動片における前記側端面から突出しないよ
う折り取りをなすこととした。そして前記圧電振動片は
逆メサ型圧電振動片であればよい。A method for manufacturing a piezoelectric vibrator according to the present invention is a method for forming a piezoelectric vibrating piece from a wafer made of a piezoelectric material, and the outer shape of the piezoelectric vibrating piece is formed from the wafer by etching. At this time, a concave portion is formed on a side end surface of the piezoelectric vibrating piece, and a connecting portion that projects from the side surface of the concave portion and forms a connection to the wafer is formed. When the piezoelectric vibrating piece is taken out from the wafer, the unfolded portion of the connecting portion is left. Is to be formed so as not to project from the side end surface of the piezoelectric vibrating piece. The piezoelectric vibrating piece may be an inverted mesa type piezoelectric vibrating piece.
【００１８】なお前記連結部における前記側端面より前
記圧電振動片側に弱体部を形成し、この弱体部に沿った
折り取りをなすことが望ましく、さらにこの弱体部は、
前記連結部の側面に形成されるくびれ部や、前記連結部
に貫通する孔部からなるようにしてもよい。そして前記
弱体部は、前記圧電振動片の外形と同時に形成されるこ
とが好ましい。また前記弱体部は、前記連結部の薄肉化
により形成されてもよく、前記連結部の薄肉化は、前記
連結部へのハーフエッチングによって行うようにしても
よい。It is desirable that a weak body portion is formed on the side of the piezoelectric vibrating piece from the side end surface of the connecting portion, and the weak body portion is broken along the weak body portion.
A constriction portion formed on a side surface of the connecting portion or a hole portion penetrating the connecting portion may be formed. Further, it is preferable that the weak body portion is formed at the same time as the outer shape of the piezoelectric vibrating piece. Further, the weak portion may be formed by thinning the connecting portion, and the thinning of the connecting portion may be performed by half etching the connecting portion.
【００１９】そして本発明に係る圧電振動子によれば、
圧電材料からなるウェハより取り出される圧電振動片を
用いた圧電振動子であって、前記圧電振動片本体の側端
面には凹部と、この当該凹部側面から突出し前記ウェハ
との接続をなす折取り残部とを有し、この折取り残部が
前記側端面より内側に収まるよう、前記折り取り残部の
高さを設定するとともに、前期凹部の両端側に電極を有
する前記圧電振動片と、当該圧電振動片を搭載可能とし
前記電極に対面する端子電極を有したベース基板とを有
し、前記電極と前記端子電極とを導電性接着剤を用いて
接続するよう構成した。ここで前記連結部における折り
取り残部の高さを、前記側端面に一致させたり、さらに
前記凹部は、前記電極の形成位置を超えるまで深く形成
されることが望ましい。According to the piezoelectric vibrator of the present invention,
A piezoelectric vibrator using a piezoelectric vibrating piece is taken out from the wafer made of a piezoelectric material, and the recess on the side end surface of the piezoelectric resonator element body, the connection between the projecting the wafer <br/> from this the concave portion side surface And a piezo-electric vibrating piece having an electrode on both end sides of the previous concave portion, while setting the height of the foldable remaining portion so that the foldable residual portion fits inside the side end surface. A base substrate having a terminal electrode facing the electrode and capable of mounting the piezoelectric vibrating piece is provided, and the electrode and the terminal electrode are configured to be connected using a conductive adhesive. Here, it is preferable that the height of the unfolded portion in the connecting portion is made to coincide with the side end surface, and that the recess is deeply formed to exceed the formation position of the electrode.
【００２０】さらに本発明に係る圧電発振器によれば、
圧電材料からなるウェハより取り出される圧電振動片を
用いた圧電発振器であって、前記圧電振動片本体の側端
面には凹部と、この当該凹部側面から突出し前記ウェハ
との接続をなす折取り残部とを有し、この折取り残部が
前記側端面より内側に収まるよう、前記折り取り残部の
高さを設定するとともに、前期凹部の両端側に電極を有
する前記圧電振動片と、当該圧電振動片を搭載可能とし
前記電極に対面する端子電極を有したベース基板と、前
記圧電振動片を発振駆動するための集積回路とを有し、
前記電極と前記端子電極とを導電性接着剤を用いて接続
するよう構成した。そして請求項１３記載の圧電発振器
であって、前記集積回路が前記圧電振動片の下部であっ
て、前記ベース基板上に搭載されていることが望まし
い。Further, according to the piezoelectric oscillator of the present invention,
A piezoelectric oscillator using a piezoelectric vibrating reed taken out from a wafer made of a piezoelectric material, wherein a concave portion is formed on a side end surface of the piezoelectric vibrating reed main body, and a protrusion is formed from a side surface of the concave portion to connect the wafer. And a piezoelectric vibrating piece having an electrode on both end sides of the recess, and a height of the remaining folding portion is set so that the remaining folding portion is located inside the side end surface. A base substrate having a terminal electrode facing the electrode and capable of mounting a piezoelectric vibrating piece; and an integrated circuit for oscillating and driving the piezoelectric vibrating piece,
The electrode and the terminal electrode were configured to be connected using a conductive adhesive. In the piezoelectric oscillator according to claim 13, it is desirable that the integrated circuit is mounted on the base substrate at a lower portion of the piezoelectric vibrating piece.
【００２１】これらの構成によれば、凹部の側面から連
結部が突出するので、当該連結部は、その一部が圧電振
動片の内側に位置することとなる。このように圧電振動
片の長さと、連結部の長さを重ねるようにすれば、連結
部が設けられた側の寸法を短くすることができ、圧電振
動片と連結部を含めた面積を低減させることが可能にな
る。ゆえにウェハ上における圧電振動片の取り個数を増
大させることができ、生産効率の向上を達成することが
できる。なお製造対象となる圧電振動片が、逆メサ型圧
電振動片であれば、外形形成時のエッチングによって同
時に凹部を形成することが可能になる。According to these configurations, since the connecting portion projects from the side surface of the concave portion, a part of the connecting portion is located inside the piezoelectric vibrating piece. By overlapping the length of the piezoelectric vibrating piece and the length of the connecting portion in this way, the dimension on the side where the connecting portion is provided can be shortened, and the area including the piezoelectric vibrating piece and the connecting portion can be reduced. It is possible to let Therefore, the number of piezoelectric vibrating reeds to be taken on the wafer can be increased, and the production efficiency can be improved. If the piezoelectric vibrating piece to be manufactured is an inverted mesa-type piezoelectric vibrating piece, it is possible to simultaneously form the concave portion by etching when forming the outer shape.
【００２２】なお連結部を形成する際、側端面より内側
に、弱体部を形成しておけば、外力を連結部に加える
と、集中荷重が前記弱体部に加わり、その部分で折り取
りがなされる。このため連結部が圧電振動片の側端面よ
り突出するのを防止することができる。そして弱体部
を、連結部の側面に形成されるくびれ部や、連結部に貫
通する孔部とすれば、連結部と同時にエッチングにより
形成することが可能になる。このように凹部を形成し
て、折り取り残部を圧電振動片の側端面内側に収めたこ
とから、余分な突起が圧電振動片の本体から突出するこ
とが無くなり、圧電振動片自体の小型化を図ることがで
きる。When forming the connecting portion, if a weak body portion is formed inside the side end face, when an external force is applied to the connecting portion, a concentrated load is applied to the weak body portion, and the portion is broken. It Therefore, it is possible to prevent the connecting portion from protruding from the side end surface of the piezoelectric vibrating piece. If the weak portion is a constricted portion formed on the side surface of the connecting portion or a hole penetrating the connecting portion, it can be formed by etching simultaneously with the connecting portion. Since the recessed portion is formed in this manner and the unfolded portion is housed inside the side end surface of the piezoelectric vibrating piece, an extra protrusion does not project from the body of the piezoelectric vibrating piece, and the piezoelectric vibrating piece itself can be miniaturized. Can be planned.
【００２３】ところで連結部にハーフエッチングを施
し、この薄肉部を弱体部としても上記と同様の作用効果
を得ることができる。なお圧電振動片が逆メサ型であれ
ば、枠体中央をハーフエッチングすると同時に、連結部
にハーフエッチングを行い、薄肉部を形成することが可
能になる。By the way, even if the connecting portion is half-etched and the thin portion is used as the weak portion, the same effect as the above can be obtained. If the piezoelectric vibrating piece is an inverted mesa type, it is possible to half-etch the center of the frame and simultaneously perform half-etching on the connecting portion to form a thin portion.
【００２４】また圧電振動子においては、圧電振動片の
凹部両端側に形成された電極と、ベース基板に形成され
る端子電極とを、導電性接着剤を用いて接続させるが、
この接続の際、前記導電性接着剤が双方の密着によって
はみ出したとしても、凹部縁辺と、折り取り残部とで形
成される空隙に導電性接着剤が入り込み、さらに折り取
り残部が、両電極に塗布された導電性接着剤を壁となっ
て分断するので、両電極に塗布された導電性接着剤が混
ざり合うことが防止でき、短絡が生じるのを防止するこ
とができる。Further, in the piezoelectric vibrator, the electrodes formed on both ends of the concave portion of the piezoelectric vibrating piece and the terminal electrodes formed on the base substrate are connected using a conductive adhesive,
At the time of this connection, even if the conductive adhesive sticks out due to the close contact between the two, the conductive adhesive enters the void formed by the edge of the recess and the remaining portion of the break, and the remaining portion of the break remains on both electrodes. Since the applied conductive adhesive is divided into walls, the conductive adhesive applied to both electrodes can be prevented from being mixed with each other, and a short circuit can be prevented.
【００２５】そして連結部における折り取り残部の高さ
を、圧電振動片における側端面に一致させれば、導電性
接着剤の流れ防止をなす壁の役割を最大限に発揮させる
ことができる。さらに凹部を、電極の形成位置を超える
まで深く形成すれば、両電極の間には必ず凹部と折り取
り残部とで形成される空隙が存在するので、双方の導電
性接着剤が交わるのを確実に防止することができる。If the height of the unfolded portion of the connecting portion is made to coincide with the side end surface of the piezoelectric vibrating piece, the role of the wall for preventing the flow of the conductive adhesive can be maximized. Furthermore, if the recess is formed deeper than the position where the electrodes are formed, there will always be a void formed between the recess and the unbroken part between both electrodes, so it is possible to ensure that both conductive adhesives intersect. Can be prevented.
【００２６】なお圧電発振器についても、当該圧電発振
器を構成する圧電振動片に凹部縁辺と、この凹部縁辺か
ら突出する折り取り残部が設けられている。このため前
記凹部縁辺と、折り取り残部とで形成される空隙に導電
性接着剤が入り込み、さらに折り取り残部が、両電極に
塗布された導電性接着剤を壁となって分断するので、両
電極に塗布された導電性接着剤が混ざり合うことが防止
でき、短絡が生じるのを防止することができる。故に前
記圧電振動片と、当該圧電振動片を発振駆動させる集積
回路との組み合わせにおいても、圧電発振器自体の小型
化と短絡防止を達成することができる。また前記集積回
路をベース基板上で、圧電振動片の下部になるよう配置
すれば、圧電発振器自体を一層小型にすることが可能に
なり、実装面積の低減を図ることができる。Regarding the piezoelectric oscillator as well, the piezoelectric vibrating reed constituting the piezoelectric oscillator is provided with the recess edge and the unfolded remaining portion protruding from the recess edge. For this reason, the conductive adhesive enters the gap formed by the edge of the recess and the remaining portion of the break, and the remaining portion of the break divides the conductive adhesive applied to both electrodes into a wall and divides it. It is possible to prevent the conductive adhesive applied to the electrodes from being mixed with each other and prevent a short circuit from occurring. Therefore, even in the combination of the piezoelectric vibrating reed and the integrated circuit for driving the piezoelectric vibrating reed to oscillate, miniaturization of the piezoelectric oscillator itself and prevention of short circuit can be achieved. Further, by disposing the integrated circuit on the base substrate so as to be below the piezoelectric vibrating piece, the piezoelectric oscillator itself can be further downsized, and the mounting area can be reduced.
【００２７】[0027]
【発明の実施の形態】以下に、本発明に係る圧電振動片
と圧電振動片の製造方法、それを用いた圧電振動子、な
らびに圧電発振器に好適な具体的実施の形態を図面を参
照して詳細に説明する。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of a piezoelectric vibrating piece and a method of manufacturing the piezoelectric vibrating piece according to the present invention, a piezoelectric vibrator using the same, and a piezoelectric oscillator will be described with reference to the drawings. The details will be described.
【００２８】図１は、本実施の形態に係る圧電振動片の
構造を示す説明図である。同図に示すように、本実施の
形態に係る圧電振動片１０は、一般に水晶体からなり、
外形をなす枠体１２と、当該枠体１２の中央部分に窪み
のように形成された薄肉部からなる励振部１４とから構
成されている。ここで当該励振部１４の厚みは、高周波
振動を得る目的から、非常に薄く設定されている（例え
ば１０μm程度）。このため励振部１４だけでは当該励
振部１４自体の姿勢を保つだけの強度が無く、その周囲
に形成された強度の有る枠体１２によって前記励振部１
４の保持を行うようにしている。FIG. 1 is an explanatory view showing the structure of the piezoelectric vibrating piece according to the present embodiment. As shown in the figure, the piezoelectric vibrating piece 10 according to the present embodiment is generally made of a crystalline lens,
It is composed of a frame body 12 having an outer shape, and an exciting portion 14 composed of a thin portion formed like a recess in the central portion of the frame body 12. Here, the thickness of the excitation part 14 is set to be extremely thin (for example, about 10 μm) for the purpose of obtaining high frequency vibration. Therefore, the exciter 14 alone does not have sufficient strength to maintain the posture of the exciter 14 itself, and the exciter 1 is formed by the strong frame 12 formed around the exciter 14.
4 is held.
【００２９】このような圧電振動片１０では、励振部１
４の表裏面に励振電極１６が形成されているとともに、
枠体１２の隅部に引出電極１８、２０が形成されてお
り、これら電極同士を接続するよう、段差２２の表面に
は配線パターン２４が形成されている。そして前記励振
部１４の表裏面に設けられた励振電極１６に引出電極１
８、２０より電圧を印加することで、あらかじめ設定さ
れた共振周波数を得るようにしている。In such a piezoelectric vibrating piece 10, the exciting portion 1
The excitation electrodes 16 are formed on the front and back surfaces of No. 4, and
Lead-out electrodes 18 and 20 are formed at the corners of the frame body 12, and a wiring pattern 24 is formed on the surface of the step 22 so as to connect these electrodes to each other. The extraction electrode 1 is attached to the excitation electrode 16 provided on the front and back surfaces of the excitation unit 14.
By applying a voltage from 8 and 20, a preset resonance frequency is obtained.
【００３０】ところで圧電振動片１０において、引出電
極１８、２０で構成される側端面２６（図中、Ａ面を参
照）には、前記引出電極１８と引出電極２０との間に凹
部２８が形成されているとともに、この凹部２８の中央
部分からは、振動子本体より外方に突出する折り取り残
部３０が形成されている。そしてこの折り取り残部３０
の突出高さは、前述した側端面２６を超えないだけの高
さに設定されている。By the way, in the piezoelectric vibrating reed 10, a concave portion 28 is formed between the extraction electrode 18 and the extraction electrode 20 on the side end surface 26 (see the surface A in the drawing) constituted by the extraction electrodes 18 and 20. At the same time, the unfolded portion 30 protruding outward from the vibrator body is formed from the central portion of the recess 28. And this unfolded portion 30
The protruding height of is set to a height that does not exceed the side end surface 26 described above.
【００３１】図２は、本実施の形態に係る圧電振動子の
構造を示す説明図であり、同図（１）は圧電振動子の長
手方向断面図を示し、同図（２）は、同図（１）におけ
るＡＡ断面図であり、同図（３）は、圧電振動子の上側
面図を示す。2A and 2B are explanatory views showing the structure of the piezoelectric vibrator according to the present embodiment. FIG. 2A is a longitudinal sectional view of the piezoelectric vibrator, and FIG. FIG. 3A is a cross-sectional view taken along the line AA in FIG. 1A, and FIG. 3C is a top side view of the piezoelectric vibrator.
【００３２】これらの図に示すように、本実施の形態に
係る圧電振動子３２は、図１で示した圧電振動片１０
と、当該圧電振動片１０を保持するためのベース基板３
４と、このベース基板３４とともに前記圧電振動片１０
を封止するためのカバー３５とで構成されている。As shown in these figures, the piezoelectric vibrator 32 according to the present embodiment has the piezoelectric vibrating piece 10 shown in FIG.
And a base substrate 3 for holding the piezoelectric vibrating piece 10.
4 and the base substrate 34 together with the piezoelectric vibrating piece 10
And a cover 35 for sealing.
【００３３】ベース基板３４は、矩形状からなり、その
中央部分には窪み３６が形成されている。そしてこの窪
み３６の周囲に位置する枠体３８の一辺を支持台４０と
し、当該支持台４０の表面に、圧電振動片１０における
引出電極１８、２０にそれぞれ対応する端子電極４２、
４４を設けるようにしている。なお端子電極４２、４４
からは図示しない配線パターンがベース基板３４の背面
側へと引き回され、ベース基板３４とカバー３５とで封
止された圧電振動片１０に、圧電振動子３２の外部よ
り、電圧を印加可能にしている。The base substrate 34 has a rectangular shape, and a recess 36 is formed in the central portion thereof. Then, one side of the frame 38 located around the recess 36 is used as a support base 40, and the surface of the support base 40 has terminal electrodes 42 respectively corresponding to the extraction electrodes 18 and 20 of the piezoelectric vibrating piece 10.
44 are provided. The terminal electrodes 42, 44
A wiring pattern (not shown) is routed to the back surface side of the base substrate 34, and a voltage can be applied to the piezoelectric vibrating reed 10 sealed by the base substrate 34 and the cover 35 from the outside of the piezoelectric vibrator 32. ing.
【００３４】なお上述した端子電極４２、４４に引出電
極１８、２０を接続するためには、導電性接着剤４６が
用いられる。当該導電性接着剤４６は、導電性を有した
銀等を含有しており、対象物の間に介在させることで、
対象物同士の接合と、電気的導通を図るようにしたもの
である。A conductive adhesive 46 is used to connect the lead electrodes 18, 20 to the above-mentioned terminal electrodes 42, 44. The conductive adhesive 46 contains silver or the like having conductivity, and by interposing it between the objects,
It is intended to connect the objects to each other and establish electrical continuity.
【００３５】そして圧電振動子３２においては、上述の
ような特性を有する導電性接着剤４６を、あらかじめ端
子電極４２、４４の表面に塗布しておき、その後、これ
ら端子電極４２、４４に引出電極１８、２０を重ねるよ
うに、ベース基板３４の上方から圧電振動片１０を押し
付け、圧電振動片１０を支持台４０から片持ちにさせた
状態で上記接着剤を硬化させる。In the piezoelectric vibrator 32, the conductive adhesive 46 having the above-described characteristics is applied to the surfaces of the terminal electrodes 42 and 44 in advance, and then the lead electrodes are drawn to the terminal electrodes 42 and 44. The piezoelectric vibrating reed 10 is pressed from above the base substrate 34 so that the layers 18 and 20 are overlapped, and the adhesive is cured in a state where the piezoelectric vibrating reed 10 is cantilevered from the support base 40.
【００３６】ところで本実施の形態に係る圧電振動片１
０では、前述の通り側端面２６に凹部２８が形成され、
引出電極１８、２０を分断するとともに、前記凹部２８
の中央部分に折り取り残部３０が形成されている。Incidentally, the piezoelectric vibrating reed 1 according to the present embodiment.
0, the concave portion 28 is formed in the side end surface 26 as described above,
The extraction electrodes 18 and 20 are divided and the recess 28 is formed.
An unfolded portion 30 is formed in the central portion of the.
【００３７】このため導電性接着剤４６が塗布された端
子電極４２、４４に引出電極１８、２０を押し付けるこ
とによって、前記導電性接着剤４６が電極範囲から広が
っても、導電性接着剤４６は凹部２８に溜まることとな
り、さらに端子電極４２と端子電極４４側それぞれの導
電性接着剤４６は、前述した折り取り残部３０が壁とな
って混ざり合うことがない。このため端子電極４２と端
子電極４４（引出電極１８と引出電極２０）が導電性接
着剤４６によって短絡することが無くなり、圧電振動子
３２の製造時における良品率を向上させることが可能に
なる。Therefore, by pressing the extraction electrodes 18 and 20 against the terminal electrodes 42 and 44 coated with the conductive adhesive 46, even if the conductive adhesive 46 spreads out of the electrode range, the conductive adhesive 46 is not removed. The conductive adhesives 46 on the terminal electrode 42 side and the terminal electrode 44 side do not mix with each other as the wall of the unfolded remaining portion 30 described above because they are accumulated in the recess 28. Therefore, the terminal electrode 42 and the terminal electrode 44 (lead-out electrode 18 and lead-out electrode 20) are not short-circuited by the conductive adhesive 46, and the non-defective rate at the time of manufacturing the piezoelectric vibrator 32 can be improved.
【００３８】なお凹部２８の最奥部の位置を引出電極１
８、２０の位置よりも内側になるようにすれば、引出電
極１８と引出電極２０とが、凹部２８によって完全に分
断されるので、導電性接着剤４６の流れ込みによる短絡
発生を一層防止することができる。図３は、本実施の形
態に係る圧電振動片をウェハから折り取る前段の状態を
示した状態図であり、同図（１）はウェハ全体図を示
し、同図（２）は同図（１）における要部拡大図を示
す。The position of the innermost portion of the recess 28 is set to the extraction electrode 1
If it is located inside the positions of 8 and 20, the extraction electrode 18 and the extraction electrode 20 are completely separated by the recess 28, so that the occurrence of a short circuit due to the inflow of the conductive adhesive 46 is further prevented. You can FIG. 3 is a state diagram showing a state before the piezoelectric vibrating reed according to the present embodiment is folded from the wafer. FIG. 3A is an overall view of the wafer, and FIG. The enlarged view of the main part in 1) is shown.
【００３９】これらの図に示すように、水晶を圧電材料
としたウェハ４８を、後述する種々の工程（図４を参
照）に通すことで、前記ウェハ４８の表面に複数の圧電
振動片１０を形成することができる。ここで個々の圧電
振動片１０においては、凹部から折り取り残部３０の前
身となる連結部５０が引き出されており、ウェハ４８と
の接続を行うようにしている。As shown in these figures, a wafer 48 made of quartz as a piezoelectric material is passed through various steps described later (see FIG. 4) to form a plurality of piezoelectric vibrating pieces 10 on the surface of the wafer 48. Can be formed. Here, in each of the piezoelectric vibrating reeds 10, the connecting portion 50 that is the predecessor of the unbroken portion 30 is pulled out from the concave portion, and is connected to the wafer 48.
【００４０】このため従来では、圧電振動片の長さに連
結部の長さを加えた寸法が、必要であったが、同図
（２）に示すように連結部の長さ（図中、寸法Ａ）と、
圧電振動片１０の長さ（図中、寸法Ｂ）が凹部２８によ
って重複した形態となり、本実施の形態では、個々の圧
電振動片１０に必要な長さ（図中、寸法Ｃ）は、For this reason, conventionally, the dimension of the length of the piezoelectric vibrating piece plus the length of the connecting portion was required, but as shown in FIG. 2B, the length of the connecting portion (in the figure, Dimension A),
The length (dimension B in the figure) of the piezoelectric vibrating piece 10 is overlapped by the recess 28, and in the present embodiment, the length (dimension C in the figure) required for each piezoelectric vibrating piece 10 is:
【数式１】
となる。Ａ寸法がＢ寸法に包含される結果、Ｃ寸法はＢ
寸法より若干大きければよいこととなる。ゆえに同図
（１）の矢印５２に示す縦方向により多くの圧電振動片
１０を形成することとができ、単一のウェハ４８からよ
り多くの圧電振動片１０を製造することが可能になる。[Formula 1] Becomes As a result of A dimension being included in B dimension, C dimension is B
It should be slightly larger than the size. Therefore, more piezoelectric vibrating reeds 10 can be formed in the vertical direction shown by the arrow 52 in FIG. 1A, and more piezoelectric vibrating reeds 10 can be manufactured from a single wafer 48.
【００４１】そしてウェハ４８上に複数形成された圧電
振動片１０に外力を加え、前記ウェハ４８から圧電振動
片１０を取り出す際、圧電振動片１０側に残る折り取り
残部３０の突出高さが、側端面２６の内側になるよう連
結部５０の折り取り位置を設定すればよい。このように
折り取り残部３０の突出高さを側端面２６の内側になる
ようにすれば、折り取り残部３０が圧電振動片１０の外
形より突出することが無くなり、上述した導電性接着剤
４６の流れ込み防止の効果に加え、圧電振動子３２の小
型化を図ることが可能になる。尚、圧電発振器を形成す
る場合には、圧電振動片１０の下でベース基板３４の窪
み３６に圧電振動片１０を駆動するために回路（図示せ
ず。）を搭載する。接着剤の流れ出しの虞がないので、
こうすることにより、極めてコンパクトな圧電発振器を
得ることができる。When an external force is applied to the plurality of piezoelectric vibrating reeds 10 formed on the wafer 48 to take out the piezoelectric vibrating reeds 10 from the wafer 48, the protrusion height of the unfolded remaining portion 30 remaining on the piezoelectric vibrating reed 10 side is The folding position of the connecting portion 50 may be set so as to be inside the side end surface 26. In this way, by setting the protruding height of the unfolded portion 30 to be inside the side end surface 26, the unfolded portion 30 does not project from the outer shape of the piezoelectric vibrating piece 10, and the conductive adhesive 46 described above is used. In addition to the effect of preventing the inflow, the piezoelectric vibrator 32 can be downsized. When forming the piezoelectric oscillator, a circuit (not shown) for driving the piezoelectric vibrating piece 10 is mounted in the recess 36 of the base substrate 34 below the piezoelectric vibrating piece 10. Since there is no risk of adhesive flowing out,
By doing so, an extremely compact piezoelectric oscillator can be obtained.
【００４２】なお逆メサ型の圧電振動片１０では、その
外形をエッチングによって形成するが、この外形形成の
ためのエッチング時に、凹部２８も同時に形成すること
が可能である。このため既存の工程に何ら追加をするこ
となく、凹部２８を形成することができる。ところで連
結部５０に対し折り取りを行う際、前記連結部５０に積
極的に弱体部を設け、折り取りの位置を一定にすること
が望ましい。Although the outer shape of the inverted mesa type piezoelectric vibrating piece 10 is formed by etching, the recess 28 can be formed at the same time as the etching for forming the outer shape. Therefore, the recess 28 can be formed without adding any existing process. By the way, when the connecting portion 50 is folded, it is desirable that the weak portion is positively provided in the connecting portion 50 so that the breaking position is constant.
【００４３】図４は、連結部に形成される弱体部の形状
説明図であり、同図（４）は同図（３）のＢＢ断面図を
示している。まず同図（１）に示すように、連結部５０
の側面に弱体部となるくびれ部５６を設け、当該くびれ
部５６を設けたことにより連結部５０の全幅を一部分だ
け狭くしておく。このように一箇所だけ連結部５０の幅
を狭めておけば、圧電振動片１０に外力を加えると、く
びれ部５６の位置に応力が集中し、連結部５０における
最狭の箇所で折り取りがなされる。なおくびれ部５６の
位置は、同図（１）の寸法ｔ1に示すように側端面２６
より内側に設定すれば、折り取り残部３０の先端は常
に、側端面２６より内側となり、圧電振動片１０の外形
からはみ出すのを防止することができる。FIG. 4 is an explanatory view of the shape of the weak body portion formed in the connecting portion, and FIG. 4 (4) is a sectional view taken along line BB of FIG. 4 (3). First, as shown in FIG.
A constricted portion 56, which is a weak body portion, is provided on the side surface of the conical portion 50, and the constricted portion 56 is provided so that the entire width of the connecting portion 50 is narrowed only partially. If the width of the connecting portion 50 is narrowed at only one position in this way, when an external force is applied to the piezoelectric vibrating piece 10, stress concentrates at the position of the constricted portion 56, and breakage occurs at the narrowest portion of the connecting portion 50. Done. The position of the constricted portion 56 is determined by the side end face 26 as shown by the dimension t 1 in FIG.
If it is set to the inner side, the tip of the unfolded portion 30 is always inside the side end surface 26, and it is possible to prevent the tip of the unfolded portion 30 from protruding from the outer shape of the piezoelectric vibrating piece 10.
【００４４】またくびれ部５６に代えて、同図（２）に
示すように、連結部５０に複数の貫通孔５８を形成し、
これを弱体部としてもよい。なお貫通孔５８の位置を、
同図（２）の寸法ｔ2に示すように側端面２６より内側
に設定すれば、同図（１）と同様、折り取り残部３０の
先端は常に、側端面２６より内側となり、圧電振動片１
０の外形からはみ出すのを防止することができる。貫通
孔５８の形成も外形形成のためのエッチング時に行うこ
とができる。Further, instead of the constricted portion 56, a plurality of through holes 58 are formed in the connecting portion 50 as shown in FIG.
This may be a weak body part. The position of the through hole 58 is
If it is set inside the side end surface 26 as shown by the dimension t 2 in FIG. 2B, the tip of the unfolded portion 30 is always inside the side end surface 26, as in FIG. 1
It is possible to prevent it from protruding from the outer shape of 0. The through holes 58 can also be formed at the time of etching for forming the outer shape.
【００４５】さらに同図（３）や同図（４）に示すよう
に、連結部５０を跨ぐよう溝部６０を形成し、この溝部
６０を弱体部としてもよい。このように溝部６０を連結
部５０に形成すれば、溝部６０の最奥部分が薄肉となる
ので、外力を加えることで容易に溝部６０に沿った折り
取りをなすことができる。また溝部６０の位置を、同図
（３）の寸法ｔ3に示すように側端面２６より内側に設
定すれば、同図（１）、同図（２）と同様、折り取り残
部３０の先端は常に、側端面２６より内側となり、圧電
振動片１０の外形からはみ出すのを防止することができ
る。溝部６０の形成は励振部１４の形成の際行うことが
できる。また上述したくびれ部５６、貫通孔５８、溝部
６０は、それぞれ単独である必要もなく、例えばくびれ
部５６と貫通孔５８とで弱体部を形成するようにしても
よい。Further, as shown in FIGS. 3C and 4D, a groove portion 60 may be formed so as to straddle the connecting portion 50, and the groove portion 60 may be a weak body portion. When the groove portion 60 is formed in the connecting portion 50 in this way, the innermost portion of the groove portion 60 becomes thin, so that it is possible to easily make a break along the groove portion 60 by applying an external force. Further, if the position of the groove portion 60 is set inside the side end surface 26 as shown by the dimension t 3 in FIG. 3C, the tip of the unfolded portion 30 is the same as in FIGS. 1A and 2B. Is always inside the side end surface 26 and can be prevented from protruding from the outer shape of the piezoelectric vibrating piece 10. The groove portion 60 can be formed when the exciting portion 14 is formed. Further, the constricted portion 56, the through hole 58, and the groove portion 60 described above do not have to be independent, and for example, the constricted portion 56 and the through hole 58 may form a weak body portion.
【００４６】[0046]
【発明の効果】以上説明したように本発明によれば、圧
電材料からなるウェハより取り出される圧電振動片であ
って、振動片本体の側端面に凹部と、この凹部側面から
突出し前記ウェハとの接続をなす連結部の折り取り残部
とを有し、この折り取り残部が前記側端面より内側に収
まるよう、前記折り取り残部の高さを設定したり、As described above, according to the present invention, a piezoelectric vibrating reed taken out from a wafer made of a piezoelectric material is provided with a concave portion at a side end surface of the vibrating piece main body and the wafer protruding from the concave side surface. And a remaining unfolded portion of the connecting portion that makes the connection, so that the remaining unfolded portion is set inside the side end surface, the height of the unfolded remaining portion is set,
【００４７】圧電材料からなるウェハより圧電振動片を
形成するための製造方法であって、前記ウェハからエッ
チングにより前記圧電振動片の外形を形成する際に、前
記圧電振動片の側端面に凹部と、この凹部側面から突出
し前記ウェハへの接続をなす連結部を形成し、前記圧電
振動片を前記ウェハから取り出す際、前記連結部の折り
取り残部が前記圧電振動片における前記側端面から突出
しないよう折り取りをなしたり、また圧電材料からなる
ウェハより取り出される圧電振動片を用いた圧電振動子
であって、前記圧電振動片本体の側端面には凹部と、こ
の当該凹部側面から突出し前記ウェハとの接続をなす折
取り残部とを有し、この折取り残部が前記側端面より内
側に収まるよう、前記折り取り残部の高さを設定すると
ともに、前期凹部の両端側に電極を有する前記圧電振動
片と、当該圧電振動片を搭載可能とし前記電極に対面す
る端子電極を有したベース基板とを有し、前記電極と前
記端子電極とを導電性接着剤を用いて接続したり、さら
に圧電材料からなるウェハより取り出される圧電振動片
を用いた圧電発振器であって、前記圧電振動片本体の側
端面には凹部と、この当該凹部側面から突出し前記ウェ
ハとの接続をなす折取り残部とを有し、この折取り残部
が前記側端面より内側に収まるよう、前記折り取り残部
の高さを設定するとともに、前期凹部の両端側に電極を
有する前記圧電振動片と、当該圧電振動片を搭載可能と
し前記電極に対面する端子電極を有したベース基板と、
前記圧電振動片を発振駆動するための集積回路とを有
し、前記電極と前記端子電極とを導電性接着剤を用いて
接続したことから、既存の工程を大幅に変更させること
なく圧電振動子や発振器の小型化を図ることが可能で、
さらに圧電振動子を導電性接着剤を用いて他部材に密着
させる際、前記導電性接着剤の広がりによって電極間で
短絡が生じるのを防止することが可能になる。A manufacturing method for forming a piezoelectric vibrating piece from a wafer made of a piezoelectric material, wherein when forming the outer shape of the piezoelectric vibrating piece from the wafer by etching, a concave portion is formed on a side end surface of the piezoelectric vibrating piece. , Forming a connecting portion projecting from the side surface of the concave portion and connecting to the wafer, so that when the piezoelectric vibrating piece is taken out from the wafer, the unfolded portion of the connecting portion does not protrude from the side end surface of the piezoelectric vibrating piece. Made of piezo material or broken
A piezoelectric vibrator using a piezoelectric vibrating reed taken out from a wafer , wherein a side end surface of the piezoelectric vibrating reed main body has a recessed portion, and a break remaining portion protruding from the side surface of the recessed portion and connected to the wafer. , The height of the unfolded remaining portion is set so that the unfolded remaining portion fits inside the side end surface, and the piezoelectric vibrating piece having electrodes on both ends of the recess and the piezoelectric vibrating piece can be mounted. A base substrate having a terminal electrode facing the electrode, connecting the electrode and the terminal electrode by using a conductive adhesive, and further using a piezoelectric vibrating piece taken out from a wafer made of a piezoelectric material. a piezoelectric oscillator had, and the recess on the side end surface of the piezoelectric resonator element body protrudes the web from the said recess side surfaces
And a folding-up the balance that forms the connection with the C, so that the folding-up the balance falls inside the said end surface, and sets the height of the break-off balance, said having electrodes on both end sides of the year recess A piezoelectric vibrating piece, and a base substrate having a terminal electrode that can mount the piezoelectric vibrating piece and faces the electrode,
An integrated circuit for oscillating and driving the piezoelectric vibrating reed, and the electrode and the terminal electrode are connected using a conductive adhesive, so that the piezoelectric vibrator can be performed without significantly changing the existing process. And oscillators can be made smaller,
Further, when the piezoelectric vibrator is brought into close contact with another member using a conductive adhesive, it is possible to prevent a short circuit between electrodes due to the spread of the conductive adhesive.
【図１】本実施の形態に係る圧電振動子の構造を示す説
明図である。FIG. 1 is an explanatory diagram showing a structure of a piezoelectric vibrator according to the present embodiment.
【図２】本実施の形態に係る圧電振動子の構造を示す説
明図である。FIG. 2 is an explanatory diagram showing the structure of the piezoelectric vibrator according to the present embodiment.
【図３】本実施の形態に係る圧電振動子をウェハから折
り取る前段の状態を示した状態図である。FIG. 3 is a state diagram showing a state before the piezoelectric vibrator according to the present embodiment is folded from a wafer.
【図４】連結部に形成される弱体部の形状説明図であ
る。FIG. 4 is an explanatory view of a shape of a weak body portion formed in a connecting portion.
【図５】圧電材料からなるウェハに複数の圧電振動片を
従来技術により形成した状態を示す説明図である。FIG. 5 is an explanatory view showing a state in which a plurality of piezoelectric vibrating pieces are formed on a wafer made of a piezoelectric material by a conventional technique.
１………ウェハ、２………圧電振動片、３………連結
部、１０………圧電振動片、１２………枠体、１４……
…励振部、１６………励振電極、１８………引出電極、
２０………引出電極、２２………段差、２４………配線
パターン、２６………側端面、２８………凹部、３０…
……折り取り残部、３２………圧電振動子、３４………
ベース基板、３５………カバー、３６………窪み、３８
………枠体、４０………支持台、４２………端子電極、
４４………端子電極、４６………導電性接着剤、４８…
……ウェハ、５０………連結部、５２………矢印、５６
………くびれ部、５８………貫通孔、６０………溝部1 ... Wafer, 2 ......... Piezoelectric vibrating piece, 3 ......... Connecting part, 10 ...... Piezoelectric vibrating piece, 12 ......... Frame body, 14 ...
… Excitation part, 16 ………… Excitation electrode, 18 ………… Extraction electrode,
20 ......... Extractor electrode, 22 ......... Step, 24 ......... Wiring pattern, 26 ......... Side end surface, 28 ...
…… Unfolded part, 32 ……… Piezoelectric vibrator, 34 ………
Base substrate, 35 ... Cover, 36 ... Recess, 38
……… Frame, 40 ……… Supporting platform, 42 ……… Terminal electrodes,
44 ......... Terminal electrodes, 46 ......... Conductive adhesive, 48 ...
...... Wafer, 50 ...... Connection part, 52 ............ Arrow, 56
……… Constriction, 58 ……… Through hole, 60 …… ... Groove
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H03H 9/19 H03H 3/02 H03H 9/10 ─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. 7 , DB name) H03H 9/19 H03H 3/02 H03H 9/10
Claims (6)
を形成するための製造方法であって、前記ウェハからエ
ッチングにより前記圧電振動片の外形を形成する際に、
前記圧電振動片の側端面に凹部と、この凹部側面から突
出し前記ウェハへの接続をなす連結部を形成し、前記圧
電振動片を前記ウェハから取り出す際、前記連結部の折
り取り残部が前記圧電振動片における前記側端面から突
出しないよう折り取りをなすことを特徴とする逆メサ型
圧電振動片の製造方法。 1. A piezoelectric vibrating piece made of a wafer made of a piezoelectric material.
A method for manufacturing a wafer, comprising:
When forming the outer shape of the piezoelectric vibrating reed by etching,
A recess is formed on the side end surface of the piezoelectric vibrating piece, and the side surface of the recess protrudes.
Forming a connecting portion for connecting to the wafer,
When removing the electro-vibration piece from the wafer, fold the connecting part.
The remaining portion of the protrusion protrudes from the side end surface of the piezoelectric vibrating piece.
Reverse mesa type characterized by breaking off so that it does not come out
A method for manufacturing a piezoelectric vibrating piece.
る圧電振動片を用いた圧電振動子であって、前記圧電振
動片本体の側端面には凹部と、この当該凹部側面から突
出し前記ウェハとの接続をなす折取り残部とを有し、こ
の折取り残部が前記側端面より内側に収まるよう、前記
折り取り残部の高さを設定するとともに、前期凹部の両
端側に電極を有する前記圧電振動片と、当該圧電振動片
を搭載可能とし前記電極に対面する端子電極を有したベ
ース基板とを有し、前記電極と前記端子電極とを導電性
接着剤を用いて接続したことを特徴とする圧電振動子。2. A taken out from the wafer made of a piezoelectric material
A piezoelectric vibrator using a piezoelectric vibrating piece,
A concave portion is formed on the side end surface of the moving piece body, and a protrusion is formed from the side surface of the concave portion.
And a break remaining portion for connection with the wafer.
Make sure that the unfolded portion of is set inside the side end surface.
Set the height of the remaining unbroken part, and
The piezoelectric vibrating piece having electrodes on the end side, and the piezoelectric vibrating piece
Mountable with a terminal electrode facing the electrode.
A base substrate, and the electrodes and the terminal electrodes are electrically conductive.
A piezoelectric vibrator characterized by being connected using an adhesive .
を、前記側端面に一致させたことを特徴とする請求項２
に記載の圧電振動子。 3. The height of the unfolded portion at the connecting portion.
Is made to coincide with the side end face.
The piezoelectric vibrator according to item 1.
るまで深く形成されることを特徴とする請求項２に記載
の圧電振動子。 4. The recess extends beyond the position where the electrode is formed.
It is deeply formed to the maximum, The claim 2 characterized by the above-mentioned.
Piezoelectric vibrator.
る圧電振動片を用いた圧電発振器であって、前記圧電振
動片本体の側端面には凹部と、この当該凹部側面から突
出し前記ウェハとの接続をなす折取り残部とを有し、こ
の折取り残部が前記側端面より内側に収まるよう、前記
折り取り残部の高さを設定するとともに、前期凹部の両
端側に電極を有する前記圧電振動片と、当該圧電振動片
を搭載可能とし前記電極に対面する端子電極を有したベ
ース基板と、前記圧電振動片を発振駆動するための集積
回路とを有し、前記電極と前記端子電極とを導電性接着
剤を用いて接続したことを特徴とする圧電発振器。 5. A wafer made of a piezoelectric material is taken out.
A piezoelectric oscillator using a piezoelectric vibrating piece, comprising:
A concave portion is formed on the side end surface of the moving piece body, and a protrusion is formed from the side surface of the concave portion.
And a break remaining portion for connection with the wafer.
Make sure that the unfolded portion of is set inside the side end surface.
Set the height of the remaining unbroken part, and
The piezoelectric vibrating piece having electrodes on the end side, and the piezoelectric vibrating piece
Mountable with a terminal electrode facing the electrode.
And a substrate for oscillating and driving the piezoelectric vibrating piece
A circuit and conductively bond the electrode and the terminal electrode
A piezoelectric oscillator characterized by being connected using a chemical.
記集積回路が前記圧電振動片の下部であって、前記ベー
ス基板上に搭載されていることを特徴とする圧電発振
器。 6. The piezoelectric oscillator according to claim 5, wherein
The integrated circuit is below the piezoelectric vibrating piece,
Piezoelectric oscillation characterized by being mounted on a substrate
vessel.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001140631A JP3520415B2 (en) | 2001-05-10 | 2001-05-10 | Piezoelectric vibrating piece, method for manufacturing piezoelectric vibrating piece, piezoelectric vibrator using the same, and piezoelectric oscillator |
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| Publication Number | Publication Date |
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| JP3520415B2 true JP3520415B2 (en) | 2004-04-19 |
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| JP5111018B2 (en) * | 2007-08-27 | 2012-12-26 | セイコーインスツル株式会社 | Airtight terminal manufacturing method and piezoelectric vibrator manufacturing method |
| JP5158706B2 (en) * | 2008-06-30 | 2013-03-06 | 日本電波工業株式会社 | Quartz crystal manufacturing method, crystal oscillator and electronic component |
| JP4908614B2 (en) * | 2009-06-12 | 2012-04-04 | 日本電波工業株式会社 | Manufacturing method of crystal unit |
| JP6127495B2 (en) | 2012-12-19 | 2017-05-17 | セイコーエプソン株式会社 | Vibrating piece, vibrator, oscillator, electronic device, moving body, and method of manufacturing vibrating piece |
| JP7424065B2 (en) * | 2020-01-20 | 2024-01-30 | セイコーエプソン株式会社 | Vibration devices, electronic equipment, and moving objects |
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