JP4690193B2 - Method for manufacturing piezoelectric device and piezoelectric device - Google Patents

Description

  The present invention relates to a piezoelectric device and a manufacturing method thereof, and particularly relates to a piezoelectric device manufactured using a piezoelectric vibrating piece connected integrally with a frame.

  In recent years, with the miniaturization of portable devices and the like, the demand for miniaturization of piezoelectric devices used therefor has also increased. As miniaturization of piezoelectric devices progresses, it is necessary to reduce the outer dimensions of piezoelectric vibrating reeds such as quartz used in piezoelectric devices.

  When the piezoelectric vibrating piece becomes small, handling of the piezoelectric vibrating piece becomes difficult when the piezoelectric vibrating piece is mounted on the container of the piezoelectric device, causing damage to the piezoelectric vibrating piece and causing deterioration of the characteristics of the piezoelectric device.

  For this reason, a piezoelectric device as disclosed in Patent Document 1 has been proposed. A conventional piezoelectric device will be described with reference to the drawings. FIG. 3 is a cross-sectional view showing a piezoelectric device in a conventional example, and FIG. 4 is a top view of the piezoelectric device in the conventional example before joining a lid. The conventional piezoelectric device 30 is a piezoelectric vibrating body 40 having a structure in which a frame body 42 and a piezoelectric vibrating piece 41 are integrated.

  In order to obtain this piezoelectric device 30, the frame body 42 of the piezoelectric vibrating body 40 in which an electrode (not shown) is provided on the piezoelectric vibrating piece 41 is fixed to the substrate member 31, and the piezoelectric vibrating piece 41 also has an adhesive member 44. The lid body 32 may be fixed to the upper surface of the frame body 42 after being electrically and mechanically connected to the substrate member 31. At this time, the frame body 42 constituting the piezoelectric vibrating body 40 is used as a part of the container of the piezoelectric device 30 by being fixed in such a manner as to be sandwiched between the substrate member 31 and the lid body 32. The adhesive member 44 is electrically connected to the external terminal 33 through wiring (not shown).

  Thus, the piezoelectric vibrating body 40 having a structure in which the frame body 42 and the piezoelectric vibrating piece 41 are integrated is formed, and the outer diameter of the piezoelectric vibrating piece is substantially increased to handle the piezoelectric vibrating piece. It deals with the difficulty of handling when mounting the resonator element, and prevents the deterioration of the characteristics of the piezoelectric device due to the damage of the piezoelectric resonator element.

JP 2000-223996 A

  However, the above configuration has the following problems. That is, when the piezoelectric vibrating piece is extremely small, the degree to which the piezoelectric vibrating piece 41 is restrained by the frame body 42 via the connection portion 43 is increased. When the restraint of the piezoelectric vibrating piece 41 is strengthened, the vibration of the piezoelectric vibrating piece 41 is hindered. As a result, the piezoelectric device characteristics are deteriorated due to an increase in crystal impedance (CI) value or the like.

  The present invention provides a method of manufacturing a piezoelectric device and a piezoelectric device that eliminates the difficulty of handling when a piezoelectric vibrating piece is mounted on a substrate member even if the piezoelectric device is small, and does not cause deterioration of device characteristics. It is intended to do.

  To achieve the above object, a piezoelectric vibrating piece in which an excitation electrode and a connection electrode are formed, and a frame body surrounding the piezoelectric vibrating piece are mounted on a substrate member, and the substrate member, the frame body, and the frame body are mounted on the substrate member. A method of manufacturing a piezoelectric device in which the piezoelectric vibrating piece is sealed with a lid mounted on the piezoelectric device, wherein at least the piezoelectric vibrating piece and the frame are integrally formed via a connection portion The vibrating body is bonded to the wiring electrode formed on the substrate member in correspondence with the connection electrode formed on the piezoelectric vibrating piece, and the substrate member and the piezoelectric vibrating body are electrically and mechanically connected. A step of cutting the connecting portion of the piezoelectric vibrating body bonded to the substrate member to separate the piezoelectric vibrating piece and the frame, and bonding the lid to the upper surface of the frame to bond the piezoelectric Piezoelectric device having a step of sealing a resonator element And manufacturing method. Moreover, it is set as the piezoelectric device manufactured by this manufacturing method.

  Furthermore, the piezoelectric vibrating piece and the frame body that are integrally formed are separated from each other by cutting the connecting portion between the piezoelectric vibrating piece and the frame body by blasting, dry etching, or laser.

  Also, a piezoelectric device in which the frame is formed thicker than the piezoelectric vibrating piece is assumed.

  According to the present invention, when the piezoelectric vibrating piece is mounted on the board member, the piezoelectric vibrating piece is a piezoelectric vibrating body integrated with the frame body via the connecting portion, so that the substantial outer dimension is large. Thus, handling becomes easy. In addition, by separating the piezoelectric vibrating piece from the frame after mounting it on the substrate member, the piezoelectric vibrating piece is released from being firmly fixed, and the vibration of the piezoelectric vibrating piece is not hindered. It can also be prevented.

  The best embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a cross-sectional view showing the structure of a piezoelectric device according to an embodiment of the present invention, and FIG. 2 is a top view of the piezoelectric device according to the present invention before joining a lid. The piezoelectric device 10 includes a piezoelectric vibrating body 20 composed of a piezoelectric vibrating piece 21 and a frame body 22, a substrate member 11 to which the piezoelectric vibrating piece 21 is electrically and mechanically connected and fixed using an adhesive member 24, The lid body 12 is configured to hermetically seal the piezoelectric vibrating piece 21. As shown in FIG. 2, the piezoelectric vibrating piece 21 and the frame body 22 that are integrated via the connection portion 23 to form the piezoelectric vibrating body 20 are connected to the substrate member 11 using the connecting member 24. After being fixed, the piezoelectric device 10 is configured in a state of being divided at the connection portion 23.

  Next, an example of the manufacturing method of the piezoelectric device 10 which is one Example of this invention is demonstrated.

  The piezoelectric vibrating body 20 including the piezoelectric vibrating piece 21 and the frame body 22 integrally connected to at least a part of the piezoelectric vibrating piece 21 via the connection portion 23 is formed by wet etching, dry etching, or sand blasting. Then, an excitation electrode (not shown) for oscillating the piezoelectric vibrating piece 21 and a connection for connecting to the excitation electrode and connecting to the substrate member 11 are formed. An electrode (not shown) is formed on the surface of the piezoelectric vibrating piece 21 using a technique such as sputtering or vacuum deposition.

  Next, the frame body 22 of the piezoelectric vibrating body 20 having the electrodes provided on the piezoelectric vibrating piece 21 is disposed so that the connection electrode formed on the piezoelectric vibrating piece 21 and the wiring electrode (not shown) formed on the substrate member correspond to each other. The frame body 22 is fixed to the substrate member 11, and the piezoelectric vibrating piece 21 is electrically and mechanically connected to the substrate member 11 using the adhesive member 24. The adhesive member 24 is electrically connected to the external terminal 13 through a wiring electrode (not shown). By fixing the frame body 22 to the substrate member 11, the frame body 22 also has a role as a part of the container of the piezoelectric device 10. In addition, by forming the frame 12 thicker than the piezoelectric vibrating piece 21, the piezoelectric vibrating piece 21 can operate stably without the piezoelectric vibrating piece 21 coming into contact with the lid 12 or the substrate member 11. Make up space.

  After the piezoelectric vibrating body 20 is fixed to the substrate member 11, the connecting portion 23 in which the piezoelectric vibrating piece 21 and the frame body 22 constituting the piezoelectric vibrating body 20 are integrated is blasted by laser, dry etching, dry ice particles, or the like. Then, the piezoelectric vibrating piece 21 and the frame body 22 are divided.

  After dividing the piezoelectric vibrating piece 21 and the frame 22, the lid 12 is fixed to the upper surface of the frame 22 in order to hermetically seal the piezoelectric vibrating piece 21 inside the piezoelectric device 10. For fixing the lid 12 and the frame 22 and fixing the substrate member 11 and the frame 22, airtight sealing is achieved by using a method such as eutectic bonding, direct bonding, anodic bonding, or surface activation bonding. Is possible.

  As described above, in the present invention, when the piezoelectric vibrating piece is mounted on the substrate member, the piezoelectric vibrating piece is a piezoelectric vibrating body integrated with the frame body via the connection portion, and has substantially the outer dimensions. Since the structure is large, the handling of the piezoelectric vibrating piece during mounting becomes easy, and the piezoelectric vibrating piece is separated from the frame after the piezoelectric vibrating piece is mounted on the substrate member. Is released from the strong restraint, and the vibration of the piezoelectric vibrating piece is not hindered, and it is possible to prevent the deterioration of the characteristics of the piezoelectric device.

  In the present invention, the following materials can be used for the substrate member, the piezoelectric vibrator, and the lid.

  As the substrate member, ceramic, glass, silicon, or a silicon wafer on which an IC circuit is formed can be used. As the lid, ceramic, glass, metal, silicon, or silicon on which an IC circuit is formed. A wafer or the like can be used. As the piezoelectric vibrator, any piezoelectric material such as quartz or piezoelectric ceramics can be used.

  In the embodiment of the present invention, the piezoelectric vibrating piece has a rectangular shape, but there is no problem even if it has a tuning fork shape, a circular shape, or other polygonal shapes.

  Furthermore, the present invention is not limited to the above-described embodiment, but can be applied to any piezoelectric device such as a piezoelectric oscillator incorporating an IC.

  The present invention can be utilized for manufacturing a small piezoelectric device.

Sectional drawing which shows the Example in this invention. The top view before the cover body joining of the piezoelectric device in this invention. Sectional drawing which shows the piezoelectric device in a prior art example. The top view before the cover body joining of the piezoelectric device in a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Piezoelectric device 11 Substrate member 12 Cover body 20 Piezoelectric vibration body 21 Piezoelectric vibration piece 22 Frame body 23 Connection part 24 Adhesive member

Claims (6)

A piezoelectric vibrating piece on which an excitation electrode and a connection electrode are formed, and a frame body surrounding the piezoelectric vibrating piece are mounted on a substrate member, and the substrate member, the frame body, and a lid body mounted on the frame body, A method of manufacturing a piezoelectric device formed by sealing the piezoelectric vibrating piece,
at least,
A piezoelectric vibrating body in which the piezoelectric vibrating piece and the frame body are integrally formed via a connection portion, and a wiring electrode formed on the substrate member and a connection electrode formed on the piezoelectric vibrating piece are associated with each other. Bonding and electrically and mechanically connecting the substrate member and the piezoelectric vibrator;
Cutting the connecting portion of the piezoelectric vibrating body joined to the substrate member to separate the piezoelectric vibrating piece and the frame;
Bonding the lid to the upper surface of the frame and sealing the piezoelectric vibrating piece;
A method for manufacturing a piezoelectric device, comprising: In the step of separating the piezoelectric vibrating piece and the frame,
The method for manufacturing a piezoelectric device according to claim 1, wherein the connecting portion of the piezoelectric vibrating body is cut by blasting. In the step of separating the piezoelectric vibrating piece and the frame,
The method for manufacturing a piezoelectric device according to claim 1, wherein the connecting portion of the piezoelectric vibrator is cut by dry etching. In the step of separating the piezoelectric vibrating piece and the frame,
The method for manufacturing a piezoelectric device according to claim 1, wherein the connecting portion of the piezoelectric vibrator is cut by a laser. A piezoelectric vibrating piece on which an excitation electrode and a connection electrode are formed, and a frame body surrounding the piezoelectric vibrating piece are mounted on a substrate member, and the substrate member, the frame body, and a lid body mounted on the frame body, A piezoelectric device formed by sealing the piezoelectric vibrating piece,
at least,
A piezoelectric vibrating body in which the piezoelectric vibrating piece and the frame body are integrally formed via a connection portion, and a wiring electrode formed on the substrate member and a connection electrode formed on the piezoelectric vibrating piece are associated with each other. Bonding and electrically and mechanically connecting the substrate member and the piezoelectric vibrator;
Cutting the connecting portion of the piezoelectric vibrating body joined to the substrate member to separate the piezoelectric vibrating piece and the frame;
Bonding the lid to the upper surface of the frame and sealing the piezoelectric vibrating piece;
A piezoelectric device manufactured by the method described above.   The piezoelectric device according to claim 5, wherein the frame is formed thicker than the piezoelectric vibrating piece.

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