JP3516623B2 - 半導体結晶の製造方法 - Google Patents
半導体結晶の製造方法Info
- Publication number
- JP3516623B2 JP3516623B2 JP2000003347A JP2000003347A JP3516623B2 JP 3516623 B2 JP3516623 B2 JP 3516623B2 JP 2000003347 A JP2000003347 A JP 2000003347A JP 2000003347 A JP2000003347 A JP 2000003347A JP 3516623 B2 JP3516623 B2 JP 3516623B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- superlattice
- heat treatment
- semiconductor crystal
- sigec
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000003347A JP3516623B2 (ja) | 1999-01-14 | 2000-01-12 | 半導体結晶の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP764299 | 1999-01-14 | ||
| JP11-7642 | 1999-01-14 | ||
| JP2000003347A JP3516623B2 (ja) | 1999-01-14 | 2000-01-12 | 半導体結晶の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000269476A JP2000269476A (ja) | 2000-09-29 |
| JP3516623B2 true JP3516623B2 (ja) | 2004-04-05 |
| JP2000269476A5 JP2000269476A5 (enExample) | 2004-08-26 |
Family
ID=26341977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000003347A Expired - Fee Related JP3516623B2 (ja) | 1999-01-14 | 2000-01-12 | 半導体結晶の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3516623B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60128647T2 (de) * | 2000-03-27 | 2007-09-20 | Matsushita Electric Industrial Co., Ltd., Kadoma | Sigec halbleiterkristall und seine herstellung |
| JP3451325B2 (ja) | 2001-03-26 | 2003-09-29 | 名古屋大学長 | シリコン・ゲルマニウム・カーボン三元混晶膜の作製方法及びシリコン・ゲルマニウム・カーボン三元混晶膜 |
| JP3461819B2 (ja) * | 2001-06-14 | 2003-10-27 | 松下電器産業株式会社 | 半導体結晶膜の製造方法 |
| KR100425579B1 (ko) * | 2001-07-21 | 2004-04-03 | 한국전자통신연구원 | 게르마늄 조성비에 따라 다른 종류의 소스를 사용하는실리콘 게르마늄 박막 형성 방법 |
| JP3719998B2 (ja) * | 2002-04-01 | 2005-11-24 | 松下電器産業株式会社 | 半導体装置の製造方法 |
| US8029620B2 (en) * | 2006-07-31 | 2011-10-04 | Applied Materials, Inc. | Methods of forming carbon-containing silicon epitaxial layers |
| EP1933384B1 (en) * | 2006-12-15 | 2013-02-13 | Soitec | Semiconductor heterostructure |
| CN118412373B (zh) * | 2024-06-28 | 2024-09-27 | 合肥欧益睿芯科技有限公司 | 含超晶格外延插入的外延片及其制备方法、晶体管 |
-
2000
- 2000-01-12 JP JP2000003347A patent/JP3516623B2/ja not_active Expired - Fee Related
Non-Patent Citations (2)
| Title |
|---|
| P.Zaumseil et.al.,Comparison of the thermal stability of Si0.603Ge0.397/Si and Si0.597Ge0.391C0.012/Si superlattice,Journal of Applied Physics,1997年 5月 1日,vol.81 no.9,pp.6134−6140 |
| Perez−Rodriguez,A et.al.,Ion beam synthesis and recrystallization of amorphous SiGe/SiC structures,Nuclear Instruments and Methods in Physics Research B,Elsevier Science,1996年12月 2日,Vol.120,pp.151−155 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000269476A (ja) | 2000-09-29 |
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