JP3504949B2 - テストヘッドと分離可能なチップ接続装置 - Google Patents

テストヘッドと分離可能なチップ接続装置

Info

Publication number
JP3504949B2
JP3504949B2 JP51826595A JP51826595A JP3504949B2 JP 3504949 B2 JP3504949 B2 JP 3504949B2 JP 51826595 A JP51826595 A JP 51826595A JP 51826595 A JP51826595 A JP 51826595A JP 3504949 B2 JP3504949 B2 JP 3504949B2
Authority
JP
Japan
Prior art keywords
test
test head
head
contact portion
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP51826595A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09507296A (ja
Inventor
ヒユープナー、ホルガー
ウエーバー、ウエルナー
ケツペ、ジークマール
クローゼ、ヘルムート
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPH09507296A publication Critical patent/JPH09507296A/ja
Application granted granted Critical
Publication of JP3504949B2 publication Critical patent/JP3504949B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06783—Measuring probes containing liquids

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
JP51826595A 1994-01-11 1995-01-09 テストヘッドと分離可能なチップ接続装置 Expired - Fee Related JP3504949B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4400551A DE4400551C2 (de) 1994-01-11 1994-01-11 Vorrichtung für reversible Chipkontaktierung und Verfahren zum Testen von Halbleiterschaltungsebenen
DE4400551.2 1994-01-11
PCT/DE1995/000013 WO1995018975A1 (de) 1994-01-11 1995-01-09 Vorrichtung für reversible chipkontaktierung

Publications (2)

Publication Number Publication Date
JPH09507296A JPH09507296A (ja) 1997-07-22
JP3504949B2 true JP3504949B2 (ja) 2004-03-08

Family

ID=6507706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51826595A Expired - Fee Related JP3504949B2 (ja) 1994-01-11 1995-01-09 テストヘッドと分離可能なチップ接続装置

Country Status (6)

Country Link
US (1) US5969534A (de)
EP (1) EP0740795B1 (de)
JP (1) JP3504949B2 (de)
KR (1) KR100334376B1 (de)
DE (2) DE4400551C2 (de)
WO (1) WO1995018975A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6043670A (en) * 1997-12-16 2000-03-28 Lucent Technologies Inc. Method for testing integrated circuits
US6081429A (en) 1999-01-20 2000-06-27 Micron Technology, Inc. Test interposer for use with ball grid array packages assemblies and ball grid array packages including same and methods
US6946864B2 (en) * 2001-02-19 2005-09-20 Osram Gmbh Method for measuring product parameters of components formed on a wafer and device for performing the method
US6913476B2 (en) * 2002-08-06 2005-07-05 Micron Technology, Inc. Temporary, conformable contacts for microelectronic components
KR100685223B1 (ko) * 2003-08-08 2007-02-22 브레인파워컴퍼니 인쇄회로기판의 검사방법
TWI226446B (en) * 2003-10-09 2005-01-11 Toppoly Optoelectronics Corp Non-destructive contact test
DE102005007103A1 (de) * 2005-02-16 2006-08-24 Infineon Technologies Ag Verfahren zum Testen einer zu testenden Schaltungseinheit mit Auskopplung von Verifikationssignalen und Testvorrichtung zur Durchführung des Verfahrens
US7726972B1 (en) * 2009-07-17 2010-06-01 Delphi Technologies, Inc. Liquid metal rotary connector apparatus for a vehicle steering wheel and column
US9835648B2 (en) * 2011-06-30 2017-12-05 Intel Corporation Liquid metal interconnects
US10802071B2 (en) * 2017-12-01 2020-10-13 International Business Machines Corporation Elemental mercury-containing probe card

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2947939A (en) * 1956-09-24 1960-08-02 Libbey Owens Ford Glass Co Testing electrically conductive articles
US4521730A (en) * 1981-01-19 1985-06-04 Msi Electronics Inc. Mercury probes
US4585991A (en) * 1982-06-03 1986-04-29 Texas Instruments Incorporated Solid state multiprobe testing apparatus
DK291184D0 (da) * 1984-06-13 1984-06-13 Boeegh Petersen Allan Fremgangsmaade og indretning til test af kredsloebsplader
GB2247565B (en) * 1990-08-22 1994-07-06 Gen Electric Co Plc A method of testing a semiconductor device
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
US5358417A (en) * 1993-08-27 1994-10-25 The Whitaker Corporation Surface mountable electrical connector
US5585736A (en) * 1994-11-29 1996-12-17 Fwu-Iuan Hshieh Contact probe utilizing conductive meltable probing material

Also Published As

Publication number Publication date
DE59501713D1 (de) 1998-04-30
WO1995018975A1 (de) 1995-07-13
JPH09507296A (ja) 1997-07-22
EP0740795A1 (de) 1996-11-06
DE4400551C2 (de) 1997-04-10
EP0740795B1 (de) 1998-03-25
US5969534A (en) 1999-10-19
KR100334376B1 (ko) 2002-09-17
DE4400551A1 (de) 1995-07-13

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Legal Events

Date Code Title Description
A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20031212

LAPS Cancellation because of no payment of annual fees