JP3503912B2 - Heat dissipation spacer with heat-generating electronic components mounted - Google Patents
Heat dissipation spacer with heat-generating electronic components mountedInfo
- Publication number
- JP3503912B2 JP3503912B2 JP26311095A JP26311095A JP3503912B2 JP 3503912 B2 JP3503912 B2 JP 3503912B2 JP 26311095 A JP26311095 A JP 26311095A JP 26311095 A JP26311095 A JP 26311095A JP 3503912 B2 JP3503912 B2 JP 3503912B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- generating electronic
- electronic components
- insulating
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、発熱性電子部品の
複数個を高密度に実装された放熱スペーサーに関するも
のである。
【０００２】
【従来の技術】トランジスタ、ダイオード等の発熱性電
子部品は使用中に発生した熱によって性能が低下するの
でそれを効率良く取り除くことが重要なことである。従
来、その放熱方法として、発熱性電子部品を絶縁放熱シ
ートを介してアルミニウム、銅等の金属からなる放熱体
に取り付けることが行われている。しかしながら、この
方法では、近年の発熱性電子部品をできるだけ隣接させ
て実装する実施形態においては、発熱性電子部品間で漏
電し、電子機器性能に支障をきたしたり電子部品が損傷
してしまう危険性があった。そこで、一定距離以上に離
して発熱性電子部品を実装するか、又はチューブやキャ
ップ状の絶縁放熱スペーサーを用いて発熱性電子部品を
１個づつ囲うしかなく、実装に時間がかかる等の問題が
あった。
【０００３】
【発明が解決しようとする課題】本発明の目的は、発熱
性電子部品の複数個を隣接して実装しても漏電せず、し
かも放熱体への取り付けも容易に行うことのできる発熱
性電子部品の実装された放熱スペーサーを提供すること
である。
【０００４】
【課題を解決するための手段】すなわち、本発明は、絶
縁性板状体１に、１又は２以上の絶縁性突起リブ２が形
成されてなる放熱スペーサー３であって、その材質はセ
ラミックス粉末の充填されたシリコーンゴム硬化体から
なり、上記絶縁性突起リブ２で分割された絶縁性板状体
１のそれぞれの領域に、発熱性電子部品がネジ止めされ
てなることを特徴とする発熱性電子部品の実装された放
熱スペーサーである。
【０００５】
【発明の実施の形態】本発明で用いられる放熱スペーサ
ーの実施態様を図１及び図２に示した。図１の例は、３
個の発熱性電子部品を隣接させて実装するために、絶縁
性板状体１に連続した絶縁性突起リブ２の２本を等間隔
に形成させてなるものであり、図２の例は、発熱性電子
部品のより容易に行うために、図１に示された放熱スペ
ーサーの両端部に更に絶縁性突起リブを形成させたもの
である。
【０００６】まず、絶縁性突起リブ２の形状について説
明すると、その高さは特に限定されないが、発熱性電子
部品の厚みよりも幾分高くすることが好ましく、発熱性
電子部品がＴＯ−３Ｐ型トランジスタである場合その金
属ベース材部分の厚みは２ｍｍであるので、絶縁性突起
リブの高さは２．５ｍｍ以上好ましくは４ｍｍ程度であ
ることが好ましい。また、絶縁性突起リブの幅は使用電
圧によって異なるが、絶縁破壊を防止する点から放熱ス
ペーサーと同等以上が好ましく、例えば使用電圧４ｋＶ
以下において厚み０．４５ｍｍの放熱スペーサーを用い
る場合、０．４５ｍｍ以上の幅であることが好ましい。
絶縁性突起リブ２は絶縁性板状体１の端部から他の端部
に連続して形成させてもよく、また間欠的に形成させて
もよい。さらには、絶縁性突起リブの形成開始位置とそ
の終了位置は、必ずしも絶縁性板状体１の端部である必
要はない。
【０００７】絶縁性突起リブ２の材質は、通常はその形
成の容易性から絶縁性板状体と同一材質であることが好
ましい。本発明においては、従来より絶縁放熱シートと
して使用されている材質、例えばＢＮ、ＡｌＮ、Ａｌ２
Ｏ３、ＳｉＯ２等のセラミックス粉末の充填されたシリ
コーンゴム硬化体が好適である。
【０００８】絶縁性突起リブ２は、絶縁性板状体１に両
者の境界に隙間を生成させることなく形成させることが
望ましく、それには口金部の断面形状を本発明の放熱ス
ペーサーと同じにした押し出し成型法が採用される。
【０００９】次に、絶縁性板状体１について説明する
と、その厚みは発熱性電子部品に印加される電圧によっ
て絶縁破壊を起こさない厚みが必要であり、また材質は
上記した絶縁性突起リブ２と同一材質であることが好ま
しい。
【００１０】
【実施例】以下、実施例をあげて更に具体的に本発明を
説明する。
【００１１】実施例１
発熱性電子部品として典型なＴＯ−３Ｐ型トランジスタ
の３個を実装するための放熱スペーサー３（図１参照）
を、ＢＮ粉末及びＳｉＯ２ 粉末の充填されたシリコー
ンゴム組成物を押し出し成型し、連続的に加熱加硫させ
て硬化させた後、切断して作製した。
【００１２】図１の放熱スペーサー３は、ＴＯ−３Ｐ型
トランジスタの３個を実装するために、幅４ｍｍ、高さ
０．４５ｍｍの連続した絶縁性突起リブ２の２本が１
９．２ｍｍ幅の間隔を設けて絶縁性板状体１（厚み０．
４５ｍｍ、長さ２４．２ｍｍ、幅５８．５ｍｍ）に形成
されてなることを示すものであり、この３分割されたそ
れぞれの領域にＴＯ−３Ｐ型トランジスタが実装される
ものである。
【００１３】実施例２
絶縁性突起リブ２を発熱性電子部品間だけではなく、絶
縁性板状体１の両端部にも形成させた放熱スペーサー３
（図２参照）を実施例１に準じて作製した。このような
放熱スペーサーによれば、発熱性電子部品間だけでな
く、隣接する他の発熱性電子部品間との漏電をも防止す
ることができる。しかも、発熱性電子部品を容易に整列
させて実装することができる。
【００１４】
【発明の効果】本発明の発熱性電子部品の実装された放
熱スペーサーは、発熱性電子部品の複数個を高密度に実
装することができるので、半導体装置を小型化すること
ができる。
【００１５】さらに、本発明の発熱性電子部品の実装さ
れた放熱スペーサーは、上部が開放されているので発熱
性電子部品のネジ止めが可能となり、従来のチューブや
キャップを使用した際のように、熱が内部にこもること
がない。
【００１６】本発明によれば、熟練工を要せずに容易に
発熱性電子部品の複数個を位置づれを起こすことなく、
放熱スペーサーに整列させて実装することができる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation spacer on which a plurality of heat-generating electronic components are mounted at high density. 2. Description of the Related Art Heat-generating electronic components such as transistors and diodes have deteriorated performance due to heat generated during use, and it is important to remove them efficiently. Conventionally, as a heat dissipation method, a heat-generating electronic component has been attached to a heat radiator made of metal such as aluminum or copper via an insulating heat dissipation sheet. However, according to this method, in an embodiment in which heat-generating electronic components are mounted as close to each other as possible in recent years, there is a risk that electric leakage may occur between heat-generating electronic components, which may hinder electronic device performance or damage the electronic components. was there. Therefore, the heat-generating electronic components must be mounted at a certain distance or more, or the heat-generating electronic components must be surrounded one by one using a tube or a cap-shaped insulating heat-dissipating spacer. there were. SUMMARY OF THE INVENTION An object of the present invention is to provide a heat-dissipating electronic component which can be easily mounted on a heat radiator without a short circuit even if a plurality of heat-generating electronic components are mounted adjacent to each other. Fever
The purpose of the present invention is to provide a heat radiation spacer on which conductive electronic components are mounted . [0004] Means for Solving the Problems That is, the present invention is absolutely
One or more insulating protrusion ribs 2 are formed on the edge plate 1.
The heat radiation spacer 3 is made of
From the cured silicone rubber filled with Lamix powder
And an insulating plate-like body divided by the insulating protrusion ribs 2
Heat-generating electronic components are screwed into each area of 1.
A heat dissipating spacer on which a heat- generating electronic component is mounted . FIG. 1 and FIG. 2 show an embodiment of a heat radiation spacer used in the present invention. The example in FIG.
In order to mount the heat-generating electronic components adjacent to each other, two insulating protrusion ribs 2 continuous to the insulating plate-like body 1 are formed at equal intervals, and the example of FIG. In order to make the heat-generating electronic component easier, the heat-dissipating spacer shown in FIG. 1 is further provided with insulating protrusion ribs at both ends. First, the shape of the insulating protrusion rib 2 will be described. The height is not particularly limited, but it is preferable that the height is somewhat higher than the thickness of the heat-generating electronic component. In the case of a transistor, since the thickness of the metal base material portion is 2 mm, the height of the insulating protrusion rib is preferably 2.5 mm or more, and more preferably about 4 mm. In addition, the width of the insulating protrusion rib is different depending on the operating voltage, but is preferably equal to or greater than that of the heat radiating spacer from the viewpoint of preventing dielectric breakdown. For example, the operating voltage is 4 kV.
When a heat radiation spacer having a thickness of 0.45 mm is used below, the width is preferably 0.45 mm or more.
The insulating protrusion ribs 2 may be formed continuously from one end of the insulating plate-like body 1 to another end, or may be formed intermittently. Furthermore, the formation start position and the end position of the insulating protrusion rib need not necessarily be the end of the insulating plate-like body 1. It is preferable that the material of the insulating projection rib 2 is usually the same as the material of the insulating plate-shaped member because of its ease of formation. In the present invention, a material conventionally used as an insulating heat radiation sheet, for example, BN, AlN, Al 2
A cured silicone rubber filled with a ceramic powder such as O 3 or SiO 2 is preferable. It is desirable that the insulating projection ribs 2 be formed on the insulating plate-like body 1 without forming a gap at the boundary between the two. Extrusion molding is employed. Next, the insulating plate-like body 1 will be described. The thickness of the insulating plate-like body 1 needs to be such that the dielectric breakdown does not occur due to the voltage applied to the heat-generating electronic component. It is preferable that the same material is used. The present invention will be described more specifically with reference to the following examples. Embodiment 1 A heat radiation spacer 3 for mounting three typical TO-3P transistors as heat-generating electronic components (see FIG. 1)
Was prepared by extruding a silicone rubber composition filled with BN powder and SiO 2 powder, continuously curing by heating and curing, and then cutting. In order to mount three TO-3P transistors, two heat-dissipating spacers 3 shown in FIG. 1 are composed of two continuous insulating projection ribs 2 having a width of 4 mm and a height of 0.45 mm.
An insulating plate-like body 1 (with a thickness of 0.2 mm) was provided at intervals of 9.2 mm.
45 mm, a length of 24.2 mm, and a width of 58.5 mm), and a TO-3P transistor is mounted in each of the three divided areas. Embodiment 2 A heat-dissipating spacer 3 in which the insulating protruding ribs 2 are formed not only between the heat-generating electronic components but also at both ends of the insulating plate-like body 1.
(See FIG. 2) was produced according to Example 1. According to such a heat radiation spacer, it is possible to prevent not only leakage between the heat-generating electronic components but also leakage between adjacent heat-generating electronic components. In addition, the heat-generating electronic components can be easily aligned and mounted . According to the present invention, the mounting of the heat-generating electronic component of the present invention is performed.
Since the heat spacer can mount a plurality of heat-generating electronic components at high density, the semiconductor device can be downsized. Further, the mounting of the heat-generating electronic component of the present invention
Since the upper portion of the heat dissipation spacer is open, the heat generating electronic components can be screwed, and heat does not stay inside as in the case of using a conventional tube or cap. According to the present invention, a plurality of heat-generating electronic components can be easily positioned without requiring a skilled person,
It can be mounted in alignment with the heat radiation spacer .
【図面の簡単な説明】
【図１】本発明で用いられる放熱スペーサーの一例を示
す斜視図である。
【図２】本発明で用いられる放熱スペーサーの一例を示
す斜視図である。
【符号の説明】
１ 絶縁性板状体
２ 絶縁性突起リブ
３ 放熱スペーサーBRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an example of a heat radiation spacer used in the present invention. FIG. 2 is a perspective view showing an example of a heat radiation spacer used in the present invention. [Description of Signs] 1 Insulating plate 2 Insulating protruding rib 3 Heat dissipation spacer
Claims (1)
絶縁性突起リブ（２）が形成されてなる放熱スペーサー
（３）であって、その材質はセラミックス粉末の充填さ
れたシリコーンゴム硬化体からなり、上記絶縁性突起リ
ブ（２）で分割された絶縁性板状体（１）のそれぞれの
領域に、発熱性電子部品がネジ止めされてなることを特
徴とする発熱性電子部品の実装された放熱スペーサー。 (57) [Claims] [Claim 1] One or two or more insulating plate-like bodies (1)
Heat-dissipating spacer with insulating ribs (2) formed
(3) The material is filled with ceramic powder.
The above-mentioned insulating protrusions
Of the insulating plate-like body (1) divided by the
It is noted that heat-generating electronic components are screwed into the area.
Heat-dissipating spacer with heat-generating electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26311095A JP3503912B2 (en) | 1995-10-11 | 1995-10-11 | Heat dissipation spacer with heat-generating electronic components mounted |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26311095A JP3503912B2 (en) | 1995-10-11 | 1995-10-11 | Heat dissipation spacer with heat-generating electronic components mounted |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09107055A JPH09107055A (en) | 1997-04-22 |
| JP3503912B2 true JP3503912B2 (en) | 2004-03-08 |
Family
ID=17384973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26311095A Expired - Fee Related JP3503912B2 (en) | 1995-10-11 | 1995-10-11 | Heat dissipation spacer with heat-generating electronic components mounted |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3503912B2 (en) |
-
1995
- 1995-10-11 JP JP26311095A patent/JP3503912B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09107055A (en) | 1997-04-22 |
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