KR200428644Y1 - Radiant heat panel for thyrister - Google Patents

Abstract

Disclosed is a heat sink for a thyristor, which is a power control semiconductor element. The heat sink for the thyristor is a radially radiating portion of the projecting shape having an uneven surface is radially connected to a predetermined portion on both sides, and extends in the form of a panel from both side end portions of the main body portion having a slot formed between the radiating portions and the portion where the heat radiating portion of the body portion is formed The heat dissipation part is bent at a predetermined angle toward the heat dissipation part, and the heat dissipation part having an uneven surface side heat sink and an insertion part fixed to the slot of the main body part is formed on one side, and is formed longer than the heat dissipating part at the insert part, and an extended heat dissipation part having an extension part having uneven surfaces By including, it is easy to densely arrange the number of heat radiation fins for heat radiation in the semiconductor device, it characterized in that the surface area is formed wider.

Container, cylinder, opening and closing board

Description

Heat sink for thyristor {RADIANT HEAT PANEL FOR THYRISTER}

1 is a plan view showing a heat sink for a thyristor according to an embodiment of the present invention.

2 is an exploded view of FIG. 1.

Figure 3 is a plan view showing another expansion heat sink of the heat sink for the thyristor according to an embodiment of the present invention.

<Explanation of symbols on main parts of the drawings>

100: heat dissipation unit 102: uneven surface

105: side heat sink 107: slot

110: body portion 115: insertion portion

116: extension 117: circular projection

120: expansion heat sink

The present invention relates to a thyristor heat sink, and more particularly, to a thyristor heat sink for releasing and cooling heat of a semiconductor device for power control.

In general, power semiconductor devices used in industrial electronic devices have a permanent change in their properties when the junction temperature is too high, and the device causes thermal runaway or breaks down due to melting. The overvoltage is lowered, the on and off time is increased, and other characteristics are out of specification, causing circuit malfunctions and causing failures before thermal runaway or melting occurs.

Due to this problem, heat sinks (HEAT SINK), which is a heat dissipation mechanism for dissipating heat of the device, are designed and used in all power semiconductor devices. The heat sink is made of aluminum (Al) or copper (Cu) having excellent heat transfer efficiency, and is formed by integrally extruding a fin (FIN) and an element ground portion designed to increase the heat transfer area.

Here, the heat sink is provided with a heat generating element on the upper portion to absorb heat emitted from the heat generating element to the heat dissipation action to prevent damage to the device due to heat or unnecessary waste of energy, and the base is formed at an arbitrary interval on the base It includes a plurality of heat radiation fins to radiate heat of the surface.

In this case, the heat radiating fins should be used in combination with the heating element in a vertical direction, and the heat radiating fins should have a structure in which the surface area is as wide as possible in order to improve heat dissipation.

However, in the conventional heat sink, since a plurality of heat sink fins are integrally formed together with the base, it is difficult to manufacture an extrusion mold for densely increasing the number of heat sink fins having a large surface area, and the heat sink fins are not properly formed in the extrusion molding. Since it was deformed, it was difficult to form a predetermined number of heat dissipation fins, and since the number of heat dissipation fins was limited to a certain number, there was a problem of low heat dissipation amount.

The present invention has been made to solve the above problems of the prior art, it is easy to densely arrange the number of heat dissipation fins for heat dissipation in the power semiconductor device, the surface area is formed a wider, the heat transfer efficiency for the thyristor It is an object to provide a heat sink.

The configuration of the heat sink for the thyristor according to the present invention for solving the above problems is that the heat dissipation portion of the projecting shape formed with the uneven surface is radially connected to both sides, the main body portion formed with a slot between the heat dissipation portion, and the main body The side of the heat radiating portion of the portion is formed in one side extending in the form of a panel, bent at a predetermined angle toward the heat dissipating portion, the side heat dissipation plate and the insertion portion fixed to the slot of the body portion is formed in the uneven surface formed on one side, the insertion portion The heat sink is formed longer than the heat dissipation part and includes an extended heat dissipation plate having an extension portion having an uneven surface.

Hereinafter, a preferred embodiment of a heat sink for a thyristor according to the present invention with reference to the accompanying drawings will be described with reference to the accompanying drawings. In this process, the thickness of the lines or the size of the components shown in the drawings may be exaggerated for clarity and convenience of description. In addition, terms to be described later are terms defined in consideration of functions in the present invention, which may vary depending on the intention or custom of a user or an operator. Therefore, definitions of these terms should be made based on the contents throughout the specification.

In addition, the following examples are not intended to limit the scope of the present invention, but are presented by way of example, and there may be various embodiments implemented through the present technical idea.

Example

1 is a plan view showing a heat sink for a thyristor according to an embodiment of the present invention, Figure 2 is an exploded view of Figure 1, Figure 3 is a plan view showing another expansion heat sink of the heat sink for a thyristor according to an embodiment of the present invention to be.

As shown in Figure 1 and 2, the heat sink for the thyristor according to an embodiment of the heat dissipation portion 100 of the protruding form formed with the uneven surface 102 is radially connected to a predetermined portion on both sides, the heat dissipation portion ( The main body unit 110 having a slot 107 formed therebetween, and both side ends of the portion where the heat dissipating unit 100 of the main body unit 110 is formed, extends in a panel form, and the heat dissipating unit 100 is formed. Towards a predetermined angle, the side heat sink 105 having an uneven surface 102 and an insertion portion 115 inserted into and fixed to the slot 107 of the main body portion 110 are formed at one side, and the insertion portion 115 is formed. ) Is formed longer than the heat dissipation unit 100 and includes an extended heat dissipation plate 120 having an extension having an uneven surface 102.

At this time, the bottom surface of the heat dissipation unit 100, the side heat dissipation plate 105, the body portion 110 and the expansion heat dissipation plate 120 is in contact with the heat dissipation surface of the thyristors to release heat generated in the thyristors to the atmosphere or the coolant, It will prevent overheating.

Here, the heat dissipation unit 100 and the side heat dissipation plate 105 may be integrally formed in the main body by the extrusion molding apparatus, and the slot 107 of the main body unit 110 is also formed while passing through the extrusion molding apparatus.

In addition, a plurality of slots 107 of the main body unit 110 are radially formed between the heat dissipating units 100, and the expansion heat sink 120 formed by another extrusion molding device is radiated by being inserted into the slots 107. To increase the surface area.

That is, the extended heat sink 120 is formed longer than the heat dissipation unit 100 is disposed between the heat dissipation unit 100, the expansion heat dissipation plate 120 and the heat dissipation unit 100 together with the main body 110, extrusion molding Although it is difficult to form, the slot 107 for inserting the insertion portion 115 of the expansion heat sink 120 is formed in the body portion 110, the expansion heat sink 120 may be fixed to the body portion 110 as a heat radiation fin. .

In addition, the uneven surface 102 formed on the heat dissipation unit 100, the side heat dissipation plate 105, and the expansion heat dissipation plate 120 has a larger amount of heat dissipation than the heat dissipation fin formed in a planar manner by enlarging the heat transfer area.

On the other hand, as shown in Figure 3, the slot 107 is formed with a circular protrusion 117 to be inserted and fixed to the insertion portion 115 of the expansion heat sink 120, the circular protrusion 117 is an expansion heat sink ( By pressing the surface portion of the inserting portion 115 while the inserting portion 115 of the 120 is inserted into the slot 107, the interference of the inserting portion 115 is provided to the slot 107, and the expansion heat sink 120 is provided. Is firmly fixed to the body.

Here, when the main body 110 and the expansion heat sink 120 is made of metal such as aluminum or copper having excellent deformation due to heat transfer and compression, the insertion portion 115 of the expansion heat sink 120 is inserted into the slot 107. The circular protrusion 117 is pressed by the surface portion of the inserting portion 115 in the process of losing, and more deformed, and a groove formed by the circular protrusion 117 is formed on the surface portion of the inserting portion 115, thereby inserting the portion 115. ) And the slot 107 can be more robust.

The thyristor heat sink according to the present invention, which is configured as described above, has a slot formed in the main body portion, and an insertion portion corresponding to the slot is formed in the extended heat sink, so that the heat sink for heat dissipation of the power semiconductor element as a heat radiation fin is densely packed. It can be formed, the heat radiation efficiency is improved by extending the heat sink is longer than the heat transfer to the atmosphere or coolant than the heat radiating portion, it is possible to obtain the effect that the coupling of the expansion heat sink and the slot is secured by the circular protrusion formed in the insert.

Claims (2)

A main body part in which a heat dissipation part having a convexo-concave surface is radially connected to a predetermined portion on both sides, and a slot is formed between the heat dissipation parts; A side heat dissipation plate extending from both side end portions of the portion in which the heat dissipation part of the main body is formed, bent at a predetermined angle toward the heat dissipation part, and having an uneven surface; And An insertion part fixed to the slot of the main body portion is formed on one side, the heat sink for the thyristor comprising an extended heat sink having an extension formed in the insertion portion longer than the heat dissipation portion and the uneven surface formed. The method of claim 1, The slot is a heat sink for the thyristor, characterized in that the circular projection for fixing the expansion heat sink is fitted.

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