WO2011025235A2 - Led fluorescent lamp - Google Patents

Led fluorescent lamp Download PDF

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Publication number
WO2011025235A2
WO2011025235A2 PCT/KR2010/005658 KR2010005658W WO2011025235A2 WO 2011025235 A2 WO2011025235 A2 WO 2011025235A2 KR 2010005658 W KR2010005658 W KR 2010005658W WO 2011025235 A2 WO2011025235 A2 WO 2011025235A2
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
fluorescent lamp
led
diffusion tube
led fluorescent
Prior art date
Application number
PCT/KR2010/005658
Other languages
French (fr)
Korean (ko)
Other versions
WO2011025235A3 (en
Inventor
윤인숙
성정화
Original Assignee
Yoon In Suk
Sung Jung Hwa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yoon In Suk, Sung Jung Hwa filed Critical Yoon In Suk
Priority to JP2012526642A priority Critical patent/JP2013503434A/en
Publication of WO2011025235A2 publication Critical patent/WO2011025235A2/en
Publication of WO2011025235A3 publication Critical patent/WO2011025235A3/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources
    • F21S4/20Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/108Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using hook and loop-type fasteners
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/777Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to a heat sink, and more particularly, a semicircular diffusion tube having a predetermined length and a heat sink body can be easily detachably hooked, and also uniformly diffuse the light emitted from the LED,
  • the present invention relates to a LED fluorescent lamp capable of rapidly dissipating heat generated from a substrate having a predetermined length and LEDs mounted on the substrate to the outside.
  • the compact fluorescent lamp has the same brightness as that of the fluorescent lamp but reduces power consumption. Excellent color reproduction characteristics.
  • LED which is used as a replacement for fluorescent lamps and fluorescent lamps, has an excellent efficiency of converting electric power into light, and has a high efficiency of light per unit power compared to incandescent lamps, fluorescent lamps, and compact fluorescent lamps, which are currently used. This is excellent, and the amount of light as desired can be obtained even at low voltage, so the stability is excellent, so the use for lighting is gradually increasing.
  • the LED has a high efficiency of converting power to light, but the light emitting part is composed of semiconductor elements, so it is relatively weak to heat compared to light emitting devices such as incandescent lamps using filaments or fluorescent lamps or fluorescent lamps using cathode rays. have. In other words, the LED is easily degraded due to thermal stress caused by self-heat generated from the light emitting device when the LED is used for a long time, thereby degrading its performance.
  • the present invention has been made to solve the above-mentioned problems, and an object of the present invention is to easily remove the semi-circular-shaped diffusion tube and heat sink body having a predetermined length by hook type, and to have a substrate having a predetermined length and
  • the present invention provides an LED fluorescent lamp that can quickly release heat generated from LEDs mounted on a substrate to the outside.
  • Another object of the present invention is to provide an LED fluorescent lamp that can dissipate heat of the substrate itself to the outside by fixing half of the fluorescent lamp as a heat sink and fixing a substrate made of a metal to the heat sink.
  • Still another object of the present invention is to provide an LED fluorescent lamp which can uniformly diffuse light emitted from the LEDs to the outside through the diffusion tube.
  • LED fluorescent lamp for solving the above problems has a predetermined length, semi-circular heat sink is formed in the groove grooves at both ends; A semicircular diffusion tube having a predetermined length and having both ends hooked to the engaging groove; And an LED substrate having a predetermined length and having both sides fitted into and fixed to a fixing groove formed at both ends of the heat sink, and having LEDs mounted at a plurality of positions on the upper surface to be exposed to the diffusion tube.
  • the heat sink may include a semi-circular heat sink body, first heat dissipation protrusions protruding at a predetermined interval on an outer circumference of the heat sink body, and protruding at a predetermined interval on an inner circumference of the heat sink body. It is preferable to have two heat radiating protrusions.
  • the length of the first heat dissipation protrusions may be longer than a length of the second heat dissipation protrusions.
  • first heat dissipation protrusions and the second heat dissipation protrusions may be positioned to be offset from each other.
  • At least one of an outer circumference and an inner circumference of the heat sink body may further include embossed first protrusions, and further embossed second protrusions may be formed on an outer surface of the first heat dissipation protrusion and the second heat dissipation protrusion. It is desirable to be.
  • the heat sink may be made of foamed aluminum, and an outer surface of the heat sink may be sanded.
  • the thickness of the diffusion tube is preferably formed to gradually increase from the edge portion along the center portion.
  • the diffusion tube is preferably further provided with embossed diffusion protrusions.
  • the diffusion protrusions may be formed on at least one of an outer surface and an inner surface of the diffusion tube.
  • the diffusion protrusions are preferably formed to gradually increase in size from the edge of the diffusion tube along the center portion.
  • the LED substrate is preferably made of any one of metal, clad metal and FR4.
  • the outer surface of the LED substrate and the outer surface of the heat sink is preferably further coated with a cooling paint using a white PSR.
  • the inclined surface which guides the both ends of the diffusion tube to be slip-fitted is further formed in the locking groove portion.
  • the present invention has the effect of quickly dissipating heat generated from the substrate having a predetermined length and the LEDs mounted on the substrate to the outside.
  • the present invention has the effect of dissipating heat of the substrate itself to the outside by using a half of a fluorescent lamp as a heat sink and fixing a substrate made of metal to the heat sink.
  • the present invention can primarily heat the internal heat by using the second heat radiation member formed inside the LED fluorescent lamp having a predetermined length, and the heat can be secondarily radiated using the first heat radiation member formed on the outside. Has the effect.
  • the present invention has an effect that can uniformly diffuse the light emitted from the LEDs to the outside through the diffusion tube.
  • 1 is a perspective view showing the LED fluorescent lamp of the present invention.
  • Figure 2 is an exploded perspective view showing the LED fluorescent lamp of the present invention.
  • Figure 3 is a front view showing the LED fluorescent lamp of the present invention.
  • FIG. 4 is a cross-sectional view showing the LED fluorescent lamp of the present invention.
  • 5A through 5E are partial cross-sectional views illustrating the LED substrate of FIG. 2 and are cross-sectional views illustrating a mounting process of the LED.
  • FIG. 6 is a partial cross-sectional view showing that the LED according to the present invention is mounted in the LED mounting groove by wire bonding.
  • FIG. 7 is a cross-sectional view illustrating a state before coupling of the heat sink and the diffusion member of FIG. 2.
  • FIG. 8 is a cross-sectional view illustrating a state after coupling of the heat sink and the diffusion member of FIG. 7.
  • FIG. 9 is a cross-sectional view showing a diffusion member in which a diffusion protrusion according to the present invention is formed.
  • FIG. 1 is a perspective view showing the LED fluorescent lamp of the present invention.
  • Figure 2 is an exploded perspective view showing the LED fluorescent lamp of the present invention.
  • Figure 3 is a front view showing the LED fluorescent lamp of the present invention.
  • 4 is a cross-sectional view showing the LED fluorescent lamp of the present invention.
  • 5A through 5E are partial cross-sectional views illustrating the LED substrate of FIG. 2 and are cross-sectional views illustrating a mounting process of the LED.
  • 6 is a partial cross-sectional view showing that the LED according to the present invention is mounted in the LED mounting groove by wire bonding.
  • 7 is a cross-sectional view illustrating a state before coupling of the heat sink and the diffusion member of FIG. 2.
  • 8 is a cross-sectional view illustrating a state after coupling of the heat sink and the diffusion member of FIG. 7.
  • 9 is a cross-sectional view showing a diffusion member in which a diffusion protrusion according to the present invention is formed.
  • the LED fluorescent lamp of the present invention has a semicircular heat sink 100 having a predetermined length and a diffusion tube coupled to the heat sink 100 and having a predetermined length and forming a semicircular shape ( 200 and an LED substrate 400 having a predetermined length and mounted with LEDs (not shown) and fixed to the heat sink 100.
  • the heat sink 100 includes a semicircular heat sink body 110, first heat dissipation protrusions 120 protruding at a predetermined interval on an outer circumference of the heat sink body 110, and the heat sink body ( The second heat dissipation protrusions 130 are formed to protrude at a predetermined interval on the inner circumference of the 110.
  • the both ends of the heat sink body 110 has a locking groove 112 to protrude to the outside.
  • the locking groove 112 is a groove to which both ends of the diffusion tube 200 are hooked.
  • both ends of the diffusion tube 200 may be formed with a locking projection 210 protruding outward.
  • the locking protrusion 210 is a protrusion that is hooked into the locking groove 112 and a predetermined curvature may be formed on an outer surface thereof.
  • both ends of the diffusion tube 200 is formed with a coupling hole 210a adjacent to the locking protrusion 210.
  • the coupling hole 210a is a hole into which the protrusion 112a formed at the upper end of the locking groove 112 is fitted.
  • the locking groove 112 may be formed with an inclined surface 112a for guiding the locking protrusion 210 to be fitted therein.
  • the diffusion tube 200 may be coupled to the locking groove 112 of the heat sink 100 at both ends of the diffusion tube 200 at a position facing the heat sink 100. .
  • the length of the first heat dissipation protrusions 120 may be longer than a length of the second heat dissipation protrusions 130. That is, the lengths of the first heat dissipation protrusions 120 and the second heat dissipation protrusions 130 may be different from each other.
  • the first heat dissipation protrusion 120 or the second heat dissipation protrusion 130 at a position corresponding to the heat concentration portion is confirmed. ) May be longer than a certain length.
  • corner portions of the first heat dissipation protrusions 120 and the second heat dissipation protrusions 130 may be formed to be rounded.
  • an area of contact with air outside the heat sink body 110 may be increased by the first heat dissipation protrusions 120, and the heat sink body (the heat sink body) may be increased by the second heat dissipation protrusions 130.
  • the area of contact with air in the interior of 110 may be increased.
  • fixing grooves 113 are formed at both ends of the heat sink body 110, and both ends of the LED substrate 400 on which the LEDs 40 are mounted may be fixed to the fixing groove 113.
  • the substrate 400 may be made of any one of metal, clad metal, and FR4.
  • a predetermined shape, preferably radial projections may be further formed on the upper surface of the substrate 400 for heat dissipation.
  • the LED substrate 400 may be in physical contact with the heat sink body 110, even when a predetermined amount of heat is generated in the substrate 400 when the LEDs 40 emit light, the heat is generated.
  • the heat sink body 110 can be easily transferred and radiated.
  • an upper surface of the LED substrate 400 may form substantially the same line as a portion where the engaging protrusion 210 of the diffusion tube 200 is formed.
  • first heat dissipation protrusions 120 and the second heat dissipation protrusions 130 may be positioned to be offset from each other. Accordingly, the area of the heat sink body 110 which is in contact with the air in the inside and outside of the heat sink may be increased and the heat may be complemented with each other.
  • At least one of the outer circumference and the inner circumference of the heat sink body 110 may further include embossed first protrusions a.
  • the first protrusions (a) may be formed only on the outer circumference or only the inner circumference of the heat sink body 110, or may be formed on both the outer circumference and the inner circumference.
  • the shapes of the first protrusions (a) may be formed of polygonal protrusions in addition to the embossing shape.
  • the embossed second protrusions 111 and 114 may be further formed on the outer surfaces of the first heat dissipation protrusion 120 and the second heat dissipation protrusion 130.
  • the second protrusions 111 and 114 may include protrusions 114 formed on the outer surface of the first heat dissipation protrusion 120 and protrusions 111 formed on the outer surface of the second heat dissipation protrusion 130. Can be.
  • the following method may be proposed as a method for maximizing the contact area with the air of the heat sink 100.
  • the heat sink 100 is made of foamed aluminum, and second, the outer surface of the heat sink 100 is sanded (or etched). Therefore, since the porous aluminum is used in the case of using foamed aluminum, the contact area with air in the heat sink body 110 itself can be increased, and in addition, by etching or sanding the outer surface of the heat sink 100. Roughness may be formed on the outer surface to further increase the contact area with air.
  • the diffusion tube 200 hooked with the heat sink body 110 has a predetermined length, and a cross-sectional shape thereof is formed in a semicircular shape. Then, both ends of the diffusion tube 200 is formed with a locking projection 210 as mentioned above, the locking projection 210 is formed in the locking groove 112 formed at both ends of the heat sink body 110. It is hooked and fixed.
  • the thickness of the diffusion tube 200 may be formed to gradually increase from the edge to the center when viewed in the shape of a cross section.
  • the amount of light emitted from the LEDs 40 is controlled to be much less outside the center portion outside the center portion, so that the amount of light emitted outside the diffusion tube 200 as a whole can be evenly distributed.
  • the diffusion tube 200 may further include diffusion protrusions 220 having an embossed shape.
  • the diffusion protrusions 220 may be formed on at least one of an outer surface and an inner surface of the diffusion tube 200. Preferably it is formed on the inner surface of the diffusion tube 200 as shown in FIG.
  • the light emitted from the LEDs 40 may be uniformly diffused to the outside of the diffusion tube 200.
  • the diffusion protrusions 220 may be formed to gradually increase in size from the edge of the diffusion tube 200 along the center portion. This is because the amount of light delivered to the center portion and the amount of light delivered to the edge portion are different from each other, and thus, the degree of diffusion of light diffused to the outside of the diffusion tube 200 may be uniform.
  • the radiation angle of the light emitted from the LEDs 40 due to the diffusion protrusions 220 formed in the diffusion tube 200 may be increased to about 280 degrees with respect to the center of the LED substrate 400.
  • the LED substrate 400 according to the present invention may generate more than a predetermined heat due to the light emitted from the LEDs 40, which may be cooled by a cooling paint.
  • this may be achieved by further applying a cooling paint using white PSR to the outer surface of the LED substrate 400 and the outer surface of the heat sink 100.
  • the cooling paint to the outer surface of the LED substrate 400 and the heat sink 100 can reduce the noise generated in the LED substrate 400. Therefore, the light emitted from the LEDs 40 may emit stable light to the outside because noise is reduced to some extent.
  • the LEDs 40 mounted on the LED substrate 400 may be inserted into the LED substrate 400 to be mounted.
  • the LED installation grooves 420 are formed by routers at a plurality of positions of the substrate body 410 of the LED substrate 400.
  • the electrode 30 is formed on the bottom surface 4222 of the LED installation groove 420.
  • the LEDs 40 may be located in the LED installation grooves 420 and may be mounted by any one of the ball grid array 42 and the wire bonding 43.
  • the LED installation groove 420 may be filled with a filler 430 in which silicon and phosphors are mixed at a predetermined ratio.
  • the top surface of the filler 430 may form the same line as the top surface of the LED substrate 400.
  • the LED substrate 400 may adjust the amount of light of the LEDs 40 to a predetermined value.
  • radially annular protrusions may be further formed on an outer surface of the opposite LED substrate 400 on which the LEDs 40 are mounted. This serves to dissipate heat generated from the LED substrate 400 itself.
  • reference numeral 421 denotes both side walls of the LED installation groove 420.
  • '430' is a filler in which silicon and phosphors are mixed at a predetermined ratio.
  • annular protrusions may be further formed on the upper surface of the LED substrate 400.
  • the annular protrusions are made of the same material as that of the LED substrate 400 as well as being integral with the LED substrate 400.
  • the LED substrate 400 is preferably made of a clad metal.
  • the clad metal refers to a material in which two or more layers of metals or nonmetals are bonded together, that is, a heterojunction metal. This has the advantage that it can be adapted to the special needs by supplementing various properties which cannot be obtained with a single metal.
  • the present invention can be used in the field of manufacturing LED fluorescent lamps.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

Provided is an LED fluorescent lamp. The LED fluorescent lamp comprises: a heatsink which has a set length and has a semicircular shape formed with attachment recessed parts at both ends; a diffusion tube which has a set length and has a semicircular shape of which both ends couple by hooking onto the attachment recessed parts; and an LED substrate which has a set length, and of which the two side parts are inserted and secured in securing recessed parts formed on the insides at both ends of the heatsink, and in a plurality of positions on the upper surface of which LEDs are mounted in such a way as to be exposed to the diffusion tube. Consequently, the present invention allows easy hooking attachment and detachment of the heatsink body and the diffusion tube having a set length and having a semicircular shape, and, in addition, the light emanating from the LEDs can be uniformly diffused, and the heat generated from the substrate which has a set length and from the LEDs mounted on the substrate can be rapidly discharged to the outside.

Description

엘이디 형광등LED Fluorescent Tube
본 발명은 히트 싱크에 관한 것으로서, 보다 상세하게는 일정 길이를 갖는 반원 형상의 확산 튜브와 히트 싱크 몸체를 후크식으로 쉽게 탈착 가능하게 함과 아울러, 엘이들로부터 발산되는 광을 균일하게 확산시키고, 일정 길이를 갖는 기판 및 기판에 실장되는 엘이디들로부터 발생되는 열을 외부로 신속하게 방출할 수 있는 엘이디 형광등에 관한 것이다.The present invention relates to a heat sink, and more particularly, a semicircular diffusion tube having a predetermined length and a heat sink body can be easily detachably hooked, and also uniformly diffuse the light emitted from the LED, The present invention relates to a LED fluorescent lamp capable of rapidly dissipating heat generated from a substrate having a predetermined length and LEDs mounted on the substrate to the outside.
일반적으로 사용되고 있는 조명등용 등기구는 대부분 형광등을 사용하고 있으며, 이러한 종래의 형광등은 주파수가 60Hz를 사용하여 구동하므로 형광등의 빛이 1초에 60회의 깜빡거림으로 인하여 장시간 사용시 사용자가 눈의 피로감을 많이 느끼고, 장시간 사용시 자체의 발열로 인해 주변온도를 상승시킴에 따라 높은 전력손실을 초래하며, 과열시에는 형광램프가 쉽게 파손되는 단점이 있다. 결국, 종래의 형광등과 같은 등기구는 온도상승 및 높은 전력손실로 인해 사용수명이 단축되고, 사용되는 부품이 많아 교체비용이 많이 드는 문제가 있었다.Most commonly used luminaires use fluorescent lamps, and the conventional fluorescent lamps are driven using a frequency of 60 Hz, so that the user may experience a lot of eye fatigue when using the lamp for a long time due to flickering 60 times per second. It causes a high power loss by increasing the ambient temperature due to the heat generated by itself during long time use, there is a disadvantage that the fluorescent lamp is easily broken when overheated. As a result, conventional lighting fixtures such as fluorescent lamps have a problem in that the service life is shortened due to the temperature rise and the high power loss, and the replacement parts are expensive due to the large number of parts used.
또한, 근래에 들어 일반 형광등에 비해 길이가 1/2 ~ 1/3인 콤팩트형 램프가 사용되는데, 콤팩트 형광램프는 형광등과 밝기가 동일하면서도 전력소모가 절감되고, 삼파장 형광물질의 사용으로 물체의 색재현 특성이 우수하다.In addition, in recent years, a compact lamp having a length of 1/2 to 1/3 compared to a general fluorescent lamp is used. The compact fluorescent lamp has the same brightness as that of the fluorescent lamp but reduces power consumption. Excellent color reproduction characteristics.
상기와 같은 형광등이나 형광램프의 대체용으로 사용되는 LED는 전력을 빛으로 변환시키는 효율이 뛰어나고, 현재 사용되고 있는 일반적 조명기구인 백열등이나 형광등, 콤팩트 형광램프에 비해 단위 전력대비 빛의 효율이 월등히 높아 경제성이 뛰어나며, 또한 저전압으로도 원하는 만큼의 광량을 얻을 수 있어 안정성이 뛰어나 므로 조명용으로서의 사용이 점차 증가하고 있는 추세이다.LED, which is used as a replacement for fluorescent lamps and fluorescent lamps, has an excellent efficiency of converting electric power into light, and has a high efficiency of light per unit power compared to incandescent lamps, fluorescent lamps, and compact fluorescent lamps, which are currently used. This is excellent, and the amount of light as desired can be obtained even at low voltage, so the stability is excellent, so the use for lighting is gradually increasing.
그러나, LED는 전력을 빛으로 변환시키는 효율이 좋은 반면에 그 발광부위가 반도체 소자로 이루어져 있으므로 필라멘트를 사용하는 백열등이나 음극선을 이용한 형광등 또는 형광램프 등의 발광소자에 비해 상대적으로 열에 취약하다는 단점이 있다. 다시 말해서, LED는 장시간 사용시 그 발광소자로부터 발생되는 자체열에 의한 열적스트레스로 인하여 반도체 소자가 쉽게 열화(degradation)되어 그 성능이 떨어지게 된다.However, the LED has a high efficiency of converting power to light, but the light emitting part is composed of semiconductor elements, so it is relatively weak to heat compared to light emitting devices such as incandescent lamps using filaments or fluorescent lamps or fluorescent lamps using cathode rays. have. In other words, the LED is easily degraded due to thermal stress caused by self-heat generated from the light emitting device when the LED is used for a long time, thereby degrading its performance.
따라서, 근래에 들어 LED에 대용량의 전류를 흘려 보내주기 위해서는 이로부터 발생되는 열을 효과적으로 방출하기 위한 방열구조가 요구되고 있다.Therefore, in recent years, in order to send a large amount of current to the LED, a heat dissipation structure for effectively dissipating heat generated therefrom is required.
또한, 종래의 형광등에서 엘이디와 같은 광원을 교체하기 위하여서는 슬라이딩 식으로 결합되어 협소한 공간에서 광원을 교체하는 등의 공수 작업을 용이하게 수행하기 어려운 문제점도 있다.In addition, in order to replace a light source such as an LED in the conventional fluorescent lamp, there is also a problem that it is difficult to easily perform the airborne operation such as replacing the light source in a narrow space coupled to the sliding type.
본 발명은 전술한 문제점을 해결하기 위하여 창출된 것으로, 본 발명의 목적은 일정 길이를 갖는 반원 형상의 확산 튜브와 히트 싱크 몸체를 후크식으로 쉽게 탈착 가능하게 함과 아울러, 일정 길이를 갖는 기판 및 기판에 실장되는 엘이디들로부터 발생되는 열을 외부로 신속하게 방출할 수 있는 엘이디 형광등을 제공함에 있다.The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to easily remove the semi-circular-shaped diffusion tube and heat sink body having a predetermined length by hook type, and to have a substrate having a predetermined length and The present invention provides an LED fluorescent lamp that can quickly release heat generated from LEDs mounted on a substrate to the outside.
본 발명의 다른 목적은 형광등의 반을 히트 싱크로 하고, 이 히트 싱크에 메탈로 이루어지는 기판을 고정 설치함으로써 기판 자체의 열을 외부로 방열할 수 있는 엘이디 형광등을 제공함에 있다.Another object of the present invention is to provide an LED fluorescent lamp that can dissipate heat of the substrate itself to the outside by fixing half of the fluorescent lamp as a heat sink and fixing a substrate made of a metal to the heat sink.
본 발명의 또 다른 목적은 일정 길이를 갖는 엘이디 형광등의 내부에 형성되는 제 2방열 부재를 사용하여 내부의 열을 일차적으로 방열하고 외부에 형성되는 제 1방열 부재를 사용하여 상기 열을 이차적으로 방열할 수 있는 엘이디 형광등을 제공함에 있다.It is still another object of the present invention to thermally dissipate internal heat primarily by using a second heat dissipation member formed inside an LED fluorescent lamp having a predetermined length, and to dissipate the heat secondly by using a first heat dissipation member formed externally. To provide an LED fluorescent lamp that can be.
본 발명의 또 다른 목적은 엘이디들로부터 발산되는 광을 확산 튜브를 통하여 외부에 균일하게 확산할 수 있도록 한 엘이디 형광등을 제공함에 있다.Still another object of the present invention is to provide an LED fluorescent lamp which can uniformly diffuse light emitted from the LEDs to the outside through the diffusion tube.
본 발명은 상기와 같은 과제를 해결하기 위한 엘이디 형광등은 일정 길이를 갖고, 양단에 걸림 홈부가 형성되는 반원 형상의 히트 싱크와; 일정 길이를 갖고, 상기 걸림 홈부에 양단이 후크 결합되는 반원 형상의 확산 튜브; 및 일정 길이를 갖고, 상기 히트 싱크의 양단 내측에 형성되는 고정 홈부에 양측부가 끼워져 고정되고, 상기 확산 튜브에 노출되도록 상면 다수 위치에 엘이디들이 실장되는 엘이디 기판을 포함한다.The present invention, LED fluorescent lamp for solving the above problems has a predetermined length, semi-circular heat sink is formed in the groove grooves at both ends; A semicircular diffusion tube having a predetermined length and having both ends hooked to the engaging groove; And an LED substrate having a predetermined length and having both sides fitted into and fixed to a fixing groove formed at both ends of the heat sink, and having LEDs mounted at a plurality of positions on the upper surface to be exposed to the diffusion tube.
여기서, 상기 히트 싱크는 반원 형상의 히트 싱크 몸체와, 상기 히트 싱크 몸체의 외주에 일정 간격을 이루어 돌출 형성되는 제 1방열 돌기들과, 상기 히트 싱크 몸체의 내주에 일정 간격을 이루어 돌출 형성되는 제 2방열 돌기들을 구비하는 것이 바람직하다.The heat sink may include a semi-circular heat sink body, first heat dissipation protrusions protruding at a predetermined interval on an outer circumference of the heat sink body, and protruding at a predetermined interval on an inner circumference of the heat sink body. It is preferable to have two heat radiating protrusions.
그리고, 상기 제 1방열 돌기들의 길이는 상기 제 2방열 돌기들의 길이 보다 일정 길이 길게 형성되는 것이 바람직하다.The length of the first heat dissipation protrusions may be longer than a length of the second heat dissipation protrusions.
또한, 상기 제 1방열 돌기들과 상기 제 2방열 돌기들은 서로 어긋나도록 위치되는 것이 바람직하다.In addition, the first heat dissipation protrusions and the second heat dissipation protrusions may be positioned to be offset from each other.
또한, 상기 히트 싱크 몸체의 외주와 내주 중 적어도 하나 이상에는 엠보싱 형상의 제 1돌기물들이 더 형성되고, 상기 제 1방열 돌기와 상기 제 2방열 돌기의 외면에는 엠보싱 형상의 제 2돌기물들이 더 형성되는 것이 바람직하다.In addition, at least one of an outer circumference and an inner circumference of the heat sink body may further include embossed first protrusions, and further embossed second protrusions may be formed on an outer surface of the first heat dissipation protrusion and the second heat dissipation protrusion. It is desirable to be.
또한, 상기 히트 싱크는 발포 알루미늄으로 이루어지고, 상기 히트 싱크의 외면은 샌딩 처리될 수도 있다.In addition, the heat sink may be made of foamed aluminum, and an outer surface of the heat sink may be sanded.
한편, 상기 확산 튜브의 두께는 가장자리부로부터 중앙부를 따라 점진적으로 증가되도록 형성되는 것이 바람직하다.On the other hand, the thickness of the diffusion tube is preferably formed to gradually increase from the edge portion along the center portion.
여기서, 상기 확산 튜브는 엠보싱 형상의 확산 돌기들을 더 구비하는 것이 바람직하다.Here, the diffusion tube is preferably further provided with embossed diffusion protrusions.
그리고, 상기 확산 돌기들은 상기 확산 튜브의 외면과 내면 중 적어도 하나 에 형성되는 것이 바람직하다.The diffusion protrusions may be formed on at least one of an outer surface and an inner surface of the diffusion tube.
또한, 상기 확산 돌기들은 상기 확산 튜브의 가장자리부로부터 중앙부를 따라 크기가 점진적으로 커지도록 형성되는 것이 바람직하다.In addition, the diffusion protrusions are preferably formed to gradually increase in size from the edge of the diffusion tube along the center portion.
또한, 상기 엘이디 기판은 메탈과 클러드 메탈과 FR4 중 어느 하나로 이루어지는 것이 바람직하다.In addition, the LED substrate is preferably made of any one of metal, clad metal and FR4.
또한, 상기 엘이디 기판의 외면과 상기 히트 싱크의 외면에는 횐색의 PSR을 사용한 냉각 도료가 더 도포되는 것이 바람직하다.In addition, the outer surface of the LED substrate and the outer surface of the heat sink is preferably further coated with a cooling paint using a white PSR.
이에 더하여, 상기 걸림 홈부에는 상기 확산 튜브의 양단이 슬립되어 끼워질 수 있도록 안내하는 경사면이 더 형성되는 것이 바람직하다.In addition, it is preferable that the inclined surface which guides the both ends of the diffusion tube to be slip-fitted is further formed in the locking groove portion.
본 발명은 일정 길이를 갖는 기판 및 기판에 실장되는 엘이디들로부터 발생되는 열을 외부로 신속하게 방출할 수 있는 효과를 갖는다.The present invention has the effect of quickly dissipating heat generated from the substrate having a predetermined length and the LEDs mounted on the substrate to the outside.
또한, 본 발명은 형광등의 반을 히트 싱크로 하고, 이 히트 싱크에 메탈로 이루어지는 기판을 고정 설치함으로써 기판 자체의 열을 외부로 방열할 수 있는 효과를 갖는다.In addition, the present invention has the effect of dissipating heat of the substrate itself to the outside by using a half of a fluorescent lamp as a heat sink and fixing a substrate made of metal to the heat sink.
또한, 본 발명은 일정 길이를 갖는 엘이디 형광등의 내부에 형성되는 제 2방열 부재를 사용하여 내부의 열을 일차적으로 방열하고 외부에 형성되는 제 1방열 부재를 사용하여 상기 열을 이차적으로 방열할 수 있는 효과를 갖는다.In addition, the present invention can primarily heat the internal heat by using the second heat radiation member formed inside the LED fluorescent lamp having a predetermined length, and the heat can be secondarily radiated using the first heat radiation member formed on the outside. Has the effect.
또한, 본 발명은 엘이디들로부터 발산되는 광을 확산 튜브를 통하여 외부에 균일하게 확산할 수 있는 효과를 갖는다.In addition, the present invention has an effect that can uniformly diffuse the light emitted from the LEDs to the outside through the diffusion tube.
도 1은 본 발명의 엘이디 형광등을 보여주는 사시도이다.1 is a perspective view showing the LED fluorescent lamp of the present invention.
도 2는 본 발명의 엘이디 형광등을 보여주는 분해 사시도이다.Figure 2 is an exploded perspective view showing the LED fluorescent lamp of the present invention.
도 3은 본 발명의 엘이디 형광등을 보여주는 정면도이다.Figure 3 is a front view showing the LED fluorescent lamp of the present invention.
도 4는 본 발명의 엘이디 형광등을 보여주는 단면도이다.4 is a cross-sectional view showing the LED fluorescent lamp of the present invention.
도 5a 내지 도 5e는 도 2의 엘이디 기판을 보여주는 부분 단면도들로서, 엘이디의 실장 과정을 보여주는 단면도들이다.5A through 5E are partial cross-sectional views illustrating the LED substrate of FIG. 2 and are cross-sectional views illustrating a mounting process of the LED.
도 6은 본 발명에 따르는 엘이디가 와이어 본딩에 의하여 엘이디 실장홈에 실장된 것을 보여주는 부분 단면도이다.6 is a partial cross-sectional view showing that the LED according to the present invention is mounted in the LED mounting groove by wire bonding.
도 7은 도 2의 히트 싱크와 확산 부재와의 결합 전 상태를 보여주는 단면도이다.7 is a cross-sectional view illustrating a state before coupling of the heat sink and the diffusion member of FIG. 2.
도 8은 도 7의 히트 싱크와 확산 부재와의 결합 후 상태를 보여주는 단면도이다.8 is a cross-sectional view illustrating a state after coupling of the heat sink and the diffusion member of FIG. 7.
도 9는 본 발명에 따르는 확산 돌기가 형성되는 확산 부재를 보여주는 단면도이다.9 is a cross-sectional view showing a diffusion member in which a diffusion protrusion according to the present invention is formed.
이하, 첨부된 도면을 참조하여 본 발명의 엘이디 형광등을 설명하도록 한다.Hereinafter, the LED fluorescent lamp of the present invention will be described with reference to the accompanying drawings.
도 1은 본 발명의 엘이디 형광등을 보여주는 사시도이다. 도 2는 본 발명의 엘이디 형광등을 보여주는 분해 사시도이다. 도 3은 본 발명의 엘이디 형광등을 보여주는 정면도이다. 도 4는 본 발명의 엘이디 형광등을 보여주는 단면도이다. 도 5a 내지 도 5e는 도 2의 엘이디 기판을 보여주는 부분 단면도들로서, 엘이디의 실장 과정을 보여주는 단면도들이다. 도 6은 본 발명에 따르는 엘이디가 와이어 본딩에 의하여 엘이디 실장홈에 실장된 것을 보여주는 부분 단면도이다. 도 7은 도 2의 히트 싱크와 확산 부재와의 결합 전 상태를 보여주는 단면도이다. 도 8은 도 7의 히트 싱크와 확산 부재와의 결합 후 상태를 보여주는 단면도이다. 도 9는 본 발명에 따르는 확산 돌기가 형성되는 확산 부재를 보여주는 단면도이다.1 is a perspective view showing the LED fluorescent lamp of the present invention. Figure 2 is an exploded perspective view showing the LED fluorescent lamp of the present invention. Figure 3 is a front view showing the LED fluorescent lamp of the present invention. 4 is a cross-sectional view showing the LED fluorescent lamp of the present invention. 5A through 5E are partial cross-sectional views illustrating the LED substrate of FIG. 2 and are cross-sectional views illustrating a mounting process of the LED. 6 is a partial cross-sectional view showing that the LED according to the present invention is mounted in the LED mounting groove by wire bonding. 7 is a cross-sectional view illustrating a state before coupling of the heat sink and the diffusion member of FIG. 2. 8 is a cross-sectional view illustrating a state after coupling of the heat sink and the diffusion member of FIG. 7. 9 is a cross-sectional view showing a diffusion member in which a diffusion protrusion according to the present invention is formed.
도 1 내지 도 4를 참조 하면, 본 발명의 엘이디 형광등은 크게 일정 길이를 갖는 반원 형상의 히트 싱크(100)와, 상기 히트 싱크(100)와 결합되며 일정 길이를 갖고 반원 형상을 이루는 확산 튜브(200)와, 일정 길이를 갖고 엘이디들(미도시)이 실장되며 상기 히트 싱크(100)에 고정되는 엘이디 기판(400)으로 구성된다.1 to 4, the LED fluorescent lamp of the present invention has a semicircular heat sink 100 having a predetermined length and a diffusion tube coupled to the heat sink 100 and having a predetermined length and forming a semicircular shape ( 200 and an LED substrate 400 having a predetermined length and mounted with LEDs (not shown) and fixed to the heat sink 100.
상기 히트 싱크(100)는 반원 형상의 히트 싱크 몸체(110)와, 상기 히트 싱크 몸체(110)의 외주에 일정 간격을 이루어 돌출 형성되는 제 1방열 돌기들(120)과, 상기 히트 싱크 몸체(110)의 내주에 일정 간격을 이루어 돌출 형성되는 제 2방열 돌기들(130)을 갖는다.The heat sink 100 includes a semicircular heat sink body 110, first heat dissipation protrusions 120 protruding at a predetermined interval on an outer circumference of the heat sink body 110, and the heat sink body ( The second heat dissipation protrusions 130 are formed to protrude at a predetermined interval on the inner circumference of the 110.
여기서, 상기 히트 싱크 몸체(110)의 양단에는 외부로 돌출되도록 걸림 홈부(112)를 갖는다. 상기 걸림 홈부(112)는 상기 확산 튜브(200)의 양단이 후크 결합되는 홈이다.Here, the both ends of the heat sink body 110 has a locking groove 112 to protrude to the outside. The locking groove 112 is a groove to which both ends of the diffusion tube 200 are hooked.
그리고, 상기 확산 튜브(200)의 양단은 외측으로 돌출되는 걸림 돌기(210)가 형성될 수 있다. 상기 걸림 돌기(210)는 상기 걸림 홈부(112)에 후크식으로 끼워지는 돌기이고, 그 외면에는 일정의 곡률이 형성될 수 있다. 이때, 상기 확산 튜브(200)의 양단 내측에는 상기 걸림 돌기(210)와 인접한 결합홀(210a)이 형성된다. 상기 결합홀(210a)은 상기 걸림 홈부(112)의 상단에 형성되는 돌출부(112a)가 끼워지는 홀이다.And, both ends of the diffusion tube 200 may be formed with a locking projection 210 protruding outward. The locking protrusion 210 is a protrusion that is hooked into the locking groove 112 and a predetermined curvature may be formed on an outer surface thereof. At this time, both ends of the diffusion tube 200 is formed with a coupling hole 210a adjacent to the locking protrusion 210. The coupling hole 210a is a hole into which the protrusion 112a formed at the upper end of the locking groove 112 is fitted.
이에 더하여, 상기 걸림 홈부(112)에는 상기 걸림 돌기(210)가 끼워지도록 안내할 수 있는 경사면(112a)이 형성되는 것이 좋다.In addition, the locking groove 112 may be formed with an inclined surface 112a for guiding the locking protrusion 210 to be fitted therein.
따라서, 상기 확산 튜브(200)는 상기 히트 싱크(100)와 마주 보는 위치에서, 상기 확산 튜브(200)의 양단은 상기 히트 싱크(100)의 걸림 홈부(112)에 후크식으로 결합될 수 있다.Therefore, the diffusion tube 200 may be coupled to the locking groove 112 of the heat sink 100 at both ends of the diffusion tube 200 at a position facing the heat sink 100. .
그리고, 상기 히트 싱크(100)에 있어서, 상기 제 1방열 돌기들(120)의 길이는 상기 제 2방열 돌기들(130)의 길이 보다 일정 길이 길게 형성되는 것이 좋다. 즉, 상기 제 1방열 돌기들(120)과 상기 제 2방열 돌기들(130)의 길이는 서로 다르게 형성되는 것이 좋다.In the heat sink 100, the length of the first heat dissipation protrusions 120 may be longer than a length of the second heat dissipation protrusions 130. That is, the lengths of the first heat dissipation protrusions 120 and the second heat dissipation protrusions 130 may be different from each other.
물론, 히트 싱크 몸체(110)에서 일정 부분에 국부적으로 열이 집중되는 위치가 미리 확인되면, 상기 열이 집중되는 부분에 해당되는 위치에서의 제 1방열 돌기(120) 또는 제 2방열 돌기(130) 중 어느 하나를 일정 길이로 더 길게 형성할 수도 있다.Of course, when the position where the heat is concentrated locally on a predetermined portion of the heat sink body 110 is confirmed in advance, the first heat dissipation protrusion 120 or the second heat dissipation protrusion 130 at a position corresponding to the heat concentration portion is confirmed. ) May be longer than a certain length.
또한, 상기 제 1방열 돌기들(120)과 상기 제 2방열 돌기들(130)의 모서리부는 둥글게 처리되어 형성되는 것이 좋다.In addition, the corner portions of the first heat dissipation protrusions 120 and the second heat dissipation protrusions 130 may be formed to be rounded.
이에 따라, 상기 제 1방열 돌기들(120)에 의하여 히트 싱크 몸체(110)의 외부에서 공기와의 접촉 면적이 증가될 수 있고, 상기 제 2방열 돌기들(130)에 의하여 상기 히트 싱크 몸체(110)의 내부에서 공기와의 접촉 면적이 증가될 수 있다.Accordingly, an area of contact with air outside the heat sink body 110 may be increased by the first heat dissipation protrusions 120, and the heat sink body (the heat sink body) may be increased by the second heat dissipation protrusions 130. The area of contact with air in the interior of 110 may be increased.
또한, 상기 히트 싱크 몸체(110)의 양단에는 고정 홈부(113)가 형성되는데, 상기 고정 홈부(113)에는 상기 엘이디들(40)이 실장되는 엘이디 기판(400)의 양단이 끼워져 고정될 수 있다. 또한, 상기 기판(400)은 메탈과 클러드 메탈과 FR4 중 어느 하나로 이루어 질 수 있다. 또한, 도면에는 도시되지 않았지만, 상기 기판(400)의 상면에는 방열용으로 일정 형상 바람직하게는 방사 형상의 돌기들이 더 형성될 수 있다.In addition, fixing grooves 113 are formed at both ends of the heat sink body 110, and both ends of the LED substrate 400 on which the LEDs 40 are mounted may be fixed to the fixing groove 113. . In addition, the substrate 400 may be made of any one of metal, clad metal, and FR4. In addition, although not shown in the drawings, a predetermined shape, preferably radial projections may be further formed on the upper surface of the substrate 400 for heat dissipation.
따라서, 상기 엘이디 기판(400)은 상기 히트 싱크 몸체(110)에 물리적으로 접촉될 수 있기 때문에, 엘이디들(40)이 광을 발산하는 경우에 기판(400)에 일정 이상의 열이 발생되더라도 상기 열은 상기 히트 싱크 몸체(110)로 용이하게 전달되어 방열될 수 있다.Accordingly, since the LED substrate 400 may be in physical contact with the heat sink body 110, even when a predetermined amount of heat is generated in the substrate 400 when the LEDs 40 emit light, the heat is generated. The heat sink body 110 can be easily transferred and radiated.
그리고, 상기 엘이디 기판(400)의 상면은 상기 확산 튜브(200)의 걸림 돌기(210)가 형성된 부분과 실질적으로 동일 선상을 이룰 수 있다.In addition, an upper surface of the LED substrate 400 may form substantially the same line as a portion where the engaging protrusion 210 of the diffusion tube 200 is formed.
이에 더하여, 상기 제 1방열 돌기들(120)과 상기 제 2방열 돌기들(130)은 서로 어긋나도록 위치되는 것이 좋다. 이에 따라, 상기 히트 싱크 몸체(110)의 내부와 외부에서 공기와의 접촉되는 면적을 증가시킴과 아울러 열을 방열하는 경우에 서로 보완할 수 있다.In addition, the first heat dissipation protrusions 120 and the second heat dissipation protrusions 130 may be positioned to be offset from each other. Accordingly, the area of the heat sink body 110 which is in contact with the air in the inside and outside of the heat sink may be increased and the heat may be complemented with each other.
또한, 상기 히트 싱크 몸체(110)의 외주와 내주 중 적어도 하나 이상에는 엠보싱 형상의 제 1돌기물들(a)이 더 형성된다. 여기서, 상기 제 1돌기물들(a)은 상기 히트 싱크 몸체(110)의 외주에만, 또는 내주에만 형성될 수도 있고, 외주와 내주에 모두 형성될 수도 있다. 또한, 도면에 도시되지는 않았지만, 상기 제 1돌기물들(a)의 형상은 엠보싱 형상 외에 다각 형상의 돌기로 형성될 수도 있다.In addition, at least one of the outer circumference and the inner circumference of the heat sink body 110 may further include embossed first protrusions a. Here, the first protrusions (a) may be formed only on the outer circumference or only the inner circumference of the heat sink body 110, or may be formed on both the outer circumference and the inner circumference. In addition, although not shown in the drawings, the shapes of the first protrusions (a) may be formed of polygonal protrusions in addition to the embossing shape.
그리고, 상기 제 1방열 돌기(120)와 제 2방열 돌기(130)의 외면에는 엠보싱 형상의 제 2돌기물들(111,114)이 더 형성될 수 있다. 여기서, 상기 제 2돌기물들(111,114)은 상기 제 1방열 돌기(120)의 외면에 형성되는 돌기들(114)과, 제 2방열 돌기(130)의 외면에 형성되는 돌기들(111)로 구성될 수 있다.The embossed second protrusions 111 and 114 may be further formed on the outer surfaces of the first heat dissipation protrusion 120 and the second heat dissipation protrusion 130. The second protrusions 111 and 114 may include protrusions 114 formed on the outer surface of the first heat dissipation protrusion 120 and protrusions 111 formed on the outer surface of the second heat dissipation protrusion 130. Can be.
이는, 히트 싱크 몸체(110)의 외주와 내부에서의 공기와의 접촉 면적을 극대화할 수 있도록 함이다. 즉, 히트 싱크 몸체(110)의 내면 및 외면에서 히트 싱크 몸체(110)의 내부의 열을 용이하게 방열시킬 수 있다.This is to maximize the contact area between the outer periphery of the heat sink body 110 and the air therein. That is, the heat inside the heat sink body 110 can be easily radiated from the inner surface and the outer surface of the heat sink body 110.
본 발명에서는 히트 싱크(100)의 공기와의 접촉 면적을 극대화할 수 있는 방안으로 하기와 같은 방안을 제시할 수 있다.In the present invention, the following method may be proposed as a method for maximizing the contact area with the air of the heat sink 100.
첫번째, 상기 히트 싱크(100)를 발포 알루미늄으로 제작하는 것과, 두번째, 상기 히트 싱크(100)의 외면을 샌딩(또는 에칭) 처리하는 것이다. 따라서, 발포 알루미늄을 사용하는 경우에 다공을 구비하기 때문에 히트 싱크 몸체(110) 자체에서의 공기와의 접촉 면적을 증가시킬 수 있고, 이에 더하여, 히트 싱크(100)의 외면을 에칭 또는 샌딩 처리함으로써 상기 외면에 거칠기를 형성하여 공기와의 접촉 면적을 더 증가시키도록 할 수 있다.First, the heat sink 100 is made of foamed aluminum, and second, the outer surface of the heat sink 100 is sanded (or etched). Therefore, since the porous aluminum is used in the case of using foamed aluminum, the contact area with air in the heat sink body 110 itself can be increased, and in addition, by etching or sanding the outer surface of the heat sink 100. Roughness may be formed on the outer surface to further increase the contact area with air.
한편, 도 7 및 도 8을 참조 하면, 상기 히트 싱크 몸체(110)와 후크 결합되는 확산 튜브(200)는 일정 길이를 갖고, 이의 단면 형상이 반원 형상으로 형성된다. 그리고, 상기 확산 튜브(200)의 양단에는 상기에 언급된 바와 같이 걸림 돌기(210)가 형성되고, 이 걸림 돌기(210)는 히트 싱크 몸체(110)의 양단에 형성되는 걸림 홈부(112)에 후크식으로 끼어져 고정된다.Meanwhile, referring to FIGS. 7 and 8, the diffusion tube 200 hooked with the heat sink body 110 has a predetermined length, and a cross-sectional shape thereof is formed in a semicircular shape. Then, both ends of the diffusion tube 200 is formed with a locking projection 210 as mentioned above, the locking projection 210 is formed in the locking groove 112 formed at both ends of the heat sink body 110. It is hooked and fixed.
이에 더하여, 도 9를 참조 하면, 상기 확산 튜브(200)의 두께는 단면의 형상으로 볼 때에 가장자리부로부터 중앙부를 따라 점진적으로 증가되도록 형성될 수 있다.In addition, referring to FIG. 9, the thickness of the diffusion tube 200 may be formed to gradually increase from the edge to the center when viewed in the shape of a cross section.
따라서, 상기 엘이디들(40)로부터 발산되는 광의 광량은 중앙부의 외부로 적게 가장자리부의 외부로 많게 조절되어, 전체적으로 확산 튜브(200)의 외부로 발산되는 광량은 균일하게 발산될 수 있다.Thus, the amount of light emitted from the LEDs 40 is controlled to be much less outside the center portion outside the center portion, so that the amount of light emitted outside the diffusion tube 200 as a whole can be evenly distributed.
또한, 상기 확산 튜브(200)는 엠보싱 형상의 확산 돌기들(220)을 더 구비할 수 있다.In addition, the diffusion tube 200 may further include diffusion protrusions 220 having an embossed shape.
여기서, 상기 확산 돌기들(220)은 상기 확산 튜브(200)의 외면과 내면 중 적어도 하나 이상에 형성되는 것이 좋다. 바람직하게는 도 9에 도시된 바와 같이 상기 확산 튜브(200)의 내면에 형성되는 것이 좋다.The diffusion protrusions 220 may be formed on at least one of an outer surface and an inner surface of the diffusion tube 200. Preferably it is formed on the inner surface of the diffusion tube 200 as shown in FIG.
따라서, 상기 엘이디들(40)로부터 발산되는 광은 확산 튜브(200)의 외부로 균일하게 확산될 수 있다.Therefore, the light emitted from the LEDs 40 may be uniformly diffused to the outside of the diffusion tube 200.
그리고, 상기에 언급한 바와 같이 도 9에서, 상기 확산 돌기들(220)은 상기 확산 튜브(200)의 가장자리부로부터 중앙부를 따라 크기가 점진적으로 커지도록 형성되는 것이 좋다. 이는, 상기 중앙부로 전달되는 광량과 가장자리부로 전달되는 광량이 서로 다르기 때문이고, 이로 인하여 확산 튜브(200)의 외부로 확산되는 광의 확산 정도는 균일하게 이루어질 수 있다.In addition, as mentioned above, in FIG. 9, the diffusion protrusions 220 may be formed to gradually increase in size from the edge of the diffusion tube 200 along the center portion. This is because the amount of light delivered to the center portion and the amount of light delivered to the edge portion are different from each other, and thus, the degree of diffusion of light diffused to the outside of the diffusion tube 200 may be uniform.
그리고, 상기 확산 튜브(200)에 형성되는 확산 돌기들(220)로 인하여 엘이디들(40)로부터 방사되는 광의 방사각은 상기 엘이디 기판(400)을 중심을 기준으로 280도 정도로 증가될 수 있다.In addition, the radiation angle of the light emitted from the LEDs 40 due to the diffusion protrusions 220 formed in the diffusion tube 200 may be increased to about 280 degrees with respect to the center of the LED substrate 400.
또한, 확산 튜브(200)의 두께를 상기에 언급된 바와 같이 제작함으로써, 확산 튜브(200) 자체의 중량을 줄일 수도 있다.In addition, by manufacturing the thickness of the diffusion tube 200 as mentioned above, it is also possible to reduce the weight of the diffusion tube 200 itself.
본 발명에 따르는 엘이디 기판(400)은 엘이디들(40)의 광의 발산으로 인하여 일정 이상의 열이 발생될 수 있는데, 이 열은 냉각 도료에 의하여 냉각될 수도 있다.The LED substrate 400 according to the present invention may generate more than a predetermined heat due to the light emitted from the LEDs 40, which may be cooled by a cooling paint.
즉, 이는 상기 엘이디 기판(400)의 외면과 상기 히트 싱크(100)의 외면에는 횐색의 PSR을 사용한 냉각 도료가 더 도포됨으로써 이루어질 수 있다.That is, this may be achieved by further applying a cooling paint using white PSR to the outer surface of the LED substrate 400 and the outer surface of the heat sink 100.
또한, 상기 냉각 도료를 엘이디 기판(400) 및 히트 싱크(100)의 외면에 도포함으로써 엘이디 기판(400)에서 발생되는 노이즈를 저감할 수 있다. 따라서, 엘이디들(40)로부터 발산되는 광은 노이즈가 일정 정도 저감되기 때문에 안정적인 광을 외부로 발산할 수 있다.In addition, by applying the cooling paint to the outer surface of the LED substrate 400 and the heat sink 100 can reduce the noise generated in the LED substrate 400. Therefore, the light emitted from the LEDs 40 may emit stable light to the outside because noise is reduced to some extent.
또한, 도 5a 내지 도 5e를 참조 하면, 상기 엘이디 기판(400)에 실장되는 엘이디들(40)은 상기 엘이디 기판(400)의 내부에 삽입되어 실장 될 수도 있다.Also, referring to FIGS. 5A to 5E, the LEDs 40 mounted on the LED substrate 400 may be inserted into the LED substrate 400 to be mounted.
즉, 상기 엘이디 기판(400)의 기판 몸체(410)의 다수 위치에는 엘이디 설치홈들(420)이 라우터에 의하여 형성된다. 그리고, 상기 엘이디 설치홈(420)의 바닥면(4222)에는 전극(30)이 형성된다. 그리고, 상기 엘이디들(40)은 상기 엘이디 설치홈(420)의 내부에 위치되어 볼 그리드 어레이(42) 또는 와이어 본딩(43) 중 어느 하나의 방법에 의하여 실장될 수 있다.That is, the LED installation grooves 420 are formed by routers at a plurality of positions of the substrate body 410 of the LED substrate 400. The electrode 30 is formed on the bottom surface 4222 of the LED installation groove 420. In addition, the LEDs 40 may be located in the LED installation grooves 420 and may be mounted by any one of the ball grid array 42 and the wire bonding 43.
이어, 상기 엘이디 설치홈(420)에는 실리콘과 형광체가 일정 비율로 혼합된 채움재(430)로 채워질 수 있다. 상기 채움재(430)의 상면은 상기 엘이디 기판(400)의 상면과 동일 선상을 이룰 수 있다.Subsequently, the LED installation groove 420 may be filled with a filler 430 in which silicon and phosphors are mixed at a predetermined ratio. The top surface of the filler 430 may form the same line as the top surface of the LED substrate 400.
이는 엘이디 기판(400)의 두께를 용이하게 감소시킬 수도 있고, 엘이디들(40)을 외부의 환경으로부터 안전하게 보호할 수 있다.This may easily reduce the thickness of the LED substrate 400 and may safely protect the LEDs 40 from the external environment.
이에 더하여, 상기 엘이디 기판(400)이 디밍 회로를 갖는 경우에, 상기 엘이디 기판(400)은 엘이디들(40)의 광량을 기설정된 값으로 조절할 수 있다.In addition, when the LED substrate 400 has a dimming circuit, the LED substrate 400 may adjust the amount of light of the LEDs 40 to a predetermined value.
또한, 엘이디들(40)이 실장된 반대편 엘이디 기판(400)의 외면에는 방사상의 환형 돌기들(미도시)이 더 형성될 수도 있다. 이는 엘이디 기판(400) 자체에서 발생되는 열을 방열 시킬 수 있는 역할을 한다.In addition, radially annular protrusions (not shown) may be further formed on an outer surface of the opposite LED substrate 400 on which the LEDs 40 are mounted. This serves to dissipate heat generated from the LED substrate 400 itself.
여기서, 도면 부호 '421'은 엘이디 설치홈(420)의 양측벽이다. 그리고, '430'은 실리콘과 형광체가 일정 비율로 혼합된 채움재이다.Here, reference numeral 421 denotes both side walls of the LED installation groove 420. '430' is a filler in which silicon and phosphors are mixed at a predetermined ratio.
이에 더하여, 도면에 도시되지는 않았지만, 상기 엘이디 기판(400)의 상면에는 다수의 환형의 돌기들(미도시)이 더 형성될 수도 있다. 여기서, 상기 환형의 돌기들은 상기 엘이디 기판(400)과 일체로 이루어짐과 아울러 상기 엘이디 기판(400)과 동일한 재질로 이루어진다. 특히, 본 발명에서는 상기 엘이디 기판(400)이 클러드 메탈(clad metal)로 이루어지는 것이 바람직하다.In addition, although not shown in the drawing, a plurality of annular protrusions (not shown) may be further formed on the upper surface of the LED substrate 400. Here, the annular protrusions are made of the same material as that of the LED substrate 400 as well as being integral with the LED substrate 400. In particular, in the present invention, the LED substrate 400 is preferably made of a clad metal.
상기의 클러드 메탈에 대하여 설명하면 다음과 같다.The above-mentioned clad metal will be described as follows.
상기 클러드 메탈은 금속 또는 비금속을 두겹 이상 맞붙인 재료, 즉 이종 접합 메탈을 통칭하는 의미로, 모재가 갖지 않는 새로운 특성을 부가한 재료를 의미한다. 이는 단일의 금속으로 얻을수 없는 다양한 성질을 보충해 특수한 요구에 합치시키는 것이 가능한 잇점을 갖는다.The clad metal refers to a material in which two or more layers of metals or nonmetals are bonded together, that is, a heterojunction metal. This has the advantage that it can be adapted to the special needs by supplementing various properties which cannot be obtained with a single metal.
예컨대, 구리-알루미늄-구리 또는 구리-스테인레스-구리 등으로 이종 접합한 예를 들 수 있다.For example, the example which carried out heterojunction with copper-aluminum-copper, copper-stainless-copper etc. is mentioned.
이상 설명한 바와 같이, 본 발명의 상세한 설명에서는 본 발명의 바람직한 실시예에 관하여 설명하였으나, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자라면 본 발명의 범주에서 벗어나지 않는 한도 내에서 여러 가지 변형 가능함은 물론이다.As described above, in the detailed description of the present invention has been described with respect to preferred embodiments of the present invention, those skilled in the art to which the present invention pertains various modifications can be made without departing from the scope of the invention Of course.
따라서 본 발명의 권리 범위는 설명된 실시 예에 국한되어 정해져서는 아니되며, 후술하는 특허 청구 범위뿐만 아니라, 이 특허 청구 범위와 균등한 것들에 의해 정해져야 한다.Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below, but also by the equivalents of the claims.
본 발명은 엘이디 형광등의 제조분야에 이용될 수 있다.The present invention can be used in the field of manufacturing LED fluorescent lamps.

Claims (13)

  1. 일정 길이를 갖고, 양단에 걸림 홈부가 형성되는 반원 형상의 히트 싱크;A semicircular heat sink having a predetermined length and having locking grooves at both ends thereof;
    일정 길이를 갖고, 상기 걸림 홈부에 양단이 후크 결합되는 반원 형상의 확산 튜브; 및A semicircular diffusion tube having a predetermined length and having both ends hooked to the engaging groove; And
    일정 길이를 갖고, 상기 히트 싱크의 양단 내측에 형성되는 고정 홈부에 양측부가 끼워져 고정되고, 상기 확산 튜브에 노출되도록 상면 다수 위치에 엘이디들이 실장되는 엘이디 기판을 포함하는 것을 특징으로 하는 엘이디 형광등.An LED fluorescent lamp having an LED substrate having a predetermined length and having both sides fitted into and fixed to a fixing groove formed inside both ends of the heat sink, and having LEDs mounted at a plurality of positions on the upper surface to be exposed to the diffusion tube.
  2. 제 1항에 있어서,The method of claim 1,
    상기 히트 싱크는 반원 형상의 히트 싱크 몸체와, 상기 히트 싱크 몸체의 외주에 일정 간격을 이루어 돌출 형성되는 제 1방열 돌기들과, 상기 히트 싱크 몸체의 내주에 일정 간격을 이루어 돌출 형성되는 제 2방열 돌기들을 구비하는 것을 특징으로 하는 엘이디 형광등.The heat sink has a semicircular heat sink body, first heat dissipation protrusions protruding at a predetermined interval on an outer circumference of the heat sink body, and second heat dissipation protruding at a predetermined interval on an inner circumference of the heat sink body. LED fluorescent lamp comprising projections.
  3. 제 2항에 있어서,The method of claim 2,
    상기 제 1방열 돌기들의 길이는 상기 제 2방열 돌기들의 길이 보다 일정 길이 길게 형성되는 것을 특징으로 하는 엘이디 형광등.LED fluorescent lamp, characterized in that the length of the first heat radiation projections are formed longer than the length of the second heat radiation projections.
  4. 제 2항에 있어서,The method of claim 2,
    상기 제 1방열 돌기들과 상기 제 2방열 돌기들은 서로 어긋나도록 위치되는 것을 특징으로 하는 엘이디 형광등.And the first heat dissipation protrusions and the second heat dissipation protrusions are positioned to be offset from each other.
  5. 제 2항에 있어서,The method of claim 2,
    상기 히트 싱크 몸체의 외주와 내주 중 적어도 하나 이상에는 엠보싱 형상의 제 1돌기물들이 더 형성되고,Embossed first protrusions are further formed on at least one of an outer circumference and an inner circumference of the heat sink body,
    상기 제 1방열 돌기와 상기 제 2방열 돌기의 외면에는 엠보싱 형상의 제 2돌기물들이 더 형성되는 것을 특징으로 하는 엘이디 형광등.LED fluorescent lamp, characterized in that the embossed second projections are further formed on the outer surface of the first heat dissipation protrusion and the second heat dissipation protrusion.
  6. 제 1항에 있어서,The method of claim 1,
    상기 히트 싱크는 발포 알루미늄으로 이루어지고,The heat sink is made of foamed aluminum,
    상기 히트 싱크의 외면은 샌딩 처리되는 것을 특징으로 하는 엘이디 형광등.LED fluorescent lamp, characterized in that the outer surface of the heat sink is sanded.
  7. 제 1항에 있어서,The method of claim 1,
    상기 확산 튜브의 두께는 가장자리부로부터 중앙부를 따라 점진적으로 증가되도록 형성되는 것을 특징으로 하는 엘이디 형광등.The thickness of the diffusion tube LED fluorescent lamp characterized in that it is formed to increase gradually from the edge portion along the center portion.
  8. 제 1항에 있어서,The method of claim 1,
    상기 확산 튜브는 엠보싱 형상의 확산 돌기들을 더 구비하는 것을 특징으로 하는 엘이디 형광등.The diffusion tube further comprises an embossed diffusion projections LED fluorescent lamp.
  9. 제 8항에 있어서,The method of claim 8,
    상기 확산 돌기들은 상기 확산 튜브의 외면과 내면 중 적어도 어느 하나에 형성되는 것을 특징으로 하는 엘이디 형광등.LED diffuser is formed on at least one of the outer surface and the inner surface of the diffusion tube.
  10. 제 8항에 있어서,The method of claim 8,
    상기 확산 돌기들은 상기 확산 튜브의 가장자리부로부터 중앙부를 따라 크기가 점진적으로 커지도록 형성되는 것을 특징으로 하는 엘이디 형광등.And the diffusion protrusions are formed to gradually increase in size from an edge portion of the diffusion tube along a center portion thereof.
  11. 제 1항에 있어서,The method of claim 1,
    상기 엘이디 기판은 메탈과 클러드 메탈과 FR4 중 어느 하나로 이루어지는 것을 특징으로 하는 엘이디 형광등.The LED substrate is an LED fluorescent lamp, characterized in that made of any one of metal, clad metal and FR4.
  12. 제 1항에 있어서,The method of claim 1,
    상기 엘이디 기판의 외면과 상기 히트 싱크의 외면에는 횐색의 PSR을 사용한 냉각 도료가 더 도포되는 것을 특징으로 하는 엘이디 형광등.The LED fluorescent lamp further comprises a cooling paint using a white PSR on the outer surface of the LED substrate and the outer surface of the heat sink.
  13. 제 1항에 있어서,The method of claim 1,
    상기 걸림 홈부에는 상기 확산 튜브의 양단이 슬립되어 끼워질 수 있도록 안내하는 경사면이 더 형성되는 것을 특징으로 하는 엘이디 형광등.LED hangers, characterized in that the inclined surface is further formed to guide so that both ends of the diffusion tube is slipped and fitted.
PCT/KR2010/005658 2009-08-27 2010-08-24 Led fluorescent lamp WO2011025235A2 (en)

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