JP2022099045A - Electric connection box - Google Patents

Abstract

To provide an electric connection box that can quickly dissipate heat generated by a bus-bar embedded substrate.SOLUTION: An electric connection box with a bus-bar embedded substrate 10 with a bus-bar embedded inside and a heat dissipating member 40 covering a non-mounted surface 12 of the bus-bar embedded substrate 10, comprises a recess 13 formed in the non-mounted surface 12 of the bus-bar embedded substrate 10 and a heat transfer part 60 provided inside the recess 13 and in contact with the heat dissipating member 40.SELECTED DRAWING: Figure 6

Description

The present disclosure relates to an electrical junction box comprising a substrate.

Conventionally, for the purpose of improving insulation, a bus bar embedded substrate manufactured by insert molding and having a bus bar embedded inside is widely used for an electric junction box.

For example, Patent Document 1 includes a bus bar embedded substrate in which one bus bar is embedded and another bus bar laminated on the bus bar embedded substrate, and by forming a through hole in the bus bar embedded substrate. A bus bar circuit body in which the one bus bar is exposed and the one bus bar and the other bus bar are soldered to each other is disclosed.

Japanese Unexamined Patent Publication No. 2016-96640

On the other hand, in the above-mentioned bus bar embedded substrate, for example, since the bus bar is embedded inside the resin substrate, it cannot be said that the heat generated by the bus bar when energized is sufficiently dissipated, and the heat is generated in the bus bar embedded substrate. There is a problem of being muffled. Further, in such a case, the heat inside the bus bar embedded substrate may be transferred to the mounted circuit components, resulting in malfunction.

However, the bus bar circuit body of Patent Document 1 does not consider such a problem and cannot solve it.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide an electric junction box capable of quickly dissipating heat generated in a bus bar embedded substrate.

The electrical junction box according to the embodiment of the present disclosure is an electrical junction box including a bus bar embedded substrate in which a bus bar is embedded and a heat radiating member covering one surface of the bus bar embedded substrate, and is the said of the bus bar embedded substrate. It is provided with a recess formed on one surface and a heat transfer portion provided in the recess and in contact with the heat radiating member.

According to the present disclosure, in an electric junction box provided with a bus bar embedded substrate, heat generated in the bus bar embedded substrate can be quickly dissipated.

It is a perspective view which shows the appearance of the electric connection box which concerns on Embodiment 1. FIG. It is a figure which shows the state which omitted the case member in the electric junction box. It is a perspective view which shows the appearance of a heat dissipation member. It is a perspective view which shows the mounting surface of the bus bar embedded board. It is a perspective view which shows the non-mounting surface of a bus bar embedded board. It is sectional drawing which shows the characteristic part of the electric connection box which concerns on Embodiment 1. FIG. It is sectional drawing which shows the characteristic part of the electric connection box which concerns on Embodiment 2. FIG. It is sectional drawing which shows the characteristic part of the electric connection box which concerns on Embodiment 3. FIG.

[Explanation of Embodiment of the present invention]
First, embodiments of the present disclosure will be listed and described. In addition, at least a part of the embodiments described below may be arbitrarily combined.

(1) The electric junction box according to the embodiment of the present disclosure is an electric junction box including a bus bar embedded substrate in which a bus bar is embedded and a heat radiating member covering one surface of the bus bar embedded substrate, and the bus bar is embedded. A recess formed on the one surface of the substrate and a heat transfer portion provided in the recess and in contact with the heat radiating member are provided.

In the present embodiment, the heat transfer portion is provided in the recess of the bus bar embedded substrate, and the heat transfer portion is in contact with the heat radiation member. Therefore, the heat generated in the bus bar embedded substrate is quickly transferred to the heat radiating member via the heat transfer portion.

(2) In the electrical junction box according to the embodiment of the present disclosure, the bus bar is exposed from the bottom of the recess, and the heat transfer portion has an insulating property and is in contact with the bus bar.

In the present embodiment, the heat transfer portion having an insulating property is provided in the recess of the bus bar embedded substrate, and the heat transfer portion is in contact with the bus bar exposed from the bottom of the recess and the heat radiation member. is doing. Therefore, the heat generated in the bus bar embedded substrate is quickly transferred to the heat radiating member via the heat transfer portion.

(3) In the electric junction box according to the embodiment of the present disclosure, the heat radiation member has a convex portion having a shape corresponding to the concave portion, and the convex portion is in contact with the heat transfer portion.

In the present embodiment, the heat transfer portion is provided in the concave portion of the bus bar embedded substrate, and the convex portion of the heat radiating member is engaged with the concave portion. At this time, the convex portion is the said. It is in contact with the heat transfer part. Therefore, the positioning of the heat radiating member is easy, and the heat generated in the bus bar embedded substrate is quickly transferred to the heat radiating member via the heat transfer portion and the convex portion.

(4) In the electrical connection box according to the embodiment of the present disclosure, a ridge is provided around the edge of the recess.

In the present embodiment, the convex strip is provided around the edge of the concave portion, and when the convex portion engages with the concave portion, the convex portion is guided by the convex strip. Therefore, the convex portion and the concave portion can be easily engaged with each other.

(5) In the electric junction box according to the embodiment of the present disclosure, the bus bar is covered with a resin, and the heat transfer portion has a higher thermal conductivity than the resin.

In the present embodiment, since the heat transfer portion has a higher thermal conductivity than the resin covering the bus bar, the heat generated in the bus bar embedded substrate is different in the recess provided with the heat transfer portion. It is transmitted to the heat radiating member more quickly than the portion of.

[Details of Embodiments of the present invention]
The electrical junction box according to the embodiment of the present disclosure will be described below with reference to the drawings. It should be noted that the present invention is not limited to these examples, and is indicated by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

(Embodiment 1)
FIG. 1 is a perspective view showing the appearance of the electrical connection box 100 according to the first embodiment.
The electric junction box 100 includes a case member (housing) 50 and a heat dissipation member 40.

The case member 50 has a substantially flat rectangular parallelepiped shape, and accommodates a bus bar embedded substrate 10 described later. The case member 50 has an opening (not shown) with one main surface open, and the inner bus bar embedded substrate 10 is exposed through such an opening. Further, in the case member 50, a connector 30 for transmitting and receiving signals to and from the outside is provided on one side surface adjacent to the opening.

The heat radiating member 40 is a so-called heat sink made of a material having a high thermal conductivity such as aluminum or copper and radiating heat generated from the bus bar embedded substrate 10. The heat radiating member 40 has a plate-shaped portion 41 and a plurality of heat radiating fins 42.

FIG. 2 is a view showing a state in which the case member 50 is omitted in the electrical junction box 100, FIG. 3 is a perspective view showing the appearance of the heat radiation member 40, and FIG. 4 is a mounting surface of the bus bar embedded substrate 10. 11 is a perspective view showing 11, FIG. 5 is a perspective view showing a non-mounting surface 12 of the bus bar embedded substrate 10, and FIG. 6 is a cross-sectional view showing a characteristic portion of the electrical junction box 100 according to the first embodiment. .. Note that FIG. 6 shows only the bus bar embedded substrate 10, the heat transfer section 60, and the heat dissipation member 40 for convenience.

The plate-shaped portion 41 has a substantially rectangular shape and has a shape corresponding to the opening of the case member 50. The heat radiating member 40 is attached to the case member 50 so that one surface 411 of the plate-shaped portion 41 covers the opening of the case member 50.

Further, the plurality of heat radiation fins 42 each have a trapezoidal shape having the same shape. Further, the plurality of heat radiation fins 42 are arranged side by side at equal intervals, and are vertically projected from the other surface on the opposite side to the one surface 411.

Further, in the heat radiating member 40, the convex portion 43 is provided so as to project from one surface 411 of the plate-shaped portion 41 over a predetermined range. The convex portion 43 has a substantially L-shape, and the tip surface 431 of the convex portion 43 is a flat surface.
A pedestal 44 is projected on one side 411. The pedestal 44 has a substantially cylindrical shape, and a screw for screwing the bus bar embedded substrate 10 is formed on the inner peripheral surface thereof.

The bus bar embedded substrate 10 is manufactured by insert molding, and a plurality of bus bars 101 are embedded therein. That is, in the bus bar embedded substrate 10, a plurality of bus bars 101 are covered with the resin 102. Each bus bar 101 is made of a conductive metal and is made of a plate material. The plurality of bus bars 101 have different shapes, but are arranged so that the main surfaces are oriented in the same direction.

The bus bar embedded substrate 10 includes a rectangular rectangular plate portion 14 and an upright portion 15 that rises vertically from the edge of one long side of the rectangular plate portion 14. Further, one end 103 of the plurality of bus bars 101 is exposed from the tip of the upright portion 15. The exposed portions of the plurality of bus bars 101 have a comb shape as a whole, and extend to the outside of the rectangular plate portion 14 in parallel with the rectangular plate portion 14.
In other words, each bus bar 101 has a crank shape at one end, and the tip of the one end is not covered with the resin 102 and is exposed.

Further, as shown in FIG. 4, a plurality of circuit components are mounted on the mounting surface 11 of the bus bar embedded substrate 10. Such a plurality of circuit components include a plurality of FETs (field effect transistors) 20.

As shown in FIG. 5, in the bus bar embedded substrate 10, the recess 13 is formed on the non-mounting surface 12 (one surface) opposite to the mounting surface 11. The concave portion 13 has an L-shape corresponding to the convex portion 43 (tip surface 431) of the heat radiating member 40. Further, as shown in FIG. 6, the recess 13 is formed in a layer of the resin 102 that covers the bus bar 101.

Further, the recess 13 is formed at a position corresponding to the mounting position of the FET 20 on the mounting surface 11. That is, the formation range of the recess 13 on the non-mounting surface 12 includes a position corresponding to the mounting position of the plurality of FETs 20 on the mounting surface 11.

A heat transfer unit 60 is arranged inside the recess 13. The heat transfer unit 60 is made of an insulating material having a higher thermal conductivity than the resin 102 of the bus bar embedded substrate 10. Further, although the heat transfer unit 60 is initially in a gel state, it hardens with the passage of time. After curing, the heat transfer portion 60 has a plate shape and, like the recess 13, has a substantially L-shape.

Hereinafter, a method of incorporating the bus bar embedded substrate 10, the heat transfer unit 60, and the heat dissipation member 40 in the electrical connection box 100 of the first embodiment will be described.

First, the operator accommodates and fixes the bus bar embedded substrate 10 in the case member 50. At this time, the bus bar embedded substrate 10 is arranged so that the non-mounting surface 12 of the bus bar embedded substrate 10 is exposed through the opening.

Next, the operator applies a material to be a heat transfer portion 60 in a gel state into the recess 13 of the bus bar embedded substrate 10. As described above, the heat transfer portion 60 is cured with the passage of time, but while the heat transfer portion 60 is not cured, one surface 411 of the plate-shaped portion 41 covers the non-mounting surface 12 of the bus bar embedded substrate 10. , The operator attaches the heat dissipation member 40 to the case member 50. At this time, the operator aligns the position of the convex portion 43 of the heat radiating member 40 with the position of the concave portion 13 of the bus bar embedded substrate 10 and inserts the convex portion 43 into the concave portion 13. Next, the bus bar embedded substrate 10 is screwed to the heat radiating member 40.

Further, as shown in FIG. 6, the heat transfer portion 60 is interposed between the heat radiating member 40 (convex portion 43) and the bus bar embedded substrate 10 (concave portion 13), and the heat radiating member 40 and the bus bar embedded substrate 10 are interposed. Both are in contact.

As described above, since the heat transfer portion 60 is initially in a gel state, it is good between the heat transfer portion 60, the convex portion 43 (tip surface 431) of the heat radiation member 40, and the bus bar embedded substrate 10 (concave portion 13). Contact occurs. After that, the heat transfer portion 60 is cured with the passage of time while maintaining a good contact state between the heat transfer portion 60 and the convex portion 43 and the concave portion 13. Therefore, the contact property between the heat radiating member 40 (convex portion 43) and the heat transfer portion 60 and the bus bar embedded substrate 10 (concave portion 13) and the heat transfer portion 60 is enhanced.

Since the electric junction box 100 of the first embodiment has the above configuration, the heat from the bus bar embedded substrate 10 can be quickly dissipated, and the heat can be prevented from being trapped in the bus bar embedded substrate 10. ..

That is, during the operation of the electrical junction box 100, the heat generated by the circuit component of the mounting surface 11 is also transmitted to the bus bar 101, and is transferred to the heat transfer portion 60 of the non-mounting surface 12 via the resin 102 of the bus bar embedded substrate 10. It is transmitted. The heat transferred to the heat transfer unit 60 is transmitted to the heat radiating member 40 via the convex portion 43, and is radiated into the air via the heat radiating fins 42.

As described above, the heat transfer portion 60 is provided in the recess 13, and the heat transfer portion 60 has a higher thermal conductivity than the resin 102 of the bus bar embedded substrate 10. Therefore, since heat conduction is performed by the heat transfer portion 60 in the region corresponding to the recess 13, heat conduction is more likely to occur than in other portions. Further, as described above, since the heat radiating member 40 and the bus bar embedded substrate 10 are in close contact with each other via the heat transfer portion 60, heat is more easily transferred from the bus bar embedded substrate 10 to the heat radiating member 40.

Further, in the electrical connection box 100 of the first embodiment, the recess 13 is formed on the non-mounting surface 12 at a position corresponding to the mounting position of the FET 20. The FET 20 generates the highest heat among the circuit components. Therefore, the heat generated from the FET 20 is preferentially transferred to the heat radiating member 40 via the heat transfer unit 60 and radiated. Therefore, heat can be dissipated more efficiently.

Further, as described above, the electric connection box 100 of the first embodiment is provided with the heat transfer portion 60 in the recess 13. In other words, the operator may apply the material to be the heat transfer portion 60 only in the recess 13. That is, since the range to which the material to be the heat transfer unit 60 should be applied can be visually recognized, the material to be the heat transfer unit 60 can be applied to a suitable place, and the waste of the heat transfer unit 60 can be prevented. Further, the heat transfer unit 60 can be provided in a certain range regardless of the skill level of the operator, and uniform quality can be obtained.

Then, in the electrical connection box 100 of the first embodiment, when the heat radiating member 40 is attached to the case member 50, the convex portion 43 is inserted into the concave portion 13, so that the positioning of the radiating member 40 becomes easy in the attachment.

(Embodiment 2)
The electric junction box 100 according to the second embodiment includes a case member 50, a heat radiating member 40, and a bus bar embedded substrate 10 as in the first embodiment. The electrical junction box 100 of the second embodiment is different from the first embodiment in the configuration of the bus bar embedded substrate 10.

FIG. 7 is a cross-sectional view showing a characteristic portion of the electrical connection box 100 according to the second embodiment. In FIG. 7, for convenience, only the bus bar embedded substrate 10, the heat transfer section 60, and the heat dissipation member 40 are shown.

Similar to the first embodiment, in the bus bar embedded substrate 10, the recess 13 is formed on the non-mounting surface 12. The concave portion 13 has a shape corresponding to the convex portion 43 of the heat radiating member 40.
In the second embodiment, the recess 13 is formed so as to penetrate the layer of the resin 102. That is, in the bus bar embedded substrate 10, the bus bar 101 is exposed from the bottom of the recess 13.

Further, the recess 13 is formed at a position corresponding to the mounting position of the FET 20 on the mounting surface 11. A heat transfer unit 60 is provided in the recess 13, and the heat transfer unit 60 has a higher thermal conductivity than the resin 102 of the bus bar embedded substrate 10.

As shown in FIG. 7, the heat transfer portion 60 is interposed between the heat radiating member 40 (convex portion 43) and the bus bar embedded substrate 10, and both the heat radiating member 40 and the bus bar embedded substrate 10 are in contact with each other. There is.

In particular, in the electrical junction box 100 of the second embodiment, the heat transfer portion 60 is interposed between the convex portion 43 (tip surface 431) of the heat radiating member 40 and the bus bar 101 of the bus bar embedded substrate 10. That is, the heat transfer unit 60 is in contact with the bus bar 101 of the bus bar embedded substrate 10 in the recess 13.

Since the electric junction box 100 of the second embodiment has the above configuration, the heat from the bus bar embedded substrate 10 can be quickly dissipated, and the heat can be prevented from being trapped in the bus bar embedded substrate 10. ..

That is, during the operation of the electrical junction box 100, the heat generated by the circuit component on the mounting surface 11 is directly transferred to the heat transfer unit 60 on the non-mounting surface 12 side via the bus bar 101. The heat transferred to the heat transfer unit 60 is transmitted to the heat radiating member 40 via the convex portion 43, and is radiated into the air via the heat radiating fins 42.

As described above, the bus bar 101 is exposed from the bottom of the recess 13, and the heat transfer portion 60 having a higher thermal conductivity than the resin 102 of the bus bar embedded substrate 10 is in contact with the bus bar 101. Therefore, heat conduction is more likely to occur in the recess 13 than in the resin 102.

Further, also in the electric junction box 100 of the second embodiment, since the recess 13 is formed at a position corresponding to the mounting position of the FET 20 that emits high heat, the heat generated from the FET 20 is preferentially transferred to the heat transfer unit. It is transmitted to the heat radiating member 40 via the 60 and radiated. Therefore, heat can be dissipated more efficiently.

Further, also in the electric connection box 100 of the second embodiment, as in the first embodiment, the range to which the material to be the heat transfer unit 60 should be applied can be visually recognized, so that the material to be the heat transfer unit 60 can be applied to the appropriate place, and the material to be the heat transfer unit 60 can be applied. It is possible to prevent waste of the heat transfer unit 60. Further, the heat transfer unit 60 can be provided in a certain range regardless of the skill level of the operator, and uniform quality can be obtained.

The same parts as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

(Embodiment 3)
The electric junction box 100 according to the third embodiment includes a case member 50, a heat radiating member 40, and a bus bar embedded substrate 10 as in the first embodiment. The electrical junction box 100 of the third embodiment is different from the first embodiment in the configuration of the bus bar embedded substrate 10.

FIG. 8 is a cross-sectional view showing a characteristic portion of the electrical connection box 100 according to the third embodiment. In FIG. 8, for convenience, only the bus bar embedded substrate 10, the heat transfer section 60, and the heat dissipation member 40 are shown.

Similar to the first embodiment, in the bus bar embedded substrate 10, the recess 13 is formed on the non-mounting surface 12. The concave portion 13 has a shape corresponding to the convex portion 43 of the heat radiating member 40, and is formed in the layer of the resin 102 of the bus bar embedded substrate 10. A ridge 131 is provided around the edge of the recess 13. The ridge 131 is projected vertically from the non-mounting surface 12. The inner surface of the ridge 131 is tapered toward the bottom of the recess 13.

Further, the recess 13 is formed at a position corresponding to the mounting position of the FET 20 on the mounting surface 11. A heat transfer unit 60 is provided in the recess 13, and the heat transfer unit 60 has a higher thermal conductivity than the resin 102 of the bus bar embedded substrate 10.

As shown in FIG. 8, the heat transfer portion 60 is interposed between the heat radiating member 40 (convex portion 43) and the bus bar embedded substrate 10 (concave portion 13), and both the heat radiating member 40 and the bus bar embedded substrate 10 are interposed. Also in contact.

Since the electric junction box 100 of the third embodiment has the above configuration, the heat from the bus bar embedded substrate 10 can be quickly dissipated, and the heat can be prevented from being trapped in the bus bar embedded substrate 10. ..

Further, also in the electric junction box 100 of the third embodiment, since the recess 13 is formed at a position corresponding to the mounting position of the FET 20 that emits high heat, the heat generated from the FET 20 is preferentially transferred to the heat transfer unit. It is transmitted to the heat radiating member 40 via the 60 and radiated. Therefore, heat can be dissipated more efficiently.

Further, also in the electric connection box 100 of the third embodiment, since the range to which the material to be the heat transfer portion 60 should be applied can be visually recognized, the material to be the heat transfer portion 60 can be applied to the appropriate place, and the heat transfer portion 60 becomes the heat transfer portion 60. You can prevent wasting materials. Further, the heat transfer unit 60 can be provided in a certain range regardless of the skill level of the operator, and uniform quality can be obtained.

Further, in the electrical connection box 100 of the third embodiment, since the ridge 131 is provided around the edge of the recess 13 as described above, the insertion of the protrusion 43 into the recess 13 is guided by the ridge 131. .. Further, since the inner surface surface of the convex strip 131 is tapered, it becomes easier to insert the convex portion 43 into the concave portion 13.

The same parts as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

In the above, the case where the electric junction box 100 has the heat transfer unit 60 and the heat transfer unit 60 is interposed between the heat radiation member 40 and the bus bar embedded substrate 10 has been described as an example, but the present invention is limited to this. It's not a thing. The heat transfer portion 60 may be omitted so that the convex portion 43 (tip surface 431) of the heat radiating member 40 comes into contact with the bottom of the concave portion 13 of the bus bar embedded substrate 10 or the bus bar 101. In such a case, it is desirable that the heat radiating member 40 is manufactured from an insulating material.

The technical features (constituent requirements) described in the first to third embodiments can be combined with each other, and by combining them, new technical features can be formed.
The embodiments disclosed this time should be considered to be exemplary in all respects and not restrictive. The scope of the present invention is indicated by the scope of claims, not the above-mentioned meaning, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

10 Bus bar embedded board 11 Mounting surface 12 Non-mounting surface 13 Recessed 14 Rectangular plate part 15 Upright part 20 FET
30 Connector 40 Heat transfer member 41 Plate shape part 42 Heat dissipation fin 43 Convex part 44 Pedestal 50 Case member 60 Heat transfer part 100 Electric junction box 101 Bus bar 102 Resin 103 One end 131 Convex 431 Tip surface

Claims (5)

An electrical junction box including a bus bar embedded substrate in which a bus bar is embedded and a heat radiating member covering one surface of the bus bar embedded substrate.
The recess formed on the one surface of the bus bar embedded substrate and
An electrical connection box provided in the recess and provided with a heat transfer portion that comes into contact with the heat dissipation member. The bus bar is exposed from the bottom of the recess.
The electrical connection box according to claim 1, wherein the heat transfer unit has an insulating property and is in contact with the bus bar. The heat radiating member has a convex portion having a shape corresponding to the concave portion.
The electrical connection box according to claim 1 or 2, wherein the convex portion is in contact with the heat transfer portion. The electrical connection box according to any one of claims 1 to 3, wherein a ridge is provided around the edge of the recess. The busbar is covered with resin and
The electrical connection box according to any one of claims 1 to 4, wherein the heat transfer unit has a higher thermal conductivity than the resin.

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