JP3498897B2 - Electronic element sealing package and electronic element sealing structure - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic element encapsulating package for encapsulating an electronic element, and a conductive glass sealing package using conductive glass for the sealing, and the same. The present invention relates to an electronic element encapsulation structure, and particularly, has an electromagnetic shield effect for an electronic element.

[0002]

2. Description of the Related Art Electronic elements, such as crystal oscillators, piezoelectric elements, semiconductor devices, etc., are generally not stored in a package of some form because it is not good to leave them in the state of being directly exposed to the outside air in use. It is used.
After being incorporated in a package, it is actually incorporated in a printed circuit board structure or the like so as to form a part of an electronic circuit. For example, when packaging an electronic element such as a crystal oscillator or a piezoelectric element, a package as shown in FIG. 11 is used.

FIG. 11 shows a ceramic base 11
By packaging some electronic element piece 112 inside the electronic element sealing package 110 composed of 1 and the cap 113 and closing the lid, the electronic element piece 112 housed inside is directly exposed to the external environment. In order to prevent the above-mentioned problem, it is possible to sufficiently secure the function of the electronic element piece 112 even in a bad environment. For example, such a package material is made of a ceramic containing alumina as a main material, and as an electronic element piece housed inside, for example, an electronic element piece such as a crystal oscillator or a piezoelectric element is used.

After being packaged as described above, the sealed electronic element sealing structure is mounted on the printed circuit board structure by solder reflow or the like to form an electronic circuit integrally with other electronic elements. ing. By the way, this type of package is suitable for so-called surface mounting, and moreover, its use is increasing in recent years because it is relatively easy to match the coefficient of thermal expansion with the electronic element piece that is housed and sealed inside.

Briefly explaining FIG. 11, what is drawn between the upper and lower ceramic bases 111 and the cap 113 is an electronic element piece 112 such as a crystal oscillator or a piezoelectric element. Are physically fixed on the ceramic base 111 and electrically connected by the two electrodes 118, 118 provided on the ceramic base 111. With the electronic element piece 112 fixed on the ceramic base 111, a sealing material 114 is formed on the bonding interface between the ceramic base 111 and the cap 113.
Is applied and pressure is applied from above and below, the ceramic base 111 and the cap 113 are completely sealed by the sealing material 114, and the electronic element piece 112 is completely protected from the surrounding environment.

Looking at the conventional packaging generally used for semiconductor devices and the like, this is as shown in FIG. The packaging used for the semiconductor element piece 123 has a structure in which the semiconductor element piece 123 is placed on the lead frame 122, necessary wire bonding 124 is performed, and then sealed with the resin 125 integrally with the lead frame 122. .

The semiconductor device 120 thus completed
Has been the mainstream structure of semiconductor devices since it is highly reliable and inexpensive, but the semiconductor device has been weakened by a minute stress as the performance of the semiconductor device has been improved in recent years. At the same time, the current consumption increases and the heat generation increases, so that the heat cannot be sufficiently escaped by the conventional sealing resin, or the problem such as the adverse effect due to the thermal stress of the sealing resin generated by the heat becomes remarkable. Is becoming.

[0008]

As described above, conventionally, the electronic element piece such as the crystal oscillator, the piezoelectric element, or the semiconductor element piece is the electronic element sealing package or the sealing resin made of the ceramic material. However, in the case of a sealed package using a ceramic material or an electronic element sealing structure, the electronic element piece sealed inside is effectively shielded from an external electromagnetic field. There is a problem that you can not.

[0009] In general, sensitive to such packaging an electronic element pieces used be those which require high-precision operations in a non-normal outside environment i.e. moisture vapor and gases and the like from their Is also a problem, and the effect of the electromagnetic field is a problem. If the electromagnetic field cannot be effectively shielded, the operation of the element may not be guaranteed in some cases.

However, a ceramic package using a ceramic material that has been conventionally used is generally a material that cannot shield electromagnetic waves, that is, a conductive material, so that an electromagnetic field is generated inside the ceramic package. In the case of sealing an electronic element piece that is easily affected by, it was necessary to separately provide a structure for electromagnetic shielding.

Further, in the case of the conventional resin sealing structure for packaging the semiconductor element piece shown in FIG. 12, the electromagnetic field from the outside cannot be effectively shielded like the packaging made of a ceramic material. As mentioned above, even though it is necessary to dissipate heat sufficiently to the outside due to the increase in current consumption, there are cases in which heat is now adversely affected by the problem of heat conductivity of the resin. There is.

In addition, as the density of the semiconductor element pieces enclosed therein becomes higher and higher, it becomes more sensitive to external stress. Therefore, when the whole is closely adhered and sealed with resin. However, there is a problem that the thermal stress or the stress caused by a simple mechanical resin hits the semiconductor element piece.

[0013]

In order to solve the above-mentioned problems, the present invention provides the following conductive glass-sealed package and an electronic element sealing structure using the same. That is, an electronic element sealing package in which a cap made of a conductive material is covered on a ceramic base, and a metal thin film made of gold or silver is formed on the surface of the cap, and a portion where the metal thin film is formed Provided is a package for encapsulating an electronic element, in which a conductive adhesive is provided on the ceramic base, the cap is adhered to the ceramic base, and the cap can be guided to a ground potential through a ground electrode of the ceramic base. .

The electronic element sealing package according to claim 1, wherein the conductive adhesive is conductive glass in which conductive particles made of a metal material are dispersed in a glass component. Also, the cap provides the electronic element encapsulating package according to claim 1, which is made of a metal material or a conductive ceramic material. Further, the ceramic base contains 30 to 70 wt of forsterite in the glass.
% Thermal expansion coefficient of 100 to 150 × 10 ⁻⁷ /
A package for encapsulating an electronic device according to claim 1 , wherein the cap is made of a glass ceramic composite material at ℃ and the cap is made of a nickel-iron alloy.

Further, there is provided an electronic element sealing structure in which a cap made of a conductive material is covered on a ceramic base on which a crystal oscillator piece is arranged, wherein the ceramic base has 30 to 70 wt% of forsterite dispersed in glass. The glass-ceramic composite material having a coefficient of thermal expansion of 100 to 150 × 10 ⁻⁷ / ° C., the cap is made of an iron-nickel alloy, and a metal thin film made of gold or silver is formed on the surface of the cap.
An electronic device capable of introducing a conductive adhesive to the portion where the metal thin film is formed, depositing the cap on the ceramic base, and guiding the cap to the ground potential through the ground electrode of the ceramic base. An element sealing structure is provided.

An electronic element encapsulation structure in which a piezoelectric material element piece as the electronic element is encapsulated in the electronic element encapsulation package according to claim 1 . The base has a substantially rectangular shape, and a substantially rectangular electronic element is fixed at both ends in the longitudinal direction of the base.
An electronic element sealing structure according to claim 4 is provided.

Further, there is provided the electronic element encapsulating package according to any one of claims 1 to 3 , wherein an oxide film is formed on the surface of the cap.

The electronic element encapsulation structure according to any one of claims 4 to 6 , wherein an oxide film is formed on the surface of the cap.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be sequentially described with reference to the drawings in the order of the claims described in the claims. First, the invention according to claim 1 can be described with reference to FIGS. 1 to 7. According to a first aspect of the present invention, there is provided an electronic element sealing package in which a cap made of a conductive material is covered on a ceramic base, and a metal thin film made of gold or silver is formed on the surface of the cap. Conductive particles made of a metal material in the glass component as a conductive adhesive on the part where the thin film is formed
A conductive glass in which a child is dispersed is disposed, the cap is attached to the ceramic base, and the cap can be guided to the ground potential through the ground electrode of the ceramic base. It is a package.

The invention described in claim 1 is shown in FIGS. 1 and 2 by using typical drawings. FIG. 1 shows a state in which a flat plate-shaped cap 12 made of a conductive material is covered on a ceramic base 11, and a part of the cap 12 is broken so that the inside can be seen. The feature of the present invention is that the cap itself is made of a conductive material, and the surface of the cap 12 is previously made of gold or silver when the cap 12 and the ceramic base 11 are bonded together. The metal thin film 13 is formed, and the conductive adhesive 14 is arranged on the portion where the metal thin film 13 is formed, or the cap 12 is adhered onto the ceramic base 11 so as to be arranged. There is a point.

First, the cap 12 is made of a conductive material, but the cap 12 is made of a conductive material because the conductive material has an electromagnetic shielding effect. Therefore, since the cap 12 covers the entire electronic element piece 16 arranged on the ceramic base 11, even if electromagnetic waves are applied to the electronic element piece 16 from the outside, particularly from the upper surface side, the cap 12 Thus, the electromagnetic wave is not shielded and the electronic element piece 16 arranged on the ceramic base 11 is not adversely affected.

Further, in order to effectively provide the cap 12 with an electromagnetic shielding effect, the material of the cap 12 is not only made of a conductive material, but the cap 12 has the ground electrode 15 which the ceramic base 11 has. It is also characterized in that it is led to the ground potential via the. When the electromagnetic wave hits the cap when it is guided to the ground potential in this way, the state of the cap 12 can be always kept at zero potential, so that electromagnetic shielding can be effectively performed.

A further feature of the present invention is the cap 12
That is, the metal thin film 13 is formed in the bonding portion between the ceramic base 11 and the ceramic base 11. Generally considered, the ground electrode 15 and the cap 12 formed on the ceramic case 11.
It seems that it suffices to adhere the above with a conductive adhesive 14 and to apply the cap 12 on the ceramic base 11, but in reality, the cap 12 made of a conductive material is easily oxidized and therefore the actual conductive adhesive is used. An oxide film is formed on the surface on which the agent 14 is adhered although it is thin, and the resistance value of the connection between the ground electrode 15 formed on the ceramic base 11 and the cap 12 becomes large due to the formation of this oxide film. There is.

If the resistance value is large, the cap 12 cannot be entirely guided to zero volt, that is, the ground potential, and the electromagnetic shielding ability is affected. For example, when the metal thin film made of gold or silver is not formed on the surface of the cap as in the invention described in claim 1, the resistance value between the ground electrode and the cap is 10 ohm to several 1
Although it is about 0 ohm, when a metal thin film made of gold or silver is formed on the portion of the cap where the conductive adhesive is disposed as in the present invention, the resistance value can be lowered to 1 ohm or less. You can do it.

As the metal thin film made of gold or silver, it is conceivable to form the thin film by using, for example, silver paste or gold paste. The gold paste or silver paste can be placed on the cap by a method such as screen printing, or can be placed by a method of dropping little by little instead of screen printing. When a gold or silver paste is used, the temperature can be raised to about 400 ° C. to remove the solvent and form a gold or silver thin film.

It is to be noted that the metal thin film made of gold or silver referred to here only needs to contain such a material. For example, even if it is made of a silver-palladium alloy, gold and other metals are not included. It goes without saying that it may be a mixture of By forming a metal thin film made of gold or silver on the portion of the cap where the conductive adhesive is arranged, the resistance value of the joint portion can be lowered. Related to the mechanism of conduction between.

The conductive adhesive contains fine particles of metal such as fine particles of silver. The fine particles made of metal are indispensable for the conductive adhesive to be conductive. Plays. However, when an oxide film is formed on the surface of the joint portion of the cap, which is thin, when the cap is made of a conductive material, it is made of metal such as silver contained in the conductive adhesive. There is a phenomenon in which the non-conductive material having good compatibility with the oxide is concentrated on the surface of the cap without the fine particles of (3) being deposited on the cap side.

Therefore, the metal particles contained in the conductive adhesive do not appear on the interface side of the cap, so that the conductivity becomes low. Of course, this does not mean that the metal particles contained in the conductive adhesive do not exist on the cap side at all, but the metal particles contained in the conductive adhesive are converted to the cap side by oxidizing the surface of the cap in this way. The proportion that exists is reduced.

However, when a metal thin film made of gold or silver is formed on the surface of the cap as in the present invention, these metal thin films are difficult to oxidize or have good compatibility with silver particles contained in the conductive adhesive. When the conductive adhesive is applied to the metal particles, the metal particles contained in the conductive adhesive are distributed in such a manner that they are in sufficient contact with the cap side.

Therefore, even if the cap is placed in an environment where it is oxidized, that part is not oxidized, or the same metal as the silver particles contained in the conductive adhesive is present. As a result, the metal particles in the conductive adhesive become more compatible with the cap, and the resistance value between the ground electrode and the cap of the ceramic base can be greatly reduced.

FIG. 2 also shows the ceramic base 21 and the cap 2.
The electronic element differently encapsulating package 20 has the electronic element piece 26 disposed between the two, and basically has the same structure as that of FIG. The difference from that of FIG. 1 is the arrangement of the ground electrode. In FIG. 1, the ground electrode 15 exists from the short side of the ceramic base 11 to the outside and extends to the printed circuit board structure side. In the case of FIG. 2, however, the recess 2 is formed on the side surface of the ceramic base 21.
7 is provided, the inside of the recess 27 is covered with a metal material, and this portion is used as the ground electrode 25.

FIG. 3 shows a state in which the electronic element sealing package as shown in FIGS. 1 and 2 or the electronic element sealing structure 31 using the same is arranged on the printed circuit board 30. It is a thing. Even if there are parts that generate strong electromagnetic waves in the surroundings when arranged on the printed circuit board as described above, it is necessary to provide another shielding mechanism because the cap is conductive. Without this, it is possible to electromagnetically shield the electronic element piece inside the electronic element sealing package.

The one shown in FIGS. 4A and 4B is shown in FIG.
3A and 3B show other examples 40a and 40b of the electronic element sealing package shown in FIG. In this case, the caps 42a and 42b are shaped like a lid of a lunch box, unlike those of FIGS. 1 and 2, but in any case, the caps 42a and 42b have gold or gold on their inner or outer surfaces. Since the metal thin films 42af, 42bf made of silver are formed and guided to the ground electrodes 45a, 45b of the ceramic bases 41a, 41b by the conductive adhesives 44a, 44b, they have a sufficiently good electromagnetic shielding effect.

Even when a bulky electronic element is housed inside by thus forming the lunch box as a lid, a cap can be provided so as to enclose the entire electronic element, so that electromagnetic shielding is provided. The effect is great. Figure 4 (a)
Shows the metal thin film 42af on the inner surface of the cap 42a.
4B, the metal thin film 42bf is formed on the outer surface of the cap 42b.

In any case, metal thin films 42af and 42bf made of gold or silver are formed on the surfaces of the caps 42a and 42b, and the conductive adhesive 4 is formed on the portions where the metal thin films are formed.
4a and 44b are arranged so that the caps 42a and 42b are attached to the ceramic bases 41a and 41b, and the caps 42a and 42b can be guided to the ground potential via the ground electrodes 45a and 45b of the ceramic bases. Therefore, the ground electrode 45 is
The resistance value between a and 45b and the caps 42a and 42b can be made extremely small, specifically 1 ohm or less, and a large electromagnetic shielding effect can be realized.

FIG. 5 simply shows the manufacturing process of this ceramic base. As described above, heat is a problem when a semiconductor element is sealed with a resin mold or the like. However, when the semiconductor element is sealed in such a ceramic package, a ceramic having a high thermal conductivity is used. By using the material, the heat generated by the semiconductor element piece is effectively removed to the outside to ensure the function of the semiconductor element piece.

The case of manufacturing such a ceramic package base using alumina, for example, will be briefly described. That is shown in FIG. With the progress of IC devices, it has become necessary to increase the density of wiring circuits, prevent heat generation, and protect from changes in temperature and humidity and dust from the substrates, and combined devices such as multilayer substrates, IC packages, and piezoelectric devices. Although packaging has evolved, the present invention is a further improvement thereof, and the ceramic base material can be manufactured using the green sheet method.

The green sheet method is one in which a conductor paste is printed on a glass, ceramic, or alumina green sheet prepared by the doctor blade method, which is laminated and fired together. It is a method of manufacturing a multilayer circuit board or a ceramic base having a multilayer circuit, which is extremely reliable for LSIs, VLSIs, and elements requiring higher reliability.

Although the ceramic base produced by this method has many characteristics, the first point is that high density wiring is possible because it is easy to stack a large number of sheets having fine wiring. . Therefore, the ceramic base of this electronic element encapsulation package can be easily accommodated by arranging the ceramic base in a multi-layer manner.

Secondly, since the insulating substrate and the conductor are produced by simultaneous firing, there is an advantage that the integration is complete and the reliability is high. The basic manufacturing process of a ceramic body such as a multilayer circuit board by the green sheet method will be described. First, raw material powder, flux, organic binder, solvent and plasticizer are thoroughly mixed in a ball mill to form a slurry. The slurry is spread on a carrier tape with a blade and dried to obtain a green sheet.

This green sheet has a thickness of 0.1-1.
The thickness is about 0 mm, and the thickness can be adjusted as necessary. A conductor paste made of metal powder is screen-printed on this green sheet. This conductor paste serves as an electrode material, and more specifically, the ground electrode is also formed by this method. There are three methods of multilayering in the green sheet method: sheet lamination, printing multilayer and both methods in combination, and the sheet lamination method is often used.

According to the sheet stacking method, a ceramic base body is manufactured by punching holes in a green sheet with a die or a microdrill, filling a conductive paste therein, stacking a plurality of patterns-printed ones, and firing them. To be done. As a general specification of the ceramic base manufactured by such a sheet lamination method, the wiring material is silver, silver palladium, or copper, and the minimum line width is 0.08 mm.
The minimum wiring line spacing is about 0.1 mm, the minimum through hole diameter is about 0.1 mm, and the minimum through hole pitch is about 0.25 mm.

As the material of the material powder that has been conventionally used, alumina having a good thermal conductivity of about 90 to 94% is used, the thermal expansion coefficient is 75 × 10 ⁻⁷ / ° C., and the dielectric constant is 8. 5. The specific resistance is about 10 ¹⁴ Ω / cm. The maximum number of sheets that can be laminated in this way is 45
Although the number of layers is possible, if such a ceramic package has at most about 10 layers, it is possible to manufacture a ceramic package with a sufficiently high density, that is, an electronic element sealing package.

The process of integrating a plurality of green sheets will be explained as shown in FIG. Generally, the low temperature isotropic consolidation molding, so-called CIP method is used. In the CIP method, the laminated green sheets that are the original material are put in a rubber bag and put in a pressure transmission liquid (pure viscous liquid) that is placed in a compression container and the transmission liquid is compressed. Then, the raw material powder in the bag is isotropically compressed and consolidated by the Pascal pressure generated in the transfer liquid.

Since it is clamped isotropically from all sides by Pascal pressure, higher isotropic pressure and higher density homogeneous compression can be achieved as compared with the case of uniaxial consolidation. Therefore, it is possible to obtain a high-density formed body excellent in retention formation, and it is the most suitable as a method for manufacturing a ceramic base for encapsulating electronic elements.

In this method, first, a ceramic sheet is punched into a desired shape into a green sheet 60 and pattern-printed green sheets 61 and 62 are processed.
A process of stacking these green sheets 61 and 62 to form a laminated body 63, and the laminated body 63 is covered with a vinyl bag 64.
From the step of putting in and packaging, the step of vacuuming the vinyl bag 64 in which the green sheet laminated body 63 is put and packaged, the step of bringing the vinyl bag 64 into close contact with the green sheet laminated body 63, and the step of performing isotropic pressing Has become.

In addition to the low temperature isotropic consolidation forming, there is one using high temperature isotropic consolidation forming, so-called HIP, but the principle is the same. The reason why the low temperature isotropic consolidation is performed is to soften the binder contained in the sheet by performing an isotropic press and to bond the green sheets with the softened binder to complete the ceramic body. Conventionally, as described above, low temperature isotropic consolidation molding has been mainly performed in the molding of the green sheet, but the present inventors have also found an optimal method for forming the ceramic base.

In this method, the ceramic sheets 61, 62 are
It is not necessary to repeat the steps of accurately stacking and wrapping in a vinyl bag 64 and evacuating several times.
It is also possible to avoid the problem that a large amount of waste is generated. That is, it is a method for manufacturing a ceramic body formed by stacking green sheets 61 and 62, and a step of applying a solvent that dissolves the binder contained in the green sheets 61 and 62 to the stacking surface of the green sheets, and applying this solvent. A method of manufacturing a ceramic base comprising a step of stacking the stacked green sheets, a step of pressing the stacked green sheets to integrate them, and a step of firing the pressed green sheets.

Regarding such a method, the application of the solvent can be carried out by bringing a wet mesh sheet into close contact with the laminated surface of the green sheet, or by spraying solvent vapor onto the laminated surface. Further, in the step of pressing and integrating the laminated green sheets, it is preferable that the pressing pressure is 1 kg / cm ² or more and 10 kg / cm ² or less. In addition, 3 in the one-way press
Bonding is possible around 0 to 50 kg / cm ² 100 ° C. Also, low-pressure bonding is possible by reviewing the plasticizer in the green sheet.

The binder can be designed by polyvinyl butyral, and the solvent can be designed by an appropriate combination of methanol, ethanol, isopropyl alcohol and N-butanol. The solvent may be a combination of cyclohexanone and isophorone, polyvinyl butyral as the binder, and N—N dimethylformamide as the solvent. As described above, the present inventors have found an inexpensive and reliable manufacturing method for a ceramic base in an electronic element sealing package.

Next , gold is used as a conductive adhesive in the glass component.
Conductive glass in which conductive particles made of a metal material are dispersed
A brief description will be given of the use of the space. Generally, the first conceivable conductive sealant is an organic sealant, but some binders in the organic sealant generate gas when the temperature rises, Such a gas may adversely affect the electronic device piece sealed in the sealing package.

Therefore, glass is considered as a material that does not generate such a gas, and a conductive adhesive in which conductive particles are dispersed in the glass is suitable as the conductive adhesive according to claim 1. It can be said that it is a thing. This is shown in FIGS. 7A and 7B. The point is that the metal particles 72 and the metal particles 72 in the conductive adhesive 70 composed of the glass binder 73 may be continuously connected. As a result, as shown in FIG. 8, electricity can flow to the portion where the metal particles 82 in the conductive adhesive 80 are continuous, and as a result, the cap can be guided to the ground potential. Incidentally, if the binder in the conductive adhesive is made of an organic type, it may be used if no problem occurs.

As the organic sealing agent of this type, a polyimide type and an epoxy type are preferable. The polyimide-based material is preferably a conductive polyimide sealant containing silver particles, and as a general property, it can be cured at about 150 ° C to 300 ° C, and the operating temperature range is -55 ° C to 35 ° C.
℃, maximum continuous use temperature is about 200 ℃, die shear adhesive strength is 205 kg at 25 ℃, 170 at 150 ℃
About 150 kg at 300 ° C. and 70 kg at 350 ° C. can be realized.

Further, the volume resistivity formed with a sufficiently high density can realize about 0.0001 to 0.0002 Ωcm. Therefore, when the die shear strength is about this level and the volume resistivity is about this level, the electronic element piece, which is the object of the present invention, can be sufficiently effectively shielded from the external electromagnetic field.

Further, if it has such a mechanical strength, it has a sufficient strength even when it is surface-mounted on a printed circuit board, and it is put in a high temperature furnace together with other electronic parts and the like, and a soldering step and other steps. There is no particular problem when passing through. The characteristics of the epoxy-based sealant are basically the same as those of the polyimide-based sealant, but the curing loss is so-called TGA.
Is smaller than a polyimide-based sealant and generally has the following characteristics.

That is, the curing conditions are about 120 ° C. to 200 ° C., the operating temperature range is about −55 ° C. to 150 ° C., and the die shear adhesive strength at 25 ° C. is 380 kg and 150 ° C., respectively.
It is 84 kg and 35 kg at 350 ° C. Further, since it is formed with a sufficiently high density, the volume resistivity is as low as about 0.0002 Ωcm. Such an organic conductive adhesive is arranged on a predetermined portion of a ceramic base of a ceramic package made of a ceramic body by various methods such as screen printing, dispenser or stamping. It goes without saying that the cap may be arranged not on the ceramic base but on the part of the cap where the metal thin film is formed.

Next, the invention described in claim 2 will be described. Billing invention according to claim 2 wherein the cap as described above, made of a metal material or a conductive ceramic material
Item 2. The electronic element encapsulating package according to Item 1 . As a material for the conductive cap, a metal material is generally conceived, but it is also possible to use a ceramic material other than the metal material, which is conductive.

When a conductive ceramic material is used in this way, the shape of the cap is relatively easy to process, and a bulky cap 92 as shown in FIG. When it is necessary to protect the electronic element piece 93 with the cap 92, the electronic element piece 93 is arranged vertically as shown in FIG. 9, and the entire electronic element piece 93 is accommodated by the cap 92. Such an electronic element sealing package 90 may be used.

Next, the invention according to claim 3 will be described. In the invention according to claim 3, as described above, the ceramic base contains forsterite in a glass of 30 to 70 w.
Coefficient of thermal expansion dispersed by t% is 100 to 150 × 10 ⁻⁷
The electronic element encapsulating package according to claim 1 , wherein the cap is made of a glass ceramic composite material of / ° C and the cap is made of a nickel-iron alloy. The features of the invention according to claim 3 are that the so-called glass-ceramic composite material is used as the ceramic-based material and the nickel-iron alloy is used as the cap material.

Since the coefficient of thermal expansion can be made relatively high by using the glass ceramic material as described above, it becomes possible to match the coefficient of thermal expansion of this ceramic base with the coefficient of thermal expansion of, for example, a crystal oscillator piece. Further, when a nickel-iron alloy is used as the material of the cap, it has an extremely high electromagnetic shielding performance, so that even if a thin cap is used, an effective electromagnetic shielding performance can be secured.

Next, the invention according to claim 4 will be described. Claim
As described above, the invention of Item 4 is an electronic element sealing structure in which a cap made of a conductive material is covered on a ceramic base on which a crystal oscillator piece is arranged, and the ceramic base is forsterite in glass. 30-70 wt%
The dispersed thermal expansion coefficient is 100 to 150 × 10 ⁻⁷ / ° C.
Of the glass-ceramic composite material, the cap is made of an iron-nickel alloy, and a metal thin film made of gold or silver is formed on the surface of the cap. An electronic element encapsulation structure, which is attached to a base and can lead the cap to a ground potential through a ground electrode of the ceramic base.

[0062] The invention of claim 4, wherein the is the optimum crystal oscillator when a obtained by more specifically the invention of claim 3, wherein based on glass-ceramic composite materials containing false Terai bets Therefore, it is limited to the ceramic base on which the crystal unit is arranged.

Next, the invention according to claim 5 will be described. The invention described in claim 5 is the electronic element sealing structure in which the piezoelectric element sealing element as the electronic element is sealed in the electronic element sealing package described in claim 1 as described above. Claim
The invention described in claim 5 claims the invention described in claim 1 in which an actual electronic element piece is sealed to form an electronic element sealing structure.

Next, the invention according to claim 6 will be described. The invention according to claim 6 is the electronic element sealing structure according to claim 4 , wherein the base is substantially rectangular as described above, and the substantially rectangular electronic element is fixed at both ends in the longitudinal direction thereof.
In this way, when the electronic element arranged on the ceramic base is fixed at both ends, that is, when the electronic element sealing structure is actually subjected to the heating step as shown in FIG. The thermal stress generated in the internal electronic device becomes a problem. That is, since the thermal expansion coefficient is generally different between that of the electronic element piece and that of the ceramic base, thermal stress is applied to the electronic element piece due to the difference in the thermal expansion coefficient .

Since this thermal stress adversely affects the electronic element piece, the thermal stress should be as small as possible. Therefore, as a material for such a ceramic base, the glass-ceramic composite is used as described above. When the glass-ceramic composite is used as described above, the electronic element piece 102 is fixed even at the electronic element sealing package 100 in which the electronic element piece 102 is fixed at both ends as shown in FIG.
Since the coefficient of thermal expansion of the ceramic base 101 and that of the ceramic base 101 match, thermal stress will not be applied to the electronic element piece 102 more than necessary. It does not impair the performance of.

Next, the invention according to claims 7 and 8 will be described. As described above, the invention according to claim 7 is such that an oxide film is formed on the surface of the cap .
3 is a package for encapsulating an electronic element according to any one of 3 above. The invention according to claim 8 is the electronic element sealing structure according to any one of claims 4 to 6 , wherein an oxide film is formed on the surface of the cap as described above. Thus, even if an oxide film is formed on the surface of the cap, by forming a metal thin film thereon, uneven distribution of metal particles contained in the conductive adhesive is prevented, and the cap and the ground electrode of the ceramic package are A low resistance value in between can be realized.

Therefore, even when the oxide film is formed on the surface of the cap as described in claim 7 or claim 8, the electronic element sealing structure or the electronic element sealing package having a sufficient electromagnetic shielding effect is obtained. Can be realized. Especially when it is necessary to form an oxide film on the surface of the cap, for example, when the oxide film is formed to protect the metal cap or the conductive cap from the external environment, the cap surface is joined. Although it is essential, it can be said that the feature of the invention of claim 7 or claim 8 is that the electromagnetic shielding performance is not impaired even in such a case.

[0068]

EFFECTS OF THE INVENTION As described above, claims 1 to 8
According to the described invention, a cap made of a conductive material is used to seal this on a ceramic base, and in particular, when a conductive adhesive is used to seal the ground electrode of the ceramic base, a metal is applied to the portion of the cap. Since the thin film is formed, a very small connection resistance can be realized and sufficient electromagnetic shielding can be realized. Further, since the electronic element piece is sealed on the ceramic base, there is no problem of heat, and thermal stress is not accumulated in the electronic element piece accommodated inside by adjusting to a specific coefficient of thermal expansion. A sealing package and an electronic element sealing structure are realized.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view of an embodiment of an electronic element sealing package of the present invention.

FIG. 2 is a partially cutaway perspective view of another embodiment of the electronic element sealing package of the present invention.

FIG. 3 is a perspective view showing a state in which the electronic element sealing structure of the present invention is arranged on a printed circuit board.

FIG. 4 is a side sectional view showing another embodiment of the electronic element sealing package of the present invention.

FIG. 5: Manufacturing process diagram of ceramic base

[Figure 6] Process diagram for integrating green sheets

FIG. 7 is a conceptual diagram showing the configuration of a conductive adhesive.

FIG. 8 is a conceptual diagram showing a mechanism for conducting a conductive adhesive.

FIG. 9 is an exploded perspective view of an electronic element sealing package showing storage of an electronic element piece by a bulky cap.

FIG. 10 is a front view showing thermal stress when the electronic element piece is fixed at both ends.

FIG. 11 is a side sectional view of a conventional semiconductor device.

FIG. 12 is an exploded perspective view of a conventional electronic element sealing package.

[Explanation of symbols]

10, 20, electronic element encapsulation package 31 Electronic element sealing structure 41a, 41b, 91, 101 Ceramic base 42a, 42b, 92 caps 42af, 42bf Metal thin film 14,44a, 44b Conductive adhesive 45a, 45b Ground electrode 72,82 conductive particles

Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 23/04 H03H 9/02

Claims (8)

(57) [Claims] 1. A package for electronic device encapsulation, comprising a ceramic base and a cap made of a conductive material, wherein a metal thin film made of gold or silver is formed on the surface of the cap, and the metal thin film is formed. The part that has been made of a conductive adhesive is made of a metallic material in the glass component.
A conductive glass in which particles are dispersed is disposed, the cap is applied to the ceramic base, and the cap can be guided to the ground potential through the ground electrode of the ceramic base. package. 2. The package for encapsulating an electronic element according to claim 1 , wherein the cap is made of a metal material or a conductive ceramic material. 3. The ceramic base is made of a glass-ceramic composite material in which forsterite is dispersed in glass in an amount of 30 to 70 wt% and has a thermal expansion coefficient of 100 to 150 × 10 ⁻⁷ / ° C., and the cap is made of a nickel iron alloy. The package for encapsulating an electronic element according to claim 1 . 4. An electronic device sealing structure body covered with a cap located on the ceramic base arranged a crystal oscillator piece, the ceramic base was 30 to 70 wt% dispersed forsterite in glass heat Expansion coefficient is 10
The cap is made of a glass-ceramic composite material of 0 to 150 × 10 ⁻⁷ / ° C., the cap is made of an iron-nickel alloy, and a metal thin film made of gold or silver is formed on the surface of the cap. An electronic element encapsulation structure in which an adhesive is disposed and the cap is adhered to the ceramic base, and the cap can be guided to a ground potential via a ground electrode of the ceramic base. 5. The electronic element sealing structure body sealing the piezoelectric material element as the electronic element to an electronic device package for sealing according to claim 1. 6. The base is generally rectangular, claim 4 for fixing the electronic elements substantially rectangular in a longitudinal direction at both ends
The electronic element encapsulating structure as described in 1. 7. The electronic device package for sealing according to any one of claims 1 to 3 oxide film is formed on the surface of the cap. 8. The electronic element encapsulating structure according to claim 4 , wherein an oxide film is formed on the surface of the cap.