JP3491639B2 - Method of manufacturing metal film supply body for multilayer ceramic electronic component, method of manufacturing metal film ceramic integrated green sheet supply body, and method of manufacturing multilayer ceramic electronic component - Google Patents
Method of manufacturing metal film supply body for multilayer ceramic electronic component, method of manufacturing metal film ceramic integrated green sheet supply body, and method of manufacturing multilayer ceramic electronic componentInfo
- Publication number
- JP3491639B2 JP3491639B2 JP19834593A JP19834593A JP3491639B2 JP 3491639 B2 JP3491639 B2 JP 3491639B2 JP 19834593 A JP19834593 A JP 19834593A JP 19834593 A JP19834593 A JP 19834593A JP 3491639 B2 JP3491639 B2 JP 3491639B2
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- ceramic
- electronic component
- supply body
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Physical Vapour Deposition (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、積層セラミック電子部
品において例えば内部電極として用いられる金属膜を転
写により供給することを可能とする金属膜支持体の製造
方法に関し、特に、この金属膜を積層セラミック電子部
品の内部電極として用いた際に、焼成の際のデラミネー
ションの発生を有効に防止することのできる金属膜供給
体の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the production of a metal film support capable of transferring a metal film used as, for example, an internal electrode in a laminated ceramic electronic component by transfer.
More particularly, the present invention relates to a method for producing a metal film supply body capable of effectively preventing the occurrence of delamination during firing when the metal film is used as an internal electrode of a laminated ceramic electronic component.
【０００２】[0002]
【従来の技術】従来、積層セラミック電子部品に用いら
れる焼結体は、セラミックグリーンシート上に金属ペ
ーストを印刷することにより内部電極パターンを形成
し、しかる後、内部電極の印刷されたセラミックグリー
ンシートを積層して得られた積層体を焼成する方法、あ
るいは積層ステージ上において、セラミックグリーン
シートの成形と、導電ペーストのパターン印刷とを繰り
返すことにより、積層体とし、これを焼成する方法等に
より製造されている。2. Description of the Related Art Conventionally, a sintered body used for a laminated ceramic electronic component has an internal electrode pattern formed by printing a metal paste on a ceramic green sheet, and then the ceramic green sheet having the internal electrode printed thereon. Manufactured by a method of firing a laminated body obtained by laminating, or a method of firing a ceramic green sheet and a conductive paste pattern printing repeatedly on a laminating stage to form a laminated body and firing this. Has been done.
【０００３】近年、積層セラミック電子部品において、
薄型化及び小型化が進行している。それにともなって、
金属ペーストを用いて内部電極を形成する方法では、焼
成後の内部電極の厚みに対し、塗布時の金属ペーストの
厚みが大きいため、すなわち焼成前後における内部電極
の寸法変化が無視できなくなってきており、品質の高い
積層セラミック電子部品を得ることが困難になってきて
いる。また、焼成前の積層体を得る段階において、内部
電極の形成されている部分と、そうでない部分とで厚み
にばらつきが生じたり、内部電極の位置ずれが生じたり
し易かった。In recent years, in multilayer ceramic electronic parts,
Thinning and miniaturization are in progress. Along with that,
In the method of forming the internal electrodes using the metal paste, the thickness of the metal paste during coating is larger than the thickness of the internal electrodes after firing, that is, the dimensional change of the internal electrodes before and after firing cannot be ignored. It has become difficult to obtain high quality monolithic ceramic electronic components. In addition, in the step of obtaining the laminated body before firing, it was easy for the thickness of the portion where the internal electrodes are formed and for the portion where the internal electrodes were not formed to vary, and for the internal electrodes to be displaced.
【０００４】そこで、焼成前後における内部電極の寸法
変化、特に厚みの変化を低減するため、金属ペーストで
はなく、薄膜形成法により形成された金属膜により内部
電極を構成して積層体を得る方法が提案されている（特
開昭６４−４２８０９号公報）。この方法では、薄膜形
成法により形成された厚みの薄い金属膜が内部電極に用
いられている。従って、焼成に先立って得られた積層体
における厚みのばらつきや内部電極の位置ずれ等を抑制
することができる。Therefore, in order to reduce the dimensional change of the internal electrodes before and after firing, especially the change of the thickness, there is a method of forming the internal electrodes by a metal film formed by a thin film forming method instead of a metal paste to obtain a laminated body. It has been proposed (Japanese Patent Laid-Open No. 64-42809). In this method, a thin metal film formed by a thin film forming method is used for the internal electrodes. Therefore, it is possible to suppress variations in the thickness of the laminate obtained before firing and displacement of the internal electrodes.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、薄膜形
成法により形成された金属膜表面は、金属ペーストを印
刷して形成される金属膜よりも平面が平滑であるため、
セラミック層と内部電極との接合力が従来よりも弱くな
り、デラミネーションが従来よりも発生し易いという問
題があった。However, since the surface of the metal film formed by the thin film forming method is flatter than the metal film formed by printing the metal paste,
There is a problem that the bonding force between the ceramic layer and the internal electrode becomes weaker than in the past and delamination is more likely to occur than in the past.
【０００６】本発明の目的は、このような従来の問題点
を解消し、薄膜形成法により形成された金属膜を内部電
極等として用いた場合に、セラミック層と内部電極等と
の接着性を向上させることができ、焼成の際のデラミネ
ーションの発生を防止することのできる金属膜供給体の
製造方法及び金属膜セラミック一体化グリーンシート供
給体の製造方法並びに積層セラミック電子部品の製造方
法を提供することにある。The object of the present invention is to solve the above-mentioned conventional problems and to improve the adhesiveness between the ceramic layer and the internal electrodes when the metal film formed by the thin film forming method is used as the internal electrodes. Of a metal film supply body that can be improved and can prevent the occurrence of delamination during firing .
Preparation and manufacturing side of the laminated ceramic electronic component manufacturing method and a metal film ceramic integrated green sheet supplying member
To provide the law .
【０００７】[0007]
【課題を解決するための手段】請求項１に記載の発明の
金属膜供給体の製造方法は、支持体上に転写用の金属膜
が形成された金属膜供給体を製造する方法であり、支持
体上に薄膜形成法により第１の金属層を形成し、該第１
の金属層の上に複合メッキ法によりセラミック粒子を含
有する第２の金属層を形成することにより、第１の金属
層と第２の金属層からなる金属膜を支持体上に形成する
ことを特徴としている。 Method for producing a metal film supply member of the invention described in claim 1 SUMMARY OF THE INVENTION is a process for producing a metal film supply member on which the metal film to be transferred is formed on the support, support
Forming a first metal layer on the body by a thin film forming method,
Of ceramic particles on the metal layer of
Forming a second metal layer having a first metal
It is characterized that you form a metal film comprising a layer and a second metal layer on a support.
【０００８】また、請求項２に記載の発明の金属膜供給
体の製造方法は、金属膜の金属層中のセラミック粒子含
有量が０．１〜５０体積％であることを特徴としてい
る。請求項３に記載の発明の金属膜セラミック一体化グ
リーンシート供給体の製造方法は、請求項１に記載の発
明の金属膜供給体の金属膜の上にセラミックグリーンシ
ートを形成することを特徴としている。The method for producing a metal film supply body according to the second aspect of the invention is characterized in that the content of the ceramic particles in the metal layer of the metal film is 0.1 to 50% by volume. Method for producing a metal film ceramic integrated green sheet supply member of the invention described in claim 3, characterized that you form a ceramic green sheet on the metal film of the metal film supply member of the invention described in claim 1 I am trying.
【０００９】請求項４に記載の発明の積層セラミック電
子部品の製造方法は、請求項３に記載の金属膜セラミッ
ク一体化グリーンシート供給体から金属膜とともにセラ
ミックグリーンシートを転写して積層し焼結することを
特徴としている。According to a fourth aspect of the present invention, there is provided a method of manufacturing a laminated ceramic electronic component , wherein the ceramic green sheet is transferred together with the metal film from the metal film / ceramic integrated green sheet supply body of the third aspect, laminated and sintered. that
It is with the features.
【００１０】[0010]
【作用及び発明の効果】請求項１に記載の発明では、支
持体上に薄膜形成法により第１の金属層を形成し、該第
１の金属層の上に複合メッキ法によりセラミック粒子を
含有する第２の金属層を形成することにより、第１の金
属層と第２の金属層からなる金属膜を支持体上に形成し
ている。第２の金属層中のセラミック粒子は、セラミッ
ク層を焼結する際セラミック層と焼結し接合を形成す
る。このため、セラミック層と金属層の間のデラミネー
ションの発生が防止され、耐クラック性を向上させるこ
とができる。またセラミック層と金属膜との間に隙間が
形成されないため、電気特性の向上も期待することがで
きる。 [Effect of the action and the Invention In the invention according to claim 1, Branch
A first metal layer is formed on the carrier by a thin film forming method, and the first metal layer is formed.
Ceramic particles on the first metal layer by the composite plating method
By forming a second metal layer containing the first gold
A metal film consisting of a metal layer and a second metal layer is formed on the support.
ing. The ceramic particles in the second metal layer sinter with the ceramic layer to form a bond when sintering the ceramic layer. Therefore, the occurrence of delamination between the ceramic layer and the metal layer is prevented, and the crack resistance can be improved. Further, since no gap is formed between the ceramic layer and the metal film, improvement in electrical characteristics can be expected .
【００１１】請求項２に記載の発明では、第２の金属層
のセラミック粒子含有量を、０．１〜５０体積％として
いる。セラミック粒子含有量が０．１体積％未満である
と、セラミック層とセラミック粒子との間の焼結による
接合が少なくなり、デラミネーションの発生の防止が充
分でない場合がある。またセラミック粒子含有量が５０
体積％を超えると、金属膜としての本来の機能、例え
ば、内部電極としての機能が損なわれる場合がある。According to the second aspect of the invention, the content of the ceramic particles in the second metal layer is 0.1 to 50% by volume. When the content of the ceramic particles is less than 0.1% by volume, the bonding between the ceramic layer and the ceramic particles due to sintering is reduced, and the occurrence of delamination may not be sufficiently prevented. The ceramic particle content is 50
When it exceeds the volume%, the original function as a metal film, for example, the function as an internal electrode may be impaired.
【００１２】請求項３に記載の発明では、請求項１に記
載の金属膜供給体の上にセラミックグリーンシートを形
成し、金属膜セラミック一体化グリーンシート供給体と
している。このような金属膜セラミック一体化グリーン
シート供給体を用い、支持体を剥離しながら金属膜とと
もにセラミックグリーンシートを転写して積層し焼結す
ることにより、焼成の際のデラミネーションが有効に防
止された積層セラミック電子部品を得ることができる。According to a third aspect of the invention, a ceramic green sheet is formed on the metal film supply body according to the first aspect to form a metal film ceramic integrated green sheet supply body. By using such a metal film / ceramic integrated green sheet supplier, the ceramic green sheet is transferred, laminated and sintered together with the metal film while peeling the support, so that delamination during firing is effectively prevented. It is possible to obtain a laminated ceramic electronic component.
【００１３】請求項４に記載の発明の積層セラミック電
子部品は、このように請求項３に記載の発明の金属膜セ
ラミック一体化グリーンシート供給体から得られるもの
であり、焼成の際のデラミネーションが有効に防止され
耐クラック性に優れた積層セラミック電子部品である。The monolithic ceramic electronic component according to the fourth aspect of the present invention is obtained from the metal film / ceramic integrated green sheet supply body according to the third aspect of the invention as described above, and the delamination during firing is performed. Is a multilayer ceramic electronic component that is effectively prevented and has excellent crack resistance.
【００１４】[0014]
【実施例の説明】以下、本発明に従う実施例を説明する
ことにより本発明を詳細に説明する。まず、図１に示す
ように、支持体としてのフィルム１の上に、Ｃｕ蒸着膜
２を形成した。フィルム１としては、ＰＥＴフィルムを
用い、表面に剥離性を良くするためシリコーン樹脂をコ
ートしたものを用いた。Ｃｕ蒸着膜２は抵抗加熱蒸着法
により形成し、厚みを約０．１μｍとした。このＣｕ蒸
着膜２の上に、複合メッキ膜３を形成した。複合メッキ
膜３は、Ｃｕ−（ＢａＡｌ2 Ｓｉ2 Ｏ8 、ＴｉＯ2 ）で
示される組成の複合メッキ膜である。この複合メッキ膜
３は、複合（分散）メッキ法により形成した。メッキ浴
は、硫酸銅浴に複合剤として粒径が１μｍ以下のＢａＣ
Ｏ3 、Ａｌ2 Ｏ3 及びＴｉＯ2 を仮焼した粉末を用い
た。メッキ浴の組成を表１に示す。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below by describing the embodiments according to the present invention. First, as shown in FIG. 1, a Cu vapor deposition film 2 was formed on a film 1 as a support. As the film 1, a PET film was used, and the surface thereof was coated with a silicone resin in order to improve the releasability. The Cu vapor deposition film 2 was formed by the resistance heating vapor deposition method and had a thickness of about 0.1 μm. A composite plating film 3 was formed on the Cu vapor deposition film 2. Composite plating film 3 is a composite plating film having a composition represented by Cu- (BaAl 2 Si 2 O 8 , TiO 2). The composite plating film 3 was formed by a composite (dispersion) plating method. The plating bath is a copper sulphate bath with a composite agent of BaC with a particle size of 1 μm or less.
A powder obtained by calcination of O 3 , Al 2 O 3 and TiO 2 was used. The composition of the plating bath is shown in Table 1.
【００１５】[0015]
【表１】 [Table 1]
【００１６】表１において、比較例のメッキ浴には、複
合剤を添加しておらず、従って比較例において形成され
るメッキ浴は単なる銅メッキ膜である。表１に示すメッ
キ浴を用いて、浴温５０℃、電流密度１．０Ａ／ｄｍ2
の条件で複合メッキ膜を形成した。得られたメッキ膜の
厚みは０．７μｍであった。実施例１の複合メッキ膜中
の粒子含有率は５体積％であり、実施例２では９．６体
積％であり、実施例３では１４．２体積％であった。ま
た比較例のメッキ膜中の粒子含有率は０体積％である。In Table 1, the composite agent was not added to the plating bath of the comparative example, so the plating bath formed in the comparative example is a simple copper plating film. Using the plating bath shown in Table 1, the bath temperature was 50 ° C. and the current density was 1.0 A / dm 2.
A composite plating film was formed under the conditions of. The thickness of the obtained plating film was 0.7 μm. The content of particles in the composite plating film of Example 1 was 5% by volume, that of Example 2 was 9.6% by volume, and that of Example 3 was 14.2% by volume. The content of particles in the plating film of the comparative example is 0% by volume.
【００１７】次に、図２に示すようにＣｕ蒸着膜２及び
メッキ膜３をフォトエッチング加工法によりパターン化
した。次に、この上にＢａＡｌ2 Ｓｉ2 Ｏ8 及びＴｉＯ
2 を主成分とするセラミックグリーンシートを塗布し、
非還元性の厚み１０μｍのセラミックグリーンシート４
を形成した。Next, as shown in FIG. 2, the Cu vapor deposition film 2 and the plating film 3 were patterned by a photoetching method. Then, on top of this, BaAl 2 Si 2 O 8 and TiO
Apply a ceramic green sheet with 2 as the main component,
Non-reducing 10 μm thick ceramic green sheet 4
Was formed.
【００１８】図３は、このようにして得られる金属膜セ
ラミック一体化グリーンシートを示す図である。図３に
示されるように、フィルム１及び複合メッキ膜３の上に
セラミックグリーンシート４が形成されている。図３に
示すような金属膜セラミック一体化グリーンシートを用
い、フィルム１を剥離しながら、セラミックグリーンシ
ート４及びメッキ膜３及びＣｕ蒸着膜２を転写し、これ
を９０層となるように積層することにより、積層セラミ
ックコンデンサを作製した。得られた積層セラミックコ
ンデンサについて、その特性を評価した。容量について
は、１ｋＨｚ、１Ｖｒｍｓの条件で測定し、絶縁抵抗
（ＩＲ）については５０Ｖ、３０秒の条件で測定した。
測定結果を表２に示す。FIG. 3 is a diagram showing the metal film / ceramic integrated green sheet thus obtained. As shown in FIG. 3, a ceramic green sheet 4 is formed on the film 1 and the composite plating film 3. Using the metal film / ceramic integrated green sheet as shown in FIG. 3, while peeling off the film 1, the ceramic green sheet 4, the plating film 3 and the Cu vapor deposition film 2 are transferred and laminated so as to have 90 layers. As a result, a laminated ceramic capacitor was produced. The characteristics of the obtained multilayer ceramic capacitor were evaluated. The capacitance was measured under the conditions of 1 kHz and 1 Vrms, and the insulation resistance (IR) was measured under the conditions of 50 V and 30 seconds.
The measurement results are shown in Table 2.
【００１９】[0019]
【表２】 [Table 2]
【００２０】表２に示されるように、本発明に従う実施
例１〜３の積層セラミックコンデンサは、従来の積層セ
ラミックコンデンサである比較例と同様のコンデンサ特
性を示している。As shown in Table 2, the monolithic ceramic capacitors of Examples 1 to 3 according to the present invention show the same capacitor characteristics as the comparative example which is a conventional monolithic ceramic capacitor.
【００２１】実施例１〜３及び比較例の積層セラミック
コンデンサを研摩し、断面を観察したところ、実施例１
〜３の積層セラミックコンデンサにおいては、内部電極
の穴を通してセラミック層と内部電極中のセラミック粒
子とが焼結していることが確認された。またこのような
セラミック層とセラミック粒子の焼結は、実施例１、実
施例２、実施例３の順に焼結箇所が増えていることが確
認された。一方、比較例の積層セラミックコンデンサで
は、このような焼結は観測されなかった。 以上のこと
から明らかなように、本発明に従いセラミック粒子を含
む金属層を備えた金属膜を用いることにより、コンデン
サ特性を損なうことなく、内部電極とセラミック層との
接合性が良好な積層セラミックコンデンサを得ることが
できる。The laminated ceramic capacitors of Examples 1 to 3 and Comparative Example were polished and their cross sections were observed.
In the laminated ceramic capacitors of Nos. 3 to 3, it was confirmed that the ceramic layers and the ceramic particles in the internal electrodes were sintered through the holes of the internal electrodes. In addition, it was confirmed that in the sintering of such a ceramic layer and ceramic particles, the number of sintering sites increased in the order of Example 1, Example 2, and Example 3. On the other hand, such sintering was not observed in the multilayer ceramic capacitor of the comparative example. As is clear from the above, by using the metal film provided with the metal layer containing the ceramic particles according to the present invention, a laminated ceramic capacitor having a good bonding property between the internal electrode and the ceramic layer without impairing the capacitor characteristics. Can be obtained.
【００２２】上記実施例においては、内部電極中に分散
させるセラミック粒子と、セラミック層の組成を同一組
成にしたが、本発明においては必ずしも同一組成にする
必要はなく、互いに焼結し得る組成であれば特に限定さ
れることはない。In the above embodiment, the composition of the ceramic particles to be dispersed in the internal electrode and the composition of the ceramic layer are the same. However, in the present invention, the composition does not necessarily have to be the same, and it is possible to sinter them. There is no particular limitation as long as it exists.
【００２３】上記実施例においては、本発明の積層セラ
ミック電子部品として、積層セラミックコンデンサを例
にして説明したが、本発明は、このような積層セラミッ
クコンデンサに限定されるものではなく、多層セラミッ
ク基板、積層バリスタ、積層圧電素子等の他の積層セラ
ミック電子部品にも適用し得るものである。In the above-mentioned embodiments, the monolithic ceramic electronic component of the present invention has been described by taking a monolithic ceramic capacitor as an example. However, the present invention is not limited to such a monolithic ceramic capacitor and a multi-layer ceramic substrate. It can also be applied to other laminated ceramic electronic components such as a laminated varistor and a laminated piezoelectric element.
【図面の簡単な説明】[Brief description of drawings]
【図１】支持体上にＣｕ蒸着膜及び複合メッキ膜を形成
した状態を示す断面図。FIG. 1 is a cross-sectional view showing a state in which a Cu vapor deposition film and a composite plating film are formed on a support.
【図２】図１に示す金属膜をフォトリソグラフィー法に
よりパターン化した状態を示す断面図。FIG. 2 is a cross-sectional view showing a state in which the metal film shown in FIG. 1 is patterned by a photolithography method.
【図３】図２に示す金属膜供給体の上にセラミックグリ
ーンシートを形成し、金属膜セラミック一体化グリーン
シート供給体とした状態を示す断面図。3 is a cross-sectional view showing a state in which a ceramic green sheet is formed on the metal film supply body shown in FIG. 2 to form a metal film ceramic integrated green sheet supply body.
１…支持体としてのＰＴＥフィルム ２…Ｃｕ蒸着膜 ３…複合メッキ膜 ４…セラミックグリーンシート 1 ... PTE film as support 2 ... Cu vapor deposition film 3 ... Composite plating film 4 ... Ceramic green sheet
Claims (4)
層セラミック電子部品用金属膜供給体を製造する方法で
あって、支持体上に薄膜形成法により第１の金属層を形成し、該
第１の金属層の上に複合メッキ法によりセラミック粒子
を含有する第２の金属層を形成することにより、前記第
１の金属層と前記第２の金属層からなる金属膜を支持体
上に形成す ることを特徴とする、積層セラミック電子部
品用金属膜供給体の製造方法。1. A method for manufacturing a metal film supply body for a laminated ceramic electronic component, comprising a support and a transfer metal film formed thereon, wherein a first metal layer is formed on the support by a thin film forming method. , The
Ceramic particles on the first metal layer by the composite plating method
By forming a second metal layer containing
A metal film composed of a first metal layer and the second metal layer is used as a support.
A method for manufacturing a metal film supply body for a multilayer ceramic electronic component, characterized by being formed on the above .
量が０．１〜５０体積％である、請求項１に記載の積層
セラミック電子部品用金属膜供給体の製造方法。 2. The method for producing a metal film supplier for a laminated ceramic electronic component according to claim 1, wherein the content of the ceramic particles in the second metal layer is 0.1 to 50% by volume.
属膜供給体の金属膜の上にセラミックグリーンシートを
形成することを特徴とする、金属膜セラミック一体化グ
リーンシート供給体の製造方法。3. An integrated metal film ceramic, characterized in that a ceramic green sheet is formed on the metal film of the metal film supply body obtained by the method according to claim 1. Method for manufacturing a green sheet supplier.
属膜セラミック一体化グリーンシート供給体から金属膜
とともにセラミックグリーンシートを転写して積層し焼
結することを特徴とする、積層セラミック電子部品の製
造方法。4. A ceramic green sheet obtained by the method according to claim 3 is transferred from the metal film ceramic integrated green sheet supply body together with the metal film, laminated and sintered . that, manufacturing of multilayer ceramic electronic parts
Build method .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19834593A JP3491639B2 (en) | 1993-08-10 | 1993-08-10 | Method of manufacturing metal film supply body for multilayer ceramic electronic component, method of manufacturing metal film ceramic integrated green sheet supply body, and method of manufacturing multilayer ceramic electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19834593A JP3491639B2 (en) | 1993-08-10 | 1993-08-10 | Method of manufacturing metal film supply body for multilayer ceramic electronic component, method of manufacturing metal film ceramic integrated green sheet supply body, and method of manufacturing multilayer ceramic electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0757960A JPH0757960A (en) | 1995-03-03 |
| JP3491639B2 true JP3491639B2 (en) | 2004-01-26 |
Family
ID=16389582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19834593A Expired - Lifetime JP3491639B2 (en) | 1993-08-10 | 1993-08-10 | Method of manufacturing metal film supply body for multilayer ceramic electronic component, method of manufacturing metal film ceramic integrated green sheet supply body, and method of manufacturing multilayer ceramic electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3491639B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005285801A (en) * | 2004-03-26 | 2005-10-13 | Kyocera Corp | Method of manufacturing stacked electronic component |
-
1993
- 1993-08-10 JP JP19834593A patent/JP3491639B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0757960A (en) | 1995-03-03 |
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