JP3483219B2 - Outer lead bonding equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an outer lead bonding apparatus for bonding an outer lead of a TAB-IC on which a semiconductor chip is mounted and an outer lead of a liquid crystal cell. The present invention relates to an outer lead bonding apparatus that heat-presses and temporarily press-bonds a TAB-IC that is temporarily pressure-bonded to the outer leads of a liquid crystal cell that is attached.

[0002]

2. Description of the Related Art A conventional outer lead bonding apparatus of this type has a cell mounting stage 9 on which a liquid crystal cell 1 is mounted, as shown in FIG. The outer lead of the TAB-IC 2 is provisionally pressure-bonded to the outer lead of the liquid crystal cell 1 placed on the cell mounting stage 9. The cell mounting stage 9 is configured so as to be movable to the right as shown by an arrow 21, and to the right of this is the bonding set tool 5 of the bonding head 3 and the backup unit tool 8 of the backup unit 6. And are arranged so as to face each other in the vertical direction.

The bonding head 3 has a bonding head heater block 4 between it and the bonding head tool 5, and the bonding head heater block 4 is a bonding head heater controller 11.
It is designed to be heated by. The backup unit 6 has a backup unit heater block 7 between it and the backup unit tool 8, and the backup unit heater block 7 is heated by the backup unit heater controller 14.

Further, the bonding head 3 and the backup unit 6 can be vertically moved by a device (not shown) so as to be close to each other as shown by a dotted line, and the tool 5 for the bonding heads of both of them which are close to each other.
LCD cell 1 between the tool and backup unit tool 8
With the provisional pressure-bonding portion of the TAB-IC2 sandwiched therebetween, the provisional pressure-bonding portion is heated and pressed, whereby the temporary pressure-bonding portion is subjected to main pressure bonding.

More specifically, the liquid crystal cell 1 and the TAB-IC
In order to perform final crimping of the temporary crimping portion with 2, first, TAB-IC2
Cell mounting stage 9 with the liquid crystal cell 1 temporarily bonded
2 by means of a drive motor or cylinder not shown
It moves to the right as shown by 1, and is positioned between the bonding head tool 5 and the backup unit tool 8. Then, the backup unit 6 is lifted by a cylinder or the like (not shown), and the backup unit tool 8 is brought into contact with the lower surfaces of the liquid crystal cell 1 and the TAB-IC 2 temporary pressure-bonding portion. Next, the bonding head 3
Is moved downward by a cylinder or the like not shown,
The bonding head tool 5 is brought into contact with the temporary pressure bonding portion, and the temporary pressure bonding portion is sandwiched between the bonding head tool 5 and the backup unit tool 8.

Thus, the bonding head tool 5
After the temporary pressure-bonding portion is sandwiched between the backup unit tool 8 and the backup unit tool 8, the bonding head tool 5 is further lowered to press the temporary pressure bonding portion between the bonding head tool 5 and the backup unit tool 8. At the same time, the bonding head heater controller 11 and the backup unit heater controller 14 heat the bonding head heater block 4 and the backup unit heater block 7, respectively.
As a result, the temporary press-bonding portion is heated between the bonding head tool 5 and the backup unit tool 8. Such heating and pressurization is performed on the temporary pressure bonding part for a predetermined time,
After the main pressure bonding, the bonding head 3 and the backup unit 6 are returned to their original positions by cylinders or the like not shown, and then the cell mounting stage 9 is also returned to its original position.

A thermocouple and a heater wire are embedded in the bonding head heater block 4 and the backup unit heater block 7, respectively, so that the bonding head heater controller 11 is provided.
And heater controller 14 for backup unit
Is designed to heat at a constant temperature.

FIG. 3 is a diagram showing a main part of the conventional outer lead bonding apparatus shown in FIG. That is, FIG. 3A shows a liquid crystal cell 1 in which the outer lead portion at the right end is provisionally pressure-bonded to the outer lead portions of a plurality of TAB-ICs 2, and FIG. 3B shows a circle A in FIG. It is the figure which expanded the enclosed part and has shown especially the temporary crimping | bonding part of the outer lead part 12 of the liquid crystal cell 1, and the outer lead of TAB-IC2. Further, FIG. 7C shows the line X in FIG.
It is a cross section taken along -X ', and an enlarged view of the bonding head tool 5 and the backup unit tool 8 for heating and pressing the temporary pressure-bonded portion of the outer lead portion shown in FIG.

As shown in FIG. 3B, the width of the outer lead portion 12 of the liquid crystal cell 1 is L1, and FIG.
As shown in FIG.
The tool width of the tip portion of the bonding head tool 5 and the backup unit tool 8 that heat and pressurize the temporary press-bonded portion with the outer lead of the B-IC 2 is L2, and the gap between the cell mounting stage 9 and the backup unit 6 is Is L3.

[0010]

In the conventional outer lead bonding apparatus configured as described above, as shown in detail in FIG. 3, the outer lead portion 12 of the liquid crystal cell 1 is used.
And the outer lead portion of the TAB-IC2, the dimensional difference between the tool width L2 at the tips of the bonding head tool 5 and the backup unit tool 8 is very small compared to the width L1 at which the temporary pressure bonding portion can be heated and pressed (L1 -L2≈1
mm), and since the distance L3 between the cell mounting stage 9 and the backup unit 6 when the cell mounting stage 9 moves the liquid crystal cell 1 to the heating and pressing position, the cell mounting stage 9 is moved to a predetermined heating and pressing position. There is a problem in that very high positioning accuracy is required to move up to, and positioning of the bonding head 3 and the backup unit 6 also requires high accuracy and considerable time.

The present invention has been made in view of the above,
It is an object of the present invention to provide an outer lead bonding apparatus which does not require high-accuracy positioning and can be economical and have a short operating time with a simple structure.

[0012]

To achieve the above object, according to an aspect of the outer lead bonding apparatus of the present invention, the upper surface of the TAB-IC, which is temporarily pressure bonded to the outer lead portion of the liquid crystal cell via an anisotropic conductive film In an outer lead bonding apparatus that applies heat and pressure using a heating and pressurizing means to perform main pressure bonding, the liquid crystal cell is mounted together with the liquid crystal cell.
The temporary pressure-bonding portion of the liquid crystal cell is connected to the upper surface heating and pressing means.
A cell mounting stage that moves so as to be positioned at a predetermined position below, and a cell mounting stage that is attached to this cell mounting stage.
And a bottom surface heating unit that moves together with the mounting stage and contacts the bottom surface of the outer lead portion to heat the bottom surface of the outer lead portion of the liquid crystal cell mounted on the cell mounting stage. .

Further, the outer lead bonding apparatus of the present invention has a heat insulating means between the lower surface heating means and the cell mounting stage so that heat of the lower surface heating means is not transferred to the cell mounting stage. And

[0014]

In the outer lead bonding apparatus of the present invention, the bottom surface heating means is attached to the cell mounting stage, and TA
The outer lead of the B-IC is placed so that the lower surface of the outer lead portion of the liquid crystal cell, which is temporarily pressure-bonded, is brought into contact with the lower surface heating means, and the cell mounting stage is moved to move the temporary pressure-bonded portion to the upper surface heating / pressurizing means. To a predetermined position below, lowering the upper surface heating / pressurizing means to contact the upper surface of the temporary pressure bonding portion, and heating and pressing the temporary pressure bonding portion between the upper surface heating / pressurizing means and the lower surface heating means. Crimp.

Further, in the outer lead bonding apparatus of the present invention, the heat insulating means is provided between the lower surface heating means and the cell mounting stage so that the heat of the lower surface heating means is not transferred to the cell mounting stage.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing the configuration of an outer lead bonding apparatus according to an embodiment of the present invention. In the outer lead bonding apparatus shown in FIG. 2, the backup unit 6 is deleted from the outer lead bonding apparatus shown in FIG. 2, the backup unit heater block 7 is attached to the cell mounting stage 9 via the heat insulating material 10, and the backup is performed. The difference is that a backup unit tool 18 having no protruding tip portion is provided on the unit heater block 7 in place of the backup unit tool 8. Other configurations are the same as in FIG.
The same constituent elements are designated by the same reference numerals. The backup unit heater block 7 attached to the cell mounting stage 9 via the heat insulating material 10 is the backup unit heater controller 1.
Controlled by 4 is the same.

In the thus constructed device, the TA
When the liquid crystal cell 1 to which the B-IC 2 is temporarily pressure-bonded is placed on the cell mounting stage 9, the outer lead portion of the liquid crystal cell 1 and the temporary pressure-bonding portion of the outer lead portion of the TAB-IC 2 are heater blocks for the backup unit. 7 is placed so as to be in contact with and located on the backup unit tool 18 of FIG.

The cell mounting stage 9 on which the liquid crystal cell 1 is mounted in this way is moved to the right as indicated by the arrow 22, and the liquid crystal cell 1 and the TAB-IC 2 are temporarily bonded to the bonding head 3 by the bonding head 3. Set it so that it is located directly below the tool 5. Then, in this state, the bonding head 3 is moved downward and the bonding head tool 5 is brought into contact with the temporary pressure bonding portion, whereby the temporary pressure bonding portion and the bonding head tool 5 of the bonding head 3 and the backup unit. The bonding head heater block 4 of the bonding head 3 is heated and controlled by the bonding head heater controller 11, and the backup unit heater block 7 is heated and controlled by the backup unit heater controller 14 while pressurizing between the bonding tool 18 and the bonding tool 18. As a result, the temporary press-bonding portion is heated via the bonding head tool 5 and the backup unit tool 18, respectively,
The temporary pressure-bonding portion is subjected to main pressure bonding. After the main press-bonding as described above, the bonding head 3 is lifted to move the bonding head tool 5 to the liquid crystal cell 1 and the TAB-IC.
The cell mounting stage 9 is moved to the left and returned to the original position.

As described above, in the outer lead bonding apparatus of this embodiment, the backup unit 6 is deleted and the heater block 7 for the backup unit is attached to the cell mounting stage 9. It is not necessary to position the cell mounting stage 9 close to the liquid crystal cell 1 and the TAB.
-The work of positioning so as to be close to the temporary press-bonded portion with IC2 is also unnecessary.

[0020]

As described above, according to the present invention,
The lower surface heating means is attached to the cell mounting stage so that the lower surface of the outer lead portion of the liquid crystal cell to which the outer lead of the TAB-IC is temporarily bonded is in contact, and the cell mounting stage is moved to heat the upper surface of the temporary pressure bonding portion. It moves to a predetermined position below the pressure means, and the upper surface heating and pressing means descends to abut against the upper surface of the temporary pressure bonding portion, and the temporary pressure bonding portion is heated and pressed between the upper surface heating and pressing means and the lower surface heating means. Since the main press bonding is performed, it is not necessary to perform the close positioning work of the cell mounting stage with respect to the backup unit and the close positioning work of the backup unit with respect to the temporary crimping part between the liquid crystal cell and the TAB-IC as in the conventional case, and the structure is simplified and economical Therefore, maintenance can be facilitated and operation time can be shortened.

Further, since the heat insulating means is provided between the lower surface heating means and the cell mounting stage to prevent the heat of the lower surface heating means from being transferred to the cell mounting stage, the cell mounting stage is not distorted by thermal stress. The device life can be improved.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of an outer lead bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a conventional outer lead bonding apparatus.

3 is a diagram showing a main part of the conventional outer lead bonding apparatus shown in FIG.

[Explanation of symbols]

1 Liquid crystal cell 2 TAB-IC 3 bonding head 4 Heater block for bonding head 5 Bonding head tools 7 Heater block for backup unit 9-cell mounting stage 10 Insulation 11 Heater controller for bonding head 14 Heater controller for backup unit 18 Backup Unit Tool

Continuation of front page (56) Reference JP-A-4-127447 (JP, A) JP-A-4-322492 (JP, A) JP-A-5-218140 (JP, A) JP-A-3-245558 (JP , A) JP-A-2-228094 (JP, A) JP-A-4-344224 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H0L 21/60 H0L 21/603

Claims (2)

(57) [Claims] 1. A TAB-IC which is temporarily pressure-bonded to an outer lead portion of a liquid crystal cell through an anisotropic conductive film is heated on the upper surface.
In an outer lead bonding apparatus for heating and pressurizing using a pressurizing means for main pressure bonding, the liquid crystal cell is mounted on the mounted liquid crystal cell.
The temporary pressure-bonding part is located below the upper surface heating and pressing means.
The cell mounting stage that moves to position the cell mounting stage and the cell mounting stage attached to the cell mounting stage.
A bottom surface heating means that moves integrally with the outer lead portion and contacts the bottom surface of the outer lead portion to heat the bottom surface of the outer lead portion of the liquid crystal cell mounted on the cell mounting stage. Lead bonding equipment. 2. The outer lead according to claim 1, further comprising heat insulating means between the lower surface heating means and the cell mounting stage so that heat of the lower surface heating means is not transferred to the cell mounting stage. Bonding equipment.