JP4801889B2 - Electrical element connection method and heating head - Google Patents

Electrical element connection method and heating head Download PDF

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Publication number
JP4801889B2
JP4801889B2 JP2004231876A JP2004231876A JP4801889B2 JP 4801889 B2 JP4801889 B2 JP 4801889B2 JP 2004231876 A JP2004231876 A JP 2004231876A JP 2004231876 A JP2004231876 A JP 2004231876A JP 4801889 B2 JP4801889 B2 JP 4801889B2
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heat conduction
main body
heating
adhesive
longitudinal direction
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JP2006049739A (en
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美佐夫 小西
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Dexerials Corp
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Sony Chemical and Information Device Corp
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Priority to JP2004231876A priority Critical patent/JP4801889B2/en
Priority to KR1020077003042A priority patent/KR20070033021A/en
Priority to PCT/JP2005/014418 priority patent/WO2006016532A1/en
Priority to TW094126893A priority patent/TWI430410B/en
Publication of JP2006049739A publication Critical patent/JP2006049739A/en
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Description

本発明は熱硬化性の接着剤を用いた電気部品の接続方法に関する。   The present invention relates to a method for connecting electrical components using a thermosetting adhesive.

従来より、半導体素子のような電気部品を配線板のような電気部品に接続するには、熱硬化性の接着剤が用いられており、半導体素子と配線板とで接着剤を挟み込んだ状態で加熱すると、接着剤が硬化する。
図９の符号１０１は従来技術の接続方法で半導体素子１１０と配線板１１５とが接続された電気装置を示している。 Conventionally, a thermosetting adhesive is used to connect an electrical component such as a semiconductor element to an electrical component such as a wiring board, and the adhesive is sandwiched between the semiconductor element and the wiring board. When heated, the adhesive is cured.
Reference numeral 101 in FIG. 9 denotes an electric device in which the semiconductor element 110 and the wiring board 115 are connected by a connection method of the prior art.

接着剤１０５には不図示の導電性粒子が分散されており、半導体素子１１０の端子１１２と配線板１１５の端子１１７とで導電性粒子が挟み込まれることで、半導体素子１１０と配線板１１５とは電気的に接続されている。また、硬化した接着剤１０５によって半導体素子１１０は配線板１１５に固定されており、従って半導体素子１１０と配線板１１５は機械的にも接続されている。   Conductive particles (not shown) are dispersed in the adhesive 105, and the conductive particles are sandwiched between the terminals 112 of the semiconductor element 110 and the terminals 117 of the wiring board 115, whereby the semiconductor element 110 and the wiring board 115 are separated from each other. Electrically connected. Further, the semiconductor element 110 is fixed to the wiring board 115 by the cured adhesive 105, and therefore the semiconductor element 110 and the wiring board 115 are mechanically connected.

しかし、半導体素子１１０や配線板１１５の温度差や線膨張係数の違いによって、接着剤が硬化するときの応力によって、半導体素子に反りが生じることがあり、特に半導体素子１１０が細長の場合には、その長手方向の端部が接着剤１０５から剥離し、図９に示すように半導体素子１１０の長手方向の端部で半導体素子１１０の端子１１２が配線板１１５の端子１１７から離間し、導通不良となってしまう。   However, due to the difference in temperature and linear expansion coefficient between the semiconductor element 110 and the wiring board 115, the semiconductor element may be warped due to the stress when the adhesive is cured, particularly when the semiconductor element 110 is elongated. , The end in the longitudinal direction peels off from the adhesive 105, and the terminal 112 of the semiconductor element 110 is separated from the terminal 117 of the wiring board 115 at the end in the longitudinal direction of the semiconductor element 110 as shown in FIG. End up.

本発明は上記従来技術の不都合を解決するために創作されたものであり、その目的は、細長の電気部品を熱硬化性の接着剤で接続し、信頼性の高い電気装置を得ることである。   The present invention was created in order to solve the above-described disadvantages of the prior art, and an object thereof is to obtain a highly reliable electric device by connecting elongated electric parts with a thermosetting adhesive. .

上記課題を解決するために請求項１記載の発明は、第一、第二の電気部品の間に熱硬化性樹脂からなる接着剤を配置し、前記第一の電気部品の第一の本体を加熱装置によって加熱して前記接着剤を加熱硬化し、前記第一、第二の電気部品の第一、第二の端子同士を電気的に接続する接続方法であって、前記第一の本体は細長にされ、前記第一の電気部品の前記第一の端子は前記第一の本体の少なくとも長手方向の端部に配置され、前記加熱装置はその熱伝導率が２００W／ｍ・ｋ以上である高熱伝導部と、その熱伝導率が１００W／ｍ・ｋ未満である低熱伝導部とを有し、前記第一の本体の加熱は、前記高熱伝導部を前記第一の本体の長手方向の端部に押し当てて、前記低熱伝導部を前記第一の本体の前記長手方向の中央部分に押し当て、前記加熱装置を前記第一の本体に押し当てた状態で、前記加熱装置を昇温させ、熱伝導により第一の本体を加熱する接続方法である。
請求項２記載の発明は、第一、第二の電気部品の間に熱硬化性樹脂からなる接着剤を配置し、前記第一の電気部品の第一の本体を加熱装置によって加熱して前記接着剤を加熱硬化し、前記第一、第二の電気部品の第一、第二の端子同士を電気的に接続する接続方法であって、前記第一の本体は細長にされ、前記第一の電気部品の前記第一の端子は前記第一の本体の少なくとも長手方向の端部に配置され、前記加熱装置を前記第一の本体に押し当てた状態で、前記加熱装置を昇温させ、熱伝導により前記第一の本体を加熱するものであり、前記加熱装置は凸部を有し、前記第一の本体の加熱は、前記凸部の先端を前記第一の本体の長手方向の端部に押し当てて加熱し、前記第一の本体の中央部は凸部と高さだけ離間した状態で加熱し、長手方向の両端部を強固に接着剤で固定させる接続方法である。
請求項３記載の発明は、請求項１記載の接続方法に用いられる加熱装置であって、前記加熱装置は、装置本体と、加熱手段とを有し、前記装置本体を被着体に押し当て、前記加熱手段に通電すると、熱伝導により前記装置本体が昇温し、前記被着体が加熱されるように構成され、前記装置本体は、低熱伝導部と、高熱伝導部とを有し、前記高熱伝導部は前記低熱伝導部を構成する材料よりも熱伝導率の高い材料で構成された高熱伝導部とを有する加熱装置である。

In order to solve the above-mentioned problems, the invention according to claim 1 is characterized in that an adhesive made of a thermosetting resin is disposed between the first and second electric components, and the first main body of the first electric component is disposed. heated by a heating device to heat curing the adhesive, the first, the first second electrical component, the second terminals of a connection method for electrically connecting said first body The first terminal of the first electrical component is disposed at least at the longitudinal end of the first body, and the heating device has a thermal conductivity of 200 W / m · k or more. A high thermal conductivity portion and a low thermal conductivity portion having a thermal conductivity of less than 100 W / m · k, and the heating of the first main body is performed at the end of the first main body in the longitudinal direction. Against the central portion of the first main body in the longitudinal direction, In pressed against the thermal device to the first body, the heating device is heated to a connection method of heating the first body by heat conduction.
According to a second aspect of the invention, first, an adhesive made of a thermosetting resin between the second electrical component is arranged to heat the first body of the first electrical component by press heating device A method of connecting the first and second terminals of the first and second electrical components by heat-curing the adhesive and electrically connecting the first and second terminals, wherein the first body is elongated, The first terminal of one electrical component is disposed at least in an end portion in the longitudinal direction of the first main body, and the heating device is heated while the heating device is pressed against the first main body. The first main body is heated by heat conduction, the heating device has a convex portion, and the heating of the first main body is performed by setting the tip of the convex portion in the longitudinal direction of the first main body. Heated by pressing against the end, the central part of the first main body is heated in a state separated from the convex part by a height, and the longitudinal direction It is a connection method for fixed firmly adhesive end portions.
According to a third aspect of the invention, a heating apparatus used in connection process of claim 1 Symbol placement, the heating apparatus includes an apparatus main body, and heating means, press the device body to an adherend When the heating means is energized, the apparatus body is heated by heat conduction, and the adherend is heated, and the apparatus body has a low heat conduction portion and a high heat conduction portion. The high heat conduction part is a heating device having a high heat conduction part made of a material having a higher thermal conductivity than a material constituting the low heat conduction part.

接着剤を加熱硬化させる際に電気部品の長手方向端部が外気で冷却されても、冷却される分は長手方向の端部への伝熱量を多くすることで補充されるので、電気部品の細長の端部で接着剤の硬化率が低くならない。従って、電気部品の細長の端部は硬化した接着剤で強固に固定されることになり、接着剤が硬化するときの応力で電気部品に反りが生じても、長手方向の端部が接着剤から剥離しない。このように、本発明の接続方法で電気部品を接続すると、電気部品の剥離による導通不良が起こらず、接続信頼性の高い電気装置が得られる。   Even if the longitudinal end of the electrical component is cooled by the outside air when the adhesive is heat-cured, the amount of cooling is supplemented by increasing the amount of heat transfer to the longitudinal end. The curing rate of the adhesive does not decrease at the elongated end. Therefore, the elongated end of the electrical component is firmly fixed with the cured adhesive, and even if the electrical component warps due to the stress when the adhesive is cured, the longitudinal end is the adhesive. Do not peel from. As described above, when electrical components are connected by the connection method of the present invention, a conduction failure due to peeling of the electrical components does not occur, and an electrical device with high connection reliability can be obtained.

図１の符号３０は本発明の第一例の加熱装置である加熱ヘッドを示しており、この加熱ヘッド３０はヘッド本体３１と、加熱手段３５とを有している。ここでは、ヘッド本体３１は細長の直方体形状にされている。ヘッド本体３１は高熱伝導部３２と、低熱伝導部３３とを有しており、低熱伝導部３３はヘッド本体３１の長手方向の中央部分に設けられ、高熱伝導部３２はヘッド本体３１の長手方向の両端部に設けられている。   Reference numeral 30 in FIG. 1 shows a heating head which is a heating device of the first example of the present invention. The heating head 30 has a head body 31 and a heating means 35. Here, the head main body 31 has an elongated rectangular parallelepiped shape. The head main body 31 includes a high heat conduction portion 32 and a low heat conduction portion 33, and the low heat conduction portion 33 is provided at a central portion of the head main body 31 in the longitudinal direction. Are provided at both ends.

加熱手段３５は高熱伝導部３２と低熱伝導部３３の両方にわたって埋設されており、不図示の電源から加熱手段３５に通電すると加熱手段３５が昇温し、高熱伝導部３２と低熱伝導部３３の両方が同時に加熱されるようになっている。   The heating means 35 is embedded over both the high heat conduction portion 32 and the low heat conduction portion 33, and when the heating means 35 is energized from a power source (not shown), the heating means 35 rises in temperature and the high heat conduction portion 32 and the low heat conduction portion 33 are connected. Both are heated at the same time.

高熱伝導部３２は高熱伝導セラミック（例えば熱伝導率が２００Ｗ／ｍ・Ｋ以上の窒化アルミニウムセラミック）のような高熱伝導材料で構成され、低熱伝導部３３は低熱伝導金属（例えば熱伝導率が１００Ｗ／ｍ・Ｋ未満の鉄）のような低熱伝導材料で構成されている。   The high thermal conductivity portion 32 is made of a high thermal conductivity material such as a high thermal conductivity ceramic (for example, an aluminum nitride ceramic having a thermal conductivity of 200 W / m · K or more), and the low thermal conductivity portion 33 is a low thermal conductivity metal (for example, a thermal conductivity of 100 W). / M · K less iron).

物質の伝熱量は熱伝導率に比例するので、同じ加熱手段３５で加熱した場合であっても、単位時間当たりの伝熱量は低熱伝導部３３よりも高熱伝導部３２の方が多くなる。従って、昇温した加熱ヘッド３０を被着体に接触させた場合に、加熱ヘッド３０から被着体への伝熱量は、高熱伝導部３２が接触した部分の方が、低熱伝導部３３が接触した部分よりも多くなる。   Since the heat transfer amount of the substance is proportional to the thermal conductivity, the high heat transfer portion 32 has a higher heat transfer amount per unit time than the low heat transfer portion 33 even when heated by the same heating means 35. Therefore, when the heated heating head 30 is brought into contact with the adherend, the amount of heat transfer from the heating head 30 to the adherend is more in contact with the low heat conduction portion 33 in the portion where the high heat conduction portion 32 is in contact. More than the part you did.

次に、この加熱ヘッド３０を用いて第一、第二の電気部品を接続する工程について説明する。
図２の符号１０は第一の電気部品である半導体素子１０を示している。半導体素子１０は素子本体１１（第一の本体）と、複数個の第一の端子１２とを有している。素子本体１１は細長の直方体形状にされており、第一の端子１２は素子本体１１の細長の一側面上に、その側面の四辺に沿って配置されている。 Next, the process of connecting the first and second electrical components using the heating head 30 will be described.
Reference numeral 10 in FIG. 2 indicates a semiconductor element 10 which is a first electric component. The semiconductor element 10 has an element body 11 (first body) and a plurality of first terminals 12. The element body 11 has an elongated rectangular parallelepiped shape, and the first terminal 12 is disposed on one elongated side surface of the element body 11 along the four sides of the side surface.

図３（ａ）の符号１５は第二の電気部品である配線板を示している。配線板１５は基板１６を有しており、基板１６の片面には配線が引き回され、その配線の一部で第二の端子１７が構成されている。   Reference numeral 15 in FIG. 3A denotes a wiring board as a second electrical component. The wiring board 15 has a substrate 16, wiring is routed on one side of the substrate 16, and the second terminal 17 is configured by a part of the wiring.

配線板１５は第二の端子１７が配置された側の面を上側に向けた状態でステージ３９上に配置されており、配線板１５の第二の端子１７が配置された側の面に接着剤５を配置する。次に、半導体素子１０を配線板１５上に配置し、第一、第二の端子１２、１７が互いに対向するように位置合わせし、半導体素子１０を接着剤５上に載せる。   The wiring board 15 is arranged on the stage 39 with the surface on which the second terminals 17 are arranged facing upward, and is bonded to the surface of the wiring board 15 on which the second terminals 17 are arranged. Agent 5 is placed. Next, the semiconductor element 10 is disposed on the wiring board 15, aligned so that the first and second terminals 12 and 17 face each other, and the semiconductor element 10 is placed on the adhesive 5.

次に、上述した加熱ヘッド３０を半導体素子１０上に配置し、その長手方向を半導体素子１０の長手方向に対して平行にすると、高熱伝導部３２と低熱伝導部３３が半導体素子１０上に並べられた状態になる。   Next, when the above-described heating head 30 is arranged on the semiconductor element 10 and the longitudinal direction thereof is parallel to the longitudinal direction of the semiconductor element 10, the high heat conduction portion 32 and the low heat conduction portion 33 are arranged on the semiconductor element 10. It will be in the state.

高熱伝導部３２と低熱伝導部３３が半導体素子１０上に並べられた時に、高熱伝導部３２の素子本体１１の長手方向の長さを高熱伝導部３２の長さとし、低熱伝導部３３の素子本体１１の長手方向の長さを低熱伝導部３３の長さとすると、素子本体１１の長さは低熱伝導部３３の長さよりも長く、かつ低熱伝導部３３の長さと高熱伝導部３２の長さの合計よりは短くなっている。   When the high heat conduction part 32 and the low heat conduction part 33 are arranged on the semiconductor element 10, the length of the element body 11 of the high heat conduction part 32 in the longitudinal direction is the length of the high heat conduction part 32, and the element body of the low heat conduction part 33. 11 is the length of the low thermal conduction portion 33, the length of the element body 11 is longer than the length of the low thermal conduction portion 33, and the length of the low thermal conduction portion 33 and the length of the high thermal conduction portion 32. It is shorter than the total.

従って、素子本体１１の長手方向の中央部分が、低熱伝導部３２の長さの中央に位置するように位置合わせをし、加熱ヘッド３０を半導体素子１０に押し当てると、低熱伝導部３３が素子本体１１の長手方向の中央部分に接触し、高熱伝導部３２が素子本体１１の長手方向の両端部にそれぞれ接触する（図３（ｂ））。   Therefore, when the alignment is performed so that the center portion in the longitudinal direction of the element body 11 is positioned at the center of the length of the low thermal conduction portion 32 and the heating head 30 is pressed against the semiconductor element 10, the low thermal conduction portion 33 becomes the element. The high heat conduction part 32 contacts the both ends of the longitudinal direction of the element main body 11, respectively, in contact with the central part of the main body 11 in the longitudinal direction (FIG. 3B).

低熱伝導部３３と高熱伝導部３２は加熱手段３５によって予め加熱されており、低熱伝導部３３と高熱伝導部３２が接触すると、素子本体１１の長手方向の中央部分と長手方向の両端部は同時に加熱されて昇温し、熱伝導によって接着剤５が加熱される。   The low heat conduction part 33 and the high heat conduction part 32 are preheated by the heating means 35. When the low heat conduction part 33 and the high heat conduction part 32 come into contact with each other, the center part in the longitudinal direction of the element body 11 and both end parts in the longitudinal direction are simultaneously The adhesive 5 is heated by heating and the adhesive 5 is heated by heat conduction.

図４は接着剤５の拡大断面図であり、接着剤５は熱硬化性樹脂５１と、熱硬化性樹脂５１中に分散された導電性粒子５２とを有している。加熱によって接着剤５が昇温すると熱硬化性樹脂５１は軟化するので、加熱ヘッド３０で押圧をしながら加熱を続けると、軟化した熱硬化性樹脂５１は押しのけられ、第一、第二の端子１２、１７で導電性粒子５２が挟み込まれる。更に加熱押圧を続け、接着剤５の温度が高くなると熱硬化性樹脂５１が重合し、接着剤５が硬化する。   FIG. 4 is an enlarged cross-sectional view of the adhesive 5, and the adhesive 5 has a thermosetting resin 51 and conductive particles 52 dispersed in the thermosetting resin 51. When the temperature of the adhesive 5 is increased by heating, the thermosetting resin 51 is softened. Therefore, when heating is continued while pressing with the heating head 30, the softened thermosetting resin 51 is pushed away, and the first and second terminals The conductive particles 52 are sandwiched between 12 and 17. When the heating and pressing are further continued and the temperature of the adhesive 5 is increased, the thermosetting resin 51 is polymerized and the adhesive 5 is cured.

半導体素子１０と接着剤５は加熱と同時に外気で冷却されるので、加熱ヘッド３０から半導体素子１０を介して接着剤５に伝わる熱量は、半導体素子１０の端部と接着剤５の端部で多く損失される。   Since the semiconductor element 10 and the adhesive 5 are cooled by the outside air simultaneously with the heating, the amount of heat transferred from the heating head 30 to the adhesive 5 through the semiconductor element 10 is between the end of the semiconductor element 10 and the end of the adhesive 5. A lot is lost.

上述したように、高熱伝導部３２からの単位時間当たりの伝熱量は、低熱伝導部３３からの単位時間当たりの伝熱量よりも多く、素子本体１１の長手方向の端部は中央部分に比べて多くの熱量を受け取るので、素子本体１１の端部や接着剤５の端部で冷却による損失が起こっても、素子本体１１の長手方向の端部に位置する接着剤５は、その長手方向の中央部分に位置する接着剤５に比べて伝達される熱量が小さくならない。   As described above, the heat transfer amount per unit time from the high heat conduction part 32 is larger than the heat transfer amount per unit time from the low heat conduction part 33, and the end in the longitudinal direction of the element body 11 is compared to the center part. Since a large amount of heat is received, even if a loss due to cooling occurs at the end of the element body 11 or the end of the adhesive 5, the adhesive 5 located at the end in the longitudinal direction of the element body 11 is in the longitudinal direction. The amount of heat transferred is not reduced compared to the adhesive 5 located in the central portion.

熱硬化性の接着剤５の硬化率は伝熱量が多い程高くなるので、接着剤５の硬化率は、半導体素子１０の長手方向の端部と、半導体素子１０の長手方向の中央部分で差が生じないことになる。   Since the curing rate of the thermosetting adhesive 5 increases as the amount of heat transfer increases, the curing rate of the adhesive 5 differs between the end portion of the semiconductor element 10 in the longitudinal direction and the central portion of the semiconductor element 10 in the longitudinal direction. Will not occur.

例えば、本発明の加熱ヘッド３０で加熱を行った場合には、接着剤５の硬化率は素子本体１１の長手方向の端部で７８％、長手方向の中央部分で８０％であり、その硬化率の差は小さかった。これに対し、ヘッド本体の熱伝導率が均一な加熱ヘッドを用いて加熱を行った場合には、接着剤の硬化率は、素子本体１１の長手方向の中央部分で７９％、長手方向の端部では６６％であり、素子本体１１長手方向端部での硬化率が中央部分に比べて１０％以上も小さくなってしまった。   For example, when heating is performed with the heating head 30 of the present invention, the curing rate of the adhesive 5 is 78% at the end in the longitudinal direction of the element body 11 and 80% at the center in the longitudinal direction. The difference in rates was small. On the other hand, when heating is performed using a heating head having a uniform thermal conductivity of the head body, the curing rate of the adhesive is 79% in the longitudinal center portion of the element body 11 and the end in the longitudinal direction. This is 66%, and the curing rate at the end in the longitudinal direction of the element body 11 is 10% or more smaller than that of the central portion.

尚、硬化率は接着剤５としてエポキシ樹脂である熱硬化性樹脂に導電性粒子が分散された異方導電性接着剤を用い、フーリエ変換赤外分光光度計で求めたエポキシ基（波数９１４ｃｍ-1）の吸収スペクトル強度と、メチレン基（波数２９３０ｃｍ-1）の吸収スペクトル強度を下記式（１）に代入して求めた。 The curing rate was determined by using an anisotropic conductive adhesive in which conductive particles were dispersed in a thermosetting resin, which is an epoxy resin, as the adhesive 5, and an epoxy group (wave number 914 cm −) determined by a Fourier transform infrared spectrophotometer. The absorption spectrum intensity of 1 ) and the absorption spectrum intensity of the methylene group (wave number 2930 cm −1 ) were determined by substituting them into the following formula (1).

式（１）：硬化率（％）＝１００−（ａ／ｂ）／（Ａ／Ｂ）×１００
Ａ：硬化前のエポキシ基の吸収スペクトル強度
Ｂ：硬化前のメチレン基の吸収スペクトル強度
ａ：硬化後のエポキシ基の吸収スペクトル強度
ｂ：硬化後のメチレン基の吸収スペクトル強度
図５の符号１は接着剤５が硬化した状態の電気装置を示している。この電気装置１では、第一、第二の接続端子１２、１７が導電性粒子５２を挟み込んだ状態で接着剤５が硬化しており、従って半導体素子１０と配線板１５は電気的にも機械的にも接続されている。 Formula (1): Curing rate (%) = 100− (a / b) / (A / B) × 100
A: Absorption spectrum intensity of epoxy group before curing B: Absorption spectrum intensity of methylene group before curing a: Absorption spectrum intensity of epoxy group after curing b: Absorption spectrum intensity of methylene group after curing The electric apparatus of the state which the adhesive agent 5 hardened | cured is shown. In this electrical apparatus 1, the adhesive 5 is cured with the first and second connection terminals 12 and 17 sandwiching the conductive particles 52, and therefore the semiconductor element 10 and the wiring board 15 are electrically mechanical. Is also connected.

接着剤５が硬化する時の応力で半導体素子１０に反りが生じることがあり、半導体素子１０が細長の場合には、長手方向の中央部分よりも長手方向端部で接着剤５から剥離する力が強く働く。接着剤５の硬化率が低いと、半導体素子１０の長手方向の端部が接着剤５から剥離するが、本発明によれば半導体素子１０の長手方向の端部に位置する接着剤５の硬化率は小さくならないので、半導体素子１０の長手方向の端部は剥離されない。
従って、本発明の接続方法により製造された電気装置１は、従来の接続方法によって製造された電気装置に比べて接続信頼性が高い。 When the adhesive 5 is cured, the semiconductor element 10 may be warped, and when the semiconductor element 10 is elongated, the force to peel from the adhesive 5 at the end in the longitudinal direction rather than the central portion in the longitudinal direction. Works strongly. If the curing rate of the adhesive 5 is low, the end of the semiconductor element 10 in the longitudinal direction peels from the adhesive 5, but according to the present invention, the adhesive 5 positioned at the end of the semiconductor element 10 in the longitudinal direction is cured. Since the rate does not decrease, the end of the semiconductor element 10 in the longitudinal direction is not peeled off.
Therefore, the electrical device 1 manufactured by the connection method of the present invention has higher connection reliability than the electrical device manufactured by the conventional connection method.

以上は、ヘッド本体３１に熱伝導率の異なる部分を設ける場合について説明したが、本発明はこれに限定されるものではない。図６の符号６０は本発明第二例の加熱ヘッドを示しており、この加熱ヘッド６０はヘッド本体６１と、２つの凸部６２とを有している。   Although the above has described the case where the head body 31 is provided with portions having different thermal conductivities, the present invention is not limited to this. Reference numeral 60 in FIG. 6 shows a heating head according to a second example of the present invention. The heating head 60 has a head body 61 and two convex portions 62.

ヘッド本体６１は細長にされており、凸部６２はヘッド本体６１の細長の一側面の両端に互いに離間して配置されている。上述した素子本体１１の長さは、凸部６２と凸部６２の間の距離よりも長く、かつ、ヘッド本体６１の長さよりも短くなっている。   The head main body 61 is elongated, and the convex portions 62 are spaced apart from each other at both ends of one elongated side surface of the head main body 61. The length of the element body 11 described above is longer than the distance between the protrusions 62 and 62 and shorter than the length of the head body 61.

従って、加熱ヘッド６０をヘッド本体６１の長手方向が素子本体１１の長手方向と平行に向けた状態で、そのヘッド本体６１の長手方向の中心と、素子本体１１の長手方向の中心とを一致させるように位置合わせを行うと、素子本体１１の長手方向の両端部上に凸部６２がそれぞれ配置され、その状態で加熱ヘッド６０を素子本体１１上に押し付けると、素子本体１１の長手方向の両端部に凸部６２の先端が接触するが、素子本体１１の長手方向の中央部分は凸部６２の高さだけヘッド本体６１と離間した状態になる。   Therefore, in the state where the longitudinal direction of the head main body 61 is oriented parallel to the longitudinal direction of the element main body 11, the center of the longitudinal direction of the head main body 61 and the center of the longitudinal direction of the element main body 11 are matched. When the alignment is performed as described above, the convex portions 62 are respectively arranged on both ends of the element body 11 in the longitudinal direction. When the heating head 60 is pressed onto the element body 11 in this state, both ends of the element body 11 in the longitudinal direction are arranged. The tip of the convex portion 62 comes into contact with the portion, but the central portion of the element body 11 in the longitudinal direction is separated from the head main body 61 by the height of the convex portion 62.

従って、加熱手段６５に通電してヘッド本体６１を昇温させると、素子本体１１の長手方向の両端部にはヘッド本体６１から直接熱が伝えられるため、伝熱量が多くなる。他方、素子本体１１の長手方向の中央部分には、ヘッド本体６１の熱が長手方向の端部を介して伝わるため、素子本体１１の長手方向の中央部分への伝熱量は、その長手方向の両端部に比べて小さくなる。従って、接着剤５への伝熱量は素子本体１１の長手方向の両端部で小さくならず、半導体素子１０の長手方向の両端部は接着剤５で強固に固定されることになる。   Therefore, when the heating means 65 is energized to raise the temperature of the head body 61, heat is directly transmitted from the head body 61 to both ends in the longitudinal direction of the element body 11, and the amount of heat transfer increases. On the other hand, the heat of the head main body 61 is transmitted to the central portion in the longitudinal direction of the element main body 11 through the end portion in the longitudinal direction, so that the amount of heat transfer to the central portion in the longitudinal direction of the element main body 11 is in the longitudinal direction. Smaller than both ends. Accordingly, the amount of heat transfer to the adhesive 5 is not reduced at both ends in the longitudinal direction of the element body 11, and both ends in the longitudinal direction of the semiconductor element 10 are firmly fixed by the adhesive 5.

以上は１つの加熱ヘッドに凸部を設け、凸部の先端と素子本体１１の長手方向の端部とを接触させる場合について説明したが、本発明はこれに限定されるものではなく、例えば２台の加熱ヘッドをそれぞれ素子本体１１の長手方向の両端部にだけに接触させて接着剤５を加熱硬化させてもよい。   The above has described the case where a convex portion is provided on one heating head and the tip of the convex portion and the end portion in the longitudinal direction of the element body 11 are brought into contact with each other. However, the present invention is not limited to this. The adhesive 5 may be cured by heating by bringing the heating heads of the table into contact with both ends of the element body 11 in the longitudinal direction.

以上は、半導体素子１０を加熱して接着剤５を熱硬化させる場合について説明したが、本発明はこれに限定されるものではない。
図７（ａ）の符号７０は本発明の加熱装置である加熱ステージを示している。この加熱ステージ７０は、ステージ本体７１と、加熱手段７５とを有している。ステージ本体７１は高熱伝導部７２と、低熱伝導部７３とを有しており、配線板１５をステージ本体７１上に配置すると配線板１５の基板１６が低熱伝導部７３と高熱伝導部７２の両方が配線板１５に接触するようになっている。 Although the case where the semiconductor element 10 is heated and the adhesive 5 is thermally cured has been described above, the present invention is not limited to this.
The code | symbol 70 of Fig.7 (a) has shown the heating stage which is a heating apparatus of this invention. The heating stage 70 includes a stage main body 71 and a heating means 75. The stage main body 71 has a high heat conduction portion 72 and a low heat conduction portion 73. When the wiring board 15 is arranged on the stage main body 71, the substrate 16 of the wiring board 15 has both the low heat conduction portion 73 and the high heat conduction portion 72. Is in contact with the wiring board 15.

加熱手段７５は低熱伝導部７３と高熱伝導部７２の両方に渡って埋設されており、加熱手段７５に通電すると、低熱伝導部７３と高熱伝導部７２の両方が同時に加熱される。   The heating means 75 is embedded over both the low heat conduction portion 73 and the high heat conduction portion 72. When the heating means 75 is energized, both the low heat conduction portion 73 and the high heat conduction portion 72 are heated simultaneously.

第一例の加熱ヘッド３０の場合と同様に、低熱伝導部７３は低熱伝導材料で構成され、高熱伝導部７２は低熱伝導材料よりも熱伝導率の高い高熱伝導材料で構成されているので、低熱伝導部７３と高熱伝導部７２が同じ加熱手段７５で加熱されると、配線板１５の高熱伝導部７２に接触した部分は低熱伝導部７３に接触した部分に比べて多くの熱量が伝達されることになる。ここでは高熱伝導部７２は二箇所設けられ、低熱伝導部７３は高熱伝導部７２と高熱伝導部７２の間に位置に、高熱伝導部７２と直線状に並べて配置されている。   As in the case of the heating head 30 of the first example, the low heat conduction part 73 is made of a low heat conduction material, and the high heat conduction part 72 is made of a high heat conduction material having a higher thermal conductivity than the low heat conduction material. When the low heat conduction part 73 and the high heat conduction part 72 are heated by the same heating means 75, a portion of the wiring board 15 that is in contact with the high heat conduction part 72 transmits a larger amount of heat than the part that is in contact with the low heat conduction part 73. Will be. Here, two high heat conduction parts 72 are provided, and the low heat conduction part 73 is arranged between the high heat conduction part 72 and the high heat conduction part 72 and arranged in a straight line with the high heat conduction part 72.

高熱伝導部７２と低熱伝導部７３の並べられた方向を並び方向とすると、低熱伝導部７２の並び方向の長さは、被着体である半導体素子１０の長手方向の長さよりも短く、かつ、２つの高熱伝導部７２の並び方向の長さと、低熱伝導部７３の並び方向の長さを足した長さは、半導体素子１０の長さよりも長くなっている。   When the direction in which the high heat conduction part 72 and the low heat conduction part 73 are arranged is taken as the arrangement direction, the length in the arrangement direction of the low heat conduction part 72 is shorter than the length in the longitudinal direction of the semiconductor element 10 that is the adherend, and The length obtained by adding the length in the arrangement direction of the two high heat conduction portions 72 and the length in the arrangement direction of the low heat conduction portions 73 is longer than the length of the semiconductor element 10.

従って、加熱ステージ７０上に配線板１５と接着剤５とを配置し、半導体素子１０を、素子本体１１の長手方向と並び方向と平行にし、その長手方向の中央部分が低熱伝道部７３の並び方向の中央部分上に位置するように位置あわせを行い、素子本体１１を接着剤５上に配意すると、素子本体１１の長手方向の両端部が高熱伝導部７２上にそれぞれ配置され、長手方向の中央部分が低熱伝導部７３上に配置される（図７（ｂ））。   Therefore, the wiring board 15 and the adhesive 5 are arranged on the heating stage 70, the semiconductor element 10 is parallel to the longitudinal direction of the element main body 11 and the alignment direction, and the central portion in the longitudinal direction is the alignment of the low heat transmission parts 73. When alignment is performed so as to be positioned on the central portion of the direction and the element body 11 is arranged on the adhesive 5, both end portions in the longitudinal direction of the element body 11 are respectively disposed on the high heat conducting portion 72, and the longitudinal direction Is disposed on the low thermal conductive portion 73 (FIG. 7B).

第一例の加熱ヘッド３０の場合と同様に、高熱伝導部７２からの伝熱量は低熱伝導部７３からの伝熱量よりも大きくされているので、配線板１５への伝熱量は素子本体１１の長手方向の端部位置で、その長手方向の中央位置よりも多くなる。 従って、配線板１５端部や接着剤５端部が外気で冷却されたとしても、接着剤５の硬化率は素子本体１１の長手方向の端部で小さくならず、半導体素子１０の長手方向の端部は接着剤５で強固に固定されるので、半導体素子１０に反りが生じても長手方向の端部で剥離が起こらず、導通信頼性の高い電気装置が得られる。   As in the case of the heating head 30 of the first example, the amount of heat transferred from the high heat conducting portion 72 is larger than the amount of heat transferred from the low heat conducting portion 73, so the amount of heat transferred to the wiring board 15 is More at the end position in the longitudinal direction than at the center position in the longitudinal direction. Therefore, even if the end of the wiring board 15 or the end of the adhesive 5 is cooled by the outside air, the curing rate of the adhesive 5 is not reduced at the end in the longitudinal direction of the element body 11, but in the longitudinal direction of the semiconductor element 10. Since the end portion is firmly fixed with the adhesive 5, even if the semiconductor element 10 is warped, peeling does not occur at the end portion in the longitudinal direction, and an electrical device with high conduction reliability is obtained.

以上は、ヘッドとステージのいずれか一方の加熱手段を設け、配線板１５と半導体素子１０のいずれか一方だけを加熱する場合について説明したが、本発明はこれに限定されるものではなく、半導体素子１０の長手方向の端部が位置する部分の伝熱量が、半導体素子１０の長手方向の中央部分が位置する部分の伝熱量よりも多くなるのであれば、ヘッドとステージの両方に加熱手段を設け、配線板１５と半導体素子１０の両方を加熱することもできる。   The above has described the case where either one of the head and the stage is provided and only one of the wiring board 15 and the semiconductor element 10 is heated, but the present invention is not limited to this, and the semiconductor If the heat transfer amount in the portion where the end portion in the longitudinal direction of the element 10 is located is larger than the heat transfer amount in the portion in which the central portion in the longitudinal direction of the semiconductor element 10 is located, heating means are provided for both the head and the stage. It is also possible to heat both the wiring board 15 and the semiconductor element 10.

また、加熱ヘッド３０や加熱ステージ７０等の加熱装置に、高熱伝導部３２、７２と低熱伝導部３３、７３を設ける場合には、高熱伝導部３２、７２が細長の電気部品の両端部に配置されるのであれば、高熱伝導部３２、７２の数や形状および低熱伝導部３３、７３の数や形状も特に限定されるものではない。   Further, when the high heat conduction parts 32 and 72 and the low heat conduction parts 33 and 73 are provided in the heating device such as the heating head 30 and the heating stage 70, the high heat conduction parts 32 and 72 are arranged at both ends of the elongated electrical component. If so, the number and shape of the high heat conduction parts 32 and 72 and the number and shape of the low heat conduction parts 33 and 73 are not particularly limited.

以上は、加熱装置に低熱伝導部と高熱伝導部を設ける場合について説明したが、本発明はこれに限定されるものではない。図８（ａ）の符号８９は冷却装置である放熱ステージを示しており、放熱ステージ８９は配線板１５が載置されるステージ本体８６を有している。   Although the above has described the case where the low heat conduction portion and the high heat conduction portion are provided in the heating device, the present invention is not limited to this. Reference numeral 89 in FIG. 8A denotes a heat radiating stage as a cooling device, and the heat radiating stage 89 has a stage body 86 on which the wiring board 15 is placed.

ステージ本体８６は、低熱伝導材料で構成された低熱伝導部８７と、該低熱伝導材料よりも熱伝導率の高い高熱伝導材料で構成された高熱伝導部８８とを有している。低熱伝導部８７と高熱伝導部８８は直線状に並んで配置されておおり、低熱伝導部８７と高熱伝導部８８が並べられた方向を並び方向とすると、低熱伝導部８７は、高熱伝導部８８の並び方向の両端に配置されている。   The stage main body 86 has a low heat conductive portion 87 made of a low heat conductive material and a high heat conductive portion 88 made of a high heat conductive material having a higher thermal conductivity than the low heat conductive material. The low heat conduction part 87 and the high heat conduction part 88 are arranged in a straight line. When the direction in which the low heat conduction part 87 and the high heat conduction part 88 are arranged is an arrangement direction, the low heat conduction part 87 is a high heat conduction part. 88 are arranged at both ends in the arrangement direction.

上述した半導体素子１０の素子本体１１の長手方向の長さは、高熱伝導部８８の並び方向の長さよりも長くされ、かつ高熱伝導部８８の並び方向の長さと、２つの低熱伝導部８７の並び方向の長さの合計よりは短くされている。   The length in the longitudinal direction of the element body 11 of the semiconductor element 10 described above is longer than the length in the arrangement direction of the high heat conduction portions 88, and the length in the arrangement direction of the high heat conduction portions 88 and the two low heat conduction portions 87. It is shorter than the total length in the line direction.

従って、放熱ステージ８９上に上述した配線板１５を配置し、配線板１５上に接着剤５を配置した後、半導体素子１０を素子本体１１の長手方向と上述した並び方向とが平行になるように接着剤５上に配置し、素子本体１１の長手方向の中央部分が高熱伝導部８８の並び方向の中央部分上に位置するように半導体素子１０を接着剤５上に配置させると、素子本体１１の長手方向の両端部が低熱伝導部８７上に位置し、素子本体１１の長手方向の中央部分が高熱伝導部８８上に位置する。   Therefore, after the wiring board 15 described above is disposed on the heat radiation stage 89 and the adhesive 5 is disposed on the wiring board 15, the semiconductor element 10 is arranged so that the longitudinal direction of the element body 11 and the above-described alignment direction are parallel to each other. When the semiconductor element 10 is disposed on the adhesive 5 such that the longitudinal central portion of the element body 11 is positioned on the central portion in the alignment direction of the high heat conducting portions 88, the element body 11 is disposed on the adhesive 5. 11, both end portions in the longitudinal direction are located on the low heat conduction portion 87, and a central portion in the longitudinal direction of the element body 11 is located on the high heat conduction portion 88.

図８（ｂ）の符号８０は加熱ヘッドを示しており、予め加熱手段８５に通電してヘッド本体８１を昇温させておき、加熱ヘッド８０を半導体素子１０に押し当てると、ヘッド本体８１が素子本体１１に接触し、素子本体１１が昇温する。ここではヘッド本体８１の熱伝導率は均一にされており、従ってヘッド本体８１から素子本体１１の長手方向の両端部と中央部分へ伝わる伝熱量は略等しくなる。   Reference numeral 80 in FIG. 8B denotes a heating head. When the heating body 85 is energized in advance to raise the temperature of the head body 81, and the heating head 80 is pressed against the semiconductor element 10, the head body 81 is The element body 11 comes into contact with the element body 11 and the temperature rises. Here, the thermal conductivity of the head main body 81 is made uniform, and therefore, the amount of heat transferred from the head main body 81 to both ends and the central portion of the element main body 11 in the longitudinal direction is substantially equal.

放熱ステージ８９には加熱手段が設けられておらず、放熱ステージ８９の温度は半導体素子１０が加熱されている間は、ヘッド本体８１の温度よりも常に低くなるようにされているので、素子本体１１から接着剤５へ伝わった熱の一部は、配線板１５を通って、配線板１５から放熱ステージ８９へ放熱される。   The heat radiating stage 89 is not provided with heating means, and the temperature of the heat radiating stage 89 is always lower than the temperature of the head main body 81 while the semiconductor element 10 is heated. Part of the heat transferred from 11 to the adhesive 5 passes through the wiring board 15 and is radiated from the wiring board 15 to the heat radiation stage 89.

上述したように、素子本体１１の長手方向の両端部は低熱伝導部８７上に位置し、長手方向の中央部分は高熱伝導部８８上に位置しており、配線板１５から低熱伝導部８７へ放熱される熱量は、配線板１５から高熱伝導部８８へ放熱される熱量よりも小さいので、素子本体１１の長手方向の両端部が位置する部分では、中央部分に比べて蓄積される熱量が多くなる。   As described above, both end portions in the longitudinal direction of the element body 11 are located on the low heat conduction portion 87, and a central portion in the longitudinal direction is located on the high heat conduction portion 88, and from the wiring board 15 to the low heat conduction portion 87. Since the amount of heat dissipated is smaller than the amount of heat dissipated from the wiring board 15 to the high heat conduction portion 88, the amount of heat accumulated in the portion where both end portions in the longitudinal direction of the element body 11 are located is larger than that in the central portion. Become.

従って、素子本体１１の端部や接着剤５の端部が外気で冷却されたとしても、素子本体１１の長手方向の両端部で蓄積される熱量が多くなることで、素子本体１１の長手方向両端部に位置する接着剤５の硬化率が低くならず、素子本体１１の長手方向の両端部は接着剤５で強固に固定された状態になる。   Therefore, even if the end portion of the element body 11 and the end portion of the adhesive 5 are cooled by the outside air, the amount of heat accumulated at both ends in the longitudinal direction of the element body 11 increases, so that the longitudinal direction of the element body 11 The curing rate of the adhesive 5 positioned at both ends is not lowered, and both ends in the longitudinal direction of the element body 11 are firmly fixed by the adhesive 5.

尚、放熱ステージ８９に冷却手段を取り付け、素子本体１１を加熱するときに、該冷却手段によって高熱伝導部８８と低熱伝導部８７の両方を冷却するようにすれば、加熱中に放熱ステージ８９の温度を、ヘッド本体８１の温度よりも常に低くすることができる。   If the cooling means is attached to the heat radiation stage 89 and the element body 11 is heated, both the high heat conduction portion 88 and the low heat conduction portion 87 are cooled by the cooling means. The temperature can always be lower than the temperature of the head body 81.

以上は、配線板１５に冷却装置である放熱ステージ８９を接触させる場合について説明したが、本発明はこれに限定されるものではない。   Although the case where the heat radiation stage 89 which is a cooling device is brought into contact with the wiring board 15 has been described above, the present invention is not limited to this.

例えば、加熱手段が設けられたステージに配線板１５を配置する場合には、冷却装置である放熱ヘッドに高熱伝導部と低熱伝導部とを設けておき、低熱伝導部が素子本体１１の長手方向の両端部に接触し、高熱伝導部が素子本体１１の長手方向の中央部分に接触するように放熱ヘッドを半導体素子１０に押し当てる。   For example, when the wiring board 15 is disposed on a stage provided with a heating means, a high heat conduction portion and a low heat conduction portion are provided in a heat dissipation head that is a cooling device, and the low heat conduction portion is in the longitudinal direction of the element body 11. The heat-radiating head is pressed against the semiconductor element 10 so that the high heat conduction part is in contact with the center part in the longitudinal direction of the element body 11.

放熱ヘッドの温度をステージ温度よりも低く維持しながら配線板１５の加熱を行えば、加熱ステージから接着剤５へ伝わる熱の一部は素子本体１１から放熱ヘッドへ放熱される。   If the wiring board 15 is heated while maintaining the temperature of the heat dissipation head lower than the stage temperature, part of the heat transmitted from the heating stage to the adhesive 5 is dissipated from the element body 11 to the heat dissipation head.

素子本体１１の長手方向の両端部は低熱伝導部に接触し、長手方向の中央部分は高熱伝導部に接触するので、素子本体１１の長手方向の両端部から放熱ヘッドに放熱される熱量は、素子本体１１の長手方向の中央部分に比べて少なくなり、素子本体１１の長手方向の端部位置で接着剤５に蓄積される熱量が多くなる。   Since both end portions in the longitudinal direction of the element body 11 are in contact with the low heat conduction portion, and a central portion in the longitudinal direction is in contact with the high heat conduction portion, the amount of heat radiated from the both ends in the longitudinal direction of the element body 11 to the heat dissipation head is Compared to the central portion of the element body 11 in the longitudinal direction, the amount of heat stored in the adhesive 5 at the end position of the element body 11 in the longitudinal direction increases.

従って、素子本体１１の端部や接着剤５の端部が外気で冷却されたとしても、上述した図８（ａ）、（ｂ）に示した場合と同様に、素子本体１１の長手方向の両端部に位置する接着剤の硬化率が小さくならず、素子本体１１の長手方向の両端部が強固に固定される。   Therefore, even if the end portion of the element body 11 and the end portion of the adhesive 5 are cooled by the outside air, the longitudinal direction of the element body 11 is the same as the case shown in FIGS. The curing rate of the adhesive located at both ends is not reduced, and both ends in the longitudinal direction of the element body 11 are firmly fixed.

以上は、冷却装置である放熱ヘッドや放熱ステージを用いる場合に、加熱装置である加熱ヘッドや加熱ステージの本体の熱伝導率が均一な場合について説明したが本発明はこれに限定されるものではなく、図１、図６に示した加熱ヘッド３０、６０と、図８に示した放熱ステージ８９とを一緒に用いたり、図７に示した加熱ステージ７０と、上述した放熱ヘッドとを一緒に用いることも可能である。   The above is a case where the heat conductivity of the main body of the heating head or heating stage as the heating device is uniform when using the heat dissipation head or heat dissipation stage as the cooling device, but the present invention is not limited to this. 1 and 6, the heating heads 30 and 60 shown in FIG. 6 and the heat radiation stage 89 shown in FIG. 8 are used together, or the heating stage 70 shown in FIG. It is also possible to use it.

低熱伝導部３３、７３を構成する低熱伝導材料と、高熱伝導部３２、７２を構成する高熱伝導材料は、高熱伝導材料の熱伝導率が低熱伝導材料の熱伝導率よりも高いのであれば特に限定されるものではない。   The low thermal conductive material constituting the low thermal conductive parts 33 and 73 and the high thermal conductive material constituting the high thermal conductive parts 32 and 72 are particularly if the thermal conductivity of the high thermal conductive material is higher than the thermal conductivity of the low thermal conductive material. It is not limited.

本発明に用いる第一、第二の電機部品も半導体素子や配線板に限定されるものでなく、例えば細長の配線板である第一の電気部品を、他の配線板である第二の電気部品に接続することもできる。   The first and second electric parts used in the present invention are not limited to semiconductor elements and wiring boards. For example, a first electric part that is an elongated wiring board is replaced with a second electric part that is another wiring board. It can also be connected to parts.

本発明に用いる接着剤５の種類も特に限定されるものではない。接着剤５に用いる熱硬化性樹脂はエポキシ樹脂の他、アクリル樹脂、ウレタン樹脂等種々のものを用いることができる。また、熱硬化性樹脂と導電性粒子の他に、熱可塑性樹脂、着色剤、老化防止剤等を接着剤５に添加したものを用いることもできる。   The type of the adhesive 5 used in the present invention is not particularly limited. As the thermosetting resin used for the adhesive 5, various resins such as an acrylic resin and a urethane resin can be used in addition to the epoxy resin. Moreover, what added the thermoplastic resin, the coloring agent, the antiaging agent, etc. to the adhesive agent 5 other than a thermosetting resin and electroconductive particle can also be used.

接着剤５に添加する導電性粒子５２も特に限定されるものではなく、樹脂粒子の表面に金属メッキ層等の導電層を設けたものや、金属粒子等種々のものを用いることができる。また、接着剤５に導電性粒子５２を添加せず、加熱押圧の際に端子１２、１７同士を直接接触させることで、電気部品１０、１５同士を電気的に接続することもできる。また、加熱ヘッド３０や加熱ステージ７０等の加熱装置に設ける加熱手段の数や種類も特に限定されるものではない。   The conductive particles 52 added to the adhesive 5 are not particularly limited, and various types such as those in which a conductive layer such as a metal plating layer is provided on the surface of the resin particles or metal particles can be used. Moreover, the electrical components 10 and 15 can also be electrically connected by making the terminals 12 and 17 contact directly at the time of a heating press, without adding the electroconductive particle 52 to the adhesive agent 5. FIG. Further, the number and types of heating means provided in a heating device such as the heating head 30 and the heating stage 70 are not particularly limited.

本発明第一例の加熱ヘッドを説明する断面図Sectional drawing explaining the heating head of 1st example of this invention 本発明に用いる第一の電気部品の一例を説明する平面図The top view explaining an example of the 1st electric component used for this invention （a）、（ｂ）：本発明の接続方法の一例を説明する断面図(A), (b): Sectional drawing explaining an example of the connection method of this invention 本発明に用いる接着剤の一例を説明する断面図Sectional drawing explaining an example of the adhesive agent used for this invention 本発明の接続方法で製造された電気装置の一例を説明する断面図Sectional drawing explaining an example of the electric equipment manufactured with the connection method of this invention 本発明第二例の加熱ヘッドを説明する断面図Sectional drawing explaining the heating head of 2nd example of this invention （a）、（ｂ）：加熱ステージを用いて接続を行う工程の断面図(A), (b): Cross-sectional view of the process of connecting using a heating stage （a）、（ｂ）：放熱ステージを用いて接続を行う工程の断面図(A), (b): Cross-sectional view of the process of connecting using a heat radiation stage 従来技術の接続方法で製造された電気装置の一例を説明する断面図Sectional drawing explaining an example of the electric equipment manufactured with the connection method of the prior art

符号の説明Explanation of symbols

１……電気装置 １０……第一の電気部品（半導体素子） １１……第一の本体（素子本体） １２……第一の端子 １５……第二の電気部品（配線板） １６……第二の本体（基板） １７……第二の端子 ３０、６０……加熱装置（加熱ヘッド） ３１、６１……ヘッド本体 ３５、６５、７５、８５……加熱手段 ７０……加熱ステージ ７１……ステージ本体 ７２……高熱伝導部 ７３……低熱伝導部   DESCRIPTION OF SYMBOLS 1 ... Electrical apparatus 10 ... 1st electrical component (semiconductor element) 11 ... 1st main body (element main body) 12 ... 1st terminal 15 ... 2nd electrical component (wiring board) 16 ... Second body (substrate) 17 ... second terminal 30, 60 ... heating device (heating head) 31, 61 ... head body 35, 65, 75, 85 ... heating means 70 ... heating stage 71 ... … Stage body 72 …… High heat conduction part 73 …… Low heat conduction part

Claims (3)

第一、第二の電気部品の間に熱硬化性樹脂からなる接着剤を配置し、前記第一の電気部品の第一の本体を加熱装置によって加熱して前記接着剤を加熱硬化し、前記第一、第二の電気部品の第一、第二の端子同士を電気的に接続する接続方法であって、
前記第一の本体は細長にされ、前記第一の電気部品の前記第一の端子は前記第一の本体の少なくとも長手方向の端部に配置され、
前記加熱装置はその熱伝導率が２００W／ｍ・ｋ以上である高熱伝導部と、その熱伝導率が１００W／ｍ・ｋ未満である低熱伝導部とを有し、
前記第一の本体の加熱は、前記高熱伝導部を前記第一の本体の長手方向の端部に押し当てて、前記低熱伝導部を前記第一の本体の前記長手方向の中央部分に押し当て、
前記加熱装置を前記第一の本体に押し当てた状態で、前記加熱装置を昇温させ、熱伝導により第一の本体を加熱する接続方法。 An adhesive made of a thermosetting resin is disposed between the first and second electrical components, the first body of the first electrical component is heated by a heating device to heat and cure the adhesive, A connection method for electrically connecting the first and second terminals of the first and second electrical components,
The first body is elongated, and the first terminal of the first electrical component is disposed at least in a longitudinal end of the first body;
The heating device has a high thermal conductivity part whose thermal conductivity is 200 W / m · k or more and a low thermal conductivity part whose thermal conductivity is less than 100 W / m · k,
The heating of the first main body is performed by pressing the high heat conductive portion against the longitudinal end portion of the first main body and pressing the low heat conductive portion against the central portion of the first main body in the longitudinal direction. ,
A connection method in which the heating device is heated while the heating device is pressed against the first main body, and the first main body is heated by heat conduction. 第一、第二の電気部品の間に熱硬化性樹脂からなる接着剤を配置し、前記第一の電気部品の第一の本体を加熱装置によって加熱して前記接着剤を加熱硬化し、前記第一、第二の電気部品の第一、第二の端子同士を電気的に接続する接続方法であって、
前記第一の本体は細長にされ、前記第一の電気部品の前記第一の端子は前記第一の本体の少なくとも長手方向の端部に配置され、
前記加熱装置を前記第一の本体に押し当てた状態で、前記加熱装置を昇温させ、熱伝導により前記第一の本体を加熱するものであり、
前記加熱装置は凸部を有し、
前記第一の本体の加熱は、前記凸部の先端を前記第一の本体の長手方向の端部に押し当てて加熱し、前記第一の本体の中央部は凸部と高さだけ離間した状態で加熱し、
長手方向の両端部を強固に接着剤で固定させる接続方法。 First, an adhesive made of a thermosetting resin between the second electrical component is arranged to heat curing the adhesive by heating the first body of the first electrical component by the pressurized heat device, A connection method for electrically connecting the first and second terminals of the first and second electrical components,
The first body is elongated, and the first terminal of the first electrical component is disposed at least in a longitudinal end of the first body;
With the heating device pressed against the first main body, the heating device is heated, and the first main body is heated by heat conduction,
The heating device has a convex portion,
The heating of the first main body is performed by pressing the front end of the convex portion against the end portion in the longitudinal direction of the first main body, and the central portion of the first main body is separated from the convex portion by a height. Heated in a state,
A connection method in which both ends in the longitudinal direction are firmly fixed with an adhesive. 請求項１記載の接続方法に用いられる加熱装置であって、
前記加熱装置は、装置本体と、加熱手段とを有し、前記装置本体を被着体に押し当て、前記加熱手段に通電すると、熱伝導により前記装置本体が昇温し、前記被着体が加熱されるように構成され、
前記装置本体は、低熱伝導部と、高熱伝導部とを有し、前記高熱伝導部は前記低熱伝導部を構成する材料よりも熱伝導率の高い材料で構成された高熱伝導部とを有する加熱装置。 A heating device used in connection process of claim 1 Symbol placement,
The heating apparatus includes an apparatus main body and a heating unit. When the apparatus main body is pressed against an adherend and the heating unit is energized, the apparatus main body is heated by heat conduction, and the adherend is Configured to be heated,
The apparatus main body has a low heat conduction part and a high heat conduction part, and the high heat conduction part has a high heat conduction part made of a material having a higher thermal conductivity than a material constituting the low heat conduction part. apparatus.
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PCT/JP2005/014418 WO2006016532A1 (en) 2004-08-09 2005-08-05 Method of connecting electric component and heater
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