JP3477123B2 - Power converter - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power conversion device used for applications such as an inverter and a rectifier.

[0002]

2. Description of the Related Art In recent years, power converters have been facing a problem of increased heat generation loss as the capacity and speed of power semiconductor elements have increased. Therefore, it is an important issue to improve the cooling efficiency of the power semiconductor element cooling device, cope with an increase in heat generation loss, and avoid increasing the size of the device.

Diodes, thyristors, GTOs, IGBTs and the like are used as power semiconductor elements in a power converter, and a heat pipe cooler is used as a cooling device thereof.

In a conventional general power converter, a semiconductor stack having a laminated structure of a power semiconductor element and a laterally arranged heat pipe cooler, a snubber resistor and a snubber resistor for suppressing a current suddenly flowing through the semiconductor element. A capacitor is placed on the frame to form a module,
Such a module has a structure in which the modules are housed and arranged in a vertically stacked state in the main body frame.

On the other hand, in recent years, it has been proposed to use a vertically arranged heat pipe type cooler in order to reduce a planar projected area. Such a vertically arranged heat pipe type cooler has been proposed. When the semiconductor stack configured by using it is directly installed in the main body frame, if it is arranged vertically in a stacked state, the heat radiation fins of the heat pipes are extended in the upward direction and extend for a long time. The height dimension is extremely unrealistic.
Therefore, when the vertically arranged heat pipe cooler is used, it is advantageous to arrange the semiconductor stacks in the depth direction of the main body frame which is a horizontal direction at a right angle to the vertically arranged heat pipe cooler.

[0006]

However, in order to directly fix the semiconductor stack using the vertically arranged heat pipe cooler in the main body frame and to arrange the semiconductor stack in the horizontal direction in the main body frame, A method of supporting the stack, a method of fixing the stack, and a method of arranging the semiconductor stack are important issues.

When arranging a plurality of semiconductor stacks in the depth direction in the main body frame, maintenance and inspection work such as replacement of semiconductor elements is performed from the front and back of the main body frame for the front and rear row semiconductor stacks. However, it is difficult to perform maintenance work on the semiconductor stacks arranged between the front row and the last row.

The present invention has been made paying attention to such a point, and an object thereof is to stably support and fix a semiconductor stack using a vertically arranged heat pipe cooler, Another object of the present invention is to provide a power conversion device that can easily and efficiently perform maintenance work.

[0009]

In order to achieve such an object, the invention of claim 1 is directed to a semiconductor element, a heat receiving block provided in contact with the semiconductor element, and a plurality of heat radiating elements provided in the heat receiving block. A semiconductor stack including a cooler having a heat pipe having fins, a pressure contact means for press-contacting the semiconductor element and the cooler, and a support member insulatingly supporting the heat receiving block of the semiconductor stack from below. A main body frame for accommodating the semiconductor stack and the supporting member.

According to a second aspect of the present invention, in the power conversion device according to the first aspect of the invention, the heat pipe is fixed to a support portion provided on the main body frame.

The invention of claim 3 is the power supply of the invention of claim 1.
In the force conversion device, an upper portion of the heat pipe is fixed to a support portion provided on the main body frame on an air intake side of the heat radiation fin.

The invention of claim 4 is based on the invention of claims 1 to 3.
The power conversion device of the present invention is characterized in that the pressure contact means of the semiconductor stack is fixed to a support portion provided on the main body frame.

[0013]

[0014]

[0015]

[0016]

[0017]

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, the same reference numerals indicate the same parts or corresponding parts.

1 to 3 show a first embodiment, FIG. 1 is a front view of a flat type semiconductor stack, FIG. 2 is a plan sectional view, and FIG. 3 is a side view.

The semiconductor stack 1 in this embodiment
Is a diode 2 as a power semiconductor device,
A pair of vertically arranged heat pipe type coolers 3 for cooling the diode 2 is provided, and the heat pipe type cooling 3 and the diode are arranged so that the diode 2 is arranged between the pair of heat pipe type coolers 3. 1 and 1 are stacked, and the stacked state is held by the pressure contact means 4.

The vertically arranged heat pipe type cooler 3 is provided with a heat receiving block 6 made of a metal such as copper having excellent electric conductivity and heat conductivity, and is attached to an upper portion of the heat receiving block 6 and extends vertically above the heat receiving block 6. For example, it is composed of three heat pipes 7, a large number of radiating fins 8 mounted across these heat pipes 7, and a terminal plate 9 for connecting external terminals attached to the lower part of the heat receiving block 6. The diode 2 is sandwiched between the heat receiving block 6 of the one cooler 3 and the heat receiving block 6 of the other cooler 3 which face each other.

The pressure contact means 4 is provided with a pair of push plates 11 and 12 provided outside the heat receiving block 6 so as to face each other with the heat receiving block 6 of the cooler 3 interposed therebetween.
As shown in FIG. 2, studs 13 are provided between both ends of the push plates 11 and 12. These studs 13
Has one end fixed to one pressing plate 11 and the other end penetrating the other pressing plate 12 to project to the outer surface side thereof, and a disc spring 14 as an elastic member is attached to the projecting part. A spring retainer 15 is mounted so as to straddle between the protrusions, and a nut 16 is screwed to the screw portion 13a at the end of the stud 13 on the outside of the spring retainer 15.

Spherical seats 17 are provided inside the pressing plates 11 and 12, respectively, and an insulating seat 18 such as an insulator is provided between the spherical seats 17 and the heat receiving block 6, and the pressing by tightening the nut 16 is performed. By moving the plates 11 and 12 toward each other, the insulating seat 18, the heat receiving block 6, and the diode 2 in the stacked state are pressed against each other via the spherical seat 17, and the stacked state is stabilized by this pressing action. Is held.

When the nut 16 is tightened, the disc spring 1
4, the insulating seat 18, the heat receiving block 6 and the diode 2 are elastically pressed against each other, and the displacement of the heat receiving block 6 due to the heat generation of the diode 2 due to the thermal expansion causes the elastic force of the disc spring 14. It is designed to be absorbed by deformation.

Radiating fins 8 provided on the heat pipe 7
Are provided so as to be vertically overlapped with each other with a certain gap therebetween as shown in FIG. And these radiation fins 8 are
The horizontal portion 8a, the first inclined portion 8b that extends obliquely downward from the one end side edge of the horizontal portion 8a, and is inclined, and the horizontal portion 8a.
And a second inclined portion 8c that extends obliquely upward from the other end side edge and is inclined, and the heat pipe 7 sequentially penetrates the horizontal portion 8a of each heat radiation fin 8.

The semiconductor stack 1 configured as described above is housed in the main body frame 20, and the main body frame 20
Inside, it is supported from below by a pair of insulators 22 on the crosspiece 21 as a support portion. That is, the terminal plate 9 of the semiconductor stack 1 is in contact with the insulator 22 as a supporting member provided on the crosspiece 21 so that the entire semiconductor stack 1 is from the lower side of the heat receiving block 6 of the vertically arranged cooler 3. It is supported via an insulator 22. The insulator 22 is formed of a material having a high heat resistance and a small friction coefficient, for example, a synthetic resin such as a fluorine resin, or another material.

As described above, the semiconductor stack 1 using the vertically arranged heat pipe cooler 3 is supported from below the heat receiving block 6 via the insulator 22 to stably support the semiconductor stack 1. You can

FIG. 4 shows a second embodiment. In this embodiment, the semiconductor stack 1 is mounted on the crosspiece 21 in the main body frame 20 via one insulator 22 to form the heat receiving block 6. It is supported from below. Even in such a support structure, the vertically arranged heat pipe cooler 3
The semiconductor stack 1 using the can be stably supported.

FIGS. 5 and 6 show a third embodiment. In this embodiment, as in the case of the first and second embodiments, the vertically arranged heat pipe cooler 3 is used.
The semiconductor stack 1 using the above is supported from below, and the upper portion of the heat pipe 7 is fixed to the crosspiece 24 as a support portion in the main body frame 20 via the support 23. That is, the support 23 has the horizontal portion 23a.
And a vertical portion 23b, the horizontal portion 23a of the support 23 is fixed to the upper portion of the heat pipe 7, and the vertical portion 23b extending vertically upward from the horizontal portion 23a is an insulator or the like. It is fixed to the crosspiece 24 via an insulator 25.

As described above, in the support structure in which the semiconductor stack 1 is supported from the lower side thereof, and the upper portion of the heat pipe 7 is fixed to the crosspiece 24 via the support 23, the vertically arranged heat pipe cooler is used. The semiconductor stack 1 using 3 can be supported in a more stable state.

In the third embodiment, the upper portion of the heat pipe 7 is fixed to the crosspiece member 24, but not limited to the upper portion, for example, the middle part of the heat pipe 7 in the longitudinal direction is crosspiece. It may be fixed to the material 24.

7 to 9 show a fourth embodiment. In this embodiment, as in the case of the third embodiment, the semiconductor stack 1 is supported from below and heat is further applied. The upper portion of the pipe 7 is fixed to the crosspiece 24 via the support 23, and the position of the fixed portion by the support 23 is the first inclined portion 8 of the heat radiation fin 8.
It is located above b.

In the vertically arranged heat pipe type cooler 3, the inclined lower end side of the first inclined portion 8b of each radiating fin 8 attached to the heat pipe 7 is the air intake side,
The inclined upper end side of the second inclined portion 8c is the air discharge side.
That is, the air around the heat pipe cooler 3 is subjected to natural convection, and as shown by arrows in FIG.
From the air intake side on the lower end side of the slope of the first inclined portion 8b to sequentially flow into the gaps between the radiating fins 8 and rise, while flowing out from the air discharge side on the upper end side of the inclined of the second inclined portion 8c. Then it flows above it. The heat pipe 7 is cooled through the heat radiation fins 8 by the circulation of such air.

Here, it is assumed that the vertical portion 23 of the support 23 is
If b is arranged at a position above the second inclined portion 8c of the heat dissipation fin 8, the air flowing upward through the gap between the second inclined portions 8c will rise to the vertical portion 23b of the support 23.
The flow of the air is impeded by hitting the insulator 25 and the insulator 25, and as a result, the flow of air passing between the radiating fins 8 is disturbed and stagnant, and the cooling efficiency is reduced.

However, in the fourth embodiment, the fixing position of the heat pipe 7 by the support 23 is arranged above the first inclined portion 8b of the heat radiation fin 8, that is, above the air suction side, and therefore, the first position. The air rising upward through the gap between the two inclined portions 8c flows smoothly without any hindrance, so that the radiation fin 8
The air flows through the space without stagnation, and the cooling efficiency is improved.

FIG. 10 shows a fifth embodiment,
In this embodiment, the semiconductor stack 1 uses four vertically arranged heat pipe coolers 3 and has a structure in which two diodes 2 are stacked in series. That is,
The four coolers 4 are divided into two groups adjacent to each other, one diode 2 is provided between the heat receiving blocks 6 of the cooler 3 in one of the groups, and the heat receiving block of the cooler 3 in the other group. Another diode 2 is provided between 6 and further, as an interference prevention means made of a conductor between the heat receiving block 6 of the cooler 3 in one set and the heat receiving block 6 of the cooler 3 in the other set. A spacer 28 is provided, and the distance between the opposing surfaces is maintained at a predetermined size by the spacer 28, and the stacked state of the diode 2 and the heat receiving block 6 of the cooler 3 is held by the pressure contact means 4.

In such a structure, the space between the one set of the coolers 3 and the other set of the coolers 3 adjacent to each other is kept at a predetermined size by the spacers 28, and therefore, they are adjacent to each other. It is possible to prevent the radiation fins 8 of the cooler 3 of one set from interfering with the radiation fins 8 of the cooler 3 of the other set.

FIG. 11 shows a sixth embodiment.
In this embodiment, the semiconductor stack 1 is configured by using two vertically arranged heat pipe type coolers 3, and one side of the radiating fins 8 attached to the heat pipe 7 of each cooler 3 is formed. Part, semiconductor stack 1
An overhanging portion 29 is integrally formed so as to extend outward from the outer surface of the heat receiving block 6 in the stacking direction of the components.

The radiating fin overhanging portion 29 in one of the coolers 3 and the radiating fin 8 in the other cooler 3
The protruding portions 29 are formed so as to protrude from the diode 2 on the opposite side, that is, in the direction away from the diode 2 with the diode 2 as a boundary.

In such a structure, the area of each radiating fin 8 of the heat pipe cooler 3 is expanded by the amount of the overhanging portion 29 to increase the contact area with air, and each of the overhanging portion 29 is heated. Since low-temperature air flows through these overhanging portions 29 so as to extend away from the diode 2 which is the generation source of the above, higher cooling efficiency can be obtained.

FIG. 12 shows a seventh embodiment.
In this embodiment, as in the case of the fifth embodiment, two vertically arranged heat pipe coolers 3 are used to stack two diodes 2 in series. Then, the heat radiation fins 8 of the cooler 3 in one set supporting the one diode 2 and the heat radiation fins 8 of the cooler 3 in the other set supporting the other one diode 2 are the sixth heat radiation fins 8. The structure has an overhanging portion 29 similar to that of the embodiment.

The heat receiving block 6 of the cooler 3 in the one set facing each other and the cooler 3 in the other set facing each other
A spacer 28 made of a conductor is provided between the heat receiving block 6 and the heat receiving block 6.
The spacer 28 prevents interference between the overhanging portion 29 of the heat radiation fin 8 in one set and the overhanging portion 29 of the heat radiation fin 8 in the other set which are arranged to face each other.

FIG. 13 shows an eighth embodiment.
In this embodiment, as in the case of the seventh embodiment, four diodes 2 are stacked in series using four vertically arranged heat pipe coolers 3 and one of the diodes 2 is supported. Each of the heat radiation fins 8 of the cooler 3 in the above group and each heat radiation fin 8 of the cooler 3 in the other group supporting the other one diode 2 respectively have the projecting portions 29. The difference is that one diode 2 and another diode 2 are stacked in series so that the same polarity faces each other.

Therefore, in the case of this embodiment, the heat receiving blocks 6 facing each other with the spacer 28 interposed therebetween are kept at the same voltage with the same polarity.

A ninth embodiment is shown in FIGS. 14 and 15, and in this embodiment, two vertically arranged heat pipe coolers 3 and one diode 2 constitute a semiconductor stack 1. The heat pipe type cooler 3 is supported from below by an insulator 22 mounted on a crosspiece 21 in the body frame.

On the other hand, one pressing plate 11 of the pressure contact means 4 for pressing the constituent elements of the semiconductor stack 1 to hold the stacked state thereof supports the crosspiece 30 in the main body frame 31.
The spring retainer 15 is fixed to the crosspiece 33 via the support 32.

In this way, the heat pipe cooler 3 is supported on the crosspiece 21 in the main body frame from the lower side through the insulator 22, and the push plate 11 and the spring retainer 15 of the pressure contact means 4 are main body. In the structure in which the crosspieces 30 and 33 are fixed in the frame, the semiconductor stack 1 is more stably supported.

Although the spring retainer 15 is fixed to the crosspiece 33 and held in a fixed position, the stud 13 penetrates the push plate 12 and the spring retainer 15 slidably, so that the structure of the semiconductor stack 1 is constituted. The elements are elastically pressed in the stacking direction by the disc spring 14, and the displacement in the stacking direction due to thermal expansion of the semiconductor stack 1 is absorbed by the elastic deformation of the disc spring 14.

16 and 17 show a tenth embodiment. In this embodiment, as in the case of the ninth embodiment, two vertically arranged heat pipe type coolers 3 and 1 are provided. A semiconductor stack 1 is composed of two diodes 2, and its heat pipe cooler 3 is supported from below by an insulator 22 mounted on a crosspiece 21 in the main body frame.

Then, one pressing plate 11 of the pressure contact means 4 is fixed to the crosspiece 30 in the main body frame via a support. Then, the disc spring 1 is extended from one of the push plates 11.
4, spring retainer 15, stud 13 that penetrates nut 16
A support plate 35 is provided between the ends on the tip side of the support plate 35, and the support plate 35 is fixed to the stud 13 by a pair of nuts 36 and 37. It is fixed at 39.

Even in such a structure, the semiconductor stack 1 is stably supported, and the constituent elements of the semiconductor stack 1 are elastically pressed in the stacking direction by the disc springs 14 due to thermal expansion of the semiconductor stack 1 or the like. The displacement in the stacking direction is absorbed by the elastic deformation of the disc spring 14.

FIG. 18 shows an eleventh embodiment. In this embodiment, the upper surface of the insulator 22 which supports the vertically arranged heat pipe cooler 3 constituting the semiconductor stack 1 from the lower side is It has an uneven shape.

That is, in the example shown in FIG. 5A, a plurality of convex portions 22a are integrally formed on the upper surface of the insulator 22 with a certain interval, and the heat pipe type is provided on the upper surface of the insulator 22 between the convex portions 22a. The terminal plate 9 of the cooler 3 is in contact with the heat pipe type cooler 3 and is supported from below the heat receiving block 6.

Further, in the example of FIG. 6B, a plurality of recesses 22b are formed on the upper surface of the insulator 22 at regular intervals, and the heat pipe cooler 3 of the heat pipe cooler 3 is provided on the upper surface of the insulator 22 between the recesses 22b. The terminal plate 9 contacts and the heat pipe type cooler 3 is supported from the lower side of the heat receiving block 6.

In such a structure, the insulator 22 between the terminal plate 9 of one heat pipe type cooler 3 and the terminal plate 9 of the other heat pipe type cooler 3 which are adjacent to each other.
The creepage distance of the insulation on the surface of is increased, and the reliability of the insulation is improved.

FIG. 19 and FIG. 20 show a twelfth embodiment. In this embodiment, the main body frame 20 has a total of six storage sections, namely, three rows before and after in the depth direction and two rows on the left and right. 20a, each of these storage units 20a
The semiconductor stack 1 using the vertically arranged heat pipe type cooler 3 is housed therein.

The pair of storage portions 20a arranged side by side in the foremost row in the depth direction of the main body frame 20 are formed as independent units, and a hinge 41 is provided at the outer edge of the one end side thereof. The structure is such that it can rotate in the front-back direction with the fulcrum as a fulcrum.

In such a configuration, the maintenance and inspection work for the semiconductor stack 1 in the storage section 20a arranged in the front row of the main body frame 20a is performed through the front surface of the storage section 20a because the front surface of the storage section 20a is open. can do. Further, the maintenance and inspection work for the semiconductor stack 1 in the storage section 20a arranged in the last row of the main body frame 20 can be carried out through the rear surface of the storage section 20a because the rear surface thereof is open.

On the other hand, the storage section 20 arranged in the middle section
In a, the front and rear storage units 20 are in the front row.
Since maintenance is not possible because it is closed by the storage units 20a in the a and the last row, in this case, the storage units 20a arranged in the front row are rotated forward with the hinge 41 as a fulcrum. By this rotation, the storage portion 20a arranged in the middle portion
The front surface of the semiconductor stack 1 is opened, so that maintenance work can be performed on the semiconductor stack 1 inside the front surface of the semiconductor stack 1.

In this case, since the front and rear sides of the frontmost storage section 20a which has been rotated to the front side are opened, the front and rear sides of the semiconductor stack 1 in the storage section 20a are opened. Both sides can perform maintenance work efficiently.

In the twelfth embodiment, the storage unit 20a in the last row is supported by a hinge similarly to the storage unit 20a in the front row so that the body frame 20 can be rotated rearward. You may comprise.

In such a case, the frontmost and rearmost storage units 20a are rotated by rotating the frontmost storage units 20a forward and the rearmost storage units 20a rearward. Therefore, the semiconductor stack 1 in the storage section 20a can be efficiently maintained and inspected from both the front surface and the rear surface thereof.

FIG. 21 and FIG. 22 show a thirteenth embodiment. In this embodiment, the semiconductor stack 1 constituted by using the vertically arranged heat pipe type cooler 3 is a crosspiece in the main frame. Two insulators 2 on the material 21
It is supported from below by means of 2.

A guide rail 43 having an L-shaped cross section is attached to the upper surface of the insulator 22, and the lower end edge of the terminal plate 9 of each cooler 3 slidably contacts the guide rail 43. The semiconductor stack 1 can be moved horizontally along these guide rails 43.

In such a structure, at the time of maintenance and inspection of the semiconductor stack 1, the semiconductor stack 1 is moved along the guide rails 43 and pulled out from the inside of the main body frame, and the maintenance and inspection of the semiconductor stack 1 can be efficiently performed in this pulled out state. You can do it well.

FIG. 23 and FIG. 24 show a fourteenth embodiment. In this embodiment, the semiconductor stack 1 constituted by using the vertically arranged heat pipe type cooler 3 is a crosspiece in the main frame. One insulator 2 on the material 21
It is supported from below by means of 2.

A guide rail 44 having a U-shaped cross section is attached to the upper surface of the insulator 22, and the lower end edge of the terminal plate 9 of each cooler 3 is slidably contacted on the guide rail 44. The semiconductor stack 1 can be moved in the horizontal direction along these guide rails 44.

In such a structure, at the time of maintenance and inspection of the semiconductor stack 1, the semiconductor stack 1 is moved along the guide rails 44 and pulled out from the body frame.
In this pulled out state, the maintenance and inspection of the semiconductor stack 1 can be efficiently performed.

FIG. 25 shows a fifteenth embodiment. In this embodiment, the semiconductor stacks 1 each composed of the vertically arranged heat pipe type cooler 3 are arranged in parallel in the main body frame 20. Of the radiator fins 8 attached to the heat pipe 7 in the cooler 3, the inclination directions of the inclined portions 8b and 8c of the coolers 3 adjacent to each other are opposite to each other. There is.

That is, for example, the inclined portions 8b and 8c of the heat radiation fins 8 of the heat pipe 7 in the intermediate semiconductor stack 1 of the three semiconductor stacks 1 arranged in parallel are inclined obliquely upward to the left as viewed from the side surface thereof, The inclined portions 8b and 8c of the heat radiation fins 8 of the heat pipe 7 in the semiconductor stack 1 arranged adjacent to each other on the left side and the right side of the semiconductor stack 1 are inclined obliquely upward to the right.

In such a structure, the heat radiating fins 8 of the heat pipes 7 adjacent to each other face each other on the air discharge side and the air suction side, so that the heat radiating fins 8 on one side adjacent to each other discharge the air. The high temperature air discharged from the other side is prevented from flowing into the air intake side of the other radiation fin 8, and since the air discharge sides face each other and the air suction sides face each other, the natural convection velocity of the air also increases. By these synergistic effects, the cooling efficiency of the heat pipe cooler 3 is improved.

[0072]

As described above, according to the present invention,
The semiconductor stack using the vertically arranged cooler can be stably supported and fixed, and maintenance work can be performed easily and efficiently.

[Brief description of drawings]

FIG. 1 is a front view showing a first embodiment of the present invention.

FIG. 2 is a plan sectional view showing a first embodiment of the present invention.

FIG. 3 is a side view showing the first embodiment of the present invention.

FIG. 4 is a side view showing a second embodiment of the present invention.

FIG. 5 is a front view showing a third embodiment of the present invention.

FIG. 6 is a plan view showing a third embodiment of the present invention.

FIG. 7 is a side view showing a fourth embodiment of the present invention.

FIG. 8 is a plan view showing a fourth embodiment of the present invention.

FIG. 9 is a front view showing a fourth embodiment of the present invention.

FIG. 10 is a front view showing a fifth embodiment of the present invention.

FIG. 11 is a front view showing a sixth embodiment of the present invention.

FIG. 12 is a front view showing a seventh embodiment of the present invention.

FIG. 13 is a front view showing an eighth embodiment of the present invention.

FIG. 14 is a front view showing a ninth embodiment of the present invention.

FIG. 15 is a plan sectional view showing a ninth embodiment of the present invention.

FIG. 16 is a front view showing a tenth embodiment of the invention.

FIG. 17 is a plan sectional view showing a tenth embodiment of the present invention.

FIG. 18 is a front view showing an eleventh embodiment of the present invention.

FIG. 19 is a plan view showing a twelfth embodiment of the present invention.

FIG. 20 is a side view showing a twelfth embodiment of the present invention.

FIG. 21 is a front view showing a thirteenth embodiment of the present invention.

FIG. 22 is a side view showing a thirteenth embodiment of the present invention.

FIG. 23 is a front view showing a fourteenth embodiment of the present invention.

FIG. 24 is a side view showing a fourteenth embodiment of the present invention.

FIG. 25 is a side view showing a fifteenth embodiment of the present invention.

[Explanation of symbols]

1 ... Semiconductor stat 2 ... Diode (semiconductor element) 3 ... Vertically arranged heat pipe cooler 4 ... Pressure welding means 6 ... Heat receiving block 7 ... Heat pipe 8 ... Radiating fin 9 ... Terminal board 20 ... Body frame 21, 24, 30, 33, 39 ... Supporting part (crosspiece) 22 ... Insulator (support member) 28 ... Spacer (interference prevention means) 29 ... Overhanging part 41 ... Hinge 43, 44 ... Guide rail

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-6-204369 (JP, A) JP-A-4-7860 (JP, A) JP-A-1-233747 (JP, A) JP-A-8- 111483 (JP, A) JP 8-294266 (JP, A) JP 8-162789 (JP, A) JP 1-192153 (JP, A) JP 53-39433 (JP, A) Fukudairai 1-137546 (JP, U) Fudodaira 4-2049 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) F28D 15/02 H01L 23/46 H05K 7/20

Claims (4)

(57) [Claims] 1. A cooler having a semiconductor element, a heat receiving block provided in contact with the semiconductor element, and a heat pipe provided on the heat receiving block and having a plurality of heat radiation fins; and the semiconductor element and the cooler. A semiconductor stack having a pressure contact means for pressure contact, and a support member for insulatingly supporting the heat receiving block of the semiconductor stack from below ,
A power converter comprising: a main body frame that houses the semiconductor stack and the support member. 2. The heat pipe is fixed to a support portion provided on the body frame.
The power converter according to. 3. The upper part of the heat pipe is the radiating fin
At the air suction side, the power converter according to claim 1, characterized in that fixed to the support part is provided et the to the body frame. 4. The semiconductor stack pressure contact means is the book.
The power conversion device according to claim 1, wherein the power conversion device is fixed to a support portion provided on the body frame .