JP3454123B2 - LED lighting module - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED lighting module having a plurality of LED chips mounted on a substrate. [0002] Conventionally, LEDs (light emitting diodes) have been mainly used for display. In recent years, studies have been made on using LEDs for lighting purposes as a light source replacing incandescent lamps and fluorescent lamps. There has been proposed an LED lighting module formed by arranging a plurality of LEDs side by side on a substrate in order to secure luminance required for lighting. [0003] Generally, an LED is formed by sealing one bare chip with an epoxy resin and forming the shape of the sealing material into a substantially shell shape so that the light emission of the LED chip is reduced by the sealing material. And is formed to emit light in all directions on the front surface of the LED. When an LED lighting module is formed by arranging a plurality of such LEDs on a substrate, each LED emits light in all directions on the front surface, so that the light of the LEDs is dispersed and emitted, and the entire device emits light. There was a problem that the use efficiency of the system was poor. The present invention has been made in view of the above problems, and an object of the present invention is to control the direction of light emission of each LED chip to increase the efficiency of use of light emission of the entire device. To provide modules. According to the first aspect of the present invention, in order to attain the above object, the present invention comprises a plurality of LED chips and a substrate on which a plurality of LED chips are mounted. comprises a light control means for controlling the light distribution of the LED chips on the first surface and the second surface of the substrate provided on the substrate itself, the optical system
A through-hole through which the control means penetrates the front and back of the substrate formed on the substrate
And some of the LED chips have through holes in the substrate surface
In the formed part, the pn junction surface is substantially
At right angles, the light emission from the pn junction surface
Arranged in the direction radiated to the back side, the remaining LED chip
The pn junction surface is substantially parallel to the substrate surface
Then, light emitted from the pn junction surface is reflected by the substrate, and
Characterized in that it is arranged in a direction radiated to the surface side,
By changing the mounting direction of the ED chip,
To emit light from the LED chip on the front side and the back side
Can be. FIG. 1 shows a basic configuration of an LED lighting module according to the present invention. In this LED lighting module, the substrate 1 itself on which the plurality of LED chips 2 are arranged is:
Light control means 1 for controlling light distribution of each LED chip 2
Since the LED chip 2 is provided, the light distribution of the LED chip 2 can be controlled to a desired light distribution without providing any additional optical means other than the substrate 1, and the light use efficiency of the LED chip 2 is improved. Hereinafter, embodiments of the present invention will be described with reference to the drawings. REFERENCE EXAMPLE 1 As shown in FIG. 2, the LED lighting module of the reference example includes a substrate 1 having an outer diameter of approximately 50 mm.
The surface of the substrate 1 is polished and has a parabolic curved surface 1a as a light control means.
Are formed. A plurality of LED chips 2 are formed on the parabolic curved surface 1a of the substrate 1 such that the pn junction surface (the interface between the p-type semiconductor and the n-type semiconductor) is substantially perpendicular to the parabolic curved surface 1a.
Has been implemented. Here, since the LED chip 2 emits light in all directions in the pn junction plane, light is emitted from the LED chip 2 in a direction substantially perpendicular to the parabolic curved surface 1a,
The parabolic curved surface 1a is formed so that the light emission of the LED chip 2 is concentrated at one point in the space. Further, as shown in FIG. 3, a plurality of saw-tooth-shaped protrusions 1b as light control means may be formed on the surface of the substrate 1, and the LED chip 2 has a pn junction surface with respect to the surface of the protrusion 1b. It is mounted on the protrusion 1b so as to be substantially vertical.
Since the LED chip 2 emits light in all directions in the pn junction plane, the light emitted from the LED chip 2
It is almost perpendicular to the surface. Here, since the surfaces of the protrusions 1b are formed to be parallel to each other, a plurality of L
The light emitted from the ED chip 2 is parallel to each other, so that parallel light can be emitted from the LED lighting module, and the light use efficiency is improved. As described above, in consideration of the light distribution when a plurality of LED chips 2 are provided, the substrate surface where the LED chips 2 are mounted is formed in a three-dimensional shape such as a parabolic curved surface or a sawtooth shape. Therefore, there is no need to separately provide an optical unit for controlling the light distribution of the LED chip 2,
Light can be used efficiently. REFERENCE EXAMPLE 2 As shown in FIG. 4, the LED lighting module of this reference example includes a substrate 1, a plurality of LED chips 2 mounted on the surface of the substrate 1 in a matrix, and an adjacent LED. Chip 2
And a reflection plate 3 as a reflection member made of, for example, an aluminum film formed on the surface of the substrate 1. Book
In the reference example , an aluminum film having high reflection efficiency is used for the reflection plate 3. However, the reflection plate 3 is not limited to the aluminum film, but a metal material having a high reflectance such as silver other than the aluminum film is used. Needless to say, this is acceptable. If an insulator is used as the material of the reflection plate 3, L
The risk of short circuit between the wiring pattern (not shown) constituting the lighting circuit of the ED chip 2 or the LED chip 2 and the reflector 3 can be eliminated. By the way, the LED chip 2 emits light when electrons move on the pn junction surface by flowing a forward current through the pn junction, and the light emission direction is all directions in the pn junction surface. Therefore, when the LED chip 2 is disposed on the substrate 1 such that the pn junction surface is substantially perpendicular to the surface of the substrate 1, the LED chip 2 can be connected not only to the front surface of the substrate 1 but also to the substrate 1. Light is also emitted in a parallel direction or a direction toward the back surface of the substrate 1. Therefore, if only the three-dimensional shape of the substrate 1 is improved as in Reference Example 1 , LE
There is a limit to effectively using the light emission of the D chip 2.
Therefore, light emitted from the LED chip 2 in a direction substantially parallel to the substrate 1 is reflected in a desired direction by the reflector 3 as light control means, and is emitted from the LED chip 2 to the front side of the substrate 1. Not only direct light but also light radiated from the LED chip 2 in a direction substantially parallel to the substrate 1 can be used, and the efficiency of light emission of the LED chip 2 is increased, thereby increasing the brightness of the LED lighting module. . The reflecting plate 3 may be formed three-dimensionally so that light from the LED chip 2 can be reflected in a desired direction. Further, the reflector 3 may be formed so that the direct light emitted from the LED chip 2 to the front side of the substrate 1 and the light reflected by the reflector 3 are emitted in different directions.
Variations in the light distribution of the ED lighting module can be increased. ( Reference Example 3 ) In Reference Example 2 , the reflection plate 3 for reflecting the light emitted from the LED chip 2 in a desired direction is formed on the surface of the substrate 1, but in this Reference Example , FIG. As shown in (a) to (d), the reflector 3 is also used as the wiring pattern of the lighting circuit of the LED chip 2 formed on the surface of the substrate 1. In the LED lighting module of this embodiment , as shown in FIG. 5A, nickel plating layers 4 and 4 constituting a wiring pattern of a lighting circuit of the LED chip 2 are formed on the surface of the substrate 1. I have. Terminal portions 5 and 5 made of gold plating are formed at the ends of the nickel plating layers 4 and 4, respectively.
The p-type semiconductor and the n-type semiconductor of the ED chip 2 are mounted on the terminal portions 5 and 5, respectively, using solder or conductive paste.
Further, as shown in FIG. 5B, three LED chips 2 are connected in series in a forward direction via a nickel plating layer 4, and a unit 1 including the three LED chips 2 is formed.
0 are provided in three sets. Then, the nickel plating layers 4 at both ends of each unit 10 are short-circuited to each other via the short-circuit portion 12, and a circuit is formed in which three LED chips 2 connected in series are connected in parallel to each other. Here, the LED chip 2 is mounted such that the pn junction surface is substantially orthogonal to the surface of the substrate 1,
On the periphery of the substrate 1 on which the D chip 2 is mounted, a projection 1c is formed which is inclined so as to protrude toward the front side of the substrate 1 as the distance from the LED chip 2 increases, and a nickel plating layer formed on the surface of the projection 1c Reference numeral 4 reflects light emitted from the LED chip 2 in a desired direction. As described above, in the LED lighting module of the present embodiment , the nickel plating layer 4 forming the wiring pattern
Since the reflector also serves as a reflector, there is no need to separately form a reflector, and circuit design can be performed without considering contact between the reflector and the wiring pattern, thereby increasing design flexibility. In order to increase the amount of light reflected by the nickel plating layer 4 in the LED lighting module as a whole, the area of the non-conductive portion 13 on the surface of the substrate 1 should be minimized and the area of the nickel plating layer 4 should be increased. . REFERENCE EXAMPLE 4 A conventional light emitting diode is formed by potting an LED chip 2 with a substantially shell-shaped epoxy resin, and this epoxy resin plays a role of a lens.
Light is emitted in all directions on the front side of the D chip 2. However, when the plurality of LED chips 2 are mounted on the substrate 1 such that the pn junction surface is substantially orthogonal to the substrate, the light of the LED chips 2 which is blocked by the substrate 1 increases, and the light emission of the LED chips 2 is completely reduced. It becomes difficult to radiate around. Therefore, in the LED lighting module of the present embodiment , as shown in FIG.
1d is provided, and the LED chips 2 and 2 are disposed in the recesses 1d and 1d. Note that the LED chips 2 and 2
Since the n-junction surface is disposed so as to be substantially orthogonal to the front surface and the back surface of the substrate 1, the light emission from the LED chips 2 and 2 is radiated into the surface substantially orthogonal to the front and back surfaces of the substrate 1 Have been. In the present reference example , since the LED chips 2 and 2 constitute the light control means from the substrate 1 itself disposed on both the front and back surfaces, the LED chips 2 disposed on the rear surface side of the substrate 1 make the light control means. Radiate light also to the side
Light can be emitted in all directions within a plane orthogonal to the front and back surfaces of the LED lighting module, and this LED lighting module can be used in the same manner as a fluorescent lamp or an incandescent lamp. Further, by mounting the LED chips 2 on the front and back surfaces of the substrate 1, the mounting density of the LED chips 2 can be increased, and the brightness of the entire LED lighting module can be increased. Also, since the LED chip 2 is mounted on both front and back surfaces of the substrate 1, the LED chip 2 is mounted on the substrate 1
The variation of the light distribution can be increased as compared with the case of mounting on only one surface. REFERENCE EXAMPLE 4a Since the LED chip 2 emits light in all directions in the pn junction surface, the LED chip 2 is placed on the substrate 1 so that the pn junction surface is substantially orthogonal to the surface of the substrate 1. If installed,
Even if the shape of the substrate 1 and the mounting direction of the LED chip 2 are variously examined, it is difficult to utilize all the light emitted from the LED chip 2 because the light traveling from the LED chip 2 toward the substrate 1 is blocked by the substrate 1. . Therefore, in this embodiment , a light-transmitting resin is used as the material of the substrate 1 on which the LED chip 2 is mounted, and light emitted from the LED chip 2 to the substrate 1 is transmitted to the back surface of the substrate 1 and used. . The LED lighting module of the present embodiment is shown in FIG.
As shown in FIG. 1, a substrate 1 formed of a transparent acrylic resin, an LED chip 2 disposed on the substrate 1 such that a pn junction surface is substantially orthogonal to a surface of the substrate 1, and an LED chip 2 A transparent sealing material 6 formed on the surface of the substrate 1 for protection. In this example , the substrate 1
Although the acrylic resin is used as the material, the material of the substrate 1 is not limited to the acrylic resin, and a transparent resin such as a polycarbonate resin other than the acrylic resin may be used. As described above, since the substrate 1 and the sealing material 6 are formed of a material having a light transmitting property, light emitted from the LED chip 2 toward the substrate 1 passes through the substrate 1 and Light emitted from the back side of the LED chip 1 to the outside and emitted from the LED chip 2 to the front side of the substrate 1 (that is, the sealing member 6 side) passes through the sealing member 6 and is emitted to the outside. Therefore, by configuring the light control means with the substrate 1 itself formed of a translucent material, not only the light radiated from the LED chip 2 to the front side of the substrate 1 but also the light radiated to the substrate 1 side Can also be used, and the light use efficiency of the LED chip 2 can be increased. In this embodiment , the entire substrate 1 is formed of a transparent resin, but the LED chip 2
May be formed of a transparent resin only on the portion of the substrate 1 on which is mounted. Reference Example 5 By the way, in order to electrically connect the LED chip 2 mounted on the substrate 1 and the wiring pattern formed on the substrate 1, the LED chip 2 must be made of a metal such as aluminum. It is necessary to provide an electrode portion made of a material and connect the electrode portion and the wiring pattern of the substrate 1 with bonding wires. However, since the electrode portion formed on the LED chip 2 does not transmit light, the electrode portion forms an LED. There is a problem that light emission of the chip 2 is blocked and a shadow is generated. So the book
In the LED lighting module of the reference example, a light-transmitting transparent conductor is used for an electrode portion for supplying power to the LED chip 2 to prevent light emission of the LED chip 2 from being blocked. The LED lighting module of the present embodiment is shown in FIG.
As shown in FIG. 1, a resin substrate 1 that does not transmit light, an electrode portion 7a formed on the surface of the substrate 1, a plurality of LED chips 2 mounted on the electrode portion 7a, and a plurality of LED chips 2 And an electrode portion 7b provided on the upper surface. Both the electrode portions 7a and 7b are made of ITO (Indium-Tin) which is a transparent conductor.
oxide). Here, n-type semiconductor 2 ₁ of a plurality of LED chips 2 are electrically connected to one electrode portions 7a respectively, p-type semiconductor 2 ₂ are respectively electrically connected to the other electrode portion 7b. The electrode portion 7a is electrically connected to a wiring pattern (not shown) formed on the substrate 1, and the electrode portion 7b is connected to a bonding wire (not shown).
Is electrically connected to another wiring pattern formed on the substrate 1 through the LED chip 2 and the electrode portions 7a and 7
b, it is electrically connected to the wiring pattern. Also,
A projection 1c is formed on the substrate 1 between the adjacent LED chips 2, and light emitted from the pn junction interface of the LED chip 2 is reflected by the projection 1c of the substrate 1 and emitted in a desired light distribution direction. You. Here, since the electrode portions 7a and 7b are used for the electrode portion for electrically connecting the LED chip 2 and the wiring pattern, the light emission of the LED chip 2 causes the electrode portions 7a and 7b to emit light.
7b, the light use efficiency of the LED chip 2 is improved, and the light emission loss is reduced. In this reference example , ITO is used for the electrode portions 7a and 7b. However, this is not intended to limit the electrode portions 7a and 7b to ITO.
A transparent conductor such as CTO (Cadmium-Tin oxide) other than TO may be used. In addition, by using a light-transmitting substrate for the substrate 1, the light emission of the LED chip 2 is reduced.
This can prevent the light from being blocked, and the light emitting efficiency of the LED chip 2 is further improved. (Embodiment 1 ) As shown in FIG. 9, the LED lighting module of the present embodiment comprises a substrate 1 and an LED chip 2 arranged in a recess 1d formed on the surface of the substrate 1. In the portion of the substrate 1 where the recess 1d is formed, a through hole 1e as light control means penetrating the front and back of the substrate 1 is formed. The LED chip 2 is arranged to be substantially perpendicular to the pn junction surface is the surface of the substrate 1, n-type semiconductor ₂ 1, p-type semiconductor _{2 2} of the LED chip 2, respectively, on the substrate 1 It is electrically connected to the formed wiring pattern (not shown). Since light is emitted from the LED chip 2 in all directions in the pn junction plane, a part of the light emitted from the LED chip 2 is emitted to the surface side of the substrate 1 and
The remainder of the light emitted from the chip 2 is radiated to the back surface of the substrate 1 through the through hole 1e, so that light can be radiated to both the front and back surfaces of the substrate 1. Here, the pn junction surface is disposed on the surface of the substrate 1 so as to be substantially parallel to the surface of the substrate 1, and light emitted from the pn junction surface is reflected by the substrate 1 and emitted to the front side of the substrate 1. LED chip (not shown) to be mounted and an LED mounted on the substrate 1 in the direction shown in FIG.
When used in combination with the chip 2, light can be emitted to both the front and back surfaces of the substrate 1. A reflective material is applied to the inner wall of the through hole 1e to prevent light from the LED chip 2 from being absorbed by the substrate 1. (Embodiment 6 ) The LED lighting module of this embodiment is shown in FIG.
As shown in (b), the flexible substrate 1 'is made of, for example, vinyl chloride and has elasticity, and a plurality of LED chips 2 mounted on the surface of the flexible substrate 1'. Since the flexible substrate 1 'has elasticity and can be easily bent, the light of the LED chip 2 can be directed in a desired direction by bending the flexible substrate 1'. Therefore, when attaching this LED lighting module to a lighting fixture, by adjusting the degree of bending of the flexible board 1 ′ as the light control means,
The LED lighting module can be mounted while adjusting the light distribution of the LED lighting module. In this embodiment , the flexible substrate 1 '
Is formed from vinyl chloride, but the material of the flexible substrate 1 'is not limited to vinyl chloride, and may be formed from an epoxy resin. In addition, in order to make the flexible substrate 1 ′ as a whole easily bendable, the wiring of the lighting circuit of the LED chip 2 formed on the flexible substrate 1 ′ is made of a copper wire as much as possible, and the sealing material for sealing the LED chip 2 is LED. It is formed only on the periphery of the chip 2 so that the sealing material itself does not bend directly. ( Reference Example 7 ) As shown in FIG. 11, the LED lighting module of this reference example has a unit 1 in which a plurality of LED chips 2 are connected in series.
0 are connected in parallel, and each unit 10 is connected to a DC power supply DC via a transistor Tr to form a lighting circuit. When the transistor Tr is turned on and off, each LED chip 2 is turned on and off. . Here, each unit 10 is arranged on a substrate so as to be cut in units, and the number of LED chips 2 is switched by cutting the substrate 1 at a desired portion (for example, a dotted line A in FIG. 11). be able to. Here, the number of the LED chips 2 constituting each unit 10 is defined as a rated output of 10 W,
If the number of units is designed so that the same amount of light as that of a fluorescent lamp such as 15 W, 20 W, or 30 W can be obtained, the light output of the LED lighting module can be easily adjusted to a desired value by changing the number of units 10 used. Can be selected. A groove may be formed in a portion of the substrate surface corresponding to the boundary of each unit 10 so that the substrate can be easily cut in units. Can be separated. The power supply is configured so that the voltage value of the power supply voltage DC changes according to the number of the units 10 used. REFERENCE EXAMPLE 8 Since the light emitted from the LED chip 2 is monochromatic light, it is necessary to mix a plurality of emission colors to obtain white light such as sunlight. Using body luminescence, L
White light is obtained by mixing the light emission of the ED chip 2 and the light emission of the phosphor. The LED lighting module of this embodiment is shown in FIG.
As shown in FIG. 2A, the substrate 1, a recess 1d formed on the surface of the substrate 1, a phosphor 9 applied on the surface of the recess 1d, and an LED chip mounted in the recess 1d And 2. As shown in FIG. 12B, the emission spectrum of the phosphor 9 [B in FIG. 12B] is not the same emission spectrum as that of the LED chip 2 [A in FIG. Since the emission spectra of the two are different, the phosphor 9 is applied to the portion of the substrate 1 on which the LED chip 2 is mounted, so that the light of the LED chip 2 and the light of the phosphor 9 are mixed, and Light different from the second light can be obtained, and white light can be obtained depending on the light of the phosphor 9. However, since the light emission luminances of the LED chip 2 and the phosphor 9 are different, a filter (not shown) for adjusting the light emission luminance of both may be provided on the surface of the LED chip 2. Further, since there is a close relationship between the emission color of the LED chip 2 and the emission color of the phosphor 9, LE
In order to control the emission color as a whole D lighting module,
The LED chip 2 may be one that emits ultraviolet light or one that emits infrared light. [0039] (Reference Example 9) Figure 13 (a), a on the surface of the wiring pattern 11a formed on the substrate 1, such as an LED chip 2 and the n-type semiconductor _{2 1} toward the substrate 1 is solder or conductive implemented by like sex paste, if p-type semiconductor 2 ₂ of the LED chip 2 is wired to another wiring pattern 11b by a bonding wire 8, since the LED chip 2 for emitting in all directions in the pn junction surface, Bode The emission of the LED chip 2 is blocked by the binding wire 8. [0040] Therefore, in the LED lighting module of this reference example, pn junction surface is disposed on the substrate 1 so as to be substantially perpendicular to the surface of the substrate 1, n-type semiconductor 2 ₁ one wiring pattern 11a implemented by solder or conductive paste, p-type semiconductor 2 ₂ is mounted by the other of the wiring pattern 11b on the solder or conductive paste. The LED chip 2 is formed in a cubic shape with each side being approximately 0.3 mm, and a gap having a width of approximately 0.15 mm is provided between the wiring patterns 11a and 11b. As described above, the pn junction surface of the LED chip 2 is substantially orthogonal to the surface of the substrate 1, and the LED chip 2 is directly mounted on the wiring patterns 11a and 11b. A bonding wire for electrically connecting the LED chip 2 to the LED chip 2 is not required, so that light emission from the LED chip 2 is prevented from being blocked by the bonding wire, and the efficiency of light emission of the LED chip 2 can be improved. The first and second embodiments and the respective
The three-dimensional circuit molded product MID (Molded
A desired three-dimensional shape can be easily formed by using a resin molded substrate made of Interconnection Device).
The light distribution of the LED chip 2 can be distributed in a desired direction. Although any resin can be used as the MID material, a material (for example, a liquid crystal polymer) excellent in various characteristics such as electric characteristics and heat dissipation is desirable. The LEDs of the first and second embodiments and the reference examples
The LED chip 2 mounted on the lighting module may be a single color LED chip or a multi-color LED chip 2. As described above, the first aspect of the present invention comprises a plurality of LED chips and a substrate on which a plurality of LED chips are mounted on the surface, and the light distribution of each LED chip. A light control means for controlling the surface control and the back side of the substrate on the substrate itself, wherein the light control means is provided on the substrate.
Of the LED chip
Indicates a pn junction surface at a portion of the substrate surface where the through hole is formed.
Is substantially perpendicular to the surface of the substrate and emits light from the pn junction
Are arranged so that they are radiated to the back side of the substrate through the through holes
And the rest of the LED chip is
Surface is almost parallel to the surface of the substrate, and light emission from the pn junction
It is arranged so that it is reflected on the board and radiated to the front side of the board.
The mounting direction of the LED chip.
LED chips on the front and back sides of the board
There is an effect that light emission of the pump can be emitted.
Further, the light distribution of the LED chip can be controlled to a desired light distribution, and there is an effect that the light use efficiency of the LED chip can be increased . Be teeth, since the substrate itself is provided with a light control unit, it is not necessary to separately provide an optical member such as a lens to control the light distribution of the LED chips, thereby reducing the number of parts, to reduce the effort of assembly There is also an effect that can be. [0045]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing a basic configuration of an LED lighting module according to the present invention. FIG. 2 is a cross-sectional view showing an LED lighting module of Reference Example 1. FIG. 3 is a sectional view showing another LED lighting module according to the first embodiment; FIG. 4 is a top view showing the LED lighting module of Reference Example 2. FIG. 5 shows an LED lighting module of Reference Example 3,
(A) is an enlarged sectional view of a main part, (b) is a front view, (c) is a sectional view seen from below, and (d) is a sectional view seen from right side. FIG. 6 is a sectional view showing an LED lighting module of Reference Example 4. FIG. 7 is a sectional view showing an LED lighting module of Reference Example 4a . FIG. 8 is a sectional view showing an LED lighting module of Reference Example 5. FIG. 9 is a cross-sectional view illustrating the LED lighting module according to the first embodiment. FIG. 10 shows an LED lighting module of Reference Example 6,
(A) is an external perspective view, (b) is a sectional view. FIG. 11 is a circuit diagram showing an LED lighting module of Reference Example 7. FIG. 12 shows an LED lighting module of Reference Example 8,
(A) is a cross-sectional view, and (b) is a diagram showing a relationship between light wavelength and intensity. 13A and 13B are perspective views showing an LED lighting module of Reference Example 9. [Description of Signs] 1 Substrate 14 Light control means

Continuing from the front page (72) Inventor Toshiyuki Suzuki 1048 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Inventor Eiji Shiohama 1048 Odaka Kazuma Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Inventor Sugimoto Masaru Yamamoto 1048, Kadoma, Kadoma, Kadoma, Osaka Prefecture, Japan Inventor Shohei Yamamoto 1048, Kadoma, Kadoma, Kadoma, Osaka, Japan Inventor Jiro Hashizume 1048, Kadoma, Kadoma, Kadoma, Osaka, Japan Electric Works Co., Ltd. (72) Inventor Yasufumi Akiba 1048 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Inventor Koji Tanaka 1048 Kadoma, Kazuma Kadoma, Osaka Prefecture Matsushita Electric Works Co., Ltd. (56) References JP-A-62-235787 (JP, A) JP-A-9-51124 (JP, A) JP-A 1-24377 (JP, U) JP-A 54-150478 (JP, U) JP-A 60-45452 (JP, A) JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) F21V 19/00 F21S 8/04 H01L 33/00

Claims (1)

(57) Claims 1. A plurality of LED chips and a plurality of LEDs
Each chip is composed of a substrate with a chip mounted on the surface.
Light control means for controlling the light distribution of the D chip on the front side and the back side of the substrate, the light control means comprising:
And a through hole penetrating the front and back of the substrate formed at
Part of the ED chip is a part of the substrate surface where a through hole is formed
The pn junction surface is substantially perpendicular to the surface of the substrate,
Light emitted from the bonding surface radiates to the back side of the substrate through the through hole
And the rest of the LED chip is
The pn junction surface is substantially parallel to the surface of the substrate,
Light emitted from the surface is reflected by the substrate and radiated to the surface side of the substrate.
An LED lighting module , wherein the LED lighting module is arranged in a direction in which the LED lighting module is oriented .