JP3447948B2 - Method for manufacturing resin-encapsulated semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [0001] [0001] The present invention relates to a semiconductor chip and a semiconductor chip.
Resin-sealed semiconductor with lead frame sealed with sealing resin
The present invention relates to an apparatus manufacturing method and a sealing tape supply apparatus.
Yes, especially so that part of it is exposed from the sealing resin.
Related to the improvement of [0002] 2. Description of the Related Art In recent years, in order to cope with miniaturization of electronic equipment,
High-density mounting of semiconductor components mounted on electronic equipment
Is required, and accordingly, small semiconductor components
Molds and thinning are progressing. A conventional resin-encapsulated semiconductor device will be described below.
Will be explained. FIG. 21A shows a conventional resin-encapsulated semiconductor.
FIG. 21B is a plan view of the device, and FIG.
FIG. 3 is a cross-sectional view of a semiconductor device. [0005] As shown in FIGS.
Has an external electrode on the back side
This is a type of resin-sealed semiconductor device. A conventional resin-encapsulated semiconductor device has an inner
Lead 201, die pad 202, and die pad
A lead frame comprising a suspension lead 203 for supporting 202
With a frame. And on the die pad 202
The semiconductor chip 204 is joined by an adhesive,
Electrode pad (not shown) of conductor chip 204 and inner
Electrically connected to lead 201 by thin metal wire 205
Have been. Then, the die pad 202, the semiconductor chip
204, inner lead 201, suspension lead 203 and
The thin metal wire 205 is sealed with the sealing resin 6. This
In the structure shown in FIG.
There is no fat 206, and the back side of the inner lead 201
The inner lead 20 that is exposed and includes this exposed surface
The lower part of 1 is an external electrode 207. FIG. 21A shows that the sealing resin 206 is
Treated as a transparent body and show through the inside of the semiconductor device
However, in the figure, the semiconductor chip 204 is indicated by a broken line,
Illustration of the thin line 205 is omitted. Conventionally, printed circuit boards and the like
When mounting a resin-encapsulated semiconductor device on a mounting board,
Sealing tree required for joining the external electrodes and the electrodes of the mounting board
To secure stand-off height from the back of grease 206
Then, as shown in FIG.
A ball electrode 209 consisting of a pad is provided.
To secure the standoff height and mount on the mounting board
Was. Next, manufacturing of a conventional resin-encapsulated semiconductor device
The method will be described with reference to the drawings. FIG.
FIG. 26 shows a manufacturing process of a conventional resin-encapsulated semiconductor device.
FIG. First, as shown in FIG.
Lead frame 2 having lead 201 and die pad 202
Prepare 10 In the drawing, the die pad 202 is suspended.
Supported by reeds, but suspended
The illustration of the node is omitted. Also, the suspension leads are
The die pad 202 is upset.
Have been. The lead frame 210 has a resin
At the time of sealing, a tie bar is provided to stop the leakage of the sealing resin.
Not. Next, as shown in FIG.
The semiconductor chip 20 on the die pad 202 of the frame.
4 is bonded with an adhesive. This process is called a die
This is a bonding process. Then, as shown in FIG.
The semiconductor chip 204 bonded on the
Electrically connected to the circuit board 201 by a thin metal wire 205.
You. This step is a so-called wire bonding step.
Aluminum thin wire, gold (Au) wire
And the like are appropriately used. Next, as shown in FIG.
02, semiconductor chip 204, inner lead 201, suspension
The lead and the metal wire 205 are sealed with a sealing resin 206.
Stop. In this case, the semiconductor chip 204 is bonded to the
The transfer frame is stored in the sealing mold
-Molded, but especially the back surface of the inner lead 201
Is in contact with the upper or lower mold of the sealing mold,
Sealing is performed. Finally, after sealing the resin, the sealing resin 206
Tip 21 of inner lead 201 projecting outward
Cut 1 By this cutting process, the inner
The tip surface of the lead 201 is almost the same as the side surface of the sealing resin 6
On the surface, the lower part of the inner lead 201
It becomes the external electrode 207. Then, a conventional resin-encapsulated semiconductor device is manufactured.
In the manufacturing process, the sealing resin 206 is
-Wrapping around the back side of the lead 201
May protrude).
Is a cutting process of the inner lead 201 after the resin sealing step.
Before the process, a water jet to blow off resin burrs
A cutting process has been introduced. If necessary, as shown in FIG.
A ball electrode made of solder on the lower surface of the external electrode 207
To form a resin-sealed semiconductor device. In addition,
In some cases, a solder plating layer was formed instead of the metal plating layer. [0017] SUMMARY OF THE INVENTION However, the conventional
In a resin-encapsulated semiconductor device,
Therefore, the lower surface of the external electrode 207 and the surface of the sealing resin 206 are almost
Since it is on the same plane, the stand from the sealing resin 206
The off-height cannot be obtained. For this purpose, a solder
If the electrode 209 is provided and mounted on the mounting board,
Section that cannot be implemented efficiently
There was a title. In addition, manufacturing of a conventional resin-encapsulated semiconductor device
In the resin sealing step of the method, the semiconductor chip is bonded.
The lead frame is stored in the sealing mold and the
Press the inner lead to close contact and seal with resin
However, the sealing resin still exists on the back side of the inner lead
Wrap around the surface of the external electrode and apply resin burrs
However, there is a problem in that a small amount is generated. Therefore, conventionally, the resin on the external electrode 207
Water jet engineering to blow off burr 206a
Was introduced, but such a water jet engineering
Mass production of resin-encapsulated semiconductor devices
Contrary to the demand for simplification of processes such as process reduction in processes
You. In other words, the occurrence of resin burrs is a simplification of such a process.
It was a major impediment to the development. Also war
Turbet allows not only resin burrs but also soft metals
Large quality problems occur, such as plating being peeled off
There was a fear. An object of the present invention is to provide a resin sealing step
Suppresses resin burrs on the back of the lead frame,
Or the stand-off height of the external electrode from the sealing resin
Take measures that can be maintained and have such a structure
Sealing to obtain a resin-sealed semiconductor device in a mass production process
Manufacturing method of semiconductor deviceThe lawTo provide. [0021] Means for Solving the Problems The present inventionTreeFat-sealed semi-conductor
Body device manufacturing methodIs a sealWith die and semiconductor chipLee Do
flameAnd a first step of preparingNote lead frame
Second process for mounting the semiconductor chip on the die pad of the system
And a third step of heating the sealing tape;
Supply the sealed sealing tape continuously and attach it to the above sealing mold
And the inner lead of the lead frame.
Fifth step of attaching the back side of the pad to the sealing tape
When,The semiconductor chip and the aboveLead frame inner
ー Lead back sideThe part excluding the part is sealed in the sealing resin
6 steps. According to this method, the sealing resin among the peripheral members
The second step when there is a part to be surely exposed from
Make sure that the sealing tape is tightly
In this way, a structure in which that part is securely exposed from the sealing resin is realized.
Manifest. And resin burrs are formed on that part of the peripheral member
Water that was previously required
-It eliminates the need for processes such as jets,
The manufacturing process can be simplified. In addition, the sealing tape is continuously supplied and mounted.
Dramatically improves efficiency when using sealing tape
Can be improved by using a sealing tape with resin sealing
To make the manufacturing method of the fixed semiconductor device suitable for mass production.
Can be. [0024]AndPreheating the sealing tape
Supply the sealing tape to the sealing mold from above.And toThan,
Set the sealing tape to the appropriate temperature to apply tension to the sealing tape.
Can be heated, wrinkles in the sealing tape,
Sagging can be effectively reduced. [0025] [0026] [0027] DESCRIPTION OF THE PREFERRED EMBODIMENTS First, the present invention can be applied to each of the embodiments in common.
Of the present invention and a method of manufacturing the same
Will be described. FIG. 1A shows a resin-sealed mold half according to the present invention.
FIG. 1B is a plan view illustrating a structural example of the conductor device, and FIG.
FIG. 2 is a cross-sectional view taken along the line Ib-Ib shown in FIG. However
In FIG. 1A, the sealing resin 17 is a transparent body.
The semiconductor chip 15 has the outline shown by the broken line
The illustration of the thin metal wires 16 is omitted. As shown in FIGS. 1A and 1B,
The resin-encapsulated semiconductor device includes an inner lead 12 and a semiconductor
Die pad 13 for supporting body chip and die
Consists of suspension leads 14 for supporting pads 13
It has a lead frame. And die pad 13
The semiconductor chip 15 is bonded thereon with an adhesive,
Electrode pad (not shown) of semiconductor chip 15 and inner
The leads 12 are electrically connected to each other by thin metal wires 16.
Has been continued. Then, the inner lead 12 and the die pad
13, suspension leads 14, semiconductor chip 15 and fine metal
The wire 16 is sealed in the sealing resin 17. Also,
The pad 13 is positioned above the inner lead 12.
In the depressed portion 19 of the suspension lead 14 so that
Upset. Therefore, the sealing resin 17
In a more sealed state, the sealing resin 17 is
3 also exists thinly on the back side. Inner lead 12
There is no sealing resin 17 on the lower surface side of
The lower surface of the inner lead 12 is exposed.
Is the connection surface with the mounting board. That is, the inner
-The lower part of the lead 12 is an external electrode 18. Ma
In addition, this external electrode 18 is inherently used in the resin sealing process.
There is no resin burr that is the protruding part of the resin, and
This external electrode 18 is slightly lower than the back surface of the sealing resin 17.
It protrudes. There is no such resin burr and
The structure of the external electrode 18 protruding downward is described in the later-described manufacturing method.
It can be easily realized by the method. In such a resin-sealed semiconductor device,
There is an outer lead on the side of inner lead 12.
Instead, the lower part of the inner lead 12 becomes the external electrode 18.
Therefore, the size of the semiconductor device can be reduced. I
The lower surface of the inner lead 12, that is, the outer electrode 18
Since there is no resin burr on the bottom surface,
The reliability of joining with the pole is improved. Also, the external electrode 18
Since it is formed so as to protrude from the surface of the sealing resin 17, the actual
External electrodes when mounting a resin-encapsulated semiconductor device on a mounting board
When the external electrode 18 is connected to the electrodes of the mounting board,
This means that the standoff height is secured in advance. did
Therefore, the external electrode 18 is used as it is as an external terminal.
Can be mounted on the mounting board as before
There is no need to attach solder balls to the external electrodes 18;
This is advantageous in terms of man-hours and manufacturing costs. The die pad 13 has an inner lead.
12 and the sealing resin 17 is
Resin 13 because it is also thin on the back side of the pad 13
The reliability as a type semiconductor device is improved. Next, a method for manufacturing a resin-encapsulated semiconductor device will be described.
This will be described with reference to the drawings. 2 to 7
1 shows an example of a manufacturing process of a resin-encapsulated semiconductor device of the present invention.
It is sectional drawing. First, in the step shown in FIG.
12 and a die pad 13 for supporting a semiconductor chip
Is prepared. Figure
In the middle, the die pad 13 is supported by suspension leads.
However, since the suspension leads do not appear in this section,
Not. A depressed part is formed on the suspension lead.
The die pad 13 is larger than the surface of the inner lead 12.
It is set up at the top. Further, for
When the lead frame 20 is sealed with a resin,
Frame without tie bar to stop outflow of water
It is. Next, in the step shown in FIG.
Place the semiconductor chip 15 on the die pad of the frame
Then, they are joined to each other with an adhesive. This step is
This is a so-called die bonding process. In addition, the semiconductor chip
Supporting members are limited to lead frames
Rather, a member that can support other semiconductor chips, for example,
A TAB tape or a substrate may be used. Then, in the step shown in FIG.
3 and the semiconductor chip 15 and the inner lead 12
Are electrically connected by the thin metal wire 16. This process
Is a so-called wire bonding process. Metal wire
Aluminum thin wire, gold (Au) wire, etc.
Can be used. In addition, the semiconductor chip 15 and
The electrical connection with the inner lead 12 is made by connecting the thin metal wire 16.
It may be performed via a bump or the like instead of via a bump. Next, in the step shown in FIG.
Semiconductor chip 15 is bonded to the die pad 13 of FIG.
In the state, the sealing tape 21 is attached to the back side of the inner lead 12.
paste. This sealing tape 21 is particularly
The sealing resin does not flow around the back side of the gate 12 during resin sealing
To play the role of a mask
The presence of the sealing tape 21
To prevent resin burrs from being formed on the back of substrate 12
Can be. Sealing to be attached to the inner lead 12 and the like
The tape 21 is made of polyethylene terephthalate, polyimid
Based on resin containing polycarbonate and polycarbonate as main components
Tape that can be easily peeled off after sealing with resin.
And it is resistant to high-temperature environments during resin sealing.
If it is. Here, polyethylene terephthale
Using a tape whose main component is 50 g
did. Here, the sealing tape 21 is
Only adheres to the inner lead 12 surface of the lead frame
Affixed over the entire back side of the lead frame
Up and down by the depressed part of the suspension lead.
Not adhered to the back of the die pad 13
Is brought into close contact with the back surface of the die pad 13 to form a resin sealing step.
After the sealing tape 21 is peeled off, the back of the die pad 13 is removed.
The surface may be exposed to improve heat radiation characteristics. Next, in the step shown in FIG.
5 to which the sealing tape 21 is attached.
The frame is housed in the mold, and the sealing resin 17 flows into the mold.
Then, resin sealing is performed. At this time, the inner lead 12
Use a metal mold so that the sealing resin 17 does not
The tip 22 of the inner lead 12 of the lead frame
Press downward to seal with resin. Also, the inner lead
12 and press the sealing tape 21 surface on the back surface side to the mold surface side.
Perform resin sealing. Finally, in the step shown in FIG.
Peel off the sealing tape 21 attached to the back of the
External electrodes protruding from the back surface of the sealing resin 17
18 are formed. And the tip of the inner lead 12
22 is formed between the tip surface of the inner lead 12 and the sealing resin 17.
By separating the sides so that they are almost flush,
A resin-sealed semiconductor device as shown in FIG. 7 is completed. FIG. 8 is an enlarged view of a portion of the external electrode 18.
FIG. 3 is a partial back view of the resin-sealed semiconductor device. Shown in the figure
In this case, the sealing tape 21 is
Since the resin sealing process attached to the back of
The back and side surfaces of the inner leads 12, that is, the external electrodes 18
Of resin burrs on the surface of
You. Further, as in the conventional manufacturing method, the sealing resin 17 is
Part of the external electrode 18 is sealed around the surface of the external electrode 18.
It is possible to prevent the resin from being buried in the stopper resin 17. In the above manufacturing method, before the resin sealing step,
A sealing tape 21 is pasted on the back surface of the inner lead 12 in advance.
The sealing resin 17 does not wrap around,
A resin burr is formed on the back surface of
No occurrence. Therefore, the lower surface of the inner lead is exposed
The conventional method of manufacturing a resin-encapsulated semiconductor device
The resin burrs formed on the inner leads
It does not need to be removed by a jet or the like. Sand
In addition, to eliminate the troublesome process for removing this resin burr
Therefore, the steps in the mass production process of the resin-encapsulated semiconductor device
Can be simplified. Conventionally, water jets
May occur during the resin burr removal process
Nickel (Ni) and palladium on lead frames
(Pd), peeling of metal plating layers such as gold (Au)
Can be turned off. Therefore, each metal layer before the resin sealing process
Can be pre-plated. Note that, as shown in FIG.
The sealing table by the heat of the molten sealing resin.
As the tape 21 softens and thermally contracts,
The tape 12 greatly bites into the sealing tape 21 and the inner
A step is formed between the back surface of the lead 12 and the back surface of the sealing resin 17.
Is formed. Therefore, the back surface of the inner lead 12
Has a structure projecting from the back surface of the sealing resin 17,
-Standoff of external electrode 18 below lead 12
Height can be secured. Therefore, this protruding external electrode 1
8 can be used as it is as an external terminal
Become. The back surface of the inner lead 12 and the sealing resin
The size of the step between the back surface of the fat 17 and the
It can be controlled by the thickness of the sealing tape 21 attached.
Can be. Here, the sealing tape 21 of 50 [μm] is used.
Is used, the size of the step, that is, the external electrode 18
The amount of protrusion is generally about half that, and a maximum of 50 [μ
m]. That is, the sealing tape 21 is
The amount of the sealing tape 21 entering above the rear surface of the
The thickness of the external electrode 18 is determined by the thickness of
Self-controllable by the thickness of the stop tape 21
This facilitates fabrication. The protrusion of this external electrode 18
In order to control the output amount, it is necessary to use the sealing tape 21 in the mass production process.
You only need to control the thickness and there is no need to provide a separate process
Therefore, the above manufacturing method is extremely cost-effective for process control.
This is an advantageous method. Note that the sealing tape 21
In other words, the hardness of the material is adjusted according to the size of the desired step.
Degree, thickness, and heat softness can be determined
You. Note that, as shown in FIG.
In the encapsulated semiconductor device, on the back side of the die pad 13
Although the sealing resin 17 is present, its thickness is
Is very thin, equal to the upset amount of the pad 13. But
Therefore, this resin-sealed semiconductor device is substantially one-side sealed.
This is a stop type semiconductor device. Here, the sealing is performed before the resin sealing step.
Stop tape 21 for the inner lead 12 of the lead frame.
The example of pasting on the lower surface is shown.
Instead, set the sealing tape 21 in the sealing mold,
The lead frame 12 may be brought into close contact with the lead frame. This place
In this case, as described later, lead the sealing tape to the sealing mold.
Can be supplied, further streamlining the process. Here, on the back surface of the lead frame,
An example of a manufacturing method in which a sealing tape is attached and resin sealing is performed
As shown, the method of the present invention includes a lead frame.
However, the present invention is not limited to such semiconductor devices. Basic of the present invention
Using sealing tape in resin sealing process, which is a general concept
Is used to mount a semiconductor chip widely and use a resin-sealed member.
It can be applied to the resin sealing process of a semiconductor device having
Resin for semiconductor devices such as TAB type, substrate type, etc.
Applicable to the sealing step. Hereinafter, each embodiment of the present invention will be described.
You. In each of the following embodiments, a resin-sealed semiconductor device
Continuous supply of sealing tape to prevent
Method and resin sealing device provided with sealing tape supply device
Will be described with reference to the drawings. (First Embodiment) FIGS. 9A to 9C show the first embodiment of the present invention.
Sealing device with a sealing tape supply device
FIG. 3 is a perspective view illustrating a resin sealing step. FIG.
Is one process during the resin sealing process in the first embodiment.
It is sectional drawing which shows a process. As shown in FIG. 9A, the sealing mold is an upper mold.
The lower mold 151 includes a mold 151a and a lower mold 151b.
b, a large number of semiconductor product molding sections 160 (die cavities).
B) supplying the sealing resin to each semiconductor product molding unit 155
And a sealing resin flow path 161 for providing the same. Ma
The unwinding roll 156a and the winding roll 156b
Sealing tape continuously while applying constant tension between
152 can be unwound and wound up.
Has been established. Then, as shown in FIG.
The lead frame 153 on which the semiconductor chip is mounted is the lower mold
151b is supplied to the semiconductor product molding section 160, and the resin
The bullet 154a is connected to the sealing resin supply section of the lower mold 151b.
It is thrown. Next, as shown in FIG.
The mold 151a and the lower mold 151b are clamped,
The sealing resin melted from below by the
The resin-encapsulated semiconductor device 1 which is supplied to the product molding unit 160
55 is injection molded. And the injection molding ends
Then, the lower mold 151b opens. At this time, as soon as the lower mold 151b is opened,
The resin cull 154b and the resin-encapsulated semiconductor shown in FIG.
The sealing tape 152 is separated from the device 155. Ma
The sealing tape 152 is used in this resin sealing step.
The taken part is taken up by a take-up roll 156b,
The part used in the next resin sealing step is the unwinding roll 15
6a. Meanwhile, resin cull 154b and tree
The resin-sealed semiconductor device 155 is taken from the lower mold 151b.
Be sent out. According to the first embodiment of this embodiment, the winding
Between the take-out roll 156a and the take-up roll 156b
By supplying the sealing tape 152 continuously,
Resin sealing process using sealing tape can be performed quickly
It is possible to improve production efficiency. The unwinding roll 156a and the winding-up
By applying a rotational force to the roll 156b, the sealing tape
152 can be given an appropriate tension, and a resin sealing process can be performed.
The generation of wrinkles in the sealing tape 152 at the time of
Can be. FIGS. 18A and 18B show the supply of the sealing tape.
Resin sealing without equipment and without applying tension to the sealing tape
A perspective view of a resin sealing device for stopping
It is sectional drawing which shows one process in a grease sealing process. However
Then, in FIGS. 18A and 18B, FIGS.
The members denoted by the same reference numerals are as described above. This
In the case of, the sealing tape 152 is simply spread to form a sealing mold.
No tension is applied just by mounting. FIGS. 19 (a) and (b) correspond to FIGS.
As shown in (b), no tension is applied to the sealing tape
Shows the state inside the sealing mold when the resin sealing process was performed.
FIG. 2 is a cross-sectional view of a resin sealing body to be formed.
You. However, in FIGS. 19A and 19B, FIG.
The members denoted by the same reference numerals as (a) and (b) have already been described.
It is a cage. In this case, the sealing tape 152 is simply spread out.
Just attach it to the sealing mold and apply tension.
Not in. FIGS. 20 (a) and (b) correspond to FIGS.
As shown in (b), the tension is applied to the sealing tape.
Shows the state inside the sealing mold when performing the resin sealing step
It is sectional drawing and sectional drawing of the resin sealing body formed.
However, in FIGS. 19 (a) and 20 (a),
In order to display in the same vertical relationship as the stationary body, FIG.
It is displayed upside down from the state shown in FIG.
You. Resin sealing without applying tension to the sealing tape
Is carried out, the sealing tape becomes as shown in FIG.
Wrinkles, sagging, and tearing may occur. Soshi
When these wrinkles occur, they are
17 so that it is taken out after the resin sealing process
19 is provided on the back surface of the sealing resin 17 of the sealed resin sealing body.
As shown in (b), dents and the like may occur.
Was. When such dents occur, the appearance is impaired
Not only that, some of the sealed members may be exposed,
There is a possibility that cracks in the sealing resin 17 may occur. On the other hand, as in the present embodiment, the sealing table
To attach the tape to the sealing mold via the roll supply device.
Since a certain tension is applied to the sealing tape,
In the sealing step, as shown in FIG.
Wrinkles in the loop, or the sealing tape is pulled between the leads.
Can be suppressed. And the tree
The sealing tree of the resin sealing body taken out after the completion of the grease sealing process
No dents or wrinkles between leads occur on the back of grease 17.
Resin-encapsulated semiconductor with good appearance and characteristics
A device is obtained. In other words, the yield by reducing the defect rate
Can be improved. (Second Embodiment) FIG. 11 is a view showing a sealing TE according to the second embodiment of the present embodiment.
It is a perspective view of the resin sealing device provided with the loop supply device.
FIG. 12 shows a resin sealing step according to the second embodiment.
It is sectional drawing which shows one of the processes. As shown in FIG. 11, in the second embodiment,
The structure of the sealing die is shown in FIG. 9A.
Since the structure is the same as that of the sealing mold shown in the embodiment, FIG.
The description of the members denoted by the same reference numerals as in FIG.
I do. In this embodiment, four rotating rolls 159 are provided.
Between the four rotating rolls 159.
The hoop 152 is hung like a hoop. And the above
Any one of the four rotating rolls 159 is a driving roller.
Sealing tape
152 is rotated clockwise in the figure.
You. Also, the side of the sealing mold and the sealing tape 152 are sealed.
On the side sent from the mold, clean the sealing tape 152
Cleaner 165 is provided. Then, in substantially the same procedure as in the first embodiment,
Perform up to injection molding. That is, as shown in FIG.
And a lead frame 15 on which a large number of semiconductor chips are mounted.
3 is supplied to the semiconductor product molding section 160 of the lower mold 151b.
The resin tablet is connected to the sealing resin supply section of the lower mold 151b.
It is thrown into. Then, the upper mold 151a and the lower mold
The mold 151b is clamped and the piston 158 is moved downward.
The sealing resin melted from the
The resin-encapsulated semiconductor device 155 is supplied and injection-molded.
It is. When the injection molding is completed, the lower mold 151b
Opens. At the same time as the lower mold 151b is opened,
From the resin-sealed semiconductor device 155
The step 152 is separated. Also, the rotating roll 159 rotates
The sealing tape 152 rotates and clears.
Cleaned by the cleaner 165 and adheres to used parts
Resin scum, dust, and the like are removed. At this time,
The stop tape 152 has a hoop shape, and the hoop is once
Rotation changes the tape feed pitch, at least 2
Until the third round, there is no
It is most important that the tape portion of the used area can be used.
You. In the meantime, the resin cull 154b and the resin-sealed mold half
The conductor device 155 is taken out from the lower mold 151b.
You. According to this embodiment, the first embodiment
In the same manner as described above, while continuously supplying the sealing tape 152,
Can be sealed with grease to increase production efficiency.
Can be. In addition, the outer roll is pulled between the rotating rolls 159.
By applying a tension force, a proper tension is applied to the sealing tape 152.
Tree with excellent appearance and characteristics without dents
A fat-sealed semiconductor device can be obtained. That is,
The yield can be improved by reducing the yield. In addition, the sealing tape supply as in this embodiment is provided.
Cleaning the closed loop-shaped sealing tape 152 using a feeding device.
The sealing tape 152 can be used without wasting
There are advantages that can be used. Note that tension was applied to the sealing tape 152.
Even if a biasing roll (see the broken line in FIG. 11) is provided separately,
Good. (Third Embodiment) FIG. 13A shows a third embodiment of the present invention.
FIG. 4 is a perspective view of a resin sealing device provided with a sealing tape supply device.
is there. FIG. 13B shows the third embodiment.
It is a top view of a sealing tape supply apparatus and a lower metallic mold. As shown in FIGS. 13A and 13B, the third
The structure of the sealing mold in the embodiment shown in FIG.
Is the same as the structure of the sealing mold shown in the first embodiment shown in FIG.
Therefore, description of members denoted by the same reference numerals as in FIG.
Is omitted. In the present embodiment, the unwinding roll 156a
Do not apply a constant tension between the
Then, unwinding and winding the sealing tape 152 continuously
It is configured to be able to perform
Preheat the sealing tape 152 at a position away from the mold
Heater 166 is provided. In addition, this implementation
In the embodiment, unlike the first embodiment, the unwinding roll
156a and the take-up roll 156b
52 is a place apart from the sealing mold and the upper mold-lower of the sealing mold.
In a roller unit that can move between the molds
It has been incorporated. In this embodiment, the sealing tape 152 is sealed.
Before supplying to the mold, the temperature of the sealing mold is increased by the heater 166.
Preheating at a low temperature and then performing injection molding.
Now. In other words, leads with many semiconductor chips mounted
The frame is connected to the semiconductor product molding section 160 of the lower mold 151b.
Supplied and the resin tablet is the sealing resin of the lower mold 151b.
It is supplied to the supply unit. Then, the upper die 151 of the sealing die
a and the lower mold 151b are clamped, and the sealing resin melts.
Is supplied to each semiconductor product molding unit 160,
A semiconductor device is injection molded. And the injection molding is finished
Then, the lower mold 151b opens. Also, the lower mold 151b
Is opened, the resin cull and the resin-encapsulated semiconductor device 15 are opened.
5, the sealing tape 152 is separated. In addition, sealing
Part of the loop 152 used in this resin sealing process
Is taken up by a take-up roll 156b, and the next resin sealing is performed.
The parts used in the process are supplied from the unwind roll 156a
Is done. In the meantime, resin culls and resin-encapsulated semiconductor devices
Is taken out of the lower mold 151b. Sealing tape 15
2 is separated from the lower mold 151b after the end of the injection molding.
Once completely independent, once the roller unit
Move the unit to the specified position and wind only the used part
It is wound up by a take-up roll 156b, and a sealing tape 152
Is supplied, and the unused portion of the sealing tape 152 is supplied.
The part is preheated at a lower temperature than the sealing mold. According to this embodiment, the first embodiment
Similarly, the unwinding roll 156a and the winding roll 1
56b, the sealing tape 152 is continuously supplied.
This speeds up the resin sealing process using sealing tape
And increase production efficiency.
You. The unwinding roll 156a and the winding roll 1
By applying a rotational force to the sealing tape 152
Appropriate tension and appearance without pits
A resin-encapsulated semiconductor device having excellent performance can be obtained. You
That is, to improve the yield by reducing the defect rate
Can be. In addition, the sealing tape 152 is continuously supplied.
The tape does not come into contact with the heated mold when heating
Supply, and immediately before the supply, the sealing tape 1
By preheating 52, the wrinkles of the sealing tape 152,
And it can more effectively control the occurrence of sagging.
Significantly reduces the failure rate of resin-encapsulated semiconductor devices
Can be done. (Fourth Embodiment) FIG. 14 is a view showing a sealing tape according to the fourth embodiment of the present embodiment.
It is a perspective view of the resin sealing device provided with the loop supply device.
FIG. 15 shows a resin sealing step according to the fourth embodiment.
It is sectional drawing which shows one of the processes. This embodiment is the same as the third embodiment.
The unwinding roll 156a and the winding roll 15
6b and a heater 1 for preheating the sealing tape 152
66 and a roller unit having the same. However,
In the present embodiment, the roller unit always has the sealing tape 15.
2 is held between the upper mold and the lower mold.
You. In the present embodiment, the roller unit is a sealing metal.
Large movement from the place where the mold is installed to the place far away
The third implementation, except that it is not configured to allow
Injection molding and subsequent processing are performed in the same procedure as
Therefore, the description thereof will be omitted. The figure
In FIG. 15, the same reference numerals as in FIG. 10 are used.
The members are as described in FIG. According to the present embodiment, the same as the third embodiment
When supplying the sealing tape 152 continuously,
Supply without contacting the heated sealing mold
Then, the sealing tape 1 is heated by heating immediately before supply.
A resin-encapsulated semiconductor that reduces wrinkles and sagging of 52
The occurrence rate of device failure can be reduced. In particular,
Compared to the third embodiment, the sealing tape 152 can be used in a smaller space.
The ability to supply is of paramount importance. (Fifth Embodiment) FIG. 16A shows a fifth embodiment of the present invention.
FIG. 4 is a perspective view of a resin sealing device provided with a sealing tape supply device.
is there. FIG. 16 (b) shows the fifth embodiment.
It is sectional drawing which shows one process in a resin sealing process. As shown in FIG. 16A, the fifth embodiment
The structure of the sealing mold in the state is shown in FIG.
Since the structure is the same as that of the sealing mold shown in the first embodiment,
In the same figure, description of members denoted by the same reference numerals as in FIG.
Is omitted. In this embodiment, the sealing tape supply device
And the unwinding roll 156a and the winding roll 15
6b, and a sealing tape at the corner of the upper mold 151a.
Auxiliary roll 167 for preventing breakage of loop 152
The feature is that it is provided. Then, in substantially the same procedure as in the first embodiment,
Perform up to injection molding. That is, as shown in FIG.
Lead frame with a large number of semiconductor chips
153 is provided to the semiconductor product molding section 160 of the lower mold 151b.
The resin tablet is supplied with the sealing resin of the lower mold 151b.
It is thrown into the supply department. Then, the upper die 151a of the sealing die
And the lower mold 151b are clamped by the piston 158.
The sealing resin melted from below is
0, and the resin-encapsulated semiconductor device 155 is injected.
Is shaped. When the injection molding is completed, the lower mold 15
1b opens. At the same time that the lower mold 151b is opened,
Sealing tape 1 from grease and resin-sealed semiconductor device 155
52 is separated. In the meantime, resin cull and resin sealing type
The semiconductor device 155 is taken out from the lower mold 151b.
You. In this embodiment, the sealing tape of the supplied unused portion is used.
152 is an auxiliary row at the corner of the upper die 151a.
Is supplied along the line 167. According to this embodiment, the first embodiment
In the same manner as described above, while continuously supplying the sealing tape 152,
Can be sealed with grease to increase production efficiency.
Can be. Also, between the unwinding roll and the winding roll
By applying a pulling force outward to the sealing tape 15
2. Give proper tension to 2 and make it look
It is possible to obtain a resin-encapsulated semiconductor device with excellent sexual characteristics.
You. That is, the yield is improved by reducing the defect rate.
Can be In addition, the corners of the upper mold 151a are supplemented.
Provide auxiliary roll 157 and seal along auxiliary roll 157
Since the tape 152 is supplied, the sealing tape 152 is supplied.
Tape wrinkles, sagging and tearing
The occurrence rate of resin-encapsulated semiconductor device failures.
Can be effectively reduced. (Sixth Embodiment) FIG. 17A shows a sixth embodiment of the present invention.
FIG. 4 is a perspective view of a resin sealing device provided with a sealing tape supply device.
is there. FIG. 17B shows that the sealing tape is sealed from above.
It is a top view when seeing a tape and a lower metallic mold. As shown in FIG. 17A, in this embodiment,
The structure of the sealing die in the first embodiment shown in FIG.
Since the structure is the same as that of the sealing mold shown in the embodiment, FIG.
In FIG. 9, description of members denoted by the same reference numerals as in FIG.
Abbreviate. In this embodiment, the sealing tape supply device
The unwinding roll 156a and the winding roll 156
at least one of b as deviation correction means
Is provided. Also unwind roll
Any one of 156a and take-up roll 156b
Misalignment hand that moves in the direction parallel to the roll axis direction
A roll moving mechanism as a step is provided. However,
This deviation correction means includes a θ correction mechanism and a roll moving device.
Sealing tape if one of the structures is provided
In order not to generate wrinkles on the sealing tape 152,
Correct the lateral displacement and apply uniform tension to the sealing tape 152
Can be Then, in substantially the same procedure as in the first embodiment,
Perform up to injection molding. That is, many semiconductor chips
Is mounted on the lower die 151b made of semiconductor
Is supplied to the product molding section 160 and the resin tablet is
The resin is supplied to the sealing resin supply unit 51b. And sealing metal
The upper mold 151a and the lower mold 151b of the mold are clamped,
The molten sealing resin is supplied to each semiconductor product molding unit 160.
Then, the resin-encapsulated semiconductor device is injection-molded. Soshi
When the injection molding is completed, the lower mold 151b is opened. Ma
At the same time as the lower mold 151b is opened,
The sealing tape 152 is separated from the stop semiconductor device 155.
Is done. In the meantime, the resin cull and the resin-encapsulated semiconductor device 1
55 is taken out from the lower mold 151b. According to the present embodiment, the first embodiment
In the same manner as described above, while continuously supplying the sealing tape 152,
Can be sealed with grease to increase production efficiency.
Can be. Also, between the unwinding roll and the winding roll
By applying a pulling force outward to the sealing tape 15
2. Give proper tension to the 2
It is possible to obtain a resin-encapsulated semiconductor device with excellent sexual characteristics.
You. That is, the yield is improved by reducing the defect rate.
Can be In addition, the unwinding roll 156a or
The take-up roll 156b has a θ correction mechanism or a roll moving mechanism.
Since it is provided, sealing tape when used
152 slack, wrinkles and other distortions in the θ direction
Can be corrected, greatly improving production efficiency
Can be. [0085] The method of manufacturing the resin-encapsulated semiconductor device of the present invention.
According to the method, the semiconductor chip with the sealing tape attached
When sealing the peripheral members in the sealing resin, the sealing tape
Is supplied continuously and is attached to the sealing mold.
To expose the part where the sealing tape has adhered from the sealing resin
Structure can be realized in a manufacturing process suitable for mass production.
Wear. [0086]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view and a cross-sectional view showing a sealing resin of a resin-sealed semiconductor device applied to each embodiment. FIG. 2 is a cross-sectional view illustrating a process of preparing a lead frame in a process of manufacturing a resin-sealed semiconductor device applied to each embodiment. FIG. 3 is a cross-sectional view showing a step of bonding a semiconductor chip onto a die pad in a manufacturing step of a resin-sealed semiconductor device applied to each embodiment. FIG. 4 is a cross-sectional view showing a step of forming a thin metal wire in a process of manufacturing a resin-sealed semiconductor device applied to each embodiment. FIG. 5 is a cross-sectional view showing a step of laying a sealing tape under a lead frame in a manufacturing process of the resin-sealed semiconductor device applied to each embodiment. FIG. 6 is a cross-sectional view showing a resin sealing step in a manufacturing step of the resin-sealed semiconductor device applied to each embodiment. FIG. 7 is a cross-sectional view of the resin-encapsulated semiconductor device after the end cutting step of the inner lead in the manufacturing process of the resin-encapsulated semiconductor device applied to each embodiment; FIG. 8 is a partial back view of the resin-sealed semiconductor device formed in the manufacturing process of the resin-sealed semiconductor device applied to each embodiment. FIG. 9 is a perspective view showing a resin sealing device provided with a sealing tape supply device according to the first embodiment and a resin sealing step. FIG. 10 illustrates a state during a resin sealing step according to the first embodiment.
It is sectional drawing which shows one process. FIG. 11 is a perspective view of a resin sealing device provided with a sealing tape supply device according to a second embodiment. FIG. 12 illustrates a state during a resin sealing step according to the second embodiment.
It is sectional drawing which shows one process. FIG. 13 is a perspective view of a resin sealing device provided with a sealing tape supply device according to a third embodiment, and a top view of the sealing tape supply device and a lower mold. FIG. 14 is a perspective view of a resin sealing device provided with a sealing tape supply device according to a fourth embodiment. FIG. 15 illustrates a state during a resin sealing step according to the fourth embodiment.
It is sectional drawing which shows one process. FIG. 16 is a perspective view of a resin sealing device provided with a sealing tape supply device according to a fifth embodiment, and a cross-sectional view illustrating one step in a resin sealing process according to the fifth embodiment. FIG. 17 is a perspective view of a resin sealing device provided with a sealing tape supply device according to a sixth embodiment, and a plan view of a sealing tape and a lower mold seen from above the sealing tape. FIG. 18 is a perspective view of a resin sealing device in which resin sealing is performed without providing a sealing tape supply device and applying tension to the sealing tape, and one step in the resin sealing process. FIG. FIG. 19 is a cross-sectional view showing a state in a sealing mold when a resin sealing step is performed in a state where tension is not applied to the sealing tape, and a cross-sectional view of a formed resin sealing body. FIG. 20 is a cross-sectional view showing a state in a sealing mold when a resin sealing step is performed with tension applied to the sealing tape;
FIG. 3 is a cross-sectional view of a formed resin sealing body. 21A and 21B are a plan view and a cross-sectional view of a conventional resin-encapsulated semiconductor device of a type having external electrodes on the back side. FIG. 22 is a cross-sectional view of a conventional resin-encapsulated semiconductor device having a stand-off height secured by providing ball electrodes on external electrodes. FIG. 23 is a cross-sectional view showing a step of preparing a lead frame in a conventional process of manufacturing a resin-sealed semiconductor device. FIG. 24 is a cross-sectional view showing a step of bonding a semiconductor chip onto a die pad in a conventional manufacturing process of a resin-encapsulated semiconductor device. FIG. 25 is a cross-sectional view showing a step of forming a thin metal wire in a manufacturing process of a conventional resin-encapsulated semiconductor device. FIG. 26 is a cross-sectional view showing a resin sealing step in a manufacturing process of a conventional resin-sealed semiconductor device. DESCRIPTION OF SYMBOLS 12 Inner lead 13 Die pad 14 Suspended lead 15 Semiconductor chip 16 Fine metal wire 17 Sealing resin 18 External electrode 19 Depressed part 20 Lead frame 21 Sealing tape 151a Upper die 151b Lower die 152 Sealing tape 153 Lead frame 154a Resin tablet 154b Resin cull 155 Resin-sealed type semiconductor device 156a Unwind roll 156b Take-up roll 158 Piston 159 Rotating roll 160 Semiconductor product forming section 161 Sealing resin flow passage 165 Cleaner 166 Heater 167 Auxiliary roll

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yasuhiro Yamada 1-1, Yukicho, Takatsuki-shi, Osaka Prefecture Inside Matsushita Electronics Corporation (72) Inventor Osamu Adachi 1-1, Yukicho, Takatsuki-shi, Osaka Matsushita Electronics (56) References JP-A-7-29927 (JP, A) JP-A-9-107061 (JP, A) JP-A-8-78821 (JP, A) JP-A-10-6358 ( JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01L 21/56

Claims (1)

(57) Claims 1. A first step of preparing a sealing die, a semiconductor chip, and a lead frame, and a second step of mounting the semiconductor chip on a die pad of the lead frame. A third step of heating the sealing tape, a fourth step of continuously supplying the heated sealing tape and mounting it on the sealing mold, and a back surface of the inner lead of the lead frame. And a sixth step of sealing a portion of the semiconductor chip and the lead frame other than the back surface of the inner lead in a sealing resin. A method for manufacturing a sealed semiconductor device.