JP3403693B2 - Component processing equipment for mounting machines - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component processing apparatus for treating a component which is determined to be defective after being taken out from a component supply section by a head unit in a mounting machine.

[0002]

2. Description of the Related Art Conventionally, a head unit, which is movably mounted above a base of a mounting machine body, is provided with a suction nozzle for suctioning a chip component so as to be able to move up and down and rotate. A mounting machine is generally known in which a head unit is moved onto a printed circuit board after picking up the chips to mount a chip component on the printed circuit board. As the component supply section, a tape feeder holding chip components at predetermined intervals is provided on a derivable tape, or JP-A-64-30.
As shown in Japanese Patent Publication No. 298, a tray storage unit that stores a plurality of upper and lower trays in which chip components are arranged so as to be freely inserted and removed, and a tray storage unit that extends from a predetermined position on the side of the tray storage unit to a predetermined position of a mounting machine body. Tray type device provided with a component transporting unit provided as a tray, a tray drawer for pulling out a tray from the tray storing unit, and a unit for transferring chip components on the tray pulled out from the tray storing unit to the component transporting unit. The component supply device is known.

In general, this type of mounting machine is equipped with an inspection means for inspecting the state of the component sucked by the suction nozzle. As this inspection means, for example, a camera for recognizing a component is installed on the base of the mounter main body, and the image of the component sucked by the suction nozzle is captured by this camera, and the image is recognized by scanning the image. There are known ones that detect a component suction position and inspect a component state.

When it is determined that the chip component sucked by the suction nozzle has a defect such as deformation of the lead based on the inspection by the inspection means, the chip component is discarded. The chip components to be disposed of are discarded, for example, in a box for storing the discarded components, or returned to the tray of the component supply device.

[0005]

The parts determined to be defective as described above are discarded, but, for example, a relatively large chip component having a large number of leads is determined to be defective, and the defect is determined. Is easily repairable, such as lead deformation, it is desirable to repair and reuse the scrapped chip component.

[0006] However, according to the conventional disposal as described above, there is a possibility that the lead may be greatly deformed or new damage may occur when it is thrown into the box or returned to the tray, and It was also inconvenient to take it out of the box for repair.

In view of the above circumstances, the present invention is to store a component adsorbed by the adsorption nozzle of the head unit in a state suitable for repair and reuse when the component is determined to be defective and disposed of. It is an object of the present invention to provide a component processing device in a mounting machine capable of performing the above.

[0008]

In order to achieve the above object, the present invention provides a component supply unit for supplying a chip component and a chip component at a predetermined component mounting position on the substrate transfer path from the component supply unit. A head unit to carry to the printed circuit board ,
In mounting machine comprising an inspection means for inspecting the state of the component held by the head unit, the component feed unit
Is a multi-row tape that supplies relatively small chip components
Feeder and parts supply that supplies relatively large chip parts
It consists of a feeding device and the inspection means is a relatively large chip.
A component recognition camera that captures an image of the component and this component recognition camera.
Recognition of relatively small chip parts that are provided separately from the camera
It is composed of a component recognition unit for performing at least one end is equipped with a defective part supporting the belt conveyor located below within the moving range of the head unit, the faulty part support
Belt conveyor for supplying parts across the board transfer path
On the side opposite to the chip component unloading section of the device,
The direction parallel to the tape feeder on the side of the loop feeder
Placed on the board and compared from the chip component unloading section to the printed circuit board
As a result of inspection during the transportation of large-sized chip parts,
If it is a good part, replace this defective part with the defective product support board.
It is a good product because it is placed at the end of the conveyor belt side
If it is, just transport it to the component mounting position.
The tape feeder to the printed circuit board
As a result of inspection during the transportation of chip parts,
If there is, replace this defective part with a belt
Discard it in a box provided in a different place from the
If there is, carry it as it is to the printed circuit board.
It is the one.

According to the above construction, when the component sucked by the suction nozzle has a defect such as deformation of the lead and the component is discarded, the component is carried by the head unit to support the defective component. It is placed on the belt conveyor, and the defective parts are arranged and held on the belt conveyor so that the defective parts can be easily taken out. Then, the space on the side of the component supply unit is effectively used, and the defective component is stored in a state suitable for repair and reuse.

[0010]

Further, in the vicinity of the end of the defective component supporting belt conveyor in the component feeding direction, a full load state in which the heads of the chip components sequentially mounted on the defective component supporting belt conveyor reach the end position of the component feeding direction is detected. It is preferable to provide a full-load sensor that does

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings.

1 and 2 show the structure of the entire mounter according to an embodiment of the present invention. In these figures, the mounter main body 1 is provided with a base 1a, on which a conveyor 2 for transferring substrates is arranged, and the printed circuit board P is conveyed on the conveyor 2 to perform a predetermined mounting operation. It is designed to be stopped at the working position. Above conveyor 2
Extend linearly in a fixed direction across the mounter body 1 and the outside thereof. Hereinafter, in the embodiment, the direction of the conveyor 2 will be referred to as the X-axis direction, the direction orthogonal to the X-axis on the horizontal plane will be referred to as the Y-axis direction, and the vertical direction orthogonal to the X-axis and the Y-axis will be referred to as the Z-axis direction.

Further, the mounter is provided with a component supply section for supplying chip components (electronic components) to be mounted on the printed circuit board P. In this embodiment, both sides of the conveyor 2 in the mounter main body 1 in the Y-axis direction are provided. Is provided with a component supply unit 3 including a plurality of rows of tape feeders 3a suitable for supplying relatively small chip components, and a relatively large chip component is provided outside the mounting machine body 1. A tray type component supply device 4 suitable for supply is provided.

Each tape feeder 3 of the component supply section 3
Each a is a small tape-shaped chip component such as an IC, which is housed and held at a predetermined interval in a tape led out from a reel, and the tape is fed out at a constant pitch by a feeding mechanism as the head unit 10 is picked up. Are supplied sequentially.

Further, the component supply device 4 is provided with a tray accommodating portion 5 and a component conveying portion 6 for conveying the chip components taken out from the tray accommodating portion 5 to the mounting machine body 1.

A plurality of upper and lower trays 5a are accommodated in the tray accommodating section 5, and chip components such as ICs are arranged and placed and held in each tray 5a, and each tray 5a is forward (Y axis). Direction). Further, the component transfer unit 6 is provided with a transfer rail 6a arranged in a range extending from the component supply device 4 to a predetermined position in the mounter main body 1 in the vicinity of and in parallel with the board transfer conveyor 2. A supply table 6b formed so that parts can be placed is movably supported on the transport rail 6a. Further, a belt 6c driven by a motor (not shown) is provided along the transport rail 6a, and the supply base 6b is connected to the belt 6c.

Between the tray accommodating portion 5 and the component conveying portion 6, in order to take out chip components from the tray accommodating portion 5 and transfer them onto the supply table 6b of the component conveying portion 6, for example, the tray 5a. Clamp member 7 for gripping the front handle part
A tray withdrawing device 7 having a and a driving means for moving it in the vertical direction and the tray withdrawal direction is provided, and a transfer head 8a capable of adsorbing a component and the transfer head 8a is moved in the X axis direction and the Y axis direction. There is provided a transfer device 8 having a drive means for driving.

After the tray pulling device 7 pulls out the tray 5a having the desired height from the tray housing portion 5, the head 8a of the transfer device 8 sucks a desired component from the tray 5a to suck the desired component. 6 is transferred onto the supply table 6b, and then the supply table 6b is moved to carry the chip component to a predetermined position in the mounter main body 1. The specific structure of the component supply device 4 is not limited to the above,
For example, as shown in Japanese Patent Laid-Open No. 64-30298, as a structure for making it possible to pull out a tray having a desired height in the tray storage portion, the tray storage portion may be movable up and down. The conveyor may use a belt conveyor.

A head unit 10 for mounting components is installed above the base 1a of the mounting machine body 1. This head unit 10 has X over a certain range.
It can move in the axial direction and the Y-axis direction. That is, on the base 1a, a pair of fixed rails 11 extending in the Y-axis direction and a Y-axis servomotor 12 are provided.
And a ball screw shaft 13 driven to rotate by
A head unit support member 14 is arranged on the fixed rail 11, and a nut portion 15 provided on the support member 14 is screwed onto the ball screw shaft 13. The support member 14 has a guide member 16 extending in the X-axis direction.
And a ball screw shaft 17 driven by an X-axis servomotor 18, and the head unit 10 is movably held by the guide member 16.
A nut portion (not shown) provided at 0 is screwed onto the ball screw shaft 17. And the Y-axis servo motor 1
2, the ball screw shaft 13 rotates to move the support member 14 in the Y-axis direction, and the X-axis servomotor 18 operates to rotate the ball screw shaft 17 to move the head unit 10 to the support member 14. On the other hand, it moves in the X-axis direction.

The head unit 10 has a suction nozzle 2
0 is provided. The suction nozzle 20 moves up and down with respect to the frame of the head unit 10 (movement in the Z-axis direction).
And rotation about the nozzle center axis (R axis) is possible,
The Z-axis servo motor 21 and the R-axis servo motor 22 are operated.

A camera 23 for recognizing a component is provided on the base 1a as an inspection means for inspecting the state of the component sucked by the suction nozzle 20 of the head unit 10.
An image recognition unit 24 (see FIG. 5) is connected to the camera 23. This inspection means images the component sucked by the suction nozzle 20 from below and optically scans the image to perform image recognition, thereby detecting the component suction position and detecting abnormality such as lead deformation. It is a thing. The camera 23 is arranged at an appropriate position below the moving range of the head unit 10, and, for example, on one side of the conveyor 2 in the mounting machine main body 1, a portion where the component supply unit 3 including the tape feeder 3a is arranged. It is fixedly installed in the space between the end of the component transporting section 6.

In addition to the camera 23 provided on the base 1a, the head unit 10 is equipped with a laser unit consisting of a laser irradiation section and a light receiving section so that the suction nozzle 20 can pick up the sucked parts. It may be possible to inspect the state of the component based on the detection of the projection when the laser is irradiated. In this case, a relatively large leaded component or the like supplied by the tray-type component supply device 4 is inspected based on the image picked up by the camera 23, and the component supply unit including the tape feeder 3a is inspected. Small parts such as those supplied by 3 may be inspected using a laser unit.

Further, the defective part processing unit 30 is provided on the base 1a of the mounting machine main body 1. The defective component processing unit 30 includes a defective component supporting belt conveyor 3
1, and is disposed on the side of the component supply unit 3 so that at least one end of the belt conveyor 31 is located below the moving range of the head unit 10.

That is, in the plan view as shown in FIG. 1, the defective component supporting belt conveyor 31 is located on the side of the component supply unit 3 and the component feeding direction of the conveyor 31 is the component feeding direction. It is arranged so as to be along the portion 3. The printed circuit board P at the mounting work position on the conveyor 2 and the tape feeder 3a of the component supply unit 3
The end portion on the delivery side, the end portion of the component conveying unit 6, the camera 23 for component recognition, and the one end side portion of the defective component supporting belt conveyor 31 are arranged within the moving range of the head unit 10. Has been done. In addition to this, a nozzle replacement station 25 having a plurality of types of replacement suction nozzles may be provided in the head unit moving range on the base 1a, if necessary.

3 and 4 show the defective part processing unit 3
A specific structure of 0 is shown. In these drawings, the defective component supporting belt conveyor 31 has a conveyor belt 31a having a predetermined width capable of supporting a relatively large chip component, and the conveyor belt 31a is attached to the frame 32. It is stretched around the drive pulley 33 and the guide 34, and is kept in tension by the tensioner 35. The frame 32 is attached to a side end portion of a plate 3b for holding the tape feeder provided in the component supply unit 3.

An air cylinder 36 is attached to the frame 32 as a driving means for the belt conveyor 31, and the shaft of the drive pulley 33 and the air cylinder 3 are attached.
6 is connected to the rod 36a via gears 37, 38, 39 and one-way clutches 40, 41, and the belt conveyor 31 is moved by a predetermined amount in accordance with the operation of the air cylinder 36 in a predetermined direction (arrow a in FIG. 3). To move to. That is, the lever 4 that can swing around the fixed shaft
2 is connected to the tip of the rod 36a of the air cylinder 36, and is attached to a shaft provided at an intermediate portion of the lever 42 so that
The gear 37 is supported via the one-way clutch 40,
A second gear 38 that meshes with the first gear 37 is supported by the fixed shaft via a one-way clutch 41, and a third gear 39 that meshes with the second gear 38 is fixed to the shaft of the drive pulley 33. . Then, when the rod 36a of the air cylinder 36 is projected, the first gear 37 moves in the lever swinging direction with the shaft 37 kept stationary (arrow b), and the second gear 38 rotates accordingly. (Arrow c)
This causes the third gear 39 and the drive pulley 33 to rotate in the clockwise direction in FIG. 3 by a fixed amount in conjunction with this (arrow d). On the other hand, when the rod 36a of the air cylinder 36 is retracted, the first gear 37 idles and the second gear 38 is fixed to the shaft, so that the third gear 39 and the drive pulley 33 stop. There is.

The air cylinder 36 is provided with a forward end confirmation sensor 45 which detects when the rod 36a reaches the forward end (maximum protruding state). Further, near the end position of the belt conveyor 31 in the component feed direction, a full load sensor 46 is provided for detecting a full load state in which the head of the chip parts W sequentially mounted on the belt conveyor 31 reaches the end position of the component feed direction. Has been.

FIG. 5 shows the drive and control system of the belt conveyor 31. In these figures, the air cylinder 36 is shown.
Inside the piston is a piston 36b connected to a rod 36a.
Air chambers 36c and 36d are provided on both sides of the air chamber, and an electromagnetic air valve 54 is interposed between the air pump 53 and the passages 51 and 52 communicating with the air chambers 36c and 36d. When turned on (energized), the air valve 54 supplies pressurized air to one air chamber 36c of the air cylinder 36 and discharges air from the other air chamber 36d to move the piston 36b in the rod protruding direction. When it is turned on and turned off (energization stopped), pressurized air is supplied to the other air chamber 36d to discharge air from the one air chamber 36c, thereby operating the piston in the rod retracting direction. It becomes a state. Each of the passages 51 and 52 is provided with air discharge speed adjusting parts 55 and 56 including a check valve and a variable throttle.

The control unit 6 including an input / output board (i / o board) 61 and a controller 62 is provided as control means for controlling the driving means of the belt conveyor 31.
0 is provided. An image processing unit 24 for checking the state of the chip component W sucked by the suction nozzle 20 of the head unit 10 on the basis of the image picked up by the camera 23 for recognizing the component sends the control unit 60 a determination signal of the state of the chip component. Is entered. Further, a signal from the descending end sensor 63 provided in the head unit 10 for detecting the descending end of the suction nozzle 20 and each signal from the advancing end confirmation sensor 45 and the full load sensor 46 are also input to the control unit 60. .

When the determination signal indicates that the chip component W is defective, the control unit 60 places the component on one end side of the belt conveyor 31 and moves the belt conveyor 31 by a certain amount. Further, a control signal is output to a drive system such as a servo motor that drives the head unit 10 and the suction nozzle 20, and a drive system such as an air cylinder 36 that drives the belt conveyor 31. Further, when the full load sensor 46 detects a full load state, a full load display means 64 such as a lamp is displayed.
The signal is designed to be output to.

FIG. 6 is a flow chart showing a specific example of the control for the component processing by the control unit 60. To explain this process, first, after the suction nozzle 20 of the head unit 10 sucks the chip component W from the supply base 6b of the component supply device 4 or the like, the head unit 10 moves above the camera 23 for component recognition. The state of the chip component W sucked by the suction nozzle 20 is inspected (step S1), and it is determined whether the chip component W is defective (step S2). If the determination in step S2 is N
When it is O, that is, when the chip component W is normal, the head unit moves onto the printed circuit board P and the mounting work is performed (step S3).

When the determination in step S2 is YES, that is, when the chip component W is determined to be defective in the above inspection, the head unit 10 moves to above the defective component supporting belt conveyor 31 (step S4). Then, the suction nozzle 20 descends until the descending end sensor 63 is turned on (steps S5 and S6). When the suction nozzle 20 descends to the lower end, suction is turned off by cutting the negative pressure applied to the suction nozzle 20 (step S7), whereby the chip component W is placed on the belt conveyor 31. Then, the falling edge sensor 6
After the suction nozzle 20 rises until 3 is turned off (steps S8, S9), the rod 36a of the air cylinder 36 is projected by turning on the air valve 54 (step S10), and the signal from the forward end confirmation sensor 45 is further output. When it is confirmed in step S11 that the forward end is reached, the air valve 54 is turned off and the rod 36a of the air cylinder 36 is retracted (step S1).
2). By the operation of the air cylinder 36, the belt conveyor 31 moves by a fixed amount.

Further, it is determined whether the full load sensor 46 is ON (step S13). If the full load sensor 46 is OFF, the process waits until the next process (step S14). If the full load sensor is ON, the lamp is turned on. Full display is performed by lighting or the like (step S15).

According to the apparatus of this embodiment as described above,
After the suction of the chip component W by the suction nozzle 20 of the head unit 10, the state of the chip component W is inspected based on the image picked up by the camera 23 for component recognition, and if there is a defect such as lead deformation, Parts are suction nozzles 2
The head unit 10 transports the defective component processing unit 30 to the defective component processing unit 30 in a state of being attracted to 0. When the head unit 10 reaches the position corresponding to the defective component processing unit 30, the suction nozzle 20 is lowered to the descending end position close to the belt conveyor 31 and then the suction is turned off. The belt conveyor 31 moves by a fixed amount each time the component W is placed. Therefore, the impact when the component W is placed on the belt conveyor 31 and the collision with other components are avoided, and the lead deformation of the component is not increased and new damage is not caused.

By holding the parts W judged to be defective on the belt conveyor 31 in an aligned state, the parts W on the belt conveyor 31 can be easily taken out, and the parts W can be repaired and reused. It is convenient for work to use. In addition, when the parts W are placed and the belt conveyor 31 is moved accordingly, the parts W are fully loaded on the belt conveyor 31.
Is detected and displayed accordingly, excessive parts are prevented from falling off the belt conveyor 31, and the defective parts processing unit 30 appropriately holds and manages the parts.

In this component processing apparatus, it is not always necessary to store all of the components determined to be defective on the belt conveyor 31, and it is relatively possible to supply them from the tray type component supply device 4, for example. Only large and expensive parts that have repairable defects such as lead deformation are stored on the belt conveyor 31, and other defective parts are discarded in a box or the like provided in another place. You may do it.

The driving means for the belt conveyor 31 of the defective part processing unit 30 may be constituted by a motor or the like, and the specific structure of each of the other parts may be changed in design without departing from the gist of the present invention. .

[0039]

As described above, the present invention is an apparatus for processing a component which has been determined by the inspection means to be defective after being taken out from the component supply unit by the head unit, and at least one end of which has the head unit. Equipped with a belt conveyor for supporting defective parts located below the moving range,
Since this defective component supporting belt conveyor is located on the side of the component supply unit and is arranged so that the component feeding direction of this conveyor is along the component supply unit, it is located on the side of the component supply unit. The space can be used to store defective parts on the defective part supporting belt conveyor arranged here, and the parts can be easily taken out from the belt conveyor. Therefore, it is very convenient for storing, repairing, reusing, and the like of the parts determined to be defective.

[Brief description of drawings]

FIG. 1 is a plan view of a mounter including a component processing apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of a main part of the mounting machine.

FIG. 3 is a side view of the component processing apparatus.

FIG. 4 is a partial cross-sectional plan view of the component processing apparatus.

FIG. 5 is a block diagram showing a drive and control system in the component processing apparatus.

FIG. 6 is a flowchart illustrating an example of control regarding component processing.

[Explanation of symbols]

1 Mounting machine body 3 parts supply department 4 Tray type parts feeder 10 head unit 20 Suction nozzle 23 Parts recognition camera 30 defective parts processing unit 31 Belt conveyor for supporting defective parts 46 full load sensor

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Claims (2)

(57) [Claims] 1. A component supply unit for supplying a chip component, a head unit for transporting the chip component from the component supply unit to a printed circuit board at a predetermined component mounting position on a substrate transfer path, and a component held by the head unit. In a mounting machine provided with an inspection means for inspecting the state of the above, the component supply unit supplies a relatively small chip component.
Multiple rows of tape feeders and relatively large chip parts
It is composed of a component supply device that supplies components, and the inspection means is a component recognition device that images relatively large chip components.
The identification camera and the parts recognition camera are installed separately.
And component recognition means for recognizing relatively small chip components
Is equipped with a defective component supporting belt conveyor , at least one end of which is located below the moving range of the head unit.
As a boundary, place it on the side opposite to the chip component unloading section of the component supply device.
The tape feeder on the side of the multi-row tape feeder.
It is placed in a direction that is parallel to the
As a result of inspection during the transportation of the parts,
If this happens, replace the defective parts with a belt conveyor
A) Placed at the end of the board transport path side, and if it is a good product,
It is transported to the component mounting position as it is, and a relatively small chip from the tape feeder to the printed circuit board is used.
As a result of inspection during transportation of defective parts,
If this is the case, replace this defective component with a belt conveyor for supporting the defective component.
I dumped it in a box provided in a different place from
In the case of the above, the component processing device in the mounting machine is characterized in that it is conveyed to the printed circuit board as it is . 2. A full load state is detected near the end of the defective component supporting belt conveyor in the component feeding direction, and the top of the chip components sequentially mounted on the defective component supporting belt conveyor reaches the end position of the component feeding direction. component processing apparatus in claim 1, wherein the mounting apparatus, characterized in that a full sensor.