JP3165280B2 - Component processing equipment for mounting machines - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component processing apparatus for processing a component determined to be defective after being taken out of a component supply unit by a head unit in a mounting machine.

[0002]

2. Description of the Related Art Conventionally, a suction unit for sucking a chip component is provided in a head unit movably mounted above a base of a mounting machine main body so as to be able to move up and down and rotate, and the chip nozzle is moved from a component supply unit by the suction nozzle. 2. Description of the Related Art A mounting machine in which a head unit is moved onto a printed circuit board after sucking the chip component and the chip component is mounted on the printed circuit board is generally known. As the component supply section, a tape feeder in which chip components are held at predetermined intervals on a tape that can be led out is provided, or Japanese Patent Laid-Open No.
As shown in Japanese Patent Publication No. 298, a tray storage section in which a plurality of upper and lower trays in which chip components are arranged is stored so as to be able to freely enter and exit, and extends from a predetermined position beside the tray storage section to a predetermined position of the mounting machine body. Tray transport device provided with a component, a tray withdrawal device for pulling out a tray from the tray storage, and a means for transferring chip components on the tray drawn from the tray storage to the component transporting means. Are known.

[0003] Generally, this type of mounting machine is equipped with an inspection means for inspecting the state of the component sucked by the suction nozzle. As this inspection means, for example, a camera for component recognition is installed on a base of the mounting machine main body, and the component sucked by the suction nozzle is imaged by the camera, and the image is scanned by image recognition. A device that detects a component suction position and inspects a component state is known.

When it is determined based on the inspection by such an inspection means that the chip component sucked by the suction nozzle has a defect such as deformation of the lead, the chip component is discarded. The chip components to be discarded are discarded, for example, in a box for storing discarded components, or returned to a tray or the like of the component supply device.

[0005]

The components determined to be defective as described above are discarded. For example, a relatively large chip component having a large number of leads is determined to be defective, and the defect is determined. Is easily repairable, such as deformation of a lead, it is desirable to repair and reuse a chip component that has been disposed of.

However, according to the above-mentioned conventional disposal, there is a possibility that the lead may be greatly deformed or may be newly damaged when dumped into the box or returned to the tray. It was also inconvenient to take it out of a box or the like for repair.

The present invention has been made in view of the above circumstances, and when a component sucked by a suction nozzle of a head unit is determined to be defective and is disposed of, the component is stored in a state suitable for repair and reuse. It is an object of the present invention to provide a component processing apparatus in a mounting machine capable of performing the above.

[0008]

To achieve the above object of the Invention The present invention provides a component supply unit for supplying chip parts, X
It can be moved over a predetermined range in the axial direction and Y-axis direction
Te, a head unit conveying chip components from the component supply unit to a predetermined component mounting position, the mounting apparatus comprising an inspection means for inspecting the state of the component held by the Heddoyuni' bets, by arranging a plurality of chip components Length that can be supported
A, one end position outside the movement range of positions and the other end the head unit down in the moving range of the head unit
A defective part supporting belt conveyor for location, the belt conveyor, the chip components with each other on the belt conveyor
A drive unit that moves by a certain amount corresponding to a component movement amount necessary to avoid overlapping, and when the inspection unit determines that the component held by the head unit is defective, the component is replaced with the component. Operate the head unit so that it is placed on one end side of the belt conveyor,
And move the belt conveyor by a certain amount.
It is obtained by a control means for operating the drive means.

[0009]

According to the above construction, when a component sucked by the suction nozzle has a defect such as deformation of a lead and the component is discarded, the component is carried by the head unit and is used for supporting the defective component. It is placed on a belt conveyor. And, by moving the belt conveyor by a fixed amount each time a component is placed, there is no possibility of damage due to collision of components on the belt conveyor, and the like, and
The parts are arranged and held on the belt conveyor so that they can be easily taken out.

[0010]

An embodiment of the present invention will be described with reference to the drawings.
1 and 2 show the structure of the entire mounting machine according to one embodiment of the present invention. In these figures, the mounting machine body 1
Is provided with a base 1a, on which a conveyor 2 for transporting substrates is arranged, and the printed circuit board P is transported on the conveyor 2 and stopped at a predetermined mounting work position. ing. The conveyor 2 linearly extends in a certain direction over the mounting machine main body 1 and the outside thereof. Hereinafter, in the embodiment, the direction of the conveyor 2 is referred to as an X-axis direction, a direction orthogonal to the X-axis on a horizontal plane is referred to as a Y-axis direction, and a vertical direction orthogonal to the X-axis and the Y-axis is referred to as a Z-axis direction.

The mounting machine is provided with a component supply section for supplying chip components (electronic components) to be mounted on the printed circuit board P. In this embodiment, both sides of the conveyor 2 in the mounting machine body 1 in the Y-axis direction are provided. In addition, a component supply unit 3 composed of a large number of tape feeders 3a suitable for supplying relatively small chip components is provided, and a relatively large chip component is provided outside the mounting machine body 1. A tray type component supply device 4 suitable for supply is provided.

Each tape feeder 3 of the component supply section 3
a, a small chip component such as an IC is stored and held at predetermined intervals in a tape led out from a reel, and the tape is fed out at a constant pitch by a feeding mechanism as the head unit 10 picks up the chip component. Are sequentially supplied.

The component supply device 4 has a tray storage section 5 and a component transport section 6 for transporting chip components taken out of the tray storage section 5 to the mounting machine main body 1.

A plurality of upper and lower trays 5a are stored in the tray storage section 5, and chip components such as ICs are arranged and held on each tray 5a. Direction). Further, the component transport section 6 includes a transport rail 6a disposed in parallel with and adjacent to the substrate transport conveyor 2 in a range from the component supply device 4 to a predetermined position in the mounting machine main body 1. A supply table 6b formed so that components can be placed thereon is movably supported on the transport rail 6a. Further, a belt 6c driven by a motor (not shown) is provided along the transport rail 6a, and the supply table 6b is connected to the belt 6c.

In order to take out chip components from the tray storage section 5 and transfer them to the supply table 6b of the component transfer section 6, for example, the tray 5a is provided between the tray storage section 5 and the component transfer section 6. Clamping member 7 for gripping front handle
and a tray pull-out device 7 having a drive means for moving the tray in the vertical direction and in and out of the tray, and a transfer head 8a capable of picking up components and moving the head 8a in the X-axis direction and the Y-axis direction. A transfer device 8 having a driving means for causing the transfer is provided.

After the tray 5a of the desired height of the tray storage unit 5 is drawn out by the tray drawing device 7, the desired component is sucked from the tray 5a by the head 8a of the transfer device 8, and the component transfer unit The supply table 6b is moved onto the supply table 6b, and then the supply table 6b moves to carry the chip component to a predetermined position in the mounting machine body 1. Note that the specific structure of the component supply device 4 is not limited to the above,
For example, as shown in the above-mentioned Japanese Patent Application Laid-Open No. Sho 64-30298, as a structure that allows a tray having a desired height to be drawn out of the tray storage section, the tray storage section may be vertically movable. The transport unit may use a belt conveyor.

Above the base 1a of the mounting machine body 1, a head unit 10 for mounting components is provided. The head unit 10 has X over a certain range.
It can move in the axial direction and the Y-axis direction. That is, on the base 1a, a pair of fixed rails 11 extending in the Y-axis direction and a Y-axis servo motor 12
And a ball screw shaft 13 that is rotationally driven by
A head unit support member 14 is disposed on the fixed rail 11, and a nut portion 15 provided on the support member 14 is screwed to the ball screw shaft 13. The support member 14 has a guide member 16 extending in the X-axis direction.
And a ball screw shaft 17 driven by an X-axis servo motor 18, and the head unit 10 is movably held by the guide member 16.
A nut portion (not shown) provided on the ball screw 0 is screwed to the ball screw shaft 17. Then, the Y-axis servo motor 1
2, the ball screw shaft 13 rotates to move the support member 14 in the Y-axis direction, and the X-axis servo motor 18 rotates the ball screw shaft 17 to move the head unit 10 to the support member 14. On the other hand, it moves in the X-axis direction.

The head unit 10 has a suction nozzle 2
0 is provided. The suction nozzle 20 moves up and down with respect to the frame of the head unit 10 (moves in the Z-axis direction).
And rotation around the nozzle center axis (R axis)
It is designed to be operated by a Z-axis servomotor 21 and an R-axis servomotor 22.

Further, a camera 23 for component recognition is provided on the base 1a as inspection means for inspecting the state of the component sucked by the suction nozzle 20 of the head unit 10;
An image recognition unit 24 (see FIG. 5) is connected to the camera 23. The inspection means picks up the component sucked by the suction nozzle 20 from below and optically scans the image to perform image recognition, thereby detecting the component suction position and detecting abnormalities such as lead deformation. Things. The camera 23 is disposed at an appropriate position below the moving range of the head unit 10. For example, on one side of the conveyor 2 in the mounting machine main body 1, the camera 23 is provided with a part where the component supply unit 3 including the tape feeder 3 a is provided. It is fixedly installed in the space between the end of the component transport section 6.

In addition to the camera 23 provided on the base 1a, the head unit 10 is equipped with a laser unit including a laser irradiation unit and a light receiving unit. The state of the component may be inspected based on the detection of the projection when the laser is irradiated. In this case, a relatively large leaded component or the like supplied by the tray-type component supply device 4 is inspected based on the image captured by the camera 23, and the component supply unit including the tape feeder 3a is inspected. Small components such as those provided by 3 may be inspected using a laser unit.

Further, a defective component processing unit 30 is provided on a base 1a of the mounting machine body 1. This defective component processing unit 30 supports a plurality of chip components side by side.
Has a length to obtain, with the defective part supporting the belt conveyor 31, one end portion of the upper Symbol belt conveyor 31 is located below in the moving range of the head unit 10, the other end the
It is arranged on the side of the component supply unit 3 so as to be located outside the moving range of the head unit .

FIGS. 3 and 4 show the defective part processing unit 3.
0 shows a specific structure. In these figures, the defective component supporting belt conveyor 31 has a conveyor belt 31a of a predetermined width capable of supporting a relatively large chip component, and this conveyor belt 31a is attached to a frame 32. And is maintained in tension by a tensioner 35. The frame 32 is attached to a side end of a plate 3 b for holding a tape feeder provided in the component supply unit 3.

As a driving means of the belt conveyor 31, an air cylinder 36 is mounted on the frame 32, and a shaft of the driving pulley 33 and the air cylinder 3
6 and the rod 36a of which is connected via a gear 37, 38, 39 and one-way clutches 40 and 41, the belt conveyor 31 by the actuation of the air cylinder 36 is the base
To avoid overlapping of chip components on the conveyor.
It moves in a predetermined direction (arrow a in FIG. 3) by a fixed amount corresponding to the component movement amount necessary for the operation. That is, a lever 42 that can swing about a fixed shaft is connected to the tip of the rod 36 a of the air cylinder 36, and the first gear 37 is connected to a shaft provided at an intermediate portion of the lever 42 via the one-way clutch 40. A second gear 38 that is supported and meshes with the first gear 37 is supported on the fixed shaft via a one-way clutch 41, and a third gear 39 that meshes with the second gear 38 is fixed on the shaft of the drive pulley 33. Have been. When the rod 36a of the air cylinder 36 projects, the first gear 37 moves in the lever swinging direction with the first gear 37 stopped against the shaft (arrow b), and the second gear 38 rotates accordingly. In response to this (arrow c), the third gear 39 and the driving pulley 33 rotate clockwise in FIG. 3 by a fixed amount (arrow d). On the other hand, when the rod 36a of the air cylinder 36 is retracted, the first
When the gear 37 idles and the second gear 38 is fixed to the shaft, the third gear 39 and the driving pulley 33 stop.

The air cylinder 36 is provided with a forward end confirmation sensor 45 for detecting when the rod 36a reaches the forward end (maximum projecting state). Further, near the end position of the belt conveyor 31 in the component feeding direction, a full load sensor 46 is provided for detecting a full loading state in which the head of the chip components W sequentially placed on the belt conveyor 31 reaches the end position in the component feeding direction. Have been.

FIG. 5 shows a drive and control system of the belt conveyor 31. In these figures, an air cylinder 36 is shown.
Inside the piston 36b connected to the rod 36a
Air chambers 36c and 36d are provided on both sides of the air chamber 36. An electromagnetic air valve 54 is interposed between the air pump 53 and the passages 51 and 52 communicating with the air chambers 36c and 36d. When turned on (energized), the air valve 54 supplies pressurized air to one air chamber 36c of the air cylinder 36 and discharges air from the other air chamber 36d to move the piston 36b in the rod projecting direction. When it is turned on (stops power supply), the piston is actuated in the rod retraction direction by supplying pressurized air to the other air chamber 36d and discharging air from the one air chamber 36c. State. Each of the passages 51 and 52 is provided with an air discharge speed adjuster 55 or 56 composed of a check valve and a variable throttle.

The control unit 6 including an input / output board (i / o board) 61 and a controller 62 serves as control means for controlling the driving means of the belt conveyor 31.
0 is provided. The control unit 60 receives from the image processing unit 24 which checks the state of the chip component W sucked by the suction nozzle 20 of the head unit 10 based on the image picked up by the camera 23 for component recognition. Is entered. Further, a signal from a descending end sensor 63 that is provided in the head unit 10 and detects a descending end of the suction nozzle 20 and signals from the forward end confirmation sensor 45 and the full load sensor 46 are also input to the control unit 60. .

When the determination signal indicates that the chip component W is defective, the control unit 60 places the component on one end of the belt conveyor 31 and moves the belt conveyor 31 by a fixed amount. Then, a control signal is output to a drive system such as a servomotor for driving the head unit 10 and the suction nozzle 20 and a drive system such as an air cylinder 36 for driving the belt conveyor 31. Further, when the full load state is detected by the full load sensor 46, the full load display means 64 such as a lamp is provided.
A signal is output.

FIG. 6 is a flowchart showing a specific example of control for component processing by the control unit 60. The process will be described. First, after the chip component W is sucked from the supply table 6b or the like of the component supply device 4 by the suction nozzle 20 of the head unit 10, the head unit 10 is moved above the camera 23 for component recognition. Then, the state of the chip component W sucked by the suction nozzle 20 is inspected (step S1), and it is determined whether the chip component W is defective (step S2). The determination in step S2 is N
If O, that is, if the chip component W is normal, the head unit moves onto the printed circuit board P and the mounting operation is performed (step S3).

If the determination in step S2 is YES , that is, if the chip component W is determined to be defective in the above inspection, the head unit 10 moves to above the defective component supporting belt conveyor 31 (step S4). Subsequently, the suction nozzle 20 is lowered until the lower end sensor 63 is turned on (steps S5 and S6). When the suction nozzle 20 descends to the lower end, the suction is turned off by cutting the negative pressure applied to the suction nozzle 20 (step S <b> 7), whereby the chip component W is placed on the belt conveyor 31. Then, the falling edge sensor 6
After the suction nozzle 20 is raised until the nozzle 3 is turned off (steps S8 and S9), the rod 36a of the air cylinder 36 is protruded by turning on the air valve 54 (step S10). Is determined (step S11), the air valve 54 is turned off, whereby the rod 36a of the air cylinder 36 is retracted (step S1).
2). By the operation of the air cylinder 36, the belt conveyor 31 moves by a certain amount.

Further, it is determined whether or not the full load sensor 46 is ON (step S13). If the full load sensor 46 is OFF, the process waits until the next processing (step S14). A full load display is performed by lighting or the like (step S15).

According to the apparatus of the present embodiment as described above, the chip component W is sucked by the suction nozzle 20 of the head unit 10.
Is sucked, the state of the chip component W is inspected based on an image captured by the camera 23 for component recognition, and if there is a defect such as lead deformation, the component is
The head unit 10 carries the defective component to the defective component processing unit 30 while being sucked. Head unit 1
When “0” reaches the position corresponding to the defective component processing unit 30, the suction nozzle 20 is lowered to the lower end position close to the belt conveyor 31 and then suction is turned off, so that the component W is quietly placed on the belt conveyor 31. And the belt conveyor 31 moves by a fixed amount each time the component W is placed. Therefore, the parts W are transferred to the belt conveyor 3
The impact and collision with other components at the time of being placed on the device 1 can be avoided, and there is no increase in lead deformation of components and new damage.

The parts W determined to be defective are held in an aligned state on the belt conveyor 31, so that the parts W on the belt conveyor 31 can be easily taken out, and the parts can be repaired and reused. It becomes convenient for the work to use. Further, when the placement of the component W and the accompanying movement of the belt conveyor 31 are repeated to reach a state where the component W is fully loaded on the belt conveyor 31, this is
, And display is performed in accordance therewith, so that excessive components are prevented from dropping off from the belt conveyor 31, and the defective component processing unit 30 appropriately holds and manages the components.

In this component processing apparatus, it is not always necessary to store all of the components determined to be defective on the belt conveyor 31. For example, a relatively small number of components supplied from a tray-type component supply device 4 may be used. Only large and expensive parts that have repairable defects such as lead deformation are stored on the belt conveyor 31, and other defective parts are discarded in a box or the like provided in another place. You may make it.

The drive means for the defective part processing unit 30 with respect to the belt conveyor 31 may be constituted by a motor or the like, and the specific structure of other parts may be changed in design without departing from the gist of the present invention. .

[0035]

The present invention as described above, according to the present invention, as a device for processing the components that are determined to be defective by the inspection unit after being taken out from the component supply unit in Heddoyuni' preparative <br/>, double
A defective part supporting the belt conveyor having a length capable of supporting side by side the number of chip components, the belt conveyor, this
Avoid overlapping of chip components on the belt conveyor
Driving means for moving by a predetermined amount so that, the component is operated the head unit so as to place the one end of the belt conveyor, and the conveyor belt constant
And control means for operating the driving means so as to move the parts by an amount, the parts can be arranged side by side on the belt conveyor, without causing damage due to collision or the like at this time, and Parts can be easily taken out from the belt conveyor. Therefore, it is very convenient for storing, repairing, reusing, and the like of components determined to be defective.

[Brief description of the drawings]

FIG. 1 is a plan view of a mounting machine provided with a component processing apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of a main part of the mounting machine.

FIG. 3 is a side view of the component processing apparatus.

FIG. 4 is a partial cross-sectional plan view of the component processing apparatus.

FIG. 5 is a block diagram showing a drive and control system in the component processing apparatus.

FIG. 6 is a flowchart illustrating an example of control regarding component processing.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mounting machine main body 3 Component supply part 4 Tray-type component supply device 10 Head unit 20 Suction nozzle 23 Component recognition camera 30 Defective component processing unit 31 Defective component support conveyor 36 Air cylinder 60 Control unit

Claims (1)

(57) [Claims] And 1. A supplying chip parts component supply unit, X
It can be moved over a predetermined range in the axial direction and Y-axis direction
Te, a head unit conveying chip components from the component supply unit to a predetermined component mounting position, the mounting apparatus comprising an inspection means for inspecting the state of the component held by the Heddoyuni' bets, by arranging a plurality of chip components It has a length capable of supporting the other end portion is located below in the moving range of the head unit
A belt conveyor for supporting a defective component whose end side is located outside the moving range of the head unit, and a belt on the belt conveyor.
The amount of component movement required to avoid overlapping
A drive unit for moving the corresponding fixed amount, and when the inspection unit determines that the component held by the head unit is defective, the component is placed on one end side of the belt conveyor. Activate the head unit and keep the belt conveyor constant
Control means for operating the driving means so as to move the component by an amount .