JP3395854B2 - 酸化銅の化学還元液およびこれを用いた多層プリント配線板の製造方法 - Google Patents

酸化銅の化学還元液およびこれを用いた多層プリント配線板の製造方法

Info

Publication number
JP3395854B2
JP3395854B2 JP01073794A JP1073794A JP3395854B2 JP 3395854 B2 JP3395854 B2 JP 3395854B2 JP 01073794 A JP01073794 A JP 01073794A JP 1073794 A JP1073794 A JP 1073794A JP 3395854 B2 JP3395854 B2 JP 3395854B2
Authority
JP
Japan
Prior art keywords
copper oxide
printed wiring
multilayer printed
copper
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP01073794A
Other languages
English (en)
Japanese (ja)
Other versions
JPH07216564A (ja
Inventor
昭士 中祖
陽一 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP01073794A priority Critical patent/JP3395854B2/ja
Priority to TW084100525A priority patent/TW280084B/zh
Priority to KR1019950001544A priority patent/KR0141619B1/ko
Priority to CN95102903A priority patent/CN1066479C/zh
Priority to SG1996000825A priority patent/SG52228A1/en
Priority to GB9501749A priority patent/GB2286197B/en
Priority to DE19503186A priority patent/DE19503186C2/de
Publication of JPH07216564A publication Critical patent/JPH07216564A/ja
Priority to US08/815,599 priority patent/US5736065A/en
Application granted granted Critical
Publication of JP3395854B2 publication Critical patent/JP3395854B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0063—Hydrometallurgy
    • C22B15/0065—Leaching or slurrying
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0063—Hydrometallurgy
    • C22B15/0065—Leaching or slurrying
    • C22B15/008—Leaching or slurrying with non-acid solutions containing salts of alkali or alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • ing And Chemical Polishing (AREA)
JP01073794A 1994-02-02 1994-02-02 酸化銅の化学還元液およびこれを用いた多層プリント配線板の製造方法 Expired - Fee Related JP3395854B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP01073794A JP3395854B2 (ja) 1994-02-02 1994-02-02 酸化銅の化学還元液およびこれを用いた多層プリント配線板の製造方法
TW084100525A TW280084B (en, 2012) 1994-02-02 1995-01-21
KR1019950001544A KR0141619B1 (ko) 1994-02-02 1995-01-27 산화구리용 화학적 환원액
CN95102903A CN1066479C (zh) 1994-02-02 1995-01-29 用于氧化铜的化学还原溶液
SG1996000825A SG52228A1 (en) 1994-02-02 1995-01-30 Chemical reducing solution for copper oxide
GB9501749A GB2286197B (en) 1994-02-02 1995-01-30 Chemical reducing solution for copper oxide
DE19503186A DE19503186C2 (de) 1994-02-02 1995-02-01 Chemische Reduzierungslösung für Kupferoxid
US08/815,599 US5736065A (en) 1994-02-02 1997-03-12 Chemical reducing solution for copper oxide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP01073794A JP3395854B2 (ja) 1994-02-02 1994-02-02 酸化銅の化学還元液およびこれを用いた多層プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPH07216564A JPH07216564A (ja) 1995-08-15
JP3395854B2 true JP3395854B2 (ja) 2003-04-14

Family

ID=11758616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP01073794A Expired - Fee Related JP3395854B2 (ja) 1994-02-02 1994-02-02 酸化銅の化学還元液およびこれを用いた多層プリント配線板の製造方法

Country Status (8)

Country Link
US (1) US5736065A (en, 2012)
JP (1) JP3395854B2 (en, 2012)
KR (1) KR0141619B1 (en, 2012)
CN (1) CN1066479C (en, 2012)
DE (1) DE19503186C2 (en, 2012)
GB (1) GB2286197B (en, 2012)
SG (1) SG52228A1 (en, 2012)
TW (1) TW280084B (en, 2012)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
CN100395059C (zh) * 2001-12-18 2008-06-18 旭化成株式会社 金属氧化物分散体、由其得到的金属薄膜和生产该金属薄膜的方法
JP4410108B2 (ja) * 2002-08-09 2010-02-03 スイッチ マテリアルズ インコーポレイテッド フォトクロミックかつエレクトロクロミックな化合物、該化合物の合成方法及び該化合物の使用方法
WO2006125317A1 (en) * 2005-05-25 2006-11-30 Switch Materials Inc. Photochromic and electrochromic compounds and synthesis and use thereof
KR101730983B1 (ko) 2010-07-06 2017-04-27 나믹스 코포레이션 인쇄회로기판에서 사용하기 위한 유기 기판에의 접착을 향상시키는 구리 표면의 처리 방법
CN103118806B (zh) 2010-07-06 2016-10-12 埃托特克德国有限公司 处理金属表面的方法和由此形成的器件
WO2013044371A1 (en) 2011-09-30 2013-04-04 Switch Materials, Inc. Photochromic and electrochromic diarylcyclopentene derivatives as optical filters
EP3911781A1 (en) * 2019-01-15 2021-11-24 ATOTECH Deutschland GmbH Method of forming copper oxide on a copper surface
CN113747683B (zh) * 2020-05-29 2023-07-07 深南电路股份有限公司 一种印制线路板及其制作方法
WO2022131186A1 (ja) * 2020-12-18 2022-06-23 株式会社トクヤマ 遷移金属の半導体の処理方法、および遷移金属酸化物の還元剤含有処理液
TWI822620B (zh) * 2023-03-24 2023-11-11 景碩科技股份有限公司 銅箔基板的前處理方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2643199A (en) * 1945-12-18 1953-06-23 Hersch Paul Process of forming a layer of metallic copper on copper oxide
DE1410807A1 (en, 2012) * 1961-07-31 1968-10-17
US4295986A (en) * 1979-05-14 1981-10-20 Gordon Roy G Low temperature catalytic reduction
JPS56153797A (en) * 1980-04-28 1981-11-27 Hitachi Chemical Co Ltd Method of manufacturing multilayer printed circuit board substrate
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
JPS59120249A (ja) * 1982-12-27 1984-07-11 Agency Of Ind Science & Technol 貴金属触媒の製造方法
US4563217A (en) * 1983-07-25 1986-01-07 Hitachi, Ltd. Electroless copper plating solution
US4634468A (en) * 1984-05-07 1987-01-06 Shipley Company Inc. Catalytic metal of reduced particle size
US4725314A (en) * 1984-05-07 1988-02-16 Shipley Company Inc. Catalytic metal of reduced particle size
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
US4770751A (en) * 1986-12-30 1988-09-13 Okuno Chemical Industry Co., Ltd. Method for forming on a nonconductor a shielding layer against electromagnetic radiation
DE3707817A1 (de) * 1987-03-09 1988-09-22 Schering Ag Stabilisiertes alkalisches goldbad zur stromlosen abscheidung von gold
ATA200888A (de) * 1987-08-11 1993-07-15 Schering Ag Konditionierungsmittel für gedruckte schaltungen
JPS6456479A (en) * 1987-08-27 1989-03-03 Mita Industrial Co Ltd Cleaning device
JPH0713304B2 (ja) * 1987-12-14 1995-02-15 日立化成工業株式会社 銅の表面処理法
GB2243577A (en) * 1990-05-07 1991-11-06 Compeq Manufacturing Co Limite A method of bonding copper and resin
DE4108073A1 (de) * 1991-03-13 1992-09-17 Compeq Mfg Co Verfahren zur verbindung von kupfer und kunststoff

Also Published As

Publication number Publication date
CN1066479C (zh) 2001-05-30
KR0141619B1 (ko) 1998-06-01
TW280084B (en, 2012) 1996-07-01
KR950024971A (ko) 1995-09-15
GB9501749D0 (en) 1995-03-22
JPH07216564A (ja) 1995-08-15
SG52228A1 (en) 1998-09-28
CN1112950A (zh) 1995-12-06
DE19503186C2 (de) 1997-08-21
US5736065A (en) 1998-04-07
DE19503186A1 (de) 1995-08-10
GB2286197A (en) 1995-08-09
GB2286197B (en) 1997-06-04

Similar Documents

Publication Publication Date Title
JP3395854B2 (ja) 酸化銅の化学還元液およびこれを用いた多層プリント配線板の製造方法
CN1292896C (zh) 层合体及其制造方法
EP1886759B1 (en) Water-soluble preflux and use thereof
US4643793A (en) Process for treating metal surface
EP0321067A1 (en) Process for treating copper surface
CN102191522A (zh) 电镀预处理剂、用于电镀的预处理方法以及电镀方法
EP2639333A1 (de) Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
ATE213510T1 (de) Verfahren zur metallischen beschichtung von substraten
EP1196016A3 (en) Wiring substrate and manufacturing method of the same along with electroless copper plating solution used therefor
EP1241209B1 (en) Solvent swell composition containing heterocyclic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous material
JP2012248770A (ja) 金属膜パターンが形成された樹脂基材
KR100413240B1 (ko) 무전해 동도금액 및 무전해 동도금방법
JP2002335067A (ja) 樹脂物質にテクスチャーを付け、樹脂物質をデスミアリングおよび除去するための溶剤膨潤組成物
WO1998037260A1 (fr) Feuil de cuivre microporeux et solution de depot autocatalytique permettant d'obtenir ce feuil
JP3930885B2 (ja) 銅および銅合金用のマイクロエッチング剤
JP3400514B2 (ja) 回路板の処理方法
JP2002060965A (ja) 銅酸化物還元用の処理液および処理方法
JPH04193956A (ja) ポリイミド樹脂のエッチング法
US4520052A (en) Method for electroless copper-plating and a bath for carrying out the method
KR101945101B1 (ko) 기판과의 접착성이 향상된 금속 배선층을 구비하는 인쇄회로 기판 및 이의 제조방법
JP4331840B2 (ja) 微細メッキ方法
JPH04116176A (ja) 無電解銅めっき液および無電解銅めっき方法
JP4305741B2 (ja) 銀めっき液
JP2002060980A (ja) 銅及び銅合金の表面粗面化処理液
TWI228531B (en) Conversion coating composition based on nitrogen and silicon compounds and a conversion coating method using the same

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080207

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090207

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100207

Year of fee payment: 7

LAPS Cancellation because of no payment of annual fees