JP3374760B2 - Printed wiring board and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, the miniaturization of electronic devices and the high density mounting of components on their mounting boards have made remarkable progress. At the same time, product reliability is becoming increasingly severe.

In particular, as mounting components, flip chips and other CSP (Chip Siz
e Package), BGA (Ball Grid Array), MCM
Surface mounting of semiconductor elements such as (Multi Chip Module) or semiconductor packages has become common.

Since these semiconductor elements and semiconductor packages are compatible with high-density mounting, the substrates on which they are mounted require electrodes with a very narrow pitch. As a result, the stress generated in the solder resist or the insulating layer existing between the electrodes has increased more than before. Therefore, in the case of a printed wiring board that uses a general acrylic or epoxy resin material for these parts, problems such as cracks and peeling may occur when soldering when mounting components under a certain operating environment. Easier to do. To be more specific, the term "under a constant use environment" means, for example, a case where thermal / mechanical stress is applied or a case where the environment is used in a humid atmosphere. Such problems occur not only on the outermost surface of the printed wiring board on which components are mounted, but also on the inner layer of the printed wiring board on which high-density wiring is performed, and similarly, problems of inner layer cracks and inner layer peeling occur. .

Further, in recent years, as part of the above-mentioned applications for high-density printed wiring boards, products using high-frequency circuits and digital circuits such as mobile phones and computers have been actively developed. In these product fields, if miniaturization and high-density mounting are performed while using a conventional glass epoxy substrate, it is unavoidable that the product characteristics deteriorate due to problems such as crosstalk noise between wirings. That is, improvement of high frequency characteristics has become an essential issue.

Regarding the former problem of cracking and peeling among the above problems, conventionally, in Japanese Unexamined Patent Publication (Kokai) No. 4-53297, the heating temperature in the previous process is set in the step of forming a laminated insulating layer of a polyimide resin. It has been proposed to reduce the thermal stress by making the temperature lower than the final baking temperature. However, even if this improves the reliability in the manufacturing process of the printed circuit board, in the soldering and long-term durability reliability tests where thermal stress at higher temperatures is expected, Lower heat treatment temperatures are not always advantageous. In particular, it can be considered to be effective only in the case of a polyimide resin material having a remarkably high curing temperature, but in this case, the polyimide resin has a large water absorption rate and a problem remains in terms of moisture resistance reliability. In addition, as in JP-A-8-248630, there is an example in which a rubber component is mixed in an insulating layer material to reduce stress. However, since rubber components such as polybutadiene and polyurethane are generally inferior in heat resistance and moisture resistance, as the compounding amount is increased in order to reduce stress, these characteristics are deteriorated, resulting in low stress and reliability. However, there is a problem that the compatibility of the two cannot always be achieved sufficiently.

Regarding the latter problem, many cases have been proposed in which a polyimide resin material is used as an insulating layer material. However, the moisture resistance reliability is low and the curing temperature is extremely high. Expansion is delayed. On the other hand, in recent years, as disclosed in Japanese Patent Laid-Open No. 9-172234, an example has been proposed in which benzocyclobutene having a lower dielectric constant than a glass epoxy substrate and good moisture resistance is used for an insulating layer. In addition to these characteristics, this material is also capable of suppressing the curing temperature to be lower than that of the polyimide resin. However, a curing temperature of about 200 ° C. is required, and it is necessary to pay sufficient attention to process control even with respect to the problem of yield reduction from the viewpoint of reliability due to residual stress in the printed wiring board manufacturing process. Furthermore, since it is still a special material at present, it has not been industrially fully established, including the supply system, and there remains a problem in terms of cost.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to provide a print that can ensure heat resistance and humidity resistance under the use environment and can improve high frequency characteristics by lowering the dielectric constant of polyimide resin. To provide a wiring board.

[0009]

Means for Solving the Problems The invention described in claims 1 to 7, a silicone resin material is 100 kgf / mm ² or less in a temperature range up to 200 ° C. elastic modulus from -50 ° C., a solder resist layer or It is characterized by being used for the insulating layer.

Here, the silicone resin is a low stress, high heat resistance, low dielectric constant and inexpensive material. When this material is used as a solder resist layer or an insulating layer material of a printed wiring board, it is heat resistant under the use environment. -It is possible to obtain a high-density packaging-compatible product at low cost that satisfies the advantages of high-frequency characteristics and cost advantages by securing moisture-proof reliability and lowering the dielectric constant as high as that of polyimide resin.

Here, as described in claims 1 and 2 , the insulating layer is the outermost insulating layer of the interlayer insulating layers in the multilayer substrate, or each layer in which the wiring pattern is formed in the multilayer substrate. outermost or an insulating layer, also of, as described in claim 3, the pre-Symbol silicone resin material, comprises 80 wt% or more of the matrix resin, which all of them are made of a silicone resin, The silicone resin material comprises a photocurable silicone resin, or a combination of a photocurable silicone resin and at least one of a thermosetting silicone resin and a moisture curable silicone resin, and a thermosetting silicone resin and a moisture curable silicone resin. When at least one of the resin and the photocurable silicone resin is combined, the silicone resin material is a thermosetting silicone resin or Gas-curable silicone resin 10
Or that one containing 80 wt%, as described in claim 4, in the printed wiring board according to any one of claims 1 to 3, wherein the silicone resin is a silicone resin in which the polyisobutylene as a main skeleton Shall be included. By doing so, it is preferable for practical use.

Further, as described in claim 5, as a resist layer or an insulating layer has a modulus of elasticity of from -50 ° C. 2
A layer using a silicone resin material of 100 kgf / mm ² or less in a temperature range up to 00 ° C., and an elastic modulus of −5.
100kgf in the temperature range from 0 ℃ to 200 ℃
When combined with a layer made of a resin material having a size larger than / mm ^2, it is possible to obtain arbitrary characteristics as the flexibility of the entire substrate.

That is, as described in claim 6 , the 1
By changing the stacking order of the layer using the silicone resin material of 00 kgf / mm ² or less and the layer using the resin material greater than 100 kgf / mm ² , it is possible to obtain an arbitrary property as the flexibility of the entire substrate. Alternatively, as described in claim 7 , by changing the number of laminated layers of the layer using the silicone resin material of 100 kgf / mm ² or less and the layer using the resin material larger than 100 kgf / mm ² . Arbitrary characteristics can be obtained as the flexibility of the entire substrate.

Further, as a method for manufacturing a printed wiring board, as described in claims 8 and 9 , 100 kgf / mm is applied to the surface of the base material in a temperature range where the elastic modulus after curing is from -50 ° C to 200 ° C. A paste-like silicone resin material having a number of ² or less and having at least one of a thermosetting component and a moisture curing component and a photocuring component is applied. Then, weak exposure is performed on the entire surface of the silicone resin material. As a result, the surface tackiness disappears. further,
The silicone resin material is exposed using a mask and is developed to open a desired region of the silicone resin material. Subsequently, wiring is patterned in the opening of the silicone resin material.

As described above, the paste-like silicone resin material containing at least one of the thermosetting component and the moisture curing component and the photo-curing component can be used as a more practical method for producing a printed wiring board. .

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a cross-sectional view of the printed wiring board in this embodiment. The printed wiring board of this example is a multilayer printed wiring board, and three layers of wiring patterns are formed on both front and back surfaces of the board. The flip chip 8, the CSP (Chip Size Package) 9 and the MCM, which are electronic components, are provided on both sides of the substrate.
(Multi Chip Module) 14 is surface-mounted.

A detailed description will be given below. A glass epoxy substrate is used as the core substrate 1. This core board 1
Through holes 4 are formed in the through holes 4 and through hole plating 5 is formed in the through holes 4. A conductive paste may be used instead of the through hole plating 5.

On the upper surface of the core substrate 1, an insulating layer having a wiring pattern (hereinafter referred to as a resist layer) and an interlayer insulating layer are alternately laminated in three layers. That is, from the top to the bottom, the first layer resist layer L1R, the first layer insulating layer L1i, the second layer resist layer L2R, and the second layer insulating layer L2i.
, A third resist layer L3R and a third insulating layer L3i are formed. Further, on the lower surface of the core substrate 1, an insulating layer having a wiring pattern (hereinafter referred to as a resist layer) and an interlayer insulating layer are alternately laminated in three layers. That is, from the top to the bottom, the fourth insulating layer L4i, the fourth resist layer L4R, the fifth insulating layer L5i, the fifth resist layer L5R, the sixth insulating layer L6i, and the sixth resist layer L6.
R is formed.

Resist layers L1R, L2R, L3R, L4
Copper-plated circuit wiring (wiring pattern) 6 is arranged on R, L5R, and L6R. Insulating layers L1i, L2i, L3
Copper plated via holes (IVH (Interstitial Via Holes)) 7 for interlayer joining are provided at i, L4i, L5i, and L6i.
Are formed, and conduction is established between the layers through this IVH7. However, one or both of the layers L3i and L4i may be omitted.

A flip chip 8 and a CSP 9 are arranged on the first-layer resist layer L1R in the laminated body 2 of insulating layers formed on the surface (upper surface) of the core substrate 1. The flip chip 8 is electrically connected to the wiring pattern 11 in the first resist layer L1R by the electrode 10,
The CSP 9 is electrically connected to the wiring pattern 11 in the first resist layer L1R by the electrode 12. Specifically, the solder resist layer 13 is formed on the first layer resist layer L1R, and the electrodes 10 and 12 and the wiring pattern 11 are soldered (bonded) by using the solder resist layer 13.

Instead of CSP9, BGA (Ball
Grid Array) may be used. Similarly, the MCM 14 is arranged on the front surface side of the sixth-layer resist layer L6R in the laminated body 3 of insulating layers formed on the back surface of the core substrate 1. The MCM 14 is electrically connected to the wiring pattern 16 in the sixth layer resist layer L6R on the surface layer by the electrode 15. Specifically, on the resist layer L6R (front surface side),
The solder resist layer 17 is formed, and the electrodes 15 and the wiring patterns 16 are soldered (bonded) using the solder resist layer 17.

Here, the solder resist layer 13, the first-layer resist layer L1R, the first-layer insulating layer L1i, the solder resist layer 17, the sixth-layer resist layer L6R, and the sixth-layer insulating layer L6i.
At least one of them has the following configuration.

A silicone resin having a modulus of elasticity of 100 kgf / mm 2 or less in a temperature range of -50 ° C to 200 ° C is included. Specifically, (i) a photocurable silicone resin (ii) a photocurable silicone resin + moisture curing Silicone resin, (iii) photocurable silicone resin + thermosetting silicone resin, (iv) photocurable silicone resin + moisture curable silicone resin + thermosetting silicone resin, and silicone resin material comprises 80 wt% or more of the matrix resin, which all of them are made of a silicone resin, the silicone
The resin material is a thermosetting silicone resin and a moisture curing type resin.
At least one of silicone resin and photocurable silicone
Together when combining a resin containing 10～80Wt% heat-curable silicone resin or a moisture-curable silicone resin, saw including a photocurable silicone resin and the silicone resin was polyisobutylene as a main skeleton Contains silicone resin.

Further, the solder resist layers 13 and 17 and the first to sixth resist / insulating layers (L1R to L6R and L1).
i to L6i) are a layer using a silicone resin material having an elastic modulus of 100 kgf / mm ² or less in the temperature range of −50 ° C. to 200 ° C., and an elastic modulus of −50 ° C. to 20 ° C.
In the temperature range up to 0 ° C., a layer made of a resin material larger than 100 kgf / mm ² is combined, and more specifically, by changing the stacking order or the number of stacked layers, the flexibility of the entire substrate can be arbitrarily adjusted. It has the characteristics.

Next, a method of manufacturing the electronic device having the above structure will be described with reference to FIGS. In the description of this manufacturing method, the resist layers L3R and L3 shown in FIG.
It is assumed that a silicone resin material having the above-mentioned characteristics is used for 4R.

First, as shown in FIG. 2, a core base material 20 is prepared, and as shown in FIG.
1, 22 are bonded together to form a central base material layer. As the constituent material of the central base material layer, for example, an epoxy resin,
Phenol resin, acrylic resin, and silicone resin are used. Then, as shown in FIG. 4, through holes 23 are formed in the central base material layer (a laminated body of the core base material 20 and the resin layers 21 and 22).
To form.

Thereafter, as shown in FIG. 5, the conductive paste 24 is filled in the through holes 23 and the conductive paste 24 is hardened. Then, the central base material layer (core base material 20
A catalyst is applied (catalyst treatment) to both upper and lower surfaces of the laminated body of the resin layers 21 and 22, and the pasty silicone resin materials 25 and 26 are further applied. The silicone resin materials 25 and 26 have an elastic modulus after curing of -50 ° C to 200 ° C.
Is 100 kgf / mm ² or less in the temperature range up to, and has a thermosetting silicone resin component and a photocuring silicone resin component. The silicone resin material 2
5, 26 may have at least one of a thermosetting component and a moisture curing component and a photo-curing component.

The silicone resin material, more specifically, as a thermosetting silicone resin material, an addition reaction type silicone resin with a platinum catalyst as a contained resin component, particularly polydimethyl and polymethylphenylpolysiloxane resin (material part number: Shin-Etsu Chemical Co., Ltd. “KE184
3 ") 100 parts by weight, a terminal acryloxy group polydialkylsiloxane resin material as an ultraviolet-curable silicone resin material (material part number:" 3161 "manufactured by ThreeBond) 80
Mix parts by weight uniformly. Mixing is done in a vacuum planetary. The resulting material is applied to the surface of the FR-4 core substrate in about 4
Apply with a thickness of 0 μm.

Thereafter, as shown in FIG. 6, the entire surface of the silicone resin material 25, 26 in paste form is exposed for a short time.
That is, weak exposure is performed and a part is cured. The overall exposure for a short time is, for example, 500 mJ / cm ² . As a result, the surface tackiness (stickiness) disappears, and the subsequent steps can be easily performed.

Then, as shown in FIG. 7, the non-patterned portions are exposed to the silicone resin materials 25 and 26 by using photomasks 27 and 28. As a result, the photocurable silicone resin in the exposed area is completely cured. Further, as shown in FIG. 8, after developing, the silicone resin materials 25, 2
6 whole surface exposure (eg 2000 mJ / cm ² ),
Further, it is heat-cured to cure all silicone resin components.

By performing the exposure and development in this way, the desired area of the silicone resin material 25, 26 is formed in the pattern portion 2.
Open as 9, 30. Subsequently, as shown in FIG. 9, copper wiring patterns 31 and 32 are formed by plating the openings 29 and 30 obtained in the silicone resin materials 25 and 26. That is, the wiring / mounting pattern is formed (the wirings 31 and 32 are patterned).

Then, a flip chip or the like is mounted.
In this way, the electronic device is completed. Hereinafter, the materials used for the printed wiring board will be described.

Solder resist materials or insulating materials used for printed wiring boards are conventionally epoxy resin-based, acrylic resin-based, polyimide resin-based, phenol resin-based,
Most of the polyester resin materials were difficult to satisfy all of heat resistance, moisture resistance, low stress, electrical characteristics, and low cost.

In the present embodiment, a silicone resin material capable of sufficiently satisfying these required characteristics is used for the printed wiring board. Regarding silicone resin materials, first of all, since silicone resin materials have a low elastic modulus, they have excellent ability to relieve mechanical stress such as thermal stress, drop impact, bending, etc. It is possible to suppress the occurrence of peeling or cracks on the wiring surface or the wiring edge portion in the mounting process. In addition, the Si-O bond energy of the main skeleton (106 kc
al / mol) is the main skeleton CC bond (8) in the epoxy resin.
Greater than the binding energy of 5 kcal / mol), 300
It is possible to guarantee heat resistance up to about ℃. Further, it is also excellent in moisture resistance, and is also excellent in electrical characteristics because it is a material that has been conventionally used for sealing a semiconductor. Dielectric constant: 2.6-
2.8, dielectric loss tangent: 0.002 to 0.004, showing high frequency characteristics higher than that of polyimide resin. Moreover, since a silicone resin raw material that is industrially mass-produced is used, there is no problem in terms of cost.

However, in the present embodiment, in order to make such a silicone resin suitable as a solder resist material or an insulating layer material for a printed wiring board,
A thermosetting silicone resin, a moisture curable silicone resin and a photocurable silicone resin were selected. In particular, when considering that the wiring pattern portion can be formed by the exposure / development process, it is effective to add a photocurable silicone resin material. In this case, it is possible to change the ratio of the uncured portion in the entire silicone resin after exposure by changing the amount of the heat-curable silicone resin or the moisture-curable silicone resin blended with the photocurable silicone resin. It will be possible. This makes it possible to change the ease of dissolution in the developing process depending on the exposure amount. In this way, after development, grooves (openings 29, 30 in FIG. 8) for forming wiring are formed by additive plating or the like in a later step. Therefore, it becomes possible to handle by the same process as the conventional material capable of forming an insulating layer or a resist layer by ultraviolet curing.

As shown in FIG. 6, the silicone resin material 2 is applied to the entire surface of the printed wiring board.
After exposing the entire surfaces of Nos. 5 and 26 to the extent that surface tackiness (stickiness) disappears, exposure using the masks 27 and 28 is performed as shown in FIG. Problems such as mask contamination at times can be avoided.

Further, in this embodiment, a silicone resin having polyisobutylene as a main skeleton is used as a part or all of the thermosetting silicone resin or the moisture curing silicone resin. As a result, the moisture permeability, which is a drawback of conventional general silicone resins, can be significantly reduced, and the moisture resistance reliability of the product can be improved.

The silicone resins applicable to this embodiment include the following. Examples of thermosetting silicone resins include benzoyl peroxide, 2,4
-Dichlorobenzoyl peroxide, p-chlorobenzoyl peroxide, dicumyl peroxide, di-t
Peroxide cross-linking type silicone polymer using ert-butyl peroxide or 2,5-dimethyl-2,5-di (tert-butylperoxy) hexane as a polymerization initiator, and 1, n-divinyl-polydimethyl Polysiloxane having a terminal unsaturated bond such as siloxane, 1, n-divinyl-polymethylvinylsiloxane, and 1, n-divinyl-polymethylphenylsiloxane can be used as a platinum-based compound Sp by a crosslinking agent having a terminal hydrosilyl group.
There is an addition reaction cross-linking type silicone polymer which is polymerized in the presence of eier's catalyst.

Further, as the addition reaction cross-linking type silicone polymer, a polyisobutylene main skeleton other than the above-mentioned dialkyl or alkylaryl siloxane main skeleton type can be applied.

Further, as the moisture-curable silicone resin, a silane having a terminal alkoxy group, a terminal acetoxy group, a terminal acetamide group or a terminal 1-methylvinyloxy group, or a dialkylaminoxy cyclic polysiloxane is used as a crosslinking agent at the terminal. The thing which polymerizes the base polymer which has a silanol group is applicable. As for the moisture-curable silicone resin, the one in which a polyisobutylene skeleton is introduced into the main chain of the base polymer is also applicable, as in the above-mentioned heat-curable silicone resin.

Further, as the UV-curable silicone resin, a polysiloxane having a vinyl group at the terminal is crosslinked with a thiolalkylpolysiloxane in the presence of a photosensitizer, or a terminal acryloxyalkyl group or a terminal vinylamide group. A composition obtained by polymerizing the above polysiloxane without a cross-linking agent, and a composition obtained by polymerizing an epoxy-modified silicone resin with an onium salt are applicable.

Table 1 shows the thermosetting silicone resin (first
Component), a photocurable silicone resin (second component), a filler, etc. (additive of the third component other than the resin component), in the thermosetting silicone resin / all the silicone resins in the resist material ( wt%) when changing 30
The observation result of whether a groove having a width of 0 μm or less can be formed by development is shown. All the silicone resins in the thermosetting silicone resin / resist material were defective at 5 wt% and 90 wt%. Further, all the silicone resins in the thermosetting silicone resin / resist material are 20 wt% and 50 wt.
%, It was good, and 10 wt% and 80 wt% mixed good and bad.

From these results, thermosetting silicone resin /
The mixing ratio of all silicone resins (wt%) in the resist material is preferably in the range of 10 to 80 wt%.
It can be seen that the range of 0 to 50 wt% is more preferable.

[0044]

[Table 1] As described above, the present embodiment has the following features. (A) In a high-density mounted printed wiring board, it is possible to improve heat stress resistance and moisture resistance and secure good high frequency characteristics. As a result, it becomes possible to satisfy the problems of miniaturization, high density, high reliability, and high functionality of an electronic device, which has been a problem in the past, at a lower cost. (B) The flexibility of the printed wiring board can be controlled by the number of insulating layers to which the silicone resin material is applied and the stacking order. Since it can be bent, the product can be made smaller.

That is, as shown in FIG. 1, from top to bottom,
First layer resist layer L1R, first layer insulating layer L1i, second layer resist layer L2R, second layer insulating layer L2i, third layer resist layer L3R, third layer insulating layer L3i, fourth layer insulating layer L4i
In the case where the fourth layer resist layer L4R, the fifth layer insulating layer L5i, the fifth layer resist layer L5R, the sixth layer insulating layer L6i, and the sixth layer resist layer L6R are laminated, for example, the first layer
.Sixth resist layer and insulating layers L1R, L1i, L6R
, Matrix resin L6i is made of a silicone resin, not more than 100 kgf / mm @ 2 in a temperature range up to the 200 ° C. modulus from -50 ° C., and the
Silicone resin material is photocurable silicone resin,
Is a thermosetting silicone resin and a moisture-curing silicone resin
Of at least one of the above and a photocurable silicone resin
Combined, thermosetting silicone resin and moisture curing type
At least one of silicone resin and photocurable silicone
When combining and down resin and the silicone resin material to contain the heat-curable silicone resin or a moisture-curable silicone resin 10～80Wt% and a light-curable silicone resins, the following effects. That is, it is possible to prevent cracks in the solder resist layer or the insulating layer immediately below the solder resist layer in the vicinity of the component mounting electrode during temperature cycling or product drop.

Further, as another example, the first, second, fifth, sixth
Layer resist layer and insulating layer (L1R, L1i, L2R
, L2i, L5R, L5i, L6R, L6i), or the matrix resin of the 1st, 2nd, 3rd, 4th, 5th, and 6th resist layers and the insulating layers (L1R to L6R, L1i to L6i) is made of a silicone resin. And its elastic modulus is -5
100kgf in the temperature range from 0 ℃ to 200 ℃
/ Mm2 or less, and the silicone resin material is
Photocurable silicone resin or thermosetting silicone
At least one of resin and moisture-curable silicone resin
Combining with photo-curable silicone resin,
Of silicone resin and moisture-curable silicone resin
Combine one side with a photo-curable silicone resin
If, when the silicone resin material to contain the heat-curable silicone resin or a moisture-curable silicone resin 10～80Wt% and a light-curable silicone resins, the following effects. In other words, as described above, in addition to being able to prevent cracks in the solder resist layer or the insulating layer immediately thereunder in the vicinity of the component mounting electrode during temperature cycling or product drop, in addition to substrate flexibility, The board can be housed in a shaped product housing. For example, as shown in FIG. 10, as the structure of the product casing 40,
In the case where the ceiling surface forming plate material is configured by the bent plates 41, 42, 43, 44, the electronic component 50 in which the component 52 is mounted on the flexible printed wiring board 51 described above is mounted on the plates 41, 42, The plate 4 is bent inside the housing 40 by being bent according to the shapes of 43 and 44.
1, 42, 43, and 44 can be arranged at a constant interval.

The silicone resin material may contain at least 80 wt% of a silicone resin as a matrix resin, and may contain additives such as fillers and dispersants in addition to the matrix resin component.

[Brief description of drawings]

FIG. 1 is a sectional view of an electronic device according to an embodiment.

FIG. 2 is a manufacturing process diagram of a printed wiring board.

FIG. 3 is a manufacturing process diagram of a printed wiring board.

FIG. 4 is a manufacturing process diagram of a printed wiring board.

FIG. 5 is a manufacturing process diagram of a printed wiring board.

FIG. 6 is a manufacturing process diagram of a printed wiring board.

FIG. 7 is a manufacturing process diagram of a printed wiring board.

FIG. 8 is a manufacturing process diagram of a printed wiring board.

FIG. 9 is a manufacturing process diagram of a printed wiring board.

FIG. 10 is a diagram for explaining the printed wiring board in a state of being arranged inside the housing.

[Explanation of symbols]

1 ... Core substrate, 4 ... Through hole, 5 ... Through hole plating, 6 ... Copper plating circuit wiring, 7 ... Copper plating via hole, 8 ... Flip chip, 9 ... CSP, 10 ... Electrode, 1
DESCRIPTION OF SYMBOLS 1 ... Wiring pattern, 12 ... Electrode, 13 ... Solder resist layer, 14 ... MCM, 15 ... Electrode, 16 ... Wiring pattern,
17 ... Solder resist layer, L1R to L6R ... Resist layer, L1i to L6i ... Insulating layer.

Claims (9)

(57) [Claims] 1. An elastic modulus at a temperature of -50 ° C. to 200 ° C.
Silicone less than 100 kgf / mm ² in degree range
Resin material used for solder resist layer or insulation layer
The printed wiring board according to claim 1, wherein the insulating layer is the outermost insulating layer among the interlayer insulating layers in the multilayer board. 2. An elastic modulus at a temperature of -50 ° C. to 200 ° C.
Silicone less than 100 kgf / mm ² in degree range
Resin material used for solder resist layer or insulation layer
The printed wiring board according to claim 1, wherein the insulating layer is the outermost insulating layer among the layers on which the wiring pattern is formed in the multilayer board. 3. A temperature of which the elastic modulus is from -50 ° C. to 200 ° C.
Silicone less than 100 kgf / mm ² in degree range
Resin material used for solder resist layer or insulation layer
The printed wiring board is characterized in that the silicone resin material contains 80 wt% or more of a matrix resin, all of which is made of a silicone resin, and the silicone resin material is a photocurable silicone resin, Alternatively, it is composed of a combination of at least one of a thermosetting silicone resin and a moisture curing silicone resin and a photocuring silicone resin, and at least one of a thermosetting silicone resin and a moisture curing silicone resin and a photocuring silicone resin. The printed wiring board, wherein the silicone resin material contains 10 to 80 wt% of a thermosetting silicone resin or a moisture curing silicone resin. In the printed wiring board according to claim 4] any one of claims 1 to 3, wherein the silicone resin material, the printed wiring board is intended to include silicone resins polyisobutylene as a main skeleton. 5. A temperature of which the elastic modulus is from -50 ° C. to 200 ° C.
Silicone less than 100 kgf / mm ² in degree range
Resin material used for solder resist layer or insulation layer
A printed wiring board having a modulus of elasticity of -50 as a solder resist layer or an insulating layer.
100kgf / in the temperature range from ℃ to 200 ℃
A layer made of a silicone resin material having a size of ² mm ² or less, and an elastic modulus of 10 in a temperature range of −50 ° C. to 200 ° C.
A printed wiring board in combination with a layer using a resin material larger than 0 kgf / mm ² . 6. The printed wiring board according to claim 5 , wherein a layer made of the silicone resin material having a weight of 100 kgf / mm ² or less and a layer made of a resin material having a weight greater than 100 kgf / mm ² are laminated in order. A printed wiring board that can be changed to obtain any desired flexibility. 7. The printed wiring board according to claim 5 , wherein the number of laminated layers of the layer made of the silicone resin material of 100 kgf / mm ² or less and the layer made of the resin material larger than 100 kgf / mm ^2. A printed wiring board that has various characteristics as the flexibility of the entire board. 8. The surface of the base material has an elastic modulus of -50 after curing.
100kgf / in the temperature range from ℃ to 200 ℃
mm ² or less and a step of applying a paste-like silicone resin material having at least one of a thermosetting component and a moisture-curing component and a photo-curing component, and a step of performing weak exposure on the entire surface of the silicone resin material And exposing the silicone resin material using a mask and developing the silicone resin material to open a desired region of the silicone resin material, and patterning a wiring in the opening of the silicone resin material. A method of manufacturing a printed wiring board, comprising: 9. A step of applying a catalyst to the surface of a base material, and a modulus of elasticity after curing of -50 ° C. to 200 ° C. on the surface of the base material.
Of 100 kgf / mm ² or less in a temperature range up to and a paste-like silicone resin material having at least one of a thermosetting component and a moisture curing component and a photocuring component; A step of exposing the entire surface to weak exposure; a step of exposing the silicone resin material using a mask and developing to open a desired region in the silicone resin material; and wiring to the opening portion of the silicone resin material. And a step of patterning, which is a method for manufacturing a printed wiring board.