JP2000091753A - Printed wiring board and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board for which heat- and moisture- resistance reliability can be secured and, at the same time, its high-frequency characteristic can be improved by lowering the permittivity of the board to the level of a polyimide resin. SOLUTION: Of a solder resist layer 13, a first resist layer L1R, a first insulating layer L1i, another soldering resist layer 17, a sixth resist layer L6R, and a sixth insulating layer L6i in a multilayered printed wiring board, at least one layer contains a silicone resin having an elastic modulus of <=100 kgf/mm2 in a temperature range from -50 deg.C to 200 deg.C. The silicone resin contains 10-80 wt.% thermosetting or moisture-setting resin, 20-100 wt.% photo-setting silicone resin, and a silicone resin containing polyisobutylene as a main skeleton.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a printed wiring board and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, miniaturization of electronic devices and high-density mounting of components on a mounting board thereof have been remarkably progressed. At the same time, the reliability of the products is becoming increasingly severe.

[0003] In particular, as mounting components, flip chip and CSP (Chip Siz
e Package), BGA (Ball Grid Array), MCM
2. Description of the Related Art Surface mounting of semiconductor elements or semiconductor packages such as (Multi Chip Module) has become common.

[0004] These semiconductor elements and semiconductor packages require very narrow pitch electrodes on the substrate on which they are mounted in order to support high-density mounting. As a result, the stress generated in the solder resist or the insulating layer existing between the electrodes has increased more than before. Therefore, in the case of a printed wiring board that uses a general acrylic or epoxy resin material in these places, problems such as cracks and peeling may occur during soldering under a certain usage environment or when mounting components Easier to do. The specific use environment is, for example, when thermal or mechanical stress is applied or when the device is used in a humid atmosphere. Such a problem is the same not only on the outermost surface of the printed wiring board on which components are mounted, but also on the inner layer of the printed wiring board on which high-density wiring has been performed, and similarly, problems of inner layer cracks and inner layer peeling occur. .

Further, as part of the above-mentioned high-density printed wiring board applications, in recent years, products utilizing high-frequency circuits and digital circuits, such as mobile phones and computers, have been actively developed. In these product fields, if miniaturization and high-density mounting are performed while using a conventional glass epoxy substrate, it is inevitable that the product characteristics deteriorate due to problems such as crosstalk noise between wirings. That is, improvement of high frequency characteristics has become an essential issue.

Among the above problems, in order to solve the former problem of cracking and peeling, Japanese Patent Application Laid-Open No. 4-53297 has disclosed that the heating temperature in the previous step in the step of forming an insulating layer with a polyimide resin is reduced. It has been proposed to reduce the thermal stress by making the temperature lower than the final baking temperature. However, even though this may improve reliability in the manufacturing process of printed circuit boards, during soldering, where thermal stress at higher temperatures is expected, and in long-term durability reliability tests, Lowering the heat treatment temperature is not always advantageous. In particular, it can be considered effective only in the case of a polyimide resin material having a remarkably high curing temperature. However, in this case, the polyimide resin has a large water absorption rate, and a problem remains in terms of moisture resistance reliability. In addition, as in JP-A-8-248630, there is an example in which a rubber component is blended in an insulating layer material to reduce stress. However, in general, rubber components such as polybutadiene and polyurethane are inferior in heat resistance and moisture resistance. Therefore, as the compounding amount is increased in order to reduce the stress, these characteristics are deteriorated. Are not always sufficiently achieved.

[0007] Regarding the latter problem, many examples in which a polyimide resin-based material is used as an insulating layer material have been conventionally proposed. Expansion is delayed. On the other hand, in recent years, as disclosed in Japanese Patent Application Laid-Open No. 9-172234, there has been proposed an example in which benzocyclobutene having a lower dielectric constant and a better moisture resistance than a glass epoxy substrate is used for an insulating layer. This material, in addition to these properties, is also capable of keeping the curing temperature lower than that of the polyimide resin. However, a curing temperature of about 200 ° C. is required, and sufficient attention must be paid to process control to reduce the yield in terms of reliability due to residual stress in the printed wiring board manufacturing process. Furthermore, since it is still a special material, it has not been fully established industrially, including its supply system, and there remains a problem in terms of cost.

[0008]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a print which can ensure high heat and humidity reliability under a use environment and can improve high frequency characteristics by lowering the dielectric constant of a polyimide resin. It is to provide a wiring board.

[0009]

According to the first aspect of the present invention, a silicone resin material having an elastic modulus of 100 kgf / mm ² or less in a temperature range from -50 ° C. to 200 ° C. is used for a solder resist layer or an insulating layer. It is characterized by being used for.

Here, the silicone resin is a low-stress, high-heat-resistant, low-dielectric-constant, and inexpensive material. If this material is used for a solder resist layer or an insulating layer material of a printed wiring board, the heat resistance under the use environment is reduced. -It is possible to obtain a high-density mounting-compatible product that satisfies the advantages in terms of high-frequency characteristics and cost in terms of securing moisture resistance reliability and lowering the dielectric constant of polyimide resin.

Here, the insulating layer may be the outermost insulating layer among the interlayer insulating layers in the multilayer substrate, or each layer of the multilayer substrate on which the wiring pattern is formed. And the printed wiring board according to any one of claims 1 to 3, wherein the silicone resin material is 80 wt% or more. , All of which are made of silicone resin, including 10 to 80 wt% of a thermosetting silicone resin or a moisture-curing silicone resin, and 20 to 100 wt% of a photosetting silicone resin. In the printed wiring board according to any one of claims 1 to 4, as described in claim 5, the silicone resin material is It is intended to include silicone resin isobutylene as a main skeleton. This is practically preferable.

Further, as described in claim 6, claim 1 is
6. The printed wiring board according to any one of items 1 to 5, wherein the solder resist layer or the insulating layer has an elastic modulus of −
100kg in the temperature range from 50 ℃ to 200 ℃
a layer using a silicone resin material of f / mm ² or less;
By combining with a layer using a resin material having a modulus of elasticity greater than 100 kgf / mm ² in a temperature range from −50 ° C. to 200 ° C., it is possible to obtain arbitrary characteristics as the flexibility of the whole substrate.

That is, as described in claim 7, the 1
By changing the lamination order of a layer using a silicone resin material of 100 kgf / mm ² or less and a layer using a resin material of more than 100 kgf / mm ² , it is possible to obtain an arbitrary characteristic as the flexibility of the whole substrate. As described in claim 8, by changing the number of laminated layers of the layer using a silicone resin material of 100 kgf / mm ² or less and the layer using a resin material larger than 100 kgf / mm ² , Arbitrary characteristics can be obtained as the flexibility of the whole substrate.

As a method of manufacturing a printed wiring board, the surface of the base material may have an elastic modulus after curing of 100 kgf / mm in a temperature range from -50 ° C. to 200 ° C. ² or less and a paste-like silicone resin material having at least one of a thermosetting component and a moisture setting component and a photosetting component is applied. Then, weak exposure is performed on the entire surface of the silicone resin material. Thereby, the surface tackiness is lost. Further, the silicone resin material is exposed using a mask and developed to open a desired region in the silicone resin material. Subsequently, wiring is patterned in the opening of the silicone resin material.

As described above, a more practical method of manufacturing a printed wiring board can be achieved by using a paste-like silicone resin material having at least one of a thermosetting component and a moisture-curing component and a photocuring component. .

[0016]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of a printed wiring board according to the present embodiment. The printed wiring board of this example is a multilayer printed wiring board, and three layers of wiring patterns are formed on both front and back surfaces of the board. Then, on both sides of the substrate, a flip chip 8, a CSP (Chip Size Package) 9 and an MCM
(Multi Chip Module) 14 is surface-mounted.

The details will be described below. A glass epoxy substrate is used as the core substrate 1. This core substrate 1
Is formed with a through hole 4 and a through hole plating 5 is formed in the through hole 4. Note that a conductive paste may be used instead of the through-hole plating 5.

On the upper surface of the core substrate 1, three insulating layers (hereinafter referred to as a resist layer) on which a wiring pattern is formed and three interlayer insulating layers are alternately laminated. That is, from top to bottom, the first resist layer L1R, the first insulating layer L1i, the second resist layer L2R, the second insulating layer L2i
, A third resist layer L3R and a third insulating layer L3i. On the lower surface of the core substrate 1, three insulating layers (hereinafter, referred to as a resist layer) on which a wiring pattern is formed and three interlayer insulating layers are alternately stacked. That is, from top to bottom, the fourth insulating layer L4i, the fourth resist layer L4R, the fifth insulating layer L5i, the fifth resist layer L5R, the sixth insulating layer L6i, the sixth resist layer L6
R is formed.

The resist layers L1R, L2R, L3R, L4
Copper-plated circuit wiring (wiring pattern) 6 is arranged on R, L5R, and L6R. Insulating layers L1i, L2i, L3
i, L4i, L5i and L6i are provided with copper plated via holes (IVH (Interstitial Via Hole)) 7 for interlayer bonding.
Is formed, and conduction between the layers is established through this IVH7. However, one or both of the layers L3i and L4i may be omitted.

The flip chip 8 and the CSP 9 are disposed on the first resist layer L1R in the insulating layer laminate 2 formed on the surface (upper surface) of the core substrate 1. The flip chip 8 is electrically connected to the wiring pattern 11 in the first resist layer L1R at the electrode 10,
The CSP 9 is electrically connected to the wiring pattern 11 in the first resist layer L1R at the electrode 12. More specifically, a solder resist layer 13 is formed on the first resist layer L1R, and the electrodes 10, 12 and the wiring pattern 11 are soldered (bonded) using the solder resist layer 13.

It should be noted that instead of the CSP 9, a BGA (Ball
Grid Array) may be used. Similarly, an MCM 14 is disposed on the front surface side of the sixth resist layer L6R in the insulating layer laminate 3 formed on the back surface of the core substrate 1. The MCM 14 is electrically connected to the wiring pattern 16 in the surface sixth resist layer L6R at the electrode 15. Specifically, on the resist layer L6R (front side),
A solder resist layer 17 is formed, and the electrode 15 and the wiring pattern 16 are soldered (bonded) using the solder resist layer 17.

Here, the solder resist layer 13, the first resist layer L1R, the first insulating layer L1i, the solder resist layer 17, the sixth resist layer L6R, the sixth insulating layer L6i.
At least one of them has the following configuration.

The silicone resin having a modulus of elasticity of 100 kgf / mm ² or less in a temperature range from −50 ° C. to 200 ° C. includes: (i) a photocurable silicone resin; and (ii) a photocurable silicone resin + moisture. Curable silicone resin, (iii) photo-curable silicone resin + thermosetting silicone resin, (iv) photo-curable silicone resin + moisture-curable silicone resin + thermosetting silicone resin, and The silicone resin material contains a matrix resin of 80 wt% or more, and all of the silicone resin material is made of a silicone resin. The silicone resin material contains a thermosetting silicone resin or a moisture curing silicone resin in an amount of 10 to 80 wt%, The silicone resin material contains 20 to 100% by weight of a curable silicone resin, and is made of polyisobutylene. Contains silicone resin with len as the main skeleton.

Further, the solder resist layers 13, 17 and the first to sixth resist / insulating layers (L1R to L6R, L1
i to L6i) are a layer using a silicone resin material having an elastic modulus of 100 kgf / mm ² or less in a temperature range from −50 ° C. to 200 ° C., and a layer having an elastic modulus from −50 ° C. to 20 ° C.
It is combined with a layer using a resin material larger than 100 kgf / mm ² in a temperature range up to 0 ° C. More specifically, by changing the lamination order or changing the number of lamination layers, the flexibility of the whole substrate can be arbitrarily determined. Get the characteristics.

Next, a method of manufacturing the electronic device configured as described above will be described with reference to FIGS. In the description of this manufacturing method, the resist layers L3R, L3R in FIG.
It is assumed that a silicone resin material having the above-mentioned characteristics is used for 4R.

First, as shown in FIG. 2, a core base material 20 is prepared, and as shown in FIG.
The central base material layer is formed by laminating 1 and 22. As a constituent material of the center base layer, for example, epoxy resin,
Use phenol resin, acrylic resin, or silicone resin. Then, as shown in FIG. 4, through holes 23 are formed in the center base layer (the laminate of the core base 20 and the resin layers 21 and 22).
To form

Thereafter, as shown in FIG. 5, a conductive paste 24 is filled in the through holes 23, and the conductive paste 24 is cured. Then, the center base material layer (core base material 20)
A catalyst is applied (catalyzed) on the upper and lower surfaces of the laminate of the resin layers 21 and 22), and paste-like silicone resin materials 25 and 26 are applied. The silicone resin materials 25 and 26 have a modulus of elasticity after curing from -50 ° C to 200 ° C.
Up to 100 kgf / mm ² in the temperature range up to and has a thermosetting silicone resin component and a photocurable silicone resin component. In addition, the silicone resin material 2
5 and 26 may have at least one of a thermosetting component and a moisture setting component and a photosetting component.

Here, regarding the silicone resin material, more specifically, as a thermosetting silicone resin material, an addition reaction type silicone resin using a platinum catalyst as a contained resin component, particularly polydimethyl and polymethylphenylpolysiloxane resins (material number: Shin-Etsu Chemical's KE184
3 ") 100 parts by weight, an acryloxy-terminated polydialkylsiloxane resin material as a UV-curable silicone resin material (material number:" 3161 "manufactured by ThreeBond) 80
Mix parts by weight uniformly. Mixing is performed in a vacuum planetary. The obtained material is applied to the surface of the FR-4 core substrate by about 4
Apply with a thickness of 0 μm.

Then, as shown in FIG. 6, the entire surface of the paste-like silicone resin materials 25 and 26 is exposed for a short time.
That is, weak exposure is performed and a part is cured. The short-time overall exposure is, for example, 500 mJ / cm ² . Thereby, the surface tackiness (stickiness) is lost, and the subsequent steps can be easily performed.

Then, as shown in FIG. 7, the non-pattern portions are exposed to the silicone resin materials 25 and 26 using photomasks 27 and 28. Thereby, the photocurable silicone resin in the exposed portion is completely cured. Further, as shown in FIG. 8, after the development, the silicone resin materials 25, 2
6 was exposed to the entire surface (for example, 2000 mJ / cm ² )
Further, it is cured by heating to cure all the silicone resin components.

By performing the exposure and development as described above, a desired region in the silicone resin materials 25 and 26 is formed in the pattern portion 2.
Open as 9,30. Subsequently, as shown in FIG. 9, the copper wiring patterns 31, 32 are formed by plating the openings 29, 30 obtained in the silicone resin materials 25, 26. That is, a wiring / mounting pattern is formed (the wirings 31 and 32 are patterned).

Then, a flip chip or the like is mounted.
Thus, the electronic device is completed. Hereinafter, the material used for the printed wiring board will be described.

Conventionally, a solder resist material or an insulating material used for a printed wiring board is an epoxy resin type, an acrylic resin type, a polyimide resin type, a phenol resin type,
Most of the polyester resin-based materials have difficulty in satisfying all of heat resistance, moisture resistance, low stress, electric characteristics, and low cost.

In the present embodiment, a silicone resin material which can sufficiently satisfy these required characteristics is used for the printed wiring board. Regarding silicone resin materials, first of all, silicone resin materials have a low modulus of elasticity, so they have excellent ability to relieve mechanical stress such as thermal stress, drop impact, bending, etc. It is possible to suppress the occurrence of peeling and cracks on the wiring surface or the wiring edge in the mounting process. Further, the bonding energy of the Si—O bond of the main skeleton (106 kc
al / mol) is the main skeleton C—C bond (8
5kcal / mol), which is 300
It is possible to guarantee heat resistance up to about ° C. Further, it is excellent in moisture resistance, and is also excellent in electric characteristics because it is a material that has been used for sealing semiconductors. Not to mention the insulating properties, but the dielectric constant: 2.6 to
2.8, dielectric loss tangent: 0.002 to 0.004, indicating high-frequency characteristics higher than that of polyimide resin. In addition, since a silicone resin raw material industrially mass-produced is used, there is no problem in terms of cost.

However, in the present embodiment, among such silicone resins, in order to make them suitable as a solder resist material or an insulating layer material for a printed wiring board,
A thermosetting silicone resin, a moisture-curing silicone resin and a photo-curing silicone resin were selected. In particular, when considering that the wiring pattern portion can be formed by an exposure and development process, it is effective to mix a photocurable silicone resin material. In this case, by changing the amount of the heat-curable silicone resin or the moisture-curable silicone resin to be mixed with the photocurable silicone resin, it is possible to change the ratio of the uncured portion in the entire silicone resin after exposure. It becomes possible. This makes it possible to change the ease of dissolution in the development step according to the exposure amount. In this manner, after the development, grooves (openings 29 and 30 in FIG. 8) for forming wiring are formed by additive plating or the like in a later step. Therefore, it can be handled by the same process as a conventional material capable of forming an insulating layer or a resist layer by ultraviolet curing.

As shown in FIG. 6, the silicone resin material 2 applied to the entire surface of the printed circuit board is used.
After exposing the entire surface of each of the surfaces 5 and 26 to such an extent that the surface tackiness (stickiness) is eliminated, as shown in FIG. 7, the exposure using the masks 27 and 28 is performed, so that the exposure using the mask is performed. Problems such as mask contamination at the time can be avoided.

Further, in the present embodiment, a silicone resin having polyisobutylene as a main skeleton is used for part or all of the thermosetting silicone resin or the moisture-curing silicone resin. As a result, the moisture permeability, which is a drawback of the conventional general silicone resin, can be significantly reduced, and the moisture resistance reliability of the product can be improved.

The following silicone resins are applicable to the present embodiment. As the thermosetting silicone resin, benzoyl peroxide, 2,4
-Dichlorobenzoyl peroxide, p-chlorobenzoyl peroxide, dicumyl peroxide, di-t
peroxide-crosslinked silicone polymer using tert-butyl peroxide or 2,5-dimethyl-2,5-di (tert-butylperoxy) hexane as a polymerization initiator, and 1, n-divinyl-polydimethyl A polysiloxane having a terminal unsaturated bond, such as siloxane, 1, n-divinyl-polymethylvinylsiloxane, or 1, n-divinyl-polymethylphenylsiloxane, is treated with a crosslinking agent having a terminal hydrosilyl group to form a platinum-based compound Sp.
There is an addition reaction cross-linking type silicone polymer that is polymerized in the presence of eier's catalyst.

In addition, as the silicone polymer of the addition reaction cross-linking type, those having a polyisobutylene main skeleton other than the above-mentioned dialkyl or alkylaryl siloxane main skeleton type can be applied.

Further, as the moisture-curable silicone resin, a silane having a terminal alkoxy group, a terminal acetoxy group, a terminal acetamido group or a terminal 1-methylvinyloxy group, or a dialkylaminoxy cyclic polysiloxane is used as a crosslinking agent to form a terminal. What polymerizes the base polymer which has a silanol group is applicable. As this moisture-curable silicone resin, similarly to the above-mentioned heat-curable silicone resin, a resin in which a polyisobutylene skeleton is introduced into the main chain of the base polymer is also applicable.

Further, as the UV-curable silicone resin, a polysiloxane having a vinyl group at a terminal may be crosslinked with a thiolalkylpolysiloxane in the presence of a photosensitizer, or an acryloxyalkyl group or a vinylamide group may be used. A composition in which the above polysiloxane is polymerized without a crosslinking agent, and a composition in which an epoxy-modified silicone resin is polymerized with an onium salt are applicable.

Table 1 shows that the thermosetting silicone resin (No. 1)
Component), a photocurable silicone resin (second component), a filler containing fillers and the like (an additive of a third component other than the resin component), and a thermosetting silicone resin / all silicone resins in the resist material ( 30 wt%)
The observation result of whether or not a groove having a width of 0 μm or less can be formed by development is shown. When all the silicone resins in the thermosetting silicone resin / resist material were 5 wt% and 90 wt%, the results were poor. In addition, all of the silicone resin in the thermosetting silicone resin / resist material is 20 wt% and 50 wt%.
%, And good and bad were mixed at 10 wt% and 80 wt%.

From these results, it can be seen that the thermosetting silicone resin /
The mixing ratio of all the silicone resins (wt%) in the resist material is preferably in the range of 10 to 80 wt%,
It turns out that the range of 0 to 50 wt% is more preferable.

[0044]

[Table 1] As described above, this embodiment has the following features. (A) In a high-density mounting printed wiring board, it is possible to improve the heat stress resistance and the moisture resistance and to secure good high-frequency characteristics. This makes it possible to satisfy the miniaturization, high density, high reliability, and high functionality of the electronic device, which have been a problem in the past, at lower cost. (B) It is also possible to control the flexibility of the printed wiring board by controlling the number of insulating layers to which a silicone resin material is applied and the order of lamination. Since it can be bent, the size of the product can be further reduced.

That is, as shown in FIG.
First resist layer L1R, first insulating layer L1i, second resist layer L2R, second insulating layer L2i, third resist layer L3R, third insulating layer L3i, fourth insulating layer L4i
When the fourth resist layer L4R, the fifth insulating layer L5i, the fifth resist layer L5R, the sixth insulating layer L6i, and the sixth resist layer L6R are stacked, for example,
.Sixth resist layer and insulating layers L1R, L1i, L6R
, L6i is made of a silicone resin, and has an elastic modulus of 100 kgf / mm ² or less in a temperature range from -50 ° C. to 200 ° C., and a thermosetting silicone resin or a moisture-curing silicone resin 1
0 to 80% by weight and photocurable silicone resin 20-1
The following effects can be obtained by including 00 wt%.
That is, it is possible to prevent cracks in the solder resist layer or the insulating layer immediately below the solder resist layer near the component mounting electrode at the time of temperature cycling or product drop.

As another example, the first, second, fifth and sixth
Resist layers and insulating layers (L1R, L1i, L2R)
, L2i, L5R, L5i, L6R, L6i) or the matrix resin of the 1st, 2nd, 3rd, 4th, 5th, 6th resist and insulating layers (L1R to L6R, L1i to L6i) is made of silicone resin. And its elastic modulus is -5
100kgf in the temperature range from 0 ° C to 200 ° C
/ Mm ² or less and containing 10 to 80 wt% of a thermosetting silicone resin or a moisture-curing silicone resin and 20 to 100 wt% of a photo-curing silicone resin, the following effects are obtained. That is, as described above, in addition to being able to prevent cracking of the solder resist layer or the insulating layer immediately below the electrode for component mounting at the time of temperature cycling or product dropping, in addition to the substrate flexibility, various types of The substrate can be housed in the product housing having the shape. For example, as shown in FIG.
0, the bent plates 41, 42,
When the ceiling surface forming plate is formed by 43 and 44, the component 5 is placed on the flexible printed wiring board 51 described above.
2 is mounted on the plate 41, 42, 4
It can be bent in accordance with the shapes of the plates 3, 44, and arranged at a fixed distance from the plates 41, 42, 43, 44 inside the housing 40.

The silicone resin material may contain at least 80% by weight or more of a silicone resin as a matrix resin, and may contain additives such as a filler and a dispersant in addition to the matrix resin component.

[Brief description of the drawings]

FIG. 1 is an exemplary sectional view of an electronic device according to an embodiment;

FIG. 2 is a manufacturing process diagram of a printed wiring board.

FIG. 3 is a manufacturing process diagram of a printed wiring board.

FIG. 4 is a manufacturing process diagram of a printed wiring board.

FIG. 5 is a manufacturing process diagram of a printed wiring board.

FIG. 6 is a manufacturing process diagram of a printed wiring board.

FIG. 7 is a manufacturing process diagram of a printed wiring board.

FIG. 8 is a manufacturing process diagram of a printed wiring board.

FIG. 9 is a manufacturing process diagram of a printed wiring board.

FIG. 10 is a diagram illustrating a printed wiring board in a state where the printed wiring board is arranged inside a housing.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Core board, 4 ... Through-hole, 5 ... Through-hole plating, 6 ... Copper plating circuit wiring, 7 ... Copper plating via hole, 8 ... Flip chip, 9 ... CSP, 10 ... Electrode, 1
DESCRIPTION OF SYMBOLS 1 ... wiring pattern, 12 ... electrode, 13 ... solder resist layer, 14 ... MCM, 15 ... electrode, 16 ... wiring pattern,
17: solder resist layer, L1R to L6R: resist layer, L1i to L6i: insulating layer.

Continued on front page F-term (reference) 5E314 AA40 BB06 BB12 BB13 CC01 DD06 DD07 DD08 FF05 FF17 GG01 GG04 GG08 GG17 5E346 AA06 AA12 AA15 AA17 AA43 BB01 BB16 CC08 CC32 DD03 DD22 FF07 FF18 GG01 HGG18H17

Claims (10)

[Claims] 1. A printed wiring board wherein a silicone resin material having an elastic modulus of 100 kgf / mm ² or less in a temperature range from −50 ° C. to 200 ° C. is used for a solder resist layer or an insulating layer. 2. The printed wiring board according to claim 1, wherein the insulating layer is an outermost insulating layer among interlayer insulating layers in a multilayer board. 3. The printed wiring board according to claim 1, wherein the insulating layer is the outermost insulating layer among layers in which a wiring pattern is formed on the multilayer board. 4. The printed wiring board according to claim 1, wherein the silicone resin material contains 80 wt% or more of a matrix resin, and all of the matrix resin is made of a silicone resin. A printed wiring board containing 10 to 80% by weight of a thermosetting silicone resin or a moisture-curing type silicone resin and 20 to 100% by weight of a photocuring type silicone resin. 5. The printed wiring board according to claim 1, wherein the silicone resin material includes a silicone resin having polyisobutylene as a main skeleton. 6. The process according to claim 1, wherein
The elastic modulus of the printed wiring board is -50 as a solder resist layer or an insulating layer.
100 kgf /
mm^TwoA layer using a silicone resin material that is
10 in the temperature range from -50 ° C to 200 ° C.
0kgf / mm ^TwoCombine with a layer using a larger resin material
Printed circuit board combined. 7. The printed wiring board according to claim 6, wherein a layer using a silicone resin material of 100 kgf / mm ² or less and a layer using a resin material of more than 100 kgf / mm ² are laminated in an order. A printed wiring board that can obtain any desired characteristics as the flexibility of the whole board by changing it. 8. The printed wiring board according to claim 6, wherein the number of laminated layers of a layer using a silicone resin material of 100 kgf / mm ² or less and a layer using a resin material of more than 100 kgf / mm ^2. The printed wiring board is designed to obtain an arbitrary characteristic as the flexibility of the entire board by changing the above. 9. An elastic modulus after curing is -50 on the surface of the base material.
100 kgf /
mm ² or less, and a step of performing the steps of applying a paste-like silicone resin having at least one and a photocurable component of the thermosetting component or moisture curing component, the entire weak exposure of the silicone resin material A step of performing exposure using a mask on the silicone resin material and performing development to open a desired region in the silicone resin material; and a step of patterning a wiring in an opening of the silicone resin material. A method for manufacturing a printed wiring board, comprising: 10. A step of applying a catalyst to a surface of a base material, wherein the elastic modulus after curing is from -50 ° C. to 200 ° C.
Applying a paste-like silicone resin material having a temperature of 100 kgf / mm ² or less and a thermosetting component or a moisture curing component and a photocuring component in a temperature range of up to Performing a weak exposure on the entire surface, performing exposure using a mask on the silicone resin material and performing development to open a desired region in the silicone resin material, and forming a wire in the opening of the silicone resin material. Patterning a printed wiring board.