JP3317225B2 - Method and apparatus for manufacturing electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing an electronic component, and more particularly, to a part of an end face of a component body provided in the electronic component and a part of an adjacent face from the end face. TECHNICAL FIELD The present invention relates to a method and an apparatus for manufacturing an electronic component that needs to be provided with a paste such as a conductive paste so as to extend.

[0002]

2. Description of the Related Art FIG. 3 is a perspective view showing an appearance of an electronic component 1 which is of interest to the present invention. For example, some composite electronic components constituting an array of capacitors or inductors, a filter including these, and the like have the appearance as shown in FIG.

The electronic component 1 includes a component body 2 having a hexahedral shape, for example, and a plurality of electrodes 4 serving as terminals for electrical connection to external circuit elements are provided on a part of an end surface 3 of the component body 2. Is formed. Each electrode 4 has a portion extending on the end face 3 as well as adjacent faces 5 and 6 respectively adjacent to the end face 3.
Has an adjacent surface extension 7 that extends to a part of. In the electronic component 1, the electrodes 4 are formed not only on the end face 3 of the component body 2 but also on an end face 8 facing the end face 3 in a similar manner. Since the adjacent surface extension 7 formed on the adjacent surface 6 is located at a position hidden by the component body 2,
Although not shown, it is formed in the same manner as the adjacent surface extension 7 on the adjacent surface 5.

An apparatus 9 as shown in FIG. 4 has been devised for forming the above-mentioned electrode 4. This device 9 includes a slit plate 10 made of metal, and the slit plate 10 includes:
A plurality of slits 11 having a width corresponding to the width of each electrode 4
Is provided. The component body 2 is arranged so that the end face 3 is in contact with the slit plate 10. In this state, by operating the piston 12 upward, the conductive paste 13 is supplied through the slit 11 so as to rise to the upper surface side of the slit plate 10. As a result, the conductive paste 13 is applied on a part of the end face 3 of the component body 2 and on a part of each of the adjacent faces 5 and 6.

The same operation is performed on the other end face 8 of the component body 2.
Is also implemented for Thereafter, the conductive paste 13 applied on the component main body 2 is baked, and the conductive paste 13 is used to apply the conductive paste 13 as shown in FIG.
Is formed. Instead of the device 9 described above, a device 14 shown in FIG. 5 has been devised.

[0006] The apparatus 14 includes a coating plate 15 made of an elastically deformable material such as rubber. Coating plate 15
Are provided with a plurality of grooves 16 having a width corresponding to the width of the electrode 4, and each groove 16 is filled with a conductive paste 17. The component body 2 is pressed toward the application plate 15 with the end surface 3 in contact with the application plate 15. Thereby, the component main body 2 compressively deforms the application plate 15 in the thickness direction. As a result, the conductive paste 17 in the groove 16 is applied on the end face 3 of the component body 2, and a part of the conductive paste 17 swells on the upper surface side of the application plate 15, and is placed on the adjacent surfaces 5 and 6. Is also given.

A similar operation is performed on the other end face 8 of the component body 2.
Is also implemented for Thereafter, as in the case of using the device 9 shown in FIG. 4, the conductive paste 17 is baked, and the electrode 4 having the adjacent surface extension 7 as shown in FIG. .

[0008]

However, when the apparatus 9 shown in FIG. 4 is used, the amount of the conductive paste 13 to be applied is temporarily determined by the stroke amount of the piston 12, but this stroke amount is controlled. It is relatively difficult to control the amount of the conductive paste 13 to be applied, and therefore, the amount of the conductive paste 13 applied tends to vary. In addition, in the case of the device 9 shown in FIG. 4, the amount of the conductive paste 13 stored therein is usually larger than the required amount to be applied, and the amount proportional to the width of the slit 11 depends on the paste viscosity. Provided to the body 2. Generally, as the electrode width increases, the coating thickness also increases.
For this reason, depending on the electrode width, the component body 2 that cannot be applied
And may be subject to certain restrictions.

On the other hand, when the apparatus 14 shown in FIG. 5 is used, since the amount of the conductive paste 17 filled in the groove 16 is limited, the amount of the conductive paste 17 constituting the coating plate 15 is limited. Variations in the degree of deformation tend to cause variations in the applied amount. In addition, the elastic body such as rubber constituting the coating plate 15 may swell due to the solvent contained in the conductive paste 17, but such swelling not only shortens the life of the coating plate 15, but also shortens the life of the coating plate 15. A variation in the degree of deformation of the elastic body is caused, and a variation in the applied amount is more likely to occur.

In the above description, the case where the conductive paste 13 or 17 is applied to form the electrode 4 on the component body 2 has been described. For example, a paste other than the conductive paste such as a resistor paste or an adhesive paste is used. A similar problem is encountered in the case where is provided on the component body of the electronic component. Therefore, an object of the present invention is to solve both of the problems encountered by the above-described two conventional techniques, and it is possible to reduce variation in the amount of paste applied to a component body. To provide a method and an apparatus for manufacturing an electronic component.

[0011]

SUMMARY OF THE INVENTION The present invention provides a component body, and has a predetermined width so as to extend over a part of an end surface of the component body and a part of the end surface to a part of an adjacent surface. The present invention is firstly directed to a method for manufacturing an electronic component, which includes a step of applying a paste by using the method described above, and is characterized by having the following configuration in order to solve the above-described technical problem.

That is, it has first and second main surfaces opposed to each other at a predetermined interval, and the first main surface side is a surface in contact with the end surface of the component body, and corresponds to the width to which the paste is to be applied. A slit plate provided with a slit having a width to be provided, provided on a second main surface side of the slit plate, and forming a convex portion capable of protruding into the slit, a plunger member Is prepared.

Then, the paste is filled in the slits of the slit plate, and the end surface of the component body is brought into contact with the first main surface of the slit plate. Next, the protrusion formed by the plunger member is caused to protrude into the slit, whereby the paste filled in the slit is supplied so as to rise to the first main surface side, and the paste in the slit is supplied to the end face of the component body. On a portion of the surface and on a portion of the adjacent surface.

In the method of manufacturing an electronic component according to the present invention, preferably, the step of filling the slit with the paste is performed before the step of bringing the end face of the component body into contact with the first main surface. In the step of filling the slit with the paste, it is more preferable that the plunger member is positioned so as to close the opening of the slit on the second main surface side of the slit plate.

Further, in the method of manufacturing an electronic component according to the present invention, when the projection is made to protrude into the slit, substantially the entire amount of the paste in the slit is supplied to the first main surface side of the slit plate. Is preferable. In the method for manufacturing an electronic component according to the present invention, preferably,
As the paste, a conductive paste for forming an electrode on a part of an end face of the component body and a part of an adjacent face is applied.

The present invention also manufactures an electronic component to which a paste is applied with a predetermined width so as to extend over a part of an end face of the component body and from a part of the end face to a part of an adjacent face. The device is also directed to: This manufacturing apparatus is characterized by having the following configuration. That is, the electronic device manufacturing apparatus according to the present invention
It has a first main surface and a second main surface opposed to each other at a predetermined interval, and the first main surface side is a surface in contact with an end surface of the component body, and is used for filling the paste. A slit plate having a slit having a width corresponding to the width to be provided is provided. In addition, a plunger member is provided on the second main surface side of the slit plate and forms a protrusion that can enter the slit. Furthermore, in order to apply the paste in the slit to a part of the end face of the component body and to a part of an adjacent face, while supplying the paste filled in the slit so as to rise to the first main surface side, Driving means is provided for driving the projection so as to project into the slit.

In the electronic component manufacturing apparatus according to the present invention, preferably, the slit plate is provided with a plurality of slits. In the electronic component manufacturing apparatus according to the present invention, the plunger member typically includes the following 2
There are two modes. In a first aspect, the plunger member has a fixed body forming a convex portion. In this case, the driving unit includes a unit that relatively brings the plunger member closer to the slit plate so that the convex portion protrudes into the slit.

In the first aspect, preferably, the above-mentioned fixed body is made of a rigid body. In a second aspect, the plunger member includes a deformable sheet member disposed along the second main surface of the slit plate, and a fluid for transmitting pressure for deforming the sheet member. . In this case, the driving means includes means for applying pressure to the fluid such that the sheet member deforms along the inner wall surface of the slit while forming a convex portion by the sheet member.

[0019] In this second aspect, the plunger member may further comprise an operable piston and means for defining a fluid-tight space in cooperation with the seat member and the piston. In this case, the means for applying pressure to the fluid, provided in the above-described driving means,
This is realized by means for operating the piston.

[0020]

FIG. 1 is a view for explaining a method and an apparatus 21 for manufacturing an electronic component according to a first embodiment of the present invention. This manufacturing method and manufacturing apparatus 2
As shown in FIG. 3, on the part of the end face 3 or 8 of the component body 2 for the electronic component 1 and on each part of the adjacent faces 5 and 6 from a part of the end face 3 or 8. In order to form the electrode 4 having the adjacent surface extension 7 with a predetermined width so as to extend to a predetermined width, the method is applied in a step of applying the conductive paste 22 on the component body 2.

The manufacturing apparatus 21 has a slit plate 23 and a plunger member 24, for example, as shown in FIG. The slit plate 23 has first and second main surfaces 25 and 26 facing each other at a predetermined interval,
Therefore, it has a predetermined thickness. As shown in FIG. 1C, the first main surface 25 side of the slit plate 23 is a surface that is in contact with the end surface 3 or 8 of the component body 2. Further, as shown in FIG. 1 (2), the slit plate 23 is filled with the conductive paste 22 and has a plurality of widths corresponding to the width to which the conductive paste 22 is to be applied. A slit 27 is provided.

On the other hand, the plunger member 24 is disposed on the second main surface 26 side of the slit plate 23, and as shown in FIG. The projection 28 is formed. In this embodiment, the entire plunger member 24 including the projection 28 is made of a rigid body such as a metal. Note that the plunger member 24 only needs to be configured at least from a fixed body, and is not configured from a rigid body as described above.
For example, it may be made of an elastic material such as rubber.

The plunger member 24 is operated by driving means (not shown) so as to be relatively close to the slit plate 23. As a result, the projection 28 is
Then, the conductive paste 22 filled in the slit 27 is supplied so as to swell toward the first main surface 25 side of the slit plate 23. The slit plate 23
The approaching operation between the plunger member 24 and the plunger member 24 is normally achieved by the approaching operation of the plunger member 24 toward the slit plate 23, but this approaching operation only needs to occur relatively. The slit 23 may be configured to move toward the plunger member 24, or the slit plate 23 and the plunger member 24 may be configured to move close to each other.

Next, a method for manufacturing the electronic component 1, particularly a method for applying the conductive paste 22 for the electrode 4, will be described with reference to FIG. First, as shown in FIG.
A manufacturing apparatus 21 including a slit plate 23 and a plunger member 24 is prepared. Next, as shown in FIG. 1B, the conductive paste 22 is filled in the slits 27 of the slit plate 23. Conductive paste 2 in slit 27
2, the conductive paste 22 is usually supplied into the slit 27 from above the slit plate 23. For example, an appropriate amount of the conductive paste 22 is placed on the first main surface 25 of the slit plate 23, and a squeegee (not shown) acts on the first main surface 25 of the slit plate 23, so that the conductive paste 22 is Each slit 27 can be efficiently filled.

In the filling step of the conductive paste 22 described above, as shown in FIG. 1B, the opening of the slit 27 on the side of the second main surface 26 of the slit plate 23 is closed.
It is preferable that the plunger member 24 be located.
Even when the viscosity of the conductive paste 22 is low, the slit 2
7, the conductive paste 22 can be held,
In addition, it is possible to prevent the conductive paste 22 from drooping below the slit 27 and to easily control the filling amount of the conductive paste 22 in the slit 27. In this case, the protrusion 2 of the plunger member 24
8 may partially enter the slit 27.

Next, as shown in FIG. 1C, the component main body 2 is placed on the first main surface 25 of the slit plate 23, and the end surface 3 of the component main body 2 is brought into contact with the first main surface 25. Normal,
At this time, the slit 27 has a relatively long plane shape, and along the longitudinal direction of such a slit 27,
A plurality of component bodies 2 are arranged in parallel at a predetermined interval between each other, and the following steps are simultaneously performed on the plurality of component bodies 2.

As described above, the step of filling the conductive paste 22 in the slit 27 is performed by the slit plate 23.
Is performed before the step of bringing the end surface 3 of the component body 2 into contact with the one main surface 25 of the component paste, the conductive paste 22 is filled with the slit plate 23 in the conductive paste 22 filling step.
Can be supplied from above, so that the supply is easy and the plunger member 2 is closed so as to close the opening of the slit 27 on the second main surface 26 side of the slit plate 23.
4 can be kept in place. However, if such an advantage is not desired, the conductive paste 22 is supplied from below the slit plate 23 and the like.
The step of filling the inside with the conductive paste 22 may be performed after the step of bringing the end face 3 of the component body 2 into contact with one main surface 25 of the slit plate 23.

Next, as shown in FIG.
By bringing the plunger member 24 close to the slit plate 23, the convex portion 28 protrudes into the slit 27. As a result, the conductive paste 22 filled in the slit 27 is supplied so as to swell on the first main surface 25 side of the slit plate 23, and a part of the end surface 3 of the component body 2 and the adjacent surfaces 5 and 6 are provided. Is given on each part.

In the above-described step of applying the conductive paste 22, the end of the stroke of the plunger member 24 is defined so as to be always at a fixed position, so that the conductive paste 22 is provided for each stroke of the plunger member 24.
It is important to keep the supply amount to the first main surface side constant. In this embodiment, as shown in FIG. 1 (3), when the projection 28 projects into the slit 27, the upper surface of the plunger member 24 forms the second surface of the slit plate 23. Of the plunger member 24, whereby the end of the stroke of the plunger member 24 can be more reliably defined.

In order to reliably define the end of the stroke of the plunger member 24 so as to be always at a fixed position, abutment at other portions may be applied. Further, if the end of the stroke of the plunger member 24 is reliably defined on the driving means side for the plunger member 24, it is not necessary to rely on such contact. Further, in this embodiment, when the projections 28 protrude into the slits 27, substantially the entire amount of the conductive paste 22 in the slits 27 is supplied to the first main surface 25 side of the slit plate 23. Accordingly, the conductive paste 22 in the slit 27 is used up every time the conductive paste 22 is applied, so that it is possible to prevent the conductive paste 22 from being applied with a change in viscosity over time. This also contributes to uniform application of the conductive paste 22.

The first main surface 2 of the slit plate 23, in particular,
5 is preferably coated with a coating agent such as a silicone-based polymer or elastomer to prevent the conductive paste 22 from bleeding. Such a coating agent is used for the conductive paste 22.
It has the property of repelling, and prevents bleeding based on this property. It is preferable that the coating agent has a property that can endure the solvent contained in the conductive paste 22.

The plunger member 24 has a projection 28 in particular.
Is also preferably coated with the above-mentioned coating agent. This coating agent
The conductive paste 22 is prevented from leaking through the gap between the projection 28 and the slit 27. As described above, the coating agent applied to the slit plate 23 and the plunger member 24 also has an effect of preventing the conductive paste 22 from remaining undesirably in gaps or the like.

After the conductive paste 22 is applied on a part of the end face 3 of the component body 2 and on a part of the adjacent faces 5 and 6 as described above, a similar operation is performed. This is also performed for the end face 8. Then, the component body 2
The conductive paste 22 applied thereon is baked, and the conductive paste 22 forms the electrode 4 having the adjacent surface extension 7 as shown in FIG.

FIG. 2 is a view for explaining a method of manufacturing an electronic component and a manufacturing apparatus 31 according to a second embodiment of the present invention. The manufacturing apparatus 31 includes a slit plate 32 and a plunger member 33, for example, as shown in FIG. The slit plate 32 has first and second main surfaces 34 and 35 and a plurality of slits 36 as in the slit plate 23 in the first embodiment.

On the other hand, the plunger member 33 includes a deformable sheet member 37 disposed along the second main surface 35 of the slit plate 32 and a fluid 38 for transmitting pressure for deforming the sheet member 37. And As the fluid 38, for example, oil is used. A piston 39 is disposed below the seat member 37, and the piston 39
It is operatively held in the cylinder 40. Fluid 38 is
The seat member 37, the piston 39, and the cylinder 40 cooperate with each other and are accommodated in a defined closed space.

By operating the piston 39 by driving means (not shown), pressure is applied to the fluid 38,
Thus, the sheet member 37 forms the convex portion 41 while deforming along the inner wall surface of the slit 36 as shown in FIG. These convex portions 41 are the same as the convex portions 28 described above.
Have substantially the same function as the
6, the conductive paste 22 filled in the slit 36 is supplied so as to rise to the first main surface 34 side of the slit plate 32.

The shape of the closed space for containing the fluid 38 is arbitrary, and therefore, the piston 39 is not disposed so as to face the seat member 37, but in another position or another operation direction. It may be provided. Next, a method of applying the conductive paste 22 for the electrode 4 of the electronic component 1 will be described with reference to FIG.

First, as shown in FIG. 2A, a manufacturing apparatus 31 having a slit plate 32 and a plunger member 33 is provided.
Is prepared. Next, as shown in FIG. 2B, the conductive paste 22 is filled in the slits 36 of the slit plate 32. The filling of the conductive paste 22 can be performed by the same method as in the first embodiment.

Also in this embodiment, when the conductive paste 22 is filled, the plunger member is closed so as to close the opening of the slit 36 on the second main surface 35 side of the slit plate 32 as shown in FIG. 33, more specifically, it is preferable to position the sheet member 37. This state of the seat member 37 is achieved by controlling the position of the piston 39. Also in this case, the sheet member 37 may be partially inserted into the slit 36.

Next, as shown in FIG. 2 (3), the component main body 2 is placed on the first main surface 34 of the slit plate 32, and the end surface 3 of the component main body 2 is brought into contact with the first main surface 34. Next, as shown in FIG. 2C, the piston 39 is operated to apply pressure to the sheet member 37 via the fluid 38, thereby deforming the sheet member 37 along the inner wall surface of the slit 36. Due to this deformation, the sheet member 37 itself forms the convex portion 41 protruding into the slit 36. As a result, the conductive paste 22 filled in the slit 36 is supplied so as to rise to the first main surface 34 side of the slit plate 32, and is provided on a part of the end surface 3 of the component body 2 and the adjacent surfaces 5 and 6. Is given on each part.

When the sheet member 37 is deformed via the fluid 38 as in this embodiment, a uniform force is applied to the sheet member 37, and therefore, the protrusion 41 of the sheet member 37 in each slit 36 is provided. The deformation for the formation of is uniformly achieved. Also in this embodiment, when the convex portion 41 protrudes into the slit 36, substantially the entire amount of the conductive paste 22 in the slit 36 is supplied to the first main surface 34 side of the slit plate 32. Is preferred.

Further, similarly to the first embodiment, it is preferable to apply a coating treatment for preventing the conductive paste 22 from bleeding, particularly on the first main surface 34 of the slit plate 32. As the material of the sheet member 37, a material having a property of repelling the conductive paste 22 is used, or a surface facing the outside of the sheet member 37 is coated with a coating agent having a property of repelling the conductive paste 22. Is preferred.

Also in this embodiment, after the conductive paste 22 is applied on a part of the end face 3 of the component body 2 and on each part of the adjacent faces 5 and 6 as described above, the same operation is performed. The process is also performed on the other end surface 8 of the component main body 2, and thereafter, the conductive paste 22 applied on the component main body 2 is baked. The electrode 4 having 7 is formed.

Although the present invention has been described with reference to the specific embodiments illustrated in the drawings, the present invention is not limited thereto, and various other embodiments are possible within the scope of the present invention. It is. For example, the shape of the component body on which the electrode is to be formed, the region on the component body on which the electrode is to be formed, and the like are arbitrary. Further, since the number of regions where electrodes are to be formed on the component body is arbitrary, the number of slits provided in the slit plate is also arbitrary. Further, the conductive paste may be applied to a plurality of regions by one slit while sequentially changing the positional relationship between the slit plate and the component body.

In each of the above-described embodiments, as shown in FIG. 1 or FIG. 2, the step of applying the conductive paste 22 is performed in such a manner that the end face 3 to be applied faces downward, and the conductive paste 22 extends upward from below. It was implemented to supply the paste 22,
The present invention is not limited to this, and the direction in which the end face 3 to be applied is directed can be arbitrarily changed in consideration of the viscosity of the conductive paste 22 and the like, such as upward, lateral, and oblique.

In each of the above-described embodiments, a conductive paste is applied as a paste to be applied to the component body. However, other pastes such as a resistor paste and an adhesive paste may be applied. Therefore, the present invention can be applied.

[0047]

As described above, according to the method for manufacturing an electronic component according to the present invention, the predetermined length of the component main body extends over a part of the end face and a part of the end face to a part of an adjacent face. In applying the paste with a width of, a slit plate provided with a slit having a width corresponding to the width to which the paste is to be applied, and a plunger member that forms a protruding portion that can enter the slit is used. After the slit is filled with the paste and the end surface of the component body is brought into contact with the first main surface of the slit plate, the projection formed by the plunger member from the second main surface side of the slit plate is slit. And the paste filled in the slit is supplied onto a part of the end face and a part of an adjacent face of the component body while supplying the paste so as to rise to the first main surface side. It is performed to.

Therefore, the maximum amount of the paste to be applied to the component body is determined by the amount of the paste that can be filled in the slit, so that the amount of the paste applied to the component body is less likely to vary. Further, since the slit plate is not required to have elasticity, it can be made of a material that is hardly affected by the solvent contained in the paste, and therefore, it is possible to prevent a change in the paste application amount due to, for example, swelling.

In the method of manufacturing an electronic component according to the present invention, if the step of filling the slit with the paste is performed before the step of bringing the end face of the component body into contact with the first main surface of the slit plate, the paste In the filling step, the paste can be supplied from the side of the slit plate facing outward, such as above, so that the supply is easy and the opening of the slit on the second main surface side of the slit plate is closed. Thus, the plunger member can be positioned.

Further, as described above, in the step of filling the paste into the slit, if the plunger member is positioned so as to close the opening of the slit on the second main surface side of the slit plate, the viscosity of the paste is increased. The paste can be held in the slit even when it is low, and the dripping of the paste below the slit can be prevented, and it becomes easier to control the filling amount of the paste in the slit to be constant. .

Further, in the method of manufacturing an electronic component according to the present invention, when the projection is made to protrude into the slit, substantially the entire amount of the paste in the slit is supplied to the first principal surface side of the slit plate. In this case, the paste in the slit is used up every time the paste is applied, so that it is possible to prevent the dispersion of the paste due to the viscosity change of the paste over time. This also contributes to making the amount of paste applied uniform.

In the method of manufacturing an electronic component according to the present invention, a conductive paste for forming an electrode on a part of an end face of the component body and a part of an adjacent face is applied as the paste. The present invention can be advantageously applied to the formation of the electrode while exhibiting the effects described above. On the other hand, according to the electronic component manufacturing apparatus of the present invention, the slit component and the plunger member used in the above-described manufacturing method are provided, and the paste filled in the slit is raised to the first main surface side. In order to apply the paste in the slit to a part of the end face of the component body and to a part of an adjacent face while supplying the same, a driving unit for driving the protrusion so as to protrude into the slit is provided. Therefore, the manufacturing method described above can be performed by this manufacturing apparatus. Therefore,
The effect of the above-described manufacturing method can be obtained as it is.

In the electronic component manufacturing apparatus according to the present invention, if the slit plate is provided with a plurality of slits, the paste can be simultaneously applied to a specific end face of the component body and a plurality of locations on the adjacent face thereof. In addition, the paste application step can be efficiently performed. In the electronic component manufacturing apparatus according to the present invention, the configuration of the plunger member can be simplified if the plunger member is configured to form the projection with a fixed body such as a rigid body. Also, in this case, the driving means only needs to have means for relatively bringing the plunger member closer to the slit plate so that the convex portion protrudes into the slit, so that the driving means has a simple configuration. can do.

As a second aspect of the plunger member, a deformable sheet member arranged along the second main surface of the slit plate, and a fluid for transmitting pressure for deforming the sheet member are provided. On the other hand, when the driving means is provided with means for applying pressure to the fluid so that the sheet member forms a convex portion while deforming the sheet member along the inner wall surface of the slit, Since a uniform force is applied to the sheet member, when a plurality of slits are provided in the slit plate, deformation for forming a convex portion by the sheet member in each slit is uniformly achieved. Therefore, it becomes easy to make the amount of paste supplied from each slit, in other words, the amount of paste applied to the component body uniform.

In the second aspect described above, when the plunger member further comprises an operable piston and means for defining a fluid-tight space in cooperation with the seat member and the piston, The means for applying pressure to the fluid provided in the driving means described above is realized by means for operating the piston, so that the driving means can have a simple configuration.

[Brief description of the drawings]

FIG. 1 is a view for explaining a method of manufacturing an electronic component and a manufacturing apparatus 21 according to a first embodiment of the present invention, and is a step performed to form an electrode 4 of the electronic component 1 shown in FIG. FIG. 1 is a front view schematically showing a section in order.

FIG. 2 is a view for explaining a method for manufacturing an electronic component and a manufacturing apparatus 31 according to a second embodiment of the present invention, and is a step performed to form the electrodes 4 of the electronic component 1 shown in FIG. FIG. 1 is a front view schematically showing a section in order.

FIG. 3 is a perspective view showing an appearance of an electronic component 1 which is of interest to the present invention.

FIG. 4 is a front view schematically showing a part of a conventional device 9 used for forming the electrodes 4 of the electronic component 1 shown in FIG.

5 is a front view schematically showing a part of a conventional device 14 used for forming the electrodes 4 of the electronic component 1 shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Component main body 3,8 End surface 4 Electrode 5,6 Adjacent surface 7 Adjacent surface extension 21,31 Manufacturing apparatus 22 Conductive paste 23,32 Slit plate 24,33 Plunger member 25,34 First principal surface 26 , 35 Second principal surface 27, 36 Slit 28, 41 Convex portion 37 Sheet member 38 Fluid 39 Piston 40 Cylinder

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01G 4/00-4/10 H01G 4/14-4/42 H01G 13/00-13/06

Claims (11)

(57) [Claims] 1. A step of preparing a component body and applying a paste with a predetermined width so as to extend over a part of an end surface of the component body and a part of the end surface to a part of an adjacent surface. A method for manufacturing an electronic component, comprising: first and second main surfaces facing each other at a predetermined interval, wherein the first main surface side is a surface in contact with an end surface of the component main body. A slit plate provided with a slit having a width corresponding to the width to which the paste is to be applied, and a slit plate, which is disposed on the second main surface side of the slit plate, and is capable of protruding into the slit. Forming a convex part,
A step of preparing a plunger member, a step of filling the paste into the slit, a step of bringing the end face of the component body into contact with the first main surface, and then placing the convex portion in the slit. While the paste filled in the slit is supplied so as to swell toward the first main surface side, and the paste in the slit is on and adjacent to a part of the end face of the component body. Providing an electronic component on a part of the surface. 2. The method of manufacturing an electronic component according to claim 1, wherein the step of filling the slit with a paste is performed before the step of bringing an end face of a component main body into contact with the first main surface. 3. The step of filling paste into the slit, wherein the plunger member is positioned so as to close an opening of the slit on the second main surface side of the slit plate. Electronic component manufacturing method. 4. The method according to claim 1, wherein in the step of projecting the projection into the slit, substantially the entire amount of the paste in the slit is supplied to the first main surface side. Electronic component manufacturing method. 5. The paste according to claim 1, wherein the paste is a conductive paste for forming an electrode on a part of an end face of the component main body and a part of an adjacent face. Manufacturing method of electronic components. 6. An apparatus for manufacturing an electronic component to which a paste is applied with a predetermined width so as to extend over a part of an end face of a component body and a part of the end face to a part of an adjacent face. A first main surface and a second main surface facing each other at a predetermined interval, and the first main surface side is a surface in contact with an end surface of the component main body, and is filled with the paste. And a slit plate provided with a slit having a width corresponding to the width to which the paste is to be applied, wherein the slit plate is disposed on the second main surface side of the slit plate, and Forming a convex part that can enter the
A plunger member, while supplying the paste filled in the slit so as to swell to the first main surface side, while supplying the paste in the slit on a part of an end surface of the component main body and an adjacent surface. An electronic component manufacturing apparatus, comprising: a driving unit configured to drive the projection so as to protrude into the slit in order to provide the projection on the part. 7. The apparatus according to claim 6, wherein a plurality of the slits are provided in the slit plate. 8. The plunger member includes a fixed body forming the convex portion, and the driving unit moves the plunger member with respect to the slit plate so that the convex portion protrudes into the slit. The apparatus for manufacturing an electronic component according to claim 6, further comprising: a unit that relatively approaches the electronic component. 9. The electronic component manufacturing apparatus according to claim 8, wherein said fixed body is made of a rigid body. 10. The plunger member includes: a deformable sheet member disposed along the second main surface of the slit plate; and a fluid for transmitting pressure for deforming the sheet member. The driving means comprises means for applying pressure to the fluid such that the sheet member forms the protrusion while deforming the sheet member along an inner wall surface of the slit. 8. The apparatus for manufacturing an electronic component according to 6 or 7. 11. The plunger member further comprises an operable piston and means for cooperating with the seat member and the piston to define a space enclosing the fluid, and applying pressure to the fluid. The apparatus for manufacturing an electronic component according to claim 10, wherein the means for performing includes a means for operating the piston.