JP2000030916A - Method and device for applying electrode material to electronic parts - Google Patents
Method and device for applying electrode material to electronic partsInfo
- Publication number
- JP2000030916A JP2000030916A JP10201501A JP20150198A JP2000030916A JP 2000030916 A JP2000030916 A JP 2000030916A JP 10201501 A JP10201501 A JP 10201501A JP 20150198 A JP20150198 A JP 20150198A JP 2000030916 A JP2000030916 A JP 2000030916A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electrode material
- mesh
- electronic component
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品の外面に
電極材料を塗布する方法および装置、特にチップ部品の
外面に外部電極を形成するのに適した方法および装置に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for applying an electrode material to an outer surface of an electronic component, and more particularly to a method and an apparatus suitable for forming an external electrode on an outer surface of a chip component.
【０００２】[0002]
【従来の技術】従来、チップ部品の外面に部分的に外部
電極を形成する方法として、図１，図２に示すような塗
布方法が用いられている。すなわち、水平に配置された
電極塗布板１にスリット状の吐出穴２を設け、電極塗布
板１の下側から供給された電極材料（導電ペースト）Ｐ
を吐出穴２より盛り上がらせた状態で、電極材料Ｐに対
してチップ部品Ｃの側面を押し当てることで、電極材料
Ｐを塗布している。2. Description of the Related Art Conventionally, as a method of partially forming external electrodes on the outer surface of a chip component, a coating method as shown in FIGS. 1 and 2 has been used. That is, a slit-shaped discharge hole 2 is provided in a horizontally arranged electrode application plate 1, and an electrode material (conductive paste) P supplied from below the electrode application plate 1 is provided.
The electrode material P is applied by pressing the side surface of the chip component C against the electrode material P in a state where is raised from the discharge hole 2.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、この方
法では、吐出穴２から吐出される電極材料Ｐが、表面張
力のために吐出穴２の中央部付近で厚くなりやすく（図
２参照）、チップ部品Ｃを押し当てた際、塗布された電
極材料Ｐの量も同様の傾向を示すことになる。このた
め、図３の（ａ）に示すように、チップ部品Ｃに塗布さ
れた電極材料Ｐはその中央部が膨らんだ形状となり、図
３の（ｂ）のような帯状の電極を得ることができないと
いう欠点があった。However, in this method, the electrode material P discharged from the discharge hole 2 tends to be thick near the center of the discharge hole 2 due to surface tension (see FIG. 2), and the chip When the component C is pressed, the amount of the applied electrode material P shows a similar tendency. For this reason, as shown in FIG. 3A, the electrode material P applied to the chip component C has a bulged shape at the center, and a strip-shaped electrode as shown in FIG. 3B can be obtained. There was a disadvantage that it could not be done.
【０００４】そこで、本発明の目的は、電子部品の外面
に電極材料を目標とする形状に塗布できる電子部品の電
極塗布方法および装置を提供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a method and an apparatus for applying an electrode to an electronic component, which can apply an electrode material to an outer surface of the electronic component in a target shape.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するた
め、請求項１に記載の発明は、電子部品の外面に電極材
料を塗布する方法において、電極塗布板に電極材料の吐
出穴を設けるとともに、この吐出穴にメッシュ状部材を
設け、電極材料を上記メッシュ状部材から滲出させる工
程と、電子部品の外面を上記メッシュ状部材から滲出さ
れた電極材料に押し当てて、電子部品の外面に電極材料
を塗布する工程と、を有することを特徴とする電子部品
の電極塗布方法を提供する。According to a first aspect of the present invention, there is provided a method for applying an electrode material to an outer surface of an electronic component, wherein the electrode application plate is provided with a discharge hole for the electrode material. Providing a mesh-like member in the discharge hole, and leaching the electrode material from the mesh-like member; and pressing an outer surface of the electronic component against the electrode material leaching from the mesh-like member to form an electrode on the outer surface of the electronic component. And a step of applying a material.
【０００６】電極材料を吐出穴およびメッシュ状部材を
介して吐出させると、メッシュ状部材の表面に電極材料
が滲み出ることになるが、メッシュ状部材を通過する際
の抵抗のため、吐出穴から吐出させた場合と異なり、表
面張力による膨らみが抑制され、電極材料がほぼ均一な
厚みで吐出される。この電極材料に電子部品を押し当て
ると、電子部品にはメッシュ状部材から盛り上がった電
極材料だけが付着するので、電極材料の拡がりが防止さ
れ、目標とする形状に正確に塗布できる。When the electrode material is discharged through the discharge hole and the mesh member, the electrode material oozes out on the surface of the mesh member. However, due to the resistance when passing through the mesh member, the electrode material is discharged from the discharge hole. Unlike the case of discharging, the swelling due to surface tension is suppressed, and the electrode material is discharged with a substantially uniform thickness. When the electronic component is pressed against the electrode material, only the electrode material raised from the mesh-like member adheres to the electronic component, so that the spread of the electrode material is prevented and the target material can be applied accurately to the target shape.
【０００７】上記吐出穴を構成する電極塗布板とメッシ
ュ状部材とを別部品で構成してもよいが、請求項２のよ
うに、電極塗布板の吐出穴の部分にメッシュ状部材を一
体に形成してもよい。この場合には、例えば電鋳などの
手法を用いれば、吐出穴にメッシュを一体に形成するこ
とができる。[0007] The electrode coating plate and the mesh member constituting the discharge hole may be formed as separate parts, but the mesh member is integrated with the discharge hole portion of the electrode coating plate. It may be formed. In this case, for example, if a method such as electroforming is used, the mesh can be formed integrally with the discharge hole.
【０００８】本発明において、メッシュ状部材とは、表
裏方向に貫通する多数の微細な連通穴が分散形成された
薄板状部材の総称であり、網目状のように連通穴が規則
的に配列されたものに限らず、ポーラス状のように連通
穴が不規則に配列されたものでもよい。電極が塗布され
る電子部品の外面は平面である必要はなく、凹溝状であ
ってもよい。また、電極材料の塗布形状は、帯状に限ら
ず、任意の形状とすることができる。本発明の電極塗布
方法は、アレー型コンデンサのように、外面に複数本の
外部電極を平行に形成する場合に好適である。すなわ
ち、隣合う外部電極間の距離が短いため、外部電極が不
必要に拡がると短絡する恐れがあるのに対し、本発明方
法を用いることで、外部電極間の短絡を確実に防止でき
る。In the present invention, the mesh member is a generic name of a thin plate member in which a large number of fine communication holes penetrating in the front and back directions are dispersedly formed, and the communication holes are regularly arranged like a mesh. However, the communication holes may be irregularly arranged like a porous shape. The outer surface of the electronic component to which the electrodes are applied does not need to be flat, but may be a groove. Further, the application shape of the electrode material is not limited to the band shape, and may be any shape. The electrode coating method of the present invention is suitable for a case where a plurality of external electrodes are formed in parallel on the outer surface, such as an array capacitor. That is, since the distance between adjacent external electrodes is short, there is a possibility that a short circuit occurs when the external electrodes unnecessarily expand. On the other hand, by using the method of the present invention, a short circuit between the external electrodes can be reliably prevented.
【０００９】[0009]
【発明の実施の形態】図４〜図６は本発明にかかる電極
塗布装置の一例を示す。図において、１０は電極ペース
トＰを貯留する貯留部である箱型のペースト槽であり、
このペースト槽１０の底板１１はピストンを構成してお
り、駆動装置１２と連結されている。駆動装置１２は例
えばシリンダやモータなどを駆動源とする直動機構より
なり、底板１１を微量ずつ上昇させることができる。4 to 6 show an example of an electrode coating apparatus according to the present invention. In the figure, reference numeral 10 denotes a box-shaped paste tank which is a storage unit for storing the electrode paste P,
The bottom plate 11 of the paste tank 10 constitutes a piston, and is connected to a driving device 12. The driving device 12 is composed of a linear motion mechanism using, for example, a cylinder or a motor as a driving source, and can raise the bottom plate 11 by a small amount.
【００１０】ペースト槽１０の上面は、複数本（図では
３本）の平行なスリット状の吐出穴１４を有する電極塗
布板１３で閉じられている。電極塗布板１３の表面に
は、吐出穴１４を覆うメッシュ板１５が固着されてい
る。メッシュ板１５は、例えば電鋳などの手法により形
成された薄肉金属板よりなり、表裏方向に貫通する多数
の微細な連通穴１５ａが網目状に分散形成されている。The upper surface of the paste tank 10 is closed by an electrode coating plate 13 having a plurality (three in the figure) of parallel slit-shaped discharge holes 14. A mesh plate 15 that covers the discharge holes 14 is fixed to the surface of the electrode coating plate 13. The mesh plate 15 is made of, for example, a thin metal plate formed by a method such as electroforming, and has a large number of fine communication holes 15a penetrating in the front and back directions formed in a mesh pattern.
【００１１】ここで、上記電極塗布装置を用いて電子部
品Ｃに電極を塗布する方法を説明する。まず駆動装置１
２によって底板１１を上方へ押し上げると、ペースト槽
１０内のペーストＰが吐出穴１４から押し出され、図７
の（ａ）のように、メッシュ板１５の連通穴１５ａを通
ってメッシュ板１５の表面にペーストＰが滲み出る。ペ
ーストＰの吐出量は底板１１の移動量（吐出圧力）、メ
ッシュ板１５の目の粗さ、ペーストＰの粘度などによっ
て調整される。ペーストＰがメッシュ板１５の連通穴１
５ａを通過する際、その流体抵抗によって滲出量が制限
されるため、表面張力による膨らみが解消されてペース
トＰがほぼ均一な厚みで盛り上がる。ここで、図７の
（ｂ）のように電子部品Ｃを吐出穴１４に対して直交方
向に交差させ、ペーストＰに電子部品Ｃを押し当てる。
この時、電子部品Ｃにはメッシュ板１５から盛り上がっ
た分のペーストＰだけが付着するので、ペーストＰの拡
がりが防止され、図７の（ｃ）のように規定量のペース
トＰが電子部品Ｃに付着する。Here, a method of applying an electrode to the electronic component C using the above-described electrode coating apparatus will be described. First, the driving device 1
When the bottom plate 11 is pushed up by 2, the paste P in the paste tank 10 is pushed out from the discharge hole 14, and FIG.
As shown in (a), the paste P oozes out to the surface of the mesh plate 15 through the communication holes 15a of the mesh plate 15. The discharge amount of the paste P is adjusted by the amount of movement (discharge pressure) of the bottom plate 11, the roughness of the mesh plate 15, the viscosity of the paste P, and the like. Paste P is connected to communication hole 1 of mesh plate 15
When passing through 5a, the amount of exudation is limited by the fluid resistance, so that swelling due to surface tension is eliminated and the paste P rises with a substantially uniform thickness. Here, as shown in FIG. 7B, the electronic component C intersects the ejection hole 14 in a direction orthogonal to the discharge hole 14, and the electronic component C is pressed against the paste P.
At this time, only the amount of the paste P that has risen from the mesh plate 15 adheres to the electronic component C, so that the spread of the paste P is prevented, and as shown in FIG. Adheres to
【００１２】上記のようにしてペーストＰを塗布すれ
ば、吐出穴１４の幅寸法に対応した幅の電極Ｐを形成で
きるので、図８に示すように、複数の帯状電極Ｐを狭い
スペースに平行に形成することができ、隣合う電極同士
が短絡するのを防止できる。If the paste P is applied as described above, an electrode P having a width corresponding to the width of the discharge hole 14 can be formed. Therefore, as shown in FIG. And short-circuiting between adjacent electrodes can be prevented.
【００１３】上記実施例では、吐出穴１４を設けた電極
塗布板１３の表面にメッシュ板１５を配置した例を示し
たが、電極塗布板１３とメッシュ板１５とを一体化して
もよい。すなわち、図９は、電極塗布板１３にメッシュ
状の吐出穴１４を設けたものであり、この場合、電極塗
布板１３とメッシュ１５とを、例えば電鋳などの手法に
よって一体に形成したものである。In the above embodiment, an example is shown in which the mesh plate 15 is disposed on the surface of the electrode coating plate 13 provided with the discharge holes 14, but the electrode coating plate 13 and the mesh plate 15 may be integrated. That is, FIG. 9 shows a configuration in which a mesh-shaped discharge hole 14 is provided in the electrode coating plate 13. In this case, the electrode coating plate 13 and the mesh 15 are integrally formed by a method such as electroforming. is there.
【００１４】この場合には、メッシュ１５が吐出穴１４
の部分のみに形成され、吐出穴１４以外の部分は平滑面
となっている。そのため、前回の電極塗布で電極塗布板
１３の表面に残ったペーストＰを除去する際、吐出穴１
４以外の部分に漏れ出たペーストＰを残らず拭き取るこ
とができる。したがって、電極塗布板１３上に前回のペ
ーストＰが残留せず、次回の塗布作業において、塗布形
状が悪化するのを防止できる。In this case, the mesh 15 is
Are formed only in the portion, and the portion other than the discharge hole 14 is a smooth surface. Therefore, when removing the paste P remaining on the surface of the electrode coating plate 13 in the previous electrode coating, the discharge holes 1
The paste P that has leaked to portions other than 4 can be wiped away. Therefore, the previous paste P does not remain on the electrode coating plate 13, and it is possible to prevent the deterioration of the coating shape in the next coating operation.
【００１５】図１０は本発明の第３実施例を示し、吐出
穴１４の形状を一定幅のスリット状ではなく、中央に膨
らみ部１４ａを有する鍵穴形状としたものである。従来
のようにメッシュを用いない場合、吐出穴１４の中央の
膨らみ部１４ａにペーストＰが集中するので、図１１の
（ａ）に示すように、電極形状の最大幅Ｄ2が吐出穴１
４の最大幅Ｄ1 に比べて大きくなり、吐出穴形状を電極
塗布形状に再現するのが困難であった。これに対し、本
発明では吐出穴１４にメッシュ１５を設けることで、膨
らみ部１４ａにペーストＰが集中するのを抑制でき、ほ
ぼ均一な厚みに吐出することができる。したがって、図
１１の（ｂ）に示すように、電極形状の最大幅Ｄ3 を吐
出穴１４の最大幅Ｄ1 とほぼ等しくでき、吐出穴１４の
形状を電極塗布形状に再現することができる。FIG. 10 shows a third embodiment of the present invention, in which the shape of the discharge hole 14 is not a slit having a constant width, but a keyhole shape having a bulging portion 14a at the center. If conventional without using the mesh as, since the paste P is concentrated in the center of the bulge portion 14a of the discharge port 14, as shown in (a) of FIG. 11, the maximum width D 2 of the electrode shape discharge port 1
It becomes larger than the maximum width D 1 of the 4, it is difficult to reproduce the discharge hole shape in the electrode coating shape. On the other hand, in the present invention, by providing the mesh 15 in the discharge hole 14, the concentration of the paste P on the bulging portion 14a can be suppressed, and the discharge can be performed with a substantially uniform thickness. Accordingly, as shown in (b) of FIG. 11, it can substantially equal the maximum width D 3 of the electrode shape as the maximum width D 1 of the discharge hole 14, the shape of the discharge port 14 can be a reproduced in the electrode coating shape.
【００１６】なお、本発明は上記実施例に限定されるも
のではなく、本発明の趣旨を逸脱しない範囲で種々変更
が可能である。例えば、本発明の電極塗布板は平板状に
限るものではなく、任意の形状を取りうるものである。
また、吐出穴の形状もスリット状や図１０のような鍵穴
形状に限らず、電極の塗布形状に応じて任意に変更可能
である。また、吐出穴を有する電極塗布板およびメッシ
ュ板は金属板に限らず、樹脂板，ゴム板あるいはセラミ
ック板であってもよい。また、電極を塗布すべき電子部
品としては、チップ部品に限るものではなく、外面に電
極塗布を必要とする電子部品であれば如何なる部品でも
よい。電極塗布装置としては、図４に示すように、ペー
スト槽１０の上面に電極塗布板１３を備えた構造に限ら
ず、ペースト槽１０の下面あるいは側面に電極塗布板１
３を備えたものでもよい。この場合も、ペーストＰが吐
出穴１４から必要以上に吐出されるのをメッシュ板が抑
制することができる。The present invention is not limited to the above embodiment, but can be variously modified without departing from the gist of the present invention. For example, the electrode coating plate of the present invention is not limited to a flat plate, but may have any shape.
Further, the shape of the discharge hole is not limited to the slit shape or the keyhole shape as shown in FIG. 10, but can be arbitrarily changed according to the application shape of the electrode. Further, the electrode coating plate and the mesh plate having the discharge holes are not limited to the metal plate, but may be a resin plate, a rubber plate, or a ceramic plate. The electronic components to which the electrodes are to be applied are not limited to chip components, but may be any electronic components that require electrode coating on the outer surface. As shown in FIG. 4, the electrode coating apparatus is not limited to the structure in which the electrode coating plate 13 is provided on the upper surface of the paste tank 10.
3 may be provided. Also in this case, the mesh plate can prevent the paste P from being discharged from the discharge holes 14 more than necessary.
【００１７】[0017]
【発明の効果】以上の説明で明らかなように、請求項１
に記載の発明によれば、電極材料の吐出穴にメッシュ状
部材を設け、電極材料をメッシュ状部材から滲出させる
ようにしたので、メッシュ状部材を通過する際の抵抗の
ため、吐出穴から電極材料を直接吐出させた場合と異な
り、表面張力による膨らみが防止され、電極材料がほぼ
均一な厚みで吐出される。そのため、この電極材料に電
子部品を押し当てると、電極材料の拡がりが防止され、
目標とする形状に正確に塗布できる。As is apparent from the above description, claim 1
According to the invention described in the above, the mesh member is provided in the discharge hole of the electrode material, and the electrode material is made to exude from the mesh member. Unlike the case where the material is directly discharged, swelling due to surface tension is prevented, and the electrode material is discharged with a substantially uniform thickness. Therefore, when an electronic component is pressed against this electrode material, the spread of the electrode material is prevented,
It can be applied accurately to the target shape.
【図１】従来の電極塗布方法を示す平面図である。FIG. 1 is a plan view showing a conventional electrode coating method.
【図２】図１の電極塗布方法を示す断面図である。FIG. 2 is a sectional view showing the electrode coating method of FIG.
【図３】（ａ）は図１の方法で形成した電極を持つ電子
部品の斜視図、（ｂ）は理想的な形状の電極を持つ電子
部品の斜視図である。3A is a perspective view of an electronic component having electrodes formed by the method of FIG. 1, and FIG. 3B is a perspective view of an electronic component having electrodes of an ideal shape.
【図４】本発明にかかる電極塗布装置の一例の分解斜視
図である。FIG. 4 is an exploded perspective view of an example of an electrode coating device according to the present invention.
【図５】図４の電極塗布装置の断面図である。FIG. 5 is a cross-sectional view of the electrode coating device of FIG.
【図６】図５のＸ部の拡大断面図である。FIG. 6 is an enlarged sectional view of a portion X in FIG. 5;
【図７】図４の電極塗布装置を用いて電子部品に電極を
塗布する方法を示す工程図である。FIG. 7 is a process chart showing a method of applying an electrode to an electronic component using the electrode applying apparatus of FIG.
【図８】図４の電極塗布装置を用いて電極を形成した電
子部品の斜視図である。8 is a perspective view of an electronic component on which electrodes are formed using the electrode coating device of FIG.
【図９】電極塗布板の第２実施例の斜視図である。FIG. 9 is a perspective view of a second embodiment of the electrode coating plate.
【図１０】電極塗布板の第３実施例の斜視図である。FIG. 10 is a perspective view of a third embodiment of the electrode coating plate.
【図１１】（ａ）は従来方法で形成した電極を持つ電子
部品の斜視図、（ｂ）は図１０の電極塗布板を用いて形
成した電極を持つ電子部品の斜視図である。11A is a perspective view of an electronic component having electrodes formed by a conventional method, and FIG. 11B is a perspective view of an electronic component having electrodes formed using the electrode coating plate of FIG.
【符号の説明】 １３ 電極塗布板 １４ 吐出穴 １５ メッシュ（メッシュ板）[Description of Signs] 13 Electrode coating plate 14 Discharge hole 15 Mesh (mesh plate)
Claims (4)
において、電極塗布板に電極材料の吐出穴を設けるとと
もに、この吐出穴にメッシュ状部材を設け、電極材料を
上記メッシュ状部材から滲出させる工程と、電子部品の
外面を上記メッシュ状部材から滲出された電極材料に押
し当てて、電子部品の外面に電極材料を塗布する工程
と、を有することを特徴とする電子部品の電極塗布方
法。In a method of applying an electrode material to an outer surface of an electronic component, a discharge hole for the electrode material is provided on an electrode coating plate, a mesh member is provided in the discharge hole, and the electrode material is exuded from the mesh member. And applying the electrode material to the outer surface of the electronic component by pressing the outer surface of the electronic component against the electrode material exuded from the mesh-like member. .
シュ状部材が一体に形成されていることを特徴とする請
求項１に記載の電子部品の電極塗布方法。2. The method for coating an electrode of an electronic component according to claim 1, wherein said mesh member is formed integrally with a discharge hole of said electrode coating plate.
押し出す機能を持つ貯留部と、上記貯留部の上部に設け
られ、電極材料の吐出穴を有する電極塗布板と、上記吐
出穴に設けられたメッシュ状部材とを備え、上記吐出穴
およびメッシュ状部材を介して電極材料を吐出させた状
態で、電子部品を電極材料に押し当てることにより、電
子部品の外面に電極を塗布することを特徴とする電子部
品の電極塗布装置。3. A storage section having a function of storing an electrode material and extruding the electrode material by a predetermined amount, an electrode coating plate provided above the storage section and having a discharge hole for the electrode material, And applying an electrode to the outer surface of the electronic component by pressing the electronic component against the electrode material in a state where the electrode material is discharged through the discharge holes and the mesh-shaped member. An electrode coating device for electronic components, characterized in that:
シュ状部材が一体に形成されていることを特徴とする請
求項３に記載の電子部品の電極塗布装置。4. An electrode coating apparatus for an electronic component according to claim 3, wherein said mesh member is formed integrally with a discharge hole of said electrode coating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10201501A JP2000030916A (en) | 1998-07-16 | 1998-07-16 | Method and device for applying electrode material to electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10201501A JP2000030916A (en) | 1998-07-16 | 1998-07-16 | Method and device for applying electrode material to electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000030916A true JP2000030916A (en) | 2000-01-28 |
Family
ID=16442109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10201501A Pending JP2000030916A (en) | 1998-07-16 | 1998-07-16 | Method and device for applying electrode material to electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000030916A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6749890B2 (en) | 2000-03-31 | 2004-06-15 | Tdk Corporation | Terminal electrode forming method in chip-style electronic component and apparatus therefor |
| US7458151B2 (en) | 2004-11-30 | 2008-12-02 | Tdk Corporation | Method of forming external electrode |
| US7673382B2 (en) | 2006-01-16 | 2010-03-09 | Tdk Corporation | External electrode forming method |
| US7803421B2 (en) | 2005-12-15 | 2010-09-28 | Tdk Corporation | External electrode forming method |
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|---|---|---|---|---|
| JPS60126180A (en) * | 1983-12-09 | 1985-07-05 | 株式会社ソフィア | Pinball machine |
| JP2000107409A (en) * | 1998-10-07 | 2000-04-18 | Sanyo Bussan:Kk | Game machine |
| JP4092433B1 (en) * | 2007-01-30 | 2008-05-28 | 株式会社大一商会 | Pachinko machine |
| JP2012010727A (en) * | 2010-06-29 | 2012-01-19 | Sanyo Product Co Ltd | Game machine |
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1998
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60126180A (en) * | 1983-12-09 | 1985-07-05 | 株式会社ソフィア | Pinball machine |
| JP2000107409A (en) * | 1998-10-07 | 2000-04-18 | Sanyo Bussan:Kk | Game machine |
| JP4092433B1 (en) * | 2007-01-30 | 2008-05-28 | 株式会社大一商会 | Pachinko machine |
| JP2012010727A (en) * | 2010-06-29 | 2012-01-19 | Sanyo Product Co Ltd | Game machine |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6749890B2 (en) | 2000-03-31 | 2004-06-15 | Tdk Corporation | Terminal electrode forming method in chip-style electronic component and apparatus therefor |
| US6945299B2 (en) | 2000-03-31 | 2005-09-20 | Tdk Corporation | Terminal electrode forming method in chip-style electronic component and apparatus therefor |
| US7487815B2 (en) | 2000-03-31 | 2009-02-10 | Tdk Corporation | Terminal electrode forming apparatus and system for holding electronic components |
| US7458151B2 (en) | 2004-11-30 | 2008-12-02 | Tdk Corporation | Method of forming external electrode |
| US7803421B2 (en) | 2005-12-15 | 2010-09-28 | Tdk Corporation | External electrode forming method |
| US7673382B2 (en) | 2006-01-16 | 2010-03-09 | Tdk Corporation | External electrode forming method |
| US8181340B2 (en) | 2006-01-16 | 2012-05-22 | Tdk Corporation | External electrode forming method |
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