JP2002151367A - Apparatus for manufacturing electronic component, and method for manufacturing the electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing electronic components and a method for manufacturing electronic components, by which the size of coating of paste hardly varies and the electronic components hardly include air bubbles. SOLUTION: An external electrode forming apparatus is provided with a slit plate 11, to which conductive paste is supplied and a holding plate, which moves in the vertical direction by a cylinder hoisting machine. The slit plate 11 and the holding plate are made a metal material, such as stainless steel or of an elastic material, such as rubber. Four long grooves 12 are provided in parallel on the top of the slit plate 11. The cross section of each of the grooves 12 is rectangular, and several slits 13 and auxiliary slits 14 are alternately provided in parallel and in the direction of the length of the grooves 12 at their bottoms. Five slits 13 are provided at a position, where electronic component bodies are impregnated. The slit plate 11 is supplied with a conductive paste 31 from the above, and the grooves 12 and the slits 13 and 14 are filled with the conductive paste 31.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component manufacturing apparatus and an electronic component manufacturing method, and more particularly to an electronic component for applying a conductive paste or an insulating paste to a chip-type electronic component such as a multilayer capacitor or a multilayer inductor. And an electronic component manufacturing method.

[0002]

2. Description of the Related Art An immersion method has been conventionally known as a method for forming external electrodes of a chip-type electronic component. In the immersion method, as shown in FIG. 22, after supplying the conductive paste 3 to the concave portion 2 a provided in the metal plate 2, the chip component main body 1 is lowered, and one end thereof is immersed in the conductive paste 3. I do. Next, as shown in FIG. 23, the component main body 1 is raised, and the conductive paste 3 is applied to one end thereof. Thereafter, the conductive paste 3 is dried to form an end face external electrode. Similarly, an end face external electrode is formed on the other end of the component body 1.

[0003]

However, the conventional method for forming an external electrode is shown in FIG. 22 due to poor wettability of the conductive paste to the component body 1 when the component body 1 is immersed in the conductive paste 3. As shown, the corners 4 of the component body 1
, The surface of the conductive paste 3 sinks and rises at the center 5. Therefore, as shown in FIG. 23, since the conductive paste 3 applied to the end of the component body 1 wraps around in an arc shape, the difference R in the irregularities increases, and as a result, the folded dimension of the end surface external electrode varies. The problem occurs.

[0004] Further, the component body 1 is removed from the conductive paste 3 due to the poor wettability of the conductive paste to the component body 1.
When immersed in the component, the bubbles are easily embraced, and there is a concern that the electrical connection between the formed end face external electrode and the internal electrode of the component body 1 may be hindered by the bubbles.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component manufacturing apparatus and an electronic component manufacturing method in which paste application dimensions are less likely to vary and bubbles are less likely to be trapped.

[0006]

In order to achieve the above object, an apparatus for manufacturing an electronic component according to the present invention comprises: a slit plate provided with a long groove having a predetermined depth; A plurality of slits provided substantially parallel to a longitudinal direction of the groove on a bottom surface of the groove of the slit plate, and a plurality of ends of the plurality of electronic component bodies are provided in a longitudinal direction of the groove of the slit plate filled with paste. The parts are immersed in a line.

If an auxiliary slit is provided substantially parallel to the longitudinal direction of the groove on the bottom surface of the groove of the slit plate and near the plurality of slits, the circulation of the paste is improved, and the accumulation of the paste is suppressed. Also, by providing a plurality of grooves in parallel on the slit plate, the workability of paste application is improved.

Further, an electronic component manufacturing apparatus according to the present invention includes a slit plate provided with a plurality of concave portions having a predetermined depth, and a plurality of slits provided on a bottom surface of the concave portion of the slit plate. One electronic component body is immersed in each recess of the slit plate filled with the paste.

Here, it is preferable that a plurality of slits are provided substantially in parallel with the longitudinal direction of the concave portion. Also, by arranging a plurality of recesses on the slit plate in a matrix,
The workability of paste application is improved.

With the above arrangement, the plurality of slits provided on the bottom surface of the groove or the concave portion improve the wettability of the paste with respect to the electronic component body and suppress the variation in the paste application size. At this time, the plurality of slits are preferably provided in parallel in a direction orthogonal to the longitudinal direction of the groove or the concave portion in order to improve the circulation of the paste.

The width of the groove or the recess is preferably set to be at least 1.5 times the width of the electronic component body. If the width of the groove or the recess is smaller than 1.5 times the width of the electronic component body, the distance between the electronic component body and the side wall of the groove or the recess becomes too short, and the paste swells when the electronic component body is immersed. This is because the application size of the paste tends to vary. In addition, by roughening the bottom surface of the groove or the concave portion, the wettability of the paste to the electronic component body is further improved.

Further, according to a method of manufacturing an electronic component according to the present invention, a paste is applied to an end of an electronic component main body using a manufacturing apparatus having the above-described features, and a paste is applied to a side of the electronic component main body in a strip shape. Is applied.

According to the above method, the paste is efficiently applied to the electronic component body. Then, when the electronic component body is immersed in the paste, by securing a gap between the bottom surface of the groove or the recess and the electronic component body, the wettability of the paste to the electronic component body is improved, and the paste application is more efficient. Done.

[0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an electronic component manufacturing apparatus and an electronic component manufacturing method according to an embodiment of the present invention. In each embodiment, a case where an external electrode is formed by applying a conductive paste to an electronic component body will be described. However, it is needless to say that the present invention can be applied to a case where an insulating paste or the like is applied to the electronic component body.

[First Embodiment, FIGS. 1 to 8] The external electrode forming apparatus of the first embodiment is vertically moved up and down by a slit plate 11 (see FIG. 1) to which a conductive paste is supplied and a cylinder elevator. And a holding plate 21 (see FIG. 5). The slit plate 11 and the holding plate 21 are made of a metal material such as stainless steel or an elastic material such as rubber.

As shown in FIG. 1 to FIG.
Are provided with four long grooves 12 in parallel. Each groove 12 has a rectangular cross section, and a plurality of slits 13 and auxiliary slits 14 extending in parallel to the longitudinal direction of the groove 12 are alternately arranged on the bottom surface. The number of the slits 13 and the auxiliary slits 14 is preferably three or more. In the first embodiment, the number of the slits 13 is 5
The number of the auxiliary slits 14 was set to three. Groove 12
(See FIG. 3) is set in accordance with the folded size of the end face external electrode formed at the end of the electronic component body. In the first embodiment, the depth H1 of the groove 12 is set to be substantially the same as the folded size (0.3 mm) of the end face external electrode.

The five slits 13 and the three auxiliary slits 14 are respectively provided in parallel in a direction orthogonal to the longitudinal direction of the groove 12. The five slits 13 are provided at positions where the electronic component body is immersed. And
As shown in FIGS. 2 and 3, two slits 13 at both ends are provided.
Is in contact with the side wall 12a of the groove 12, so that the amount of the conductive paste supplied to the groove 12 can be reduced. Further, the depth H2 of the slit 13 and the auxiliary slit 14 is preferably set to be equal to or greater than the depth H1 of the groove 12. Also, the width of the slit 13 and the auxiliary slit 14 is preferably 0.3 mm or more. This is because the circulating property of the conductive paste 31 is improved.

As shown in FIG. 3, a conductive paste 31 is supplied to the slit plate 11 from above, and the groove 12 and the slits 13 and 14 are filled with the conductive paste 31. The conductive paste 31 is made of Ag, Pd, Cu, Ni,
It is obtained by kneading a metal powder such as Au or Ag-Pd together with a binder or the like.

Next, the conductive paste 31 other than the groove 12 and the slits 13 and 14 is scraped off with a squeegee blade. At this time, the sweep direction of the squeegee blade is
As shown in FIG. 1, it is set in a direction parallel to the longitudinal direction of the groove 12 (direction of arrow K1). As a result, FIG.
As shown in (a), the surface of the conductive paste 31 filled in the groove 12 can be leveled flat. It is preferable to use rubber having a hardness of 70 ° or more as a material of the squeegee blade. When the hardness is lower than 70 °, the squeegee blade bends at the time of sweeping, extra scraping of the conductive paste 31 in the groove 12 is performed, and the folded size of the external electrode on the end face of the electronic component body is reduced, and the electrode shape is also reduced. This is because it may become unstable. The shape of the tip of the squeegee blade is appropriately selected so as to have good workability.

When the sweep direction of the squeegee blade is set to a direction perpendicular to the longitudinal direction of the groove 12, as shown in FIG. 4B, the conductive paste 31 near the edge of the groove 12 is scraped off. Can be For this reason, the surface of the conductive paste 31 filled in the groove 12 cannot be leveled flatly, and the folded size of the external electrode on the end face of the electronic component body varies.

Next, as shown in FIG.
After holding a plurality of chip-type electronic component main bodies 25 in 1, the holding plate 21 is mounted on a cylinder elevator (not shown) to face the slit plate 11. Here, for example, in the case of a multilayer capacitor, the chip-type electronic component main body 25 is formed by stacking a plurality of green ceramic sheets on which internal electrodes are formed to form a laminate, and the unfired unpasted conductive paste for external electrodes has not yet been applied. Things.

Next, the cylinder elevator is lowered by a predetermined stroke, and the lower end of each electronic component body 25 is immersed in the conductive paste 31. The lower end surface of the electronic component body 25 is
Is slightly lowered from the bottom surface of the electronic component body 25 to secure a slight gap between the bottom surface of the groove 12 and the lower end surface of the electronic component body 25. As the electronic component body 25 is immersed, the conductive paste 31 in the groove 12 is pressed by the lower end surface of the electronic component body 25. At this time, a part of the conductive paste 31 near the slit 13 flows into the slit 13, but the remaining part cannot flow into the slit 13. Slit 1
In the area between three, it rises small. Therefore, the conductive paste 31 applied to the end of the electronic component main body 25 wraps around in a small wave shape, and the difference R (see FIG. 7 and FIG. 8) of the unevenness can be reduced. As the number of slits 13 increases, the wraparound shape of conductive paste 31 approaches flatter. In addition, since the slit 13 is provided at the position where the electronic component body 25 is immersed, the conductive paste 31 has good circulating properties and is less likely to contain air bubbles. Further, by providing the auxiliary slit 14, the circulation property of the paste can be further improved.

Further, as shown in FIG.
Is preferably set to be at least 1.5 times the dimension of the width D1 of the electronic component body 25. Groove 1
2 is smaller than 1.5 times the width D1 of the electronic component body 25, the distance between the electronic component body 25 and the side wall 12a of the groove 12 becomes too short, and when the electronic component body 25 is immersed, This is because the conductive paste 31 between the electronic component body 25 and the side wall 12a of the groove 12 swells, and there is a concern that the variation in the folded size of the external electrode on the end surface becomes large.
In the case where the electronic component main body 25 shown in FIG. 6 is rotated by 90 degrees so that the height T direction of the electronic component main body 25 is parallel to the width D2 direction of the groove 12 and immersed, the width of the groove 12 is D
2 is 1.5 times the height T of the electronic component body 25.
Needless to say, it is preferable that the setting is made twice or more.

In FIG. 1, the electronic component body 25 is not immersed in a region E surrounded by a chain line. In other words, the slits 13 provided at both ends in the longitudinal direction of the groove 12 are used as the dummy slits 13. At the beginning and end of squeezing (that is, at both ends of the groove 12), the contact area between the squeegee blade and the slit plate 11 changes discontinuously, and
This is because the scraping amount of the conductive paste 31 filled in the electronic component changes, and the folded size of the end surface external electrode of the electronic component body 25 varies.

The electronic component body 25 has a groove 12
The above-described effect can be obtained even if the device is lowered until it comes into contact with the bottom surface. In this case, since the folded size of the end face external electrode is determined by the depth H1 of the groove 12, the work of setting the conditions of the equipment becomes unnecessary, and there is no human variation among operators.

Next, as shown in FIG.
Then, the conductive paste 31 is applied to one end of the electronic component body 25. Thereafter, the conductive paste 31
Is dried. Next, the conductive paste 3 is applied to the other end of the electronic component body 25 (the upper end of the electronic component body 25 in FIG. 7).
In order to apply 1, the upper and lower sides of the electronic component body 25 are exchanged and held on the holding plate 21, and the same application process as described above is repeated. As a result, as shown in FIG. 8, the electronic component body 25 having the end face external electrodes 32 formed at both ends is manufactured.

[Second Embodiment, FIGS. 9 to 15] The external electrode forming apparatus of the second embodiment is vertically moved up and down by a slit plate 41 (see FIG. 9) to which a conductive paste is supplied and a cylinder elevator. And a holding plate 21 (see FIG. 13).

As shown in FIGS. 9 and 10, on the upper surface of the slit plate 41, a plurality of concave portions 42 are provided in a matrix. Each recess 42 has a rectangular cross section, and has five slits 43 extending parallel to the longitudinal direction of the recess 42 on the bottom surface. The five slits 43 are arranged in parallel in a direction orthogonal to the longitudinal direction of the recess 42. Note that the five slits 43 may extend in a direction orthogonal to the longitudinal direction of the recess 42. Recess 4
The depth H1 (see FIG. 10) of No. 2 is set in accordance with the folded size of the end face external electrode formed at the end of the electronic component body. The conductive paste 31 is provided below the slit plate 41.
Is stored in the storage section 45 for storing.

As shown in FIG. 11, this slit plate 41
At the time, the pressure P is applied to the conductive paste 31 in the storage section 45.
Then, the conductive paste 31 is supplied into the concave portion 42 through the slit 43 and filled therein. Next, as shown in FIG. 12, the conductive paste 31 other than the concave portion 42 is scraped off with a squeegee blade. At this time, the sweep direction of the squeegee blade may be a direction parallel to the longitudinal direction of the concave portion 42 (direction of arrow K1), as shown in FIG.
The direction may be orthogonal to the longitudinal direction of the recess 42. Thereby, the surface of the conductive paste 31 filled in the recess 42 can be leveled flat.

Next, as shown in FIG. 13, after holding a plurality of chip-type electronic component bodies 25 on the holding plate 21,
The holding plate 21 is mounted on a cylinder lift (not shown) to face the slit plate 41. Next, the cylinder elevator is lowered by a predetermined stroke, and the lower end of each electronic component body 25 is immersed in the conductive paste 31 in the recess 42. The lower end surface of the electronic component body 25 is lowered to a position slightly raised from the bottom surface of the concave portion 42. With the immersion of the electronic component body 25, a part of the conductive paste 31 in the concave portion 42 flows into the slit 43, while the remaining portion of the conductive paste 31
3, the surface of the conductive paste 31 is moved from the recoil to the portion between the adjacent slits 43.
Small swell. Therefore, the conductive paste 31 applied to the end of the electronic component body 25 wraps around in a small wave.

Next, as shown in FIG.
A pressure P is applied to the conductive paste 31 in the first storage section 45 to supply a minute amount of the conductive paste 31 into the recess 42 through the slit 43. As a result, an upward paste pressure is generated from the slit 43, and the surface of the conductive paste 31 rises slightly at the slit 43 portion. As a result, the conductive paste 31 applied to the end of the electronic component body 25 wraps around in a minute wave shape, and the difference R (see FIG. 15) of the irregularities can be made smaller than in the first embodiment.

Next, the holding plate 21 is raised, and a conductive paste 31 is applied to one end of the electronic component body 25. After that, the conductive paste 31 is dried. next,
In order to apply the conductive paste 31 to the other end of the electronic component main body 25 (the upper end of the electronic component main body 25 in FIG. 13), the electronic component main body 25 is held upside down by holding the electronic component main body 25 on the holding plate 21. Is repeated. As a result, as shown in FIG.
The electronic component main body 25 on which 2 is formed is manufactured.

[Third Embodiment, FIGS. 16 to 19]
This embodiment uses substantially the same apparatus as the external electrode forming apparatus described in the second embodiment, as shown in FIG.
A method for forming the end face external electrode 32 and the side face external electrode 33 on the chip-type electronic component body 25 will be described.

FIG. 17 shows a flowchart for forming the end face external electrode 32 and the side face external electrode 33. Step S1
Then, as shown in FIG. 18, the electronic component body 25 is held horizontally on the holding plate 21 and then held on the holding plate 2.
1 is mounted on a cylinder elevator, and is opposed to a slit plate 51 for forming the side surface external electrode 33. The slit plate 51 has a plurality of concave portions 52 provided in a matrix on the upper surface thereof. Needless to say, a long groove as shown in the first embodiment may be provided instead of the concave portion 52. Each of the recesses 52 has a rectangular cross section, and three slits 53 are arranged on the bottom thereof in parallel in a direction orthogonal to the longitudinal direction of the recess 52. A storage unit 55 for storing the conductive paste 31 is provided below the slit plate 51. The dimension of the width D2 of the recess 52 is
The numerical value is set to be substantially equal to the width dimension of the side external electrode 33 to be formed.

In the slit plate 51, the storage section 55
Pressure is applied to the conductive paste 31 in the inside, and the conductive paste 31 is supplied into the concave portion 52 through the slit 53 and filled therein. Then, the conductive paste 31 other than the concave portion 52 is scraped off with a squeegee blade. Thereby, the surface of the conductive paste 31 filled in the concave portion 52 can be leveled flat.

Next, in step S2, as shown in FIG. 19, the cylinder elevator is lowered by a predetermined stroke to bring the lower surface of the electronic component body 25 into contact with the slit plate 51. Thereafter, a pressure P is applied to the conductive paste 31 in the storage portion 55 of the slit plate 51 to supply a predetermined amount of the conductive paste 31 into the recess 52 through the slit 53. As a result, an upward paste pressure is generated from the slit 53, the surface of the conductive paste 31 rises, and the conductive paste 31 is applied to one side surface of the electronic component body 25 (transfer method).

Next, in step S3, the electronic component body 25
Is dried. Next, in step S4, the other end of the electronic component body 25 (FIG. 19)
Then, the conductive paste 31 is applied to the upper surface of the electronic component body 25).
Is applied, the upper and lower sides of the electronic component main body 25 are exchanged, and the electronic component main body 25 is again held horizontally. Thereafter, in steps S5 and S6,
The same application process as steps S2 and S3 is repeated. Thereby, as shown in FIG. 16, the side surface external electrodes 33 can be formed on both side surfaces.

Next, in step S7, the holding plate 21
After holding the electronic component main body 25 in a vertical position, the holding plate 21 is mounted on a cylinder elevator, and is opposed to a slit plate 41 (see FIG. 9) for forming the end face external electrode 32. In this slit plate 41, as shown in FIG.
Then, the conductive paste 31 is supplied into the concave portion 42 through the slit 43 and filled therein. Thereafter, as shown in FIG. 12, the conductive paste 31 in a portion other than the concave portion 42 is scraped off with a squeegee blade, and the surface of the conductive paste 31 filled in the concave portion 42 is leveled flat.

Next, in step S8, as shown in FIG. 13, the cylinder elevator is lowered by a predetermined stroke, and the lower end of the electronic component body 25 is placed in the conductive paste 31 in the recess 42.
Soak in Thereafter, as shown in FIG. 14, a pressure P is applied to the conductive paste 31 in the storage portion 45 of the slit plate 41 to supply a minute amount of the conductive paste 31 through the slit 43 into the concave portion 42, and The conductive paste 31 is applied to one end of the electronic component body 25 (immersion method).

Next, in step S9, the electronic component body 25
Is dried. Next, in step S10, the other end of the electronic component body 25 (FIG.
In FIG. 3, the conductive paste 3 is applied to the upper end of the electronic component body 25).
In order to apply 1, the upper and lower sides of the electronic component body 25 are exchanged, and the electronic component body 25 is held vertically again. Thereafter, steps S11 and S1
In step 2, the same coating process as in steps S8 and S9 is repeated. Thereby, as shown in FIG. 16, the end face external electrodes 32 can be formed at both ends. As a result, the third
By using the method of the embodiment, the end surface external electrode 32 and the side surface external electrode 33 of the chip-type electronic component body 25 are
It can be formed by a single external electrode forming apparatus having the slit plates 41 and 51.

[Other Embodiments] It should be noted that the electronic component manufacturing apparatus and the electronic component manufacturing method according to the present invention are not limited to the above-described embodiment, but may be variously modified within the scope of the invention. it can.

For example, instead of separately providing the slit and the auxiliary slit, as shown in FIG. 20, a part of the slit 13 may be extended to have the function of the auxiliary slit. Further, as shown in FIG. 21, the opening of the slit 13 may be widened.

Further, the method of supplying the paste to the grooves and recesses of the slit plate is not necessarily limited to the above-described embodiment, and an arbitrary method is selected. Further, the bottom surface of the groove or the concave portion of the slit plate may be roughened by using a method such as sandblasting. Thereby, the wettability of the paste to the electronic component body can be further improved. Further, the paste of the present invention is not limited to an electrode paste or an insulating paste such as an adhesive or an exterior resin.

[0044]

As is apparent from the above description, according to the present invention, by providing a plurality of slits on the bottom surface of a groove or a concave portion provided on a slit plate, the plurality of slits allow paste to be applied to the electronic component body. The wettability can be improved, and the variation in paste application size and the inclusion of bubbles can be suppressed.

By providing auxiliary slits substantially parallel to the longitudinal direction of the groove on the bottom surface of the groove of the slit plate and near the plurality of slits, the circulation of the paste is improved and the accumulation of the paste can be suppressed. . Further, by providing a plurality of grooves in parallel on the slit plate, the workability of paste application can be improved. Further, in order to improve the circulation of the paste, the plurality of slits are preferably provided in parallel in a direction orthogonal to the longitudinal direction of the groove or the concave portion.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an electronic component manufacturing apparatus according to the present invention.

FIG. 2 is a partially enlarged plan view of the slit plate shown in FIG.

FIG. 3 is a sectional view taken along the line III-III in FIG. 2;

FIG. 4 is a sectional view showing a procedure of forming an end face external electrode following FIG. 3;

FIG. 5 is a sectional view showing a procedure of forming an end face external electrode following FIG. 4;

FIG. 6 is a plan view showing the positional relationship between the electronic component main body shown in FIG. 5 and the grooves of the slit plate.

FIG. 7 is a sectional view showing a procedure of forming the end face external electrode following FIG. 5;

FIG. 8 is a perspective view showing a procedure of forming an end face external electrode following FIG. 7;

FIG. 9 is a perspective view showing another embodiment of the electronic component manufacturing apparatus according to the present invention.

FIG. 10 is a sectional view taken along line XX of FIG. 9;

FIG. 11 is a sectional view showing a procedure of forming an end face external electrode following FIG. 10;

FIG. 12 is a sectional view showing a procedure of forming an end face external electrode following FIG. 11;

FIG. 13 is a sectional view showing a procedure of forming an end face external electrode following FIG. 12;

FIG. 14 is a sectional view showing a procedure of forming an end face external electrode following FIG. 13;

FIG. 15 is a perspective view showing a procedure of forming an end face external electrode following FIG. 14;

FIG. 16 is a perspective view illustrating one embodiment of a method for manufacturing an electronic component according to the present invention.

FIG. 17 is a flowchart showing one embodiment of a method for manufacturing an electronic component according to the present invention.

FIG. 18 is a sectional view showing a procedure for forming a side external electrode.

FIG. 19 is a sectional view showing a procedure of forming the side surface external electrode following FIG. 18;

FIG. 20 is a plan view showing another embodiment.

FIG. 21 is a cross-sectional view showing another embodiment.

FIG. 22 is a sectional view showing a conventional electronic component manufacturing apparatus.

FIG. 23 is a cross-sectional view illustrating an end face external electrode formed using the electronic component manufacturing apparatus shown in FIG. 22;

[Explanation of symbols]

 11, 41, 51 ... slit plate 12 ... groove 13, 43, 53 ... slit 14 ... auxiliary slit 42, 52 ... recess 25 ... electronic component body 31 ... conductive paste D1 ... width of electronic component body D2 ... groove (or recess) ) Width

Claims (11)

[Claims] 1. A slit plate provided with an elongated groove having a predetermined depth, and a plurality of slits provided on a bottom surface of the groove of the slit plate substantially parallel to a longitudinal direction of the groove. In the longitudinal direction of the groove of the slit plate filled with paste,
An electronic component manufacturing apparatus, comprising: immersing a plurality of electronic component bodies in a line. 2. An auxiliary slit is provided substantially parallel to a longitudinal direction of the groove on the bottom surface of the groove of the slit plate and in the vicinity of the plurality of slits. Equipment for manufacturing electronic components. 3. The electronic component manufacturing apparatus according to claim 1, wherein a plurality of grooves are provided in the slit plate in parallel. 4. A slit plate provided with a plurality of recesses having a predetermined depth, and a plurality of slits provided on a bottom surface of the recess of the slit plate, wherein each slit of the slit plate filled with paste is provided. An electronic component manufacturing apparatus, wherein one electronic component body is immersed in the electronic component. 5. The electronic component manufacturing apparatus according to claim 4, wherein the plurality of slits are provided substantially parallel to a longitudinal direction of the recess. 6. The electronic component manufacturing apparatus according to claim 4, wherein a plurality of recesses are arranged in a matrix on the slit plate. 7. The device according to claim 1, wherein the plurality of slits are provided in parallel in a direction perpendicular to a longitudinal direction of one of the groove and the recess.
An electronic component manufacturing apparatus according to any one of the above. 8. The electronic component according to claim 1, wherein a width of one of the groove and the concave portion is at least 1.5 times a width of the electronic component body. Manufacturing equipment. 9. The method according to claim 1, wherein a bottom surface of one of the groove and the concave portion is roughened.
An electronic component manufacturing apparatus according to any one of the above. 10. An electronic component manufacturing apparatus according to claim 1, wherein a paste is applied to an end of the electronic component main body, and a band is formed on a side of the electronic component main body. A method for producing an electronic component, comprising applying a paste to a substrate. 11. The method for manufacturing an electronic component according to claim 10, wherein when the electronic component main body is immersed in the paste, a gap is provided between any one of the bottom surfaces of the grooves and the concave portions and the electronic component main body. .