JPH09275046A - Formation of terminal electrode of electronic part and its transfer - Google Patents

Formation of terminal electrode of electronic part and its transfer

Info

Publication number
JPH09275046A
JPH09275046A JP8082794A JP8279496A JPH09275046A JP H09275046 A JPH09275046 A JP H09275046A JP 8082794 A JP8082794 A JP 8082794A JP 8279496 A JP8279496 A JP 8279496A JP H09275046 A JPH09275046 A JP H09275046A
Authority
JP
Japan
Prior art keywords
electronic component
elastic body
terminal electrode
conductive paste
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8082794A
Other languages
Japanese (ja)
Inventor
Koichiro Kurihara
光一郎 栗原
Hiroshi Mita
博司 三田
Satoru Inada
悟 稲田
Makoto Ota
誠 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP8082794A priority Critical patent/JPH09275046A/en
Publication of JPH09275046A publication Critical patent/JPH09275046A/en
Pending legal-status Critical Current

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PROBLEM TO BE SOLVED: To easily form a terminal electrode at the end surface of electronic part riding over the surface connected thereto. SOLUTION: A rubber body 21 on which a plurality of recessed grooves 22 are formed on a flat surface is provided, the recessed groove 22 of the rubber body 21 is filled with a conductive paste, the rubber body 21 is pressed toward one surface of an electronic part 24, the conductive paste is transferred simultaneously to one surface of the electronic part 24 and the surface connected thereto, and terminal electrodes are formed to one surface of the electronic part and the surface connected thereto.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は、粘性体の転写方
法に関し、特に電子部品の端子電極を形成する方法に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a viscous body transfer method, and more particularly to a method for forming a terminal electrode of an electronic component.

【0002】[0002]

【従来の技術】電子部品の一例の斜視図を図8に示す。
この電子部品は、内部にコイル又はコンデンサ等の回路
が構成されており、側面1に端子電極2が形成されてい
る。この端子電極2は、側面1に続く上面3及び下面に
も、回り込むように形成されている。この端子電極2が
側面1のみでなく上面3及び下面にも連続して形成され
ているのは、回路基板にこの電子部品を実装する場合
に、回路基板との固着強度を上げるために必要とされて
いる。この電子部品に端子電極2を形成する方法とし
て、スクリーン印刷法がある。このスクリーン印刷法で
は、図8の場合、端子電極の形成される面、すなわち側
面1、上面3、下面及び側面1に対向するもう一つの側
面の4面毎にスクリーン印刷を行っていた。
2. Description of the Related Art FIG. 8 shows a perspective view of an example of an electronic component.
In this electronic component, a circuit such as a coil or a capacitor is formed inside, and a terminal electrode 2 is formed on a side surface 1. The terminal electrode 2 is also formed so as to extend around the upper surface 3 and the lower surface following the side surface 1. The fact that the terminal electrode 2 is formed continuously not only on the side surface 1 but also on the upper surface 3 and the lower surface is necessary in order to increase the fixing strength with the circuit board when mounting this electronic component on the circuit board. Has been done. As a method of forming the terminal electrode 2 on this electronic component, there is a screen printing method. In this screen printing method, in the case of FIG. 8, screen printing is performed on each of the surfaces on which the terminal electrodes are formed, that is, the side surface 1, the upper surface 3, the lower surface and the other side surface facing the side surface 1.

【0003】他の方法として、特開平2−256225
号公報に開示されているものがある。この方法は、図9
に示すとおり、形成したい電極の数、位置に応じて所定
の幅かつ間隔で貫通スリット6aが形成されたスリット
板6と、このスリット板6が上に置かれ、また内部に電
極ペースト浴5が貯留された容器7と、この容器7の側
面側に設けた加圧手段8とを有し、この加圧手段8に備
わった押圧板8aを押し下げて電極ペースト5を押す
と、電極ペースト5の一部が貫通スリット6aより押し
出される構造を有する。電子部品4は、電極を形成すべ
き端面4aが貫通スリット6aをまたぐようにスリット
板6の上に置かれ、上記の如く加圧手段8を加圧して、
電極ペースト浴液面を上昇させ、スリット板6上に電極
ペースト5が一定高さ盛り上がった状態とし、電子部品
4の端面4aとこれに連なる2面にまたがって電極ペー
スト2が接触して形成するものである。
Another method is disclosed in Japanese Patent Laid-Open No. 256256/1990.
Is disclosed in Japanese Unexamined Patent Application Publication No. 2000-205,878. This method is illustrated in FIG.
As shown in FIG. 5, a slit plate 6 having through slits 6a formed with a predetermined width and interval according to the number and position of electrodes to be formed, the slit plate 6 is placed on top, and the electrode paste bath 5 is provided inside. It has a container 7 stored therein and a pressurizing means 8 provided on the side surface side of this container 7. When the pressing plate 8a provided in this pressurizing means 8 is pushed down to press the electrode paste 5, the electrode paste 5 It has a structure in which a part is pushed out from the through slit 6a. The electronic component 4 is placed on the slit plate 6 so that the end surface 4a on which the electrode is to be formed straddles the through slit 6a, and the pressing means 8 is pressed as described above,
The liquid level of the electrode paste bath is raised so that the electrode paste 5 is raised to a certain height on the slit plate 6, and the electrode paste 2 is formed by contacting the end face 4a of the electronic component 4 and the two faces continuous with the end face 4a. It is a thing.

【0004】また他の方法として、特開平6−7709
9号公報に開示されているものがある。この方法は、図
10に示す治具を用いる。この治具9は、形成しようと
する電極の数及び位置に応じた幅と間隔をもった互いに
平行な第1の溝11と、この溝11と直交して第1の溝
11の長さよりも狭く、かつ電子部品の厚みよりも大き
い幅をもつ第2の溝12とが形成された弾性体からな
る。この第2の溝12に適量の導電ペーストを供給し、
第2の溝12の幅一杯のスキージを引いて第1の溝11
に導電ペーストを充填し、電子部品を第2の溝12の中
央に位置するように浮かして、そのまま水平に移動し、
一方の壁に接触させて押圧を加えた後押圧を解除し、次
いで他方の壁に接触するように押圧を加え解除すること
により、該電子部品の端面に連なる両サイドに導電ペー
ストを塗布し、さらに両壁に接触しない状態で電子部品
を下降させて第2の溝12の底に押圧して、電子部品の
端面に導電ペーストを塗布するものである。これによ
り、電子部品の端面とこれに連なる面にまたがって帯状
の導電ペーストを塗布するものである。
Another method is disclosed in Japanese Patent Laid-Open No. 6-7709.
Some of them are disclosed in Japanese Patent No. This method uses the jig shown in FIG. This jig 9 has a first groove 11 which is parallel to each other and has a width and an interval depending on the number and position of electrodes to be formed, and a length which is orthogonal to the groove 11 and is longer than the length of the first groove 11. The second groove 12 having a narrow width and a width larger than the thickness of the electronic component is formed of an elastic body. An appropriate amount of conductive paste is supplied to the second groove 12,
Pull the full width squeegee of the second groove 12 into the first groove 11
Is filled with a conductive paste, the electronic component is floated so as to be located in the center of the second groove 12, and horizontally moved as it is.
Release the pressure after applying pressure by contacting one wall, then release by applying a pressure so as to contact the other wall, apply the conductive paste to both sides continuous with the end surface of the electronic component, Further, the electronic component is lowered and pressed against the bottom of the second groove 12 in a state where it is not in contact with both walls, and the conductive paste is applied to the end face of the electronic component. As a result, the strip-shaped conductive paste is applied across the end surface of the electronic component and the surface continuous with the end surface.

【0005】[0005]

【発明が解決しようとする課題】従来の端子電極形成方
法には、次のような問題点がある。まず、スクリーン印
刷法によれば、例えば、図8に示す電子部品では、印刷
工程が4工程となり、その都度、電子部品を整列し、電
極ペーストをスクリーン印刷し、電極を乾燥させ、その
次にまた電子部品を整列し、電極ペーストをスクリーン
印刷し、電極を乾燥させ、というように同様の工程を繰
り返し行う必要がある。このように、製造工程が煩雑で
あり、工数大で、コスト大となってしまう。
The conventional method for forming a terminal electrode has the following problems. First, according to the screen printing method, for example, in the electronic component shown in FIG. 8, there are four printing steps, each time the electronic components are aligned, the electrode paste is screen printed, the electrodes are dried, and then the It is also necessary to repeat the same steps such as aligning electronic components, screen-printing an electrode paste, and drying the electrodes. As described above, the manufacturing process is complicated, the number of steps is large, and the cost is high.

【0006】図9に示した特開平2−256225号公
報記載の方法では、特開平6−77099号公報に記載
してあるように、貫通孔6aより上昇してきた導電ペー
スト5によって電極が形成されるので、導電ペーストの
回り込み部分が導電ペーストの粘度に左右され、安定し
た形状が得られないため製品の不良率が上がること、な
らびに電極形成後、貫通孔を有するスリット板上に導電
ペーストが残ってしまうので、これを取り除く必要があ
り、その結果、作業能率に影響を与えるという問題点が
指摘されている。
In the method described in Japanese Patent Application Laid-Open No. 2-256225 shown in FIG. 9, as described in Japanese Patent Application Laid-Open No. 6-77099, an electrode is formed by the conductive paste 5 rising from the through hole 6a. Since the wraparound part of the conductive paste is affected by the viscosity of the conductive paste and a stable shape cannot be obtained, the defective rate of the product increases and the conductive paste remains on the slit plate with through holes after the electrodes are formed. Therefore, it is necessary to remove this, and as a result, it has been pointed out that it affects work efficiency.

【0007】また図10に示した特開平6−77099
号公報記載の方法では、電子部品を図10に示した治具
の第2の溝の中央に浮かして保持し、更に浮いた状態で
水平方向に移動させるため、高い位置精度で電子部品を
保持し、かつ移動させる必要がある。また、電子部品に
導電ペーストを塗布する工程も、水平方向に2回、垂直
方向に1回電子部品を移動させる必要があり、工数も大
であり、コスト大となる。本発明は、上記のことを鑑み
て、電子部品の端面にそれと連なる面にまたがった端子
電極を容易に形成する方法を提供することを目的とす
る。
Further, Japanese Patent Laid-Open No. 6-77099 shown in FIG.
According to the method described in the publication, the electronic component is held in the center of the second groove of the jig shown in FIG. 10 by floating, and is moved in the horizontal direction in the floating state. Therefore, the electronic component is held with high positional accuracy. And needs to be moved. Also, in the step of applying the conductive paste to the electronic component, it is necessary to move the electronic component twice in the horizontal direction and once in the vertical direction, resulting in a large number of steps and a large cost. In view of the above, it is an object of the present invention to provide a method for easily forming a terminal electrode on an end face of an electronic component, the terminal electrode straddling a surface continuous with the end face.

【0008】[0008]

【課題を解決するための手段】本発明は、凹部が形成さ
れた弾性体、該弾性体の前記凹部に導電性ペーストを充
填し、該弾性体を電子部品の一面に押し付け、前記電子
部品の前記一面及び該一面に連なる少なくとも一面に同
時に導電性ペーストを転写し、前記電子部品の一面及び
該一面に連なる少なくとも一面に端子電極を形成する電
子部品の端子電極形成方法である。また本発明では、前
記凹部は溝状とし、この溝状凹部を複数形成されている
弾性体を用いるものである。この溝状凹部は、必要とす
る電子部品の端子数と同じであることが望ましいが、必
ずしも同一でなくても良い。また弾性体としてはシリコ
ンゴムが望ましく、かつ該シリコンゴムとしてはショア
硬度(JIS A硬さ)が20〜60であることが望ま
しい。このゴムのショア硬度が60を超えると電子部品
を押し付けた後、ゴム体に電子部品の圧痕が残り、そこ
に導電性ペーストが残るため、好ましくない。また、ゴ
ムのショア硬度が20より小さいとやわらか過ぎて、好
ましくない。特に好ましいゴムのショア硬度は、40〜
50である。このゴムのショア硬度は、シリコンゴム以
外のゴムを用いた場合でも有効な範囲である。また本発
明は、前記弾性体が移動して、前記電子部品に押し付け
られる方法であっても良いし、前記電子部品が移動し、
前記弾性体に押し付けられる方法であっても良い。また
本発明は、前記弾性体が前記電子部品に対し、重力方向
の上方又は下方に位置しても良いし、水平方向に位置し
ていても良い。このように、本発明は弾性体(ゴム体)
の変形を利用して、弾性体に充填された導電性ペースト
を電子部品の一面及びその一面に連なる面に同時に転写
するものである。つまり、同時に複数の面に所定形状の
電極を形成するものである。特に、電子部品の3面に連
なる端子電極を形成する場合、その3面に同時に所定形
状の端子電極を形成出来るものである。この凹部が形成
される弾性体の平面は、その凹部の伸びる方向におい
て、電子部品の一面の幅の2倍以上の幅を有することが
望ましく、更に好ましくは3倍以上である。また本発明
は、前記弾性体の凹部に充填される導電性ペーストの粘
度比(1/100回転(毎分))が、3以上であること
が好ましい。この導電性ペーストは、弾性体の凹部内に
充填されているとき、粘度が高く、その凹部内で静止し
ており、電子部品に押し付けられて転写される時は、粘
度が低く、導電性ペーストが動きやすくなることが望ま
しい。そのため、チクソ性が高く、粘度比(1/100
回転(毎分))が、3以上であることが好ましい。更に
好ましいのは、5以上である。本発明の転写された端子
電極は焼付され、その後、Niメッキ、半田メッキが施
されることが望ましい。また本発明の導電性ペーストと
しては,Ag又はCuを主体としている方が電気抵抗が
低く好ましい。ただし、Cuの場合、焼付または熱処理
において、還元性の雰囲気が必要となる。また本発明
は、電子部品の端子電極を形成する方法のみに限定され
なく、単に粘性を有する物質を複数面に同時に転写する
方法として利用できる。つまり、本発明の一つは、凹部
が形成された弾性体、該弾性体の前記凹部に粘性体を充
填し、該弾性体を被転写体の一面に押し付け、前記被転
写体の前記一面及び該一面に連なる少なくとも一面に同
時に粘性体を転写するものである。
SUMMARY OF THE INVENTION According to the present invention, an elastic body having a recess formed therein, a conductive paste is filled in the recess of the elastic body, and the elastic body is pressed against one surface of the electronic component, A method of forming a terminal electrode of an electronic component, wherein a conductive paste is simultaneously transferred to the one face and at least one face connected to the one face, and a terminal electrode is formed on the one face of the electronic component and at least one face connected to the one face. Further, in the present invention, the recess is formed in a groove shape, and an elastic body having a plurality of groove-like recesses formed therein is used. It is desirable that the number of groove-shaped recesses is the same as the number of terminals of the required electronic component, but it is not necessarily the same. Silicon rubber is desirable as the elastic body, and the Shore hardness (JIS A hardness) of the silicone rubber is desirably 20-60. If the Shore hardness of the rubber exceeds 60, after pressing the electronic component, an impression of the electronic component remains on the rubber body and the conductive paste remains there, which is not preferable. On the other hand, if the Shore hardness of the rubber is less than 20, it is too soft, which is not preferable. Particularly preferred shore hardness of rubber is 40 to
50. The Shore hardness of this rubber is in an effective range even when rubber other than silicone rubber is used. Further, the present invention may be a method in which the elastic body is moved and pressed against the electronic component, or the electronic component is moved,
A method of pressing the elastic body may be used. In the present invention, the elastic body may be located above or below the electronic component in the direction of gravity, or may be located horizontally. Thus, the present invention is an elastic body (rubber body)
By utilizing the above deformation, the conductive paste filled in the elastic body is simultaneously transferred to one surface of the electronic component and the surface connected to the one surface. That is, electrodes of a predetermined shape are simultaneously formed on a plurality of surfaces. In particular, when forming terminal electrodes connected to three surfaces of an electronic component, terminal electrodes of a predetermined shape can be formed simultaneously on the three surfaces. The plane of the elastic body in which the recess is formed preferably has a width that is at least twice the width of the one surface of the electronic component in the direction in which the recess extends, and more preferably at least three times. Further, in the present invention, it is preferable that a viscosity ratio (1/100 rotation (per minute)) of the conductive paste with which the concave portion of the elastic body is filled is 3 or more. This conductive paste has a high viscosity when filled in the concave portion of the elastic body, is stationary in the concave portion, and has a low viscosity when pressed and transferred to an electronic component, and has a low viscosity. It is desirable that the robot be easy to move. Therefore, the thixotropy is high and the viscosity ratio (1/100
The rotation (per minute)) is preferably 3 or more. More preferably, it is 5 or more. It is desirable that the transferred terminal electrode of the present invention is baked and then Ni-plated and solder-plated. The conductive paste of the present invention preferably contains Ag or Cu as the main component because of its low electric resistance. However, in the case of Cu, a reducing atmosphere is required for baking or heat treatment. Further, the present invention is not limited to the method of forming the terminal electrode of the electronic component, and can be used as a method of simply transferring a substance having viscosity to a plurality of surfaces simultaneously. That is, according to one aspect of the present invention, an elastic body having a recess is formed, the recess of the elastic body is filled with a viscous body, and the elastic body is pressed against one surface of the transfer target, The viscous body is simultaneously transferred to at least one surface connected to the one surface.

【0009】[0009]

【発明の実施の形態】本発明に係る実施例を図面を用い
て説明する。図1に本発明に係る一実施例の斜視図を示
す。図2に端子電極転写後の電子部品の斜視図を示す。
図3に本発明に係るゴム体の溝状凹部の形成された面を
示す斜視図である。この実施例は、シリコンゴムからな
る弾性体21に3本の溝状凹部22が形成されている。
この溝状凹部22にAgを主体とする導電体ペーストを
充填する。この導電性ペーストは、ディスペンサーで充
填した後、図4に示すように、スキージ23でかきと
る。このとき、スキージ23の角度を溝状凹部22の溝
方向と90°ではなく、斜めに当たるようにしてかきと
ることにより、かきとり性が向上した。この角度θ1
は、60°で実施したが、15°〜75°が適当であ
る。また、弾性体21の平面に対するスキージの角度θ
2は45°で行った。端子電極が形成される面25が上
面になるように電子部品24を位置決めし、その上方か
らこの導電性ペーストが充填されたゴム体21を下降さ
せ、電子部品24にゴム体21を押し付けて、ゴム体2
1の溝状凹部22内の導電性ペーストを電子部品24の
一面25およびその一面に連なる面に転写するしたもの
である。この電子部品24は、セラミックス材料を用い
た電子部品であり、内部に回路が形成されている。この
電子部品24の寸法は、A=1.0mm、B=3.2m
mのものを用い、それに対して、弾性体21の寸法は、
C=50mm、D=10mmの寸法ものを用いた。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described with reference to the drawings. FIG. 1 shows a perspective view of an embodiment according to the present invention. FIG. 2 is a perspective view of the electronic component after terminal electrode transfer.
FIG. 3 is a perspective view showing the surface of the rubber body according to the present invention in which the groove-shaped recess is formed. In this embodiment, three groove-shaped recesses 22 are formed in an elastic body 21 made of silicon rubber.
The groove-shaped recess 22 is filled with a conductive paste mainly composed of Ag. This conductive paste is filled with a dispenser and then scraped off with a squeegee 23 as shown in FIG. At this time, the scraping property was improved by scraping the squeegee 23 so that the angle of the squeegee 23 and the groove direction of the groove-shaped recess 22 were not 90 ° but slanted. This angle θ1
Was carried out at 60 °, but 15 ° to 75 ° is suitable. Further, the angle θ of the squeegee with respect to the plane of the elastic body 21
2 was done at 45 °. The electronic component 24 is positioned so that the surface 25 on which the terminal electrode is formed is the upper surface, the rubber body 21 filled with the conductive paste is lowered from above, and the rubber body 21 is pressed against the electronic component 24. Rubber body 2
The conductive paste in the groove-shaped recess 22 of No. 1 is transferred to one surface 25 of the electronic component 24 and a surface continuous with the one surface. The electronic component 24 is an electronic component using a ceramic material and has a circuit formed therein. The dimensions of this electronic component 24 are A = 1.0 mm and B = 3.2 m.
m, and the size of the elastic body 21 is
C = 50 mm and D = 10 mm were used.

【0010】次に、弾性体21を下側とし、電子部品2
4を上側として、弾性体21のシリコンゴムのショア硬
度(JIS A硬さ)について種々評価した。ゴムのシ
ョア硬度と押し付け量(接触前のゴムの平面を0mmと
し、そこから電子部品が押し付けられた距離)とを変化
させ、押し付け後の弾性体21の電子部品24の圧痕の
状態を表1に示す。このとき、弾性体の厚さは5mm
で、溝状凹部の幅は0.4mm、深さは0.33mm、
押し付け時間は3秒である。
Next, with the elastic body 21 facing downward, the electronic component 2
Various evaluations were made on the Shore hardness (JIS A hardness) of the silicone rubber of the elastic body 21 with 4 as the upper side. The shore hardness of the rubber and the pressing amount (the plane of the rubber before contact is 0 mm and the distance from which the electronic component is pressed) are changed, and the state of the indentation of the electronic component 24 of the elastic body 21 after the pressing is shown in Table 1. Shown in. At this time, the thickness of the elastic body is 5 mm
The width of the groove-shaped recess is 0.4 mm, the depth is 0.33 mm,
The pressing time is 3 seconds.

【0011】[0011]

【表1】 [Table 1]

【0012】表1において、○は、圧痕が残らなく良好
であることを示す。△は、押し付け直後は圧痕が残る
が、その後消えるため使用可能であることを示す。×
は、圧痕が残り、圧痕に導電性ペーストがたまり、使用
出来ないことを示す。この表1に示すように、ゴムのシ
ョア硬度が20〜60であれば、良好な結果となり、ゴ
ムの硬度が70となると、使用出来ないことがわかる。
In Table 1, ◯ means that no indentation remained and it was good. Δ indicates that an indentation remains immediately after pressing, but disappears thereafter and is usable. ×
Indicates that the impression remains, the conductive paste accumulates on the impression, and cannot be used. As shown in Table 1, when the Shore hardness of the rubber is 20 to 60, good results are obtained, and when the rubber hardness is 70, it cannot be used.

【0013】別の実施例の斜視図を図5に、端子電極を
転写した電子部品の斜視図を図6に示す。尚、同一部品
は、同一符号を付す。この実施例は、弾性体21を電子
部品24に対して、水平方向に配置し、溝状凹部22が
垂直方向に伸びている。そして、電子部品24に対し
て、弾性体21を両側から押し付け、電子部品24に一
度に両側の端子電極を形成したものである。この実施例
において、導電性ペーストを変えて実施した。その導電
性ペーストの諸特性を表2に示す。このとき、弾性体の
厚さは5mmで、溝状凹部の幅は0.4mm、深さは
0.33mm、押し付け量は0.4mm、押し付け時間
は1秒である。
FIG. 5 shows a perspective view of another embodiment, and FIG. 6 shows a perspective view of an electronic component to which a terminal electrode is transferred. The same parts are designated by the same reference numerals. In this embodiment, the elastic body 21 is arranged horizontally with respect to the electronic component 24, and the groove-shaped recess 22 extends vertically. Then, the elastic body 21 is pressed against the electronic component 24 from both sides to form the terminal electrodes on both sides of the electronic component 24 at once. In this example, the conductive paste was changed. Table 2 shows properties of the conductive paste. At this time, the thickness of the elastic body is 5 mm, the width of the groove-shaped recess is 0.4 mm, the depth is 0.33 mm, the pressing amount is 0.4 mm, and the pressing time is 1 second.

【0014】[0014]

【表2】 [Table 2]

【0015】この表2の粘度は、回転粘度計としてブル
ックフィールド社製DV3型を用い、スピンドルNo1
4を用いて測定したものである。これらのペーストを用
いた結果を評価として表2に記載する。この評価は、電
子部品の側面に形成された電極の幅及び厚さの値及びバ
ラツキを考慮した評価である。○は、全く問題なし、△
は、ややバラツキは大きいが実施可能レベルである。こ
の実施例の端子電極の電極厚さは乾燥後で30μm±1
0μmの範囲にあり、焼付後15μm±5μmの範囲で
実施可能であった。また電極の幅は、0.4mm±0.
05mmで、その端子電極の側面の端子電極に連続して
形成される上下面のランド部分の突出寸法は、0.35
±0.05mmであり、実用レベルであった。この端子
電極上には、約1〜5μmのNiメッキが施され、更に
約10μmの半田メッキが施される。
The viscosities shown in Table 2 are as follows: Spindle No. 1 using a Brookfield DV3 model as a rotational viscometer.
4 was used. The results of using these pastes are shown in Table 2 as evaluations. This evaluation is an evaluation taking into account the values and variations of the width and thickness of the electrodes formed on the side surfaces of the electronic component. ○ means no problem at all, △
Is slightly feasible but at a feasible level. The electrode thickness of the terminal electrode of this example is 30 μm ± 1 after drying.
It was in the range of 0 μm, and it could be carried out in the range of 15 μm ± 5 μm after baking. The width of the electrode is 0.4 mm ± 0.
The protrusion dimension of the upper and lower lands formed on the side surface of the terminal electrode is 0.35 mm.
It was ± 0.05 mm, which was a practical level. On this terminal electrode, Ni plating of about 1 to 5 μm is applied, and solder plating of about 10 μm is applied.

【0016】各実施例の中から、弾性体の寸法として
は、図7に示すように電子部品26と弾性体25の端ま
での寸法において、E寸法としては、0.5mm以上が
良く、F寸法としては、1mm以上が良い。もちろん、
この範囲の弾性体は平面であることが必要である。従っ
て、その範囲外は平面でなくてもよく、凹部も溝状に端
面から端面まで形成されていなくてもよい。また、弾性
体25の溝深さは、上記実施例では、0.33mmが最
良であった。これは目的とする電極厚み、ペースト粘度
などによって変わるものと考えられる。また、弾性体を
電子部品に押し付ける押付量は、0.4〜0.45mm
が適当であった。これも、目的とする電極厚み、ペース
ト粘度などによって変わるものと考えられる。もちろ
ん、これらの実施例は、電子部品に弾性体を1回押し付
けるのみで端子電極が形成されるものである。これらの
実施例から、この導電性ペーストの代わりに、別の粘性
を有するものを用い、電子部品の代わりに別のものを用
いても、同様に、複数面に粘性材料を転写できる事がわ
かる。
From each of the embodiments, as the dimension of the elastic body, as shown in FIG. 7, the dimension up to the end of the electronic component 26 and the elastic body 25, and the E dimension of 0.5 mm or more, F is preferable. The dimension is preferably 1 mm or more. of course,
The elastic body in this range needs to be flat. Therefore, the outside of the range may not be flat, and the recess may not be formed in a groove shape from end face to end face. In addition, the groove depth of the elastic body 25 was best 0.33 mm in the above embodiment. This is considered to change depending on the target electrode thickness, paste viscosity, and the like. Moreover, the pressing amount for pressing the elastic body against the electronic component is 0.4 to 0.45 mm.
Was appropriate. This is also considered to change depending on the target electrode thickness, paste viscosity, and the like. Of course, in these examples, the terminal electrode is formed by pressing the elastic body once against the electronic component. From these examples, it can be seen that the viscous material can be similarly transferred to a plurality of surfaces by using a material having another viscosity instead of the conductive paste and using another material instead of the electronic component. .

【0017】[0017]

【発明の効果】本発明によれば、少なくとも一部平面状
の弾性体に電極に応じた幅及び深さを有する凹部を形成
し、その凹部に導電性ペーストを充填した後、電子部品
に押し付けることにより、電子部品の所定の側面及びそ
の側面に続く面に、うまり複数面に同時に端子電極を形
成することができるものであり、極めて簡単に電子部品
の端子電極を形成することができる。また、電子部品以
外、あるいは導電性ペースト以外であっても同様の効果
を得る事が出来る。
According to the present invention, a recess having a width and a depth corresponding to an electrode is formed in at least a part of a planar elastic body, and the recess is filled with a conductive paste and then pressed against an electronic component. Thus, it is possible to simultaneously form the terminal electrodes on the predetermined side surface of the electronic component and the surface following the side surface on a plurality of concavities, and it is possible to extremely easily form the terminal electrode of the electronic component. Moreover, the same effect can be obtained even if it is other than an electronic component or a conductive paste.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る一実施例の斜視図である。FIG. 1 is a perspective view of an embodiment according to the present invention.

【図2】本発明に係る一実施例の端子電極転写後の電子
部品の斜視図である。
FIG. 2 is a perspective view of an electronic component after terminal electrode transfer according to one embodiment of the present invention.

【図3】本発明に係る一実施例の弾性体の斜視図であ
る。
FIG. 3 is a perspective view of an elastic body according to an embodiment of the present invention.

【図4】本発明に係る一実施例の説明図である。FIG. 4 is an explanatory diagram of an embodiment according to the present invention.

【図5】本発明に係る別の実施例の斜視図である。FIG. 5 is a perspective view of another embodiment according to the present invention.

【図6】本発明に係る別の実施例の端子電極転写後の電
子部品の斜視図である。
FIG. 6 is a perspective view of an electronic component after terminal electrode transfer according to another embodiment of the present invention.

【図7】本発明に係る実施例の弾性体の説明図である。FIG. 7 is an explanatory diagram of an elastic body according to an embodiment of the present invention.

【図8】電子部品の斜視図である。FIG. 8 is a perspective view of an electronic component.

【図9】従来例の構造図である。FIG. 9 is a structural diagram of a conventional example.

【図10】従来の別例の斜視図である。FIG. 10 is a perspective view of another conventional example.

【符号の説明】[Explanation of symbols]

21 弾性体 22 溝状凹部 23 スキージ 24 電子部品 21 Elastic Body 22 Groove-Shaped Recess 23 Squeegee 24 Electronic Component

フロントページの続き (72)発明者 太田 誠 鳥取県鳥取市南栄町33番地12号日立金属株 式会社鳥取工場内Front page continued (72) Inventor Makoto Ota 33-12 Minamieicho, Tottori City, Tottori Prefecture Hitachi Metals Co., Ltd. Tottori Factory

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 凹部が形成された弾性体、該弾性体の前
記凹部に導電性ペーストを充填し、該弾性体を電子部品
の一面に押し付け、前記電子部品の前記一面及び該一面
に連なる少なくとも一面に同時に導電性ペーストを転写
し、前記電子部品の一面及び該一面に連なる少なくとも
一面に端子電極を形成することを特徴とする電子部品の
端子電極形成方法。
1. An elastic body having a concave portion formed therein, the concave portion of the elastic body being filled with a conductive paste, the elastic body being pressed against one surface of an electronic component, and being connected to the one surface of the electronic component and the one surface. A method of forming a terminal electrode for an electronic component, comprising simultaneously transferring a conductive paste onto one face and forming a terminal electrode on the one face of the electronic component and at least one face connected to the one face.
【請求項2】 前記凹部は溝状であり、複数形成されて
いる請求項1記載の電子部品の端子電極形成方法。
2. The method of forming a terminal electrode of an electronic component according to claim 1, wherein the recess has a groove shape and a plurality of recesses are formed.
【請求項3】 前記弾性体がシリコンゴムであり、かつ
該シリコンゴムのショア硬度(JIS A硬さ)が20
〜60であることを特徴とする請求項1記載の電子部品
の端子電極形成方法。
3. The elastic body is silicone rubber, and the Shore hardness (JIS A hardness) of the silicone rubber is 20.
The method for forming a terminal electrode of an electronic component according to claim 1, wherein:
【請求項4】 前記弾性体が前記電子部品に対し、重力
方向の上方又は下方に位置することを特徴とする請求項
1記載の電子部品の端子電極形成方法。
4. The method of forming a terminal electrode of an electronic component according to claim 1, wherein the elastic body is located above or below the electronic component in the gravity direction.
【請求項5】 前記弾性体が前記電子部品に対し、水平
方向に位置することを特徴とする請求項1記載の電子部
品の端子電極形成方法。
5. The method of forming a terminal electrode of an electronic component according to claim 1, wherein the elastic body is positioned in a horizontal direction with respect to the electronic component.
【請求項6】 前記弾性体の凹部に充填される導電性ペ
ーストの粘度比(1回転/毎分と100回転/毎分の
比)が、3以上であることを特徴とする請求項1記載の
電子部品の端子電極形成方法。
6. The viscosity ratio (ratio of 1 rotation / minute and 100 rotations / minute) of the conductive paste filled in the concave portion of the elastic body is 3 or more. Of forming a terminal electrode of an electronic component.
【請求項7】 凹部が形成された弾性体、該弾性体の前
記凹部に粘性体を充填し、該弾性体を被転写体の一面に
押し付け、前記被転写体の前記一面及び該一面に連なる
少なくとも一面に同時に粘性体を転写することを特徴と
する転写方法。
7. An elastic body having a concave portion formed therein, the concave portion of the elastic body being filled with a viscous body, and the elastic body being pressed against one surface of the transferred material, and being connected to the one surface of the transferred material and the one surface. A transfer method comprising simultaneously transferring a viscous material onto at least one surface.
JP8082794A 1996-04-04 1996-04-04 Formation of terminal electrode of electronic part and its transfer Pending JPH09275046A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8082794A JPH09275046A (en) 1996-04-04 1996-04-04 Formation of terminal electrode of electronic part and its transfer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8082794A JPH09275046A (en) 1996-04-04 1996-04-04 Formation of terminal electrode of electronic part and its transfer

Publications (1)

Publication Number Publication Date
JPH09275046A true JPH09275046A (en) 1997-10-21

Family

ID=13784318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8082794A Pending JPH09275046A (en) 1996-04-04 1996-04-04 Formation of terminal electrode of electronic part and its transfer

Country Status (1)

Country Link
JP (1) JPH09275046A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007575A (en) * 2001-06-20 2003-01-10 Murata Mfg Co Ltd Formation method of electrode of electronic component
JP2008200857A (en) * 2007-02-16 2008-09-04 Tokyo Ohka Kogyo Co Ltd Photosensitive composition and printing original plate for forming electrode
JP2008204977A (en) * 2007-02-16 2008-09-04 Tokyo Ohka Kogyo Co Ltd Method of manufacturing electronic part
JP2009044181A (en) * 2008-10-22 2009-02-26 Tdk Corp Method of forming external electrode
US7803421B2 (en) * 2005-12-15 2010-09-28 Tdk Corporation External electrode forming method
JP2010258743A (en) * 2009-04-24 2010-11-11 Kyocera Corp Laminated dielectric filter
WO2022196501A1 (en) * 2021-03-16 2022-09-22 パナソニックIpマネジメント株式会社 Laminated ceramic component

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007575A (en) * 2001-06-20 2003-01-10 Murata Mfg Co Ltd Formation method of electrode of electronic component
US7803421B2 (en) * 2005-12-15 2010-09-28 Tdk Corporation External electrode forming method
JP2008200857A (en) * 2007-02-16 2008-09-04 Tokyo Ohka Kogyo Co Ltd Photosensitive composition and printing original plate for forming electrode
JP2008204977A (en) * 2007-02-16 2008-09-04 Tokyo Ohka Kogyo Co Ltd Method of manufacturing electronic part
JP2009044181A (en) * 2008-10-22 2009-02-26 Tdk Corp Method of forming external electrode
JP4697285B2 (en) * 2008-10-22 2011-06-08 Tdk株式会社 External electrode formation method
JP2010258743A (en) * 2009-04-24 2010-11-11 Kyocera Corp Laminated dielectric filter
WO2022196501A1 (en) * 2021-03-16 2022-09-22 パナソニックIpマネジメント株式会社 Laminated ceramic component

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