JP4529809B2 - Electronic component manufacturing method and electronic component manufacturing apparatus - Google Patents

Description

  The present invention relates to an electronic component manufacturing method and an electronic component manufacturing apparatus, and more particularly to an electronic component manufacturing method obtained by improving the external electrode forming method and an electronic component manufacturing apparatus used therefor.

  A multilayer ceramic capacitor, which is a typical chip-type electronic component, is usually arranged such that a plurality of internal electrode layers 52a and 52b face each other with a ceramic layer (dielectric layer) 53, as shown in FIG. A pair of external electrodes 55a are connected to the internal electrode layers 52a and 52b at both end faces 54a and 54b of the ceramic element (electronic component element) 51 that are provided and are drawn out to end faces on different sides alternately. , 55b.

  When manufacturing such a multilayer ceramic capacitor, the external electrode is usually applied by immersing both end faces 54a and 54b of the ceramic element (electronic component element) 51 in a conductive paste for forming the external electrode. It is formed by baking. At this time, the conductive paste is difficult to adhere to the corners and ridges of the electronic component element 51, and the thicknesses of the external electrodes 55a and 55b at the corners and ridges of the electronic component 51 are the end faces 54a and 54b of the electronic component element 51. Generally, it is thinner than the central region.

  By the way, in order to ensure the characteristics of the electronic component, it is usually necessary to ensure a certain thickness as the thickness of the external electrode in the corner portion and the ridge line portion of the electronic component element. Therefore, conventionally, the application of the conductive paste to the electronic component element is repeated a plurality of times to ensure the thickness of the external electrode at the corner portion and the ridge line portion of the electronic component element.

However, if priority is given to securing the thickness of the external electrodes at the corners and ridge lines, the thickness of the external electrodes in the center region of the end face becomes excessively thick, resulting in a decrease in shape accuracy, dimensional accuracy, and mounting reliability. There is a problem that this problem occurs. Further, if the dimensions of the product are the same, there is a problem that the volume ratio of the electronic component element in the entire product is reduced by the increase in the volume of the external electrode.
On the other hand, if it is attempted to suppress the thickness of the end face from becoming too thick, the corner portions and the ridge line portions are insufficient in thickness, and there is a problem that characteristics such as conduction reliability and sealing performance are deteriorated.

  In order to solve such problems, as shown in FIGS. 14A, 14B, and 14C, a conductive paste 62 for forming an external electrode is formed on the inner peripheral surface of a funnel-shaped jig 61. (FIG. 14A), the corner portion 71 of the electronic component element 51 is brought into contact (FIG. 14B), and the conductive paste 62 is attached only to the corner portion 71 (FIG. 14C). Thereafter, as shown in FIG. 15, a method of manufacturing an electronic component is disclosed in which a conductive paste 62 is applied to the entire end surface 54a (54b) of the electronic component element 51 (see Patent Document 1).

However, in the method of Patent Document 1, it is necessary to prepare a dedicated jig for each product type, and it is necessary to perform positioning in order to insert an electronic component element inside the jig. Had a point.
JP 2004-103927 A

  The invention of the present application solves the above-described problem, and suppresses the external electrode from becoming too thick in the central region of the end face of the electronic component element, while preventing the external electrode from being formed at the corner and ridge line portions of the end face of the electronic component element. A method for manufacturing an electronic component capable of efficiently manufacturing a highly reliable electronic component having an external electrode excellent in connection reliability and hermeticity, which can have a necessary thickness, and the manufacturing method An object of the present invention is to provide an electronic component manufacturing apparatus for carrying out the above.

In order to solve the above problems, a method for manufacturing an electronic component of the present invention (Claim 1) includes:
In a method of forming an external electrode by applying and baking a conductive paste on a region including an end face of an electronic component element,
(a) a first conductive paste applying step of immersing an end face on which the external electrode of the electronic component element is to be formed in a conductive paste for forming an external electrode, and attaching the conductive paste to the end face of the electronic component element;
(b) After pressing the end surface of the electronic component element to which the conductive paste is attached to a flat surface to which the conductive paste is not applied , the end surface of the electronic component element is separated from the flat surface. A first conductive paste removing step of removing the conductive paste attached to a portion excluding the corner portion and the ridge line portion of the end face among the conductive paste attached to the end face;
(c) An electronic component element in which, in the first conductive paste removing step, the conductive paste attached to a portion excluding the corner portion and the ridge line portion of the end face is removed , and the conductive paste is attached to the corner portion and the ridge line portion of the end face And a second conductive paste applying step of immersing the end face of the conductive paste in a conductive paste to adhere the conductive paste to the entire end face.

  According to a second aspect of the present invention, there is provided a method of manufacturing an electronic component according to the first aspect of the present invention, wherein the conductive paste is attached to the end face of the electronic component element in the second conductive paste applying step, It is characterized by including a second conductive paste removing step for removing surplus portions including the raised portions.

  According to a third aspect of the present invention, there is provided the electronic component manufacturing method according to the first or second aspect of the invention, wherein the edge of the electronic component element where the external electrode is to be formed is chamfered. In the first conductive paste applying step, the immersion depth of the electronic component element in the conductive paste is set to the chamfered portion of the side surface adjacent to the end surface where the external electrode is to be formed. It is characterized by the depth to the end position.

Moreover, the manufacturing method of the electronic component of Claim 4 WHEREIN: In the structure of the invention in any one of Claims 1-3,
In the first conductive paste applying step, the conductive paste is applied on the flat surface to have a predetermined thickness, and then the end surface on which the external electrode of the electronic component element is to be formed is immersed in the conductive paste. , Attaching a conductive paste to the end face of the electronic component element,
In the first conductive paste removal step, after removing the conductive paste on the flat surface, after pressing the end surface to which the conductive paste of the electronic component element is attached to the flat surface from which the conductive paste has been removed, By removing the end face of the electronic component element from the flat surface, the conductive paste attached to the portion excluding the corner portion and the ridge line portion of the end face is removed from the conductive paste attached to the end surface of the electronic component element. It is a feature.

  According to a fifth aspect of the present invention, there is provided a method for manufacturing an electronic component according to any one of the second to fourth aspects, wherein the second conductive paste is removed in the second conductive paste application step. After pressing the end surface of the electronic component element to which the surface is attached to the surplus conductive paste removal surface having irregularities formed on the surface, the surplus portion including the raised portion of the conductive paste is removed by separating the end surface. Yes.

According to a sixth aspect of the present invention, there is provided a method for manufacturing an electronic component according to the fifth aspect of the present invention, wherein in the first conductive paste application step, the conductive paste transferred to the flat surface is removed, In preparation for the conductive paste removal step, and
In the second conductive paste application step, the conductive paste transferred to the surplus conductive paste removal surface is removed to prepare for the next second conductive paste removal step.

In addition, the electronic component manufacturing apparatus of the present invention (Claim 7)
(a) Conductive paste holding means having a flat surface for holding a conductive paste in which an end surface on which an external electrode of an electronic component element is to be formed is immersed, and supplying the conductive paste on the flat surface of the conductive paste holding means A conductive paste supplying means, and the conductive paste is attached to the end face of the electronic component element by immersing the end face of the electronic component element in the conductive paste held on the flat surface of the conductive paste holding means. First conductive paste applying means configured to be capable of:
(b) a flat surface on which the end surface of the electronic component element to which the conductive paste is attached is pressed, and the end surface of the electronic component element is pressed against the flat surface and then pulled away to adhere to the end surface of the electronic component element Of the conductive paste, it is possible to remove the conductive paste attached to the portion excluding the corner portion and the ridge line portion, and by removing the conductive paste transferred from the end surface of the electronic component element to the flat surface, A first conductive paste removing means configured to be prepared for the next conductive paste removing step;
(c) a conductive paste holding means having a flat surface for holding the conductive paste; and a conductive paste supply means for supplying the conductive paste on the flat surface; and a corner portion and a ridge line by the first conductive paste removing means. The end face of the electronic component element from which the conductive paste attached to the portion excluding the portion is removed is immersed in the conductive paste held on the flat surface of the conductive paste holding means, and the conductive paste is attached to the end face of the electronic component element. A second conductive paste applying means configured to be able to be
(d) Second conductive having a surplus conductive paste removal surface with irregularities formed on the surface, on which the end surface of the electronic component element having the conductive paste attached to the end surface using the second conductive paste applying means is pressed. Paste removing means for pressing the end surface of the electronic component element, to which the conductive paste is attached by the second conductive paste applying means, against the surplus conductive paste removing surface, and then pulling it apart to raise the conductive paste. It is possible to remove a surplus portion including a portion, and to prepare for the next step of removing the conductive paste by removing the conductive paste transferred from the end face of the electronic component element to the surplus conductive paste removal surface. A second conductive paste removing means configured to be capable of:
(e) the first conductive paste applying means (a), the first conductive paste removing means (b), the second conductive paste applying means (c), and the second conductive paste applying means (d) In the application and removal of the conductive paste using the conductive paste removing means, the electronic component element holding and handling means for holding and moving the electronic component element along a predetermined path is provided.

  According to an eighth aspect of the present invention, in the electronic component manufacturing apparatus according to the seventh aspect of the invention, the first conductive paste applying means is also used as the second conductive paste applying means. It is said.

An electronic component manufacturing apparatus according to claim 9 is the configuration of the invention according to claim 7 or 8,
(a) In the first conductive paste removing means, a removing means for removing the conductive paste that has moved to the flat surface; and
(b) In the second conductive paste removing means, a squeegee is used as the removing means for removing the conductive paste transferred to the surplus conductive paste removing surface.

In the method of manufacturing an electronic component according to the present invention (claim 1), (a) an end surface on which an external electrode of an electronic component element is to be formed is immersed in a conductive paste for forming an external electrode, and the end surface of the electronic component element is electrically conductive. A first conductive paste applying step for attaching a paste; and (b) pressing an end surface of the electronic component element to which the conductive paste is attached to a flat surface to which the conductive paste is not applied, and then setting the end surface of the electronic component element to a flat surface. A first conductive paste removing step of removing the conductive paste adhering to the portion excluding the corner portion and the ridge line portion of the end surface from among the conductive paste adhering to the end surface of the electronic component element, in the conductive paste removal step, the conductive paste deposited on the corner portion and the portion except the ridge portion of the end surface is removed, the conductive paste is adhered to the corner portion and the ridge line portion of the end face A second conductive paste applying step of immersing the end face of the child component element in the conductive paste and attaching the conductive paste to the entire end face, so that the necessary thickness at the corner portion and the ridge line portion of the electronic component element It is possible to efficiently manufacture an electronic component having an external electrode having excellent conduction reliability and sealing performance.

That is, after applying the conductive paste in the first conductive paste applying step, the end surface to which the conductive paste of the electronic component element is attached is pressed against the flat surface where the conductive paste is not applied in the first conductive paste removing step. Thereafter, by separating, it becomes possible to efficiently remove the conductive paste adhering to the portions other than the corner portion and the ridge line portion of the end face, and in the second conductive paste applying step, the end face of the electronic component element is made conductive. Since the conductive paste is soaked in the paste to adhere to the entire end face, the conductive paste is applied twice to the corner and ridge line portions of the end face of the electronic component, and the conductive paste is once applied to the central area of the end face. It will be in a state where only is granted. As a result, the thickness of the central region of the end face of the electronic component element is not excessively thick, and the corner portion and the ridge line portion of the end face of the electronic component element are provided with external electrodes having the necessary thickness, and are reliable in conduction and sealed. It is possible to efficiently manufacture a highly reliable electronic component including an external electrode having excellent properties.
Further, according to the method for manufacturing an electronic component of the present invention (Claim 1), it is possible to suppress the external electrode from becoming too thick and reduce the volume and weight of the electrode. It is possible to improve the volume ratio of the electronic component element when the sizes are the same, and it is possible to improve the size and performance.

  Further, as in the method of manufacturing an electronic component of claim 2, in the configuration of the invention of claim 1, after the conductive paste is attached to the end face of the electronic component element in the second conductive paste applying step, When the second conductive paste removing step for removing the surplus portion including the raised portion is provided, the surplus portion in the central region of the end face of the electronic component element that the conductive paste is likely to rise and adhere is removed. It is possible to reliably suppress the coating thickness of the conductive paste from being excessively thick in the central region, and to make the thickness uniform, and to have the necessary thickness at the corner portion and the ridge line portion of the end face of the electronic component element, And it becomes possible to manufacture efficiently the electronic component provided with the external electrode with uniform thickness in the center area | region of an end surface.

  Further, as in the method for manufacturing an electronic component according to claim 3, in the configuration of the invention according to claim 1 or 2, when the ridge line portion of the end surface of the electronic component element where the external electrode is to be formed is chamfered In the first conductive paste applying step, the immersion depth of the electronic component element in the conductive paste is set to the position where the chamfered portion of the chamfered portion is adjacent to the end surface where the external electrode is to be formed. In this case, it is possible to more reliably form an external electrode having a proper and uniform thickness in the central region of the end face of the electronic component element and a necessary thickness in the corner portion and the ridge line portion. The invention can be made more effective.

  That is, when the immersion depth in the first conductive paste application step is insufficient, the amount of conductive paste adhering to the corner portion and the ridge line portion is insufficient, and when the immersion depth is too deep, the conductive paste is not attached to the external electrode. The amount of wrapping around to the side surface adjacent to the end surface to be formed (the amount of wrapping of the conductive paste) increases, and the thickness of the conductive paste on the side surface becomes too thick, which is not preferable, but the conductive paste of the electronic component element By setting the immersion depth in the chamfered portion to the depth of the side surface adjacent to the end surface where the external electrode is to be formed up to the position where the chamfered portion ends, an appropriate amount of conductive paste is added to the corner portion. It can be applied to the ridgeline portion, and the present invention can be effectively presented.

Further, as in the method for manufacturing an electronic component according to claim 4, in the configuration of the invention according to any one of claims 1 to 3, the first conductive paste applying step has a predetermined thickness on the flat surface. After the conductive paste is applied to the electronic component element, the end surface on which the external electrode of the electronic component element is to be formed is immersed in the conductive paste so that the conductive paste adheres to the end surface of the electronic component element. It is possible to apply an appropriate amount of conductive paste to the electronic component element in the conductive paste application step, and after removing the conductive paste on the flat surface in the first conductive paste removal step, After pressing the end surface to which the conductive paste of the electronic component element is attached to the removed flat surface and then pulling the end surface of the electronic component element away from the flat surface, the conductive sheet attached to the end surface of the electronic component element is removed. Of strike, the conductive paste deposited on the corner portion and the portion except the ridge portion of the end face and efficiently removed, it is possible to uniform the thickness of the external electrode in the central region of the end face of the electronic component element.
Moreover, when it is set as the above structure, it is possible to carry out the first conductive paste applying step and the first conductive paste removing step by using the same mechanism portion as the mechanism portion constituting the flat surface. Thus, the equipment cost can be reduced.

  Moreover, like the manufacturing method of the electronic component of Claim 5, in the structure of the invention in any one of Claims 2-4, in the 2nd conductive paste removal process, it is the conductive paste in the 2nd conductive paste provision process. In the case where the end face of the electronic component element to which the adhesive has been applied is pressed against the surplus conductive paste removal surface having unevenness formed on the surface and then separated, the conductive paste includes a raised portion of the conductive paste while leaving the necessary conductive paste. It is possible to efficiently remove the surplus portion.

  The surplus conductive paste removal surface has irregularities formed on the surface as described above, and among the irregularities formed on the surface, the convex portion comes into contact with the end surface of the electronic component element, but the concave portion is the electronic component element. Therefore, as compared with a flat surface having the same plane area, the surplus conductive paste removal surface on which the irregularities are formed has a smaller area of the portion in contact with the end surface of the electronic component element. Therefore, in the second conductive paste removal step, the degree to which the conductive paste on the end face is removed is smaller than that in the first conductive paste removal step, and the conductive paste necessary as an external electrode having desired characteristics. Can be left on the end face and only the excess conductive paste can be removed.

  As a specific configuration of the surplus conductive paste removal surface with irregularities formed on the surface, a configuration in which ridges are provided in a lattice pattern on the surface, and a large number of protrusions with flat tips are regularly or irregularly arranged. It is possible to adopt various configurations such as an installed configuration and a configuration in which a large number of protrusions with sharp tips are arranged like a sword mountain.

  Moreover, like the manufacturing method of the electronic component of Claim 6, in the structure of Claim 5, in the said 1st electrically conductive paste provision process, the electrically conductive paste which moved to the said flat surface is removed, The following In preparation for the first conductive paste removal step, in the second conductive paste application step, the conductive paste transferred to the surplus conductive paste removal surface is removed to prepare for the next second conductive paste removal step. In this case, the first conductive paste removing step and the second conductive paste removing step can be performed continuously and stably, and the present invention can be more effectively realized.

Further, the electronic component manufacturing apparatus of the present invention (Claim 7) includes: (a) a conductive paste holding means having a flat surface for holding a conductive paste in which an end surface on which an external electrode of an electronic component element is to be formed is immersed; And a conductive paste supply means for supplying a conductive paste on the flat surface of the conductive paste holding means, and immersing the end face of the electronic component element in the conductive paste held on the flat surface of the conductive paste holding means, A first conductive paste applying means configured to allow the conductive paste to adhere to the end face of the electronic component element; and (b) a flat surface against which the end face of the electronic component element to which the conductive paste is attached is pressed. The portion excluding the corner portion and the ridge line portion of the conductive paste attached to the end surface of the electronic component element by pressing and separating the end surface of the electronic component element against the flat surface It is possible to remove the conductive paste adhering to the minute, and by removing the conductive paste transferred from the end surface of the electronic component element to the flat surface, it is possible to prepare for the next conductive paste removal step First conductive paste removing means, (c) conductive paste holding means having a flat surface for holding the conductive paste, and conductive paste supply means for supplying the conductive paste on the flat surface, The end face of the electronic component element from which the conductive paste attached to the portion excluding the corner portion and the ridge line portion is removed by the conductive paste removing means is immersed in the conductive paste held on the flat surface of the conductive paste holding means. A second conductive paste applying means configured to allow the conductive paste to adhere to the end face; and (d) an end using the second conductive paste applying means. A second conductive paste removing means having an excess conductive paste removal surface with irregularities formed on the surface, to which the end face of the electronic component element having the conductive paste attached to the surface is pressed, After the end surface of the electronic component element to which the conductive paste is attached is pressed against the surplus conductive paste removing surface and then separated, the surplus portion including the raised portion of the conductive paste can be removed, and the electronic component element is removed. A second conductive paste removing means configured to remove the conductive paste transferred from the end face of the first conductive paste to the surplus conductive paste removal surface, thereby preparing for the next conductive paste removal step; and (e) (a ) First conductive paste applying means; (b) first conductive paste removing means; (c) second conductive paste applying means; and (d) second conductive paste applying means. When the conductive paste is applied and removed using the electric paste removing means, the electronic component element is provided with an electronic component element holding and handling means for holding and moving the electronic component element along a predetermined path. a first conductive paste application step of applying a conductive paste in a region including the out of the conductive paste adhering to the end surface of the electronic component element, the removing conductive paste adhered to the corner portion and the portion except the ridge portion of the end face The first conductive paste removing step and the second conductive paste applying step of applying the conductive paste to the end face after removing the conductive paste attached to the portion excluding the corner portion and the ridge line portion of the end face in the first conductive paste removing step And a portion where the conductive paste is raised after the conductive paste is attached to the end face of the electronic component element in the second conductive paste application step It is possible to efficiently carry out the second conductive paste removing step for removing the surplus portion including. As a result, the thickness in the center region of the end face is uniform, has an appropriate thickness, and has the necessary thickness at the corner and ridge line portions of the end face of the electronic component element, and has good conduction reliability and sealing performance. A highly reliable electronic component having an external electrode can be efficiently manufactured.

  Further, as in the electronic device manufacturing apparatus according to claim 8, in the configuration of the invention according to claim 7, by using the first conductive paste applying means as the second conductive paste applying means, the device can be effectively used. It is possible to reduce the cost by simplifying the use and equipment configuration.

  The first conductive paste applying unit removes the conductive paste from the flat surface holding the conductive paste using, for example, a squeegee so that the flat surface becomes the flat surface of the first conductive paste removing unit. It can also be configured to be used as As described above, a configuration in which the first conductive paste applying unit can be used as the first conductive paste removing unit is also included in the scope of the present invention.

  Further, as in the electronic component manufacturing apparatus according to claim 9, in the configuration of the invention according to claim 7 or 8, (a) the first conductive paste removing means removes the conductive paste transferred to the flat surface. And (b) in the second conductive paste removing means, by using a squeegee as the removing means for removing the conductive paste transferred to the surplus conductive paste removal surface, the first and second It is possible to efficiently remove the conductive paste in the conductive paste removing means, and the present invention can be effectively realized.

  The features of the present invention will be described in more detail below with reference to examples of the present invention.

  In the first embodiment, as shown in FIG. 2, a plurality of internal electrodes 2 (2a, 2b) are laminated and disposed in a ceramic element (electronic component element) 1 via a ceramic layer 3, and The internal electrodes 2 (2a, 2b) facing each other through the layer 3 are alternately drawn out to the opposite end face of the ceramic element (electronic component element) 1 and are formed on both end faces 4 (4a, 4b) of the ceramic element 1. In the case of manufacturing a multilayer ceramic capacitor (electronic component) 10 having a structure connected to a pair of formed external electrodes 5 (5a, 5b), external electrodes 5 ( A method of forming 5a, 5b) will be described as an example.

In Example 1, when the external electrodes 5 were formed at both ends of the ceramic element (electronic component element) 1 as shown in FIG. 2, an apparatus having a configuration as shown in FIG. 1 was used.
In this apparatus, an electronic component element holding / handling means 11 for holding and moving the electronic component element 1 and an end face 4 (4a, 4b) (FIG. 2) on which external electrodes of the electronic component element 1 are to be formed are immersed. A conductive paste holding means (plate) 13 having a flat surface 13a for holding the conductive paste 12 and a conductive paste supply for supplying the conductive paste 12 to a predetermined thickness on the flat surface 13a of the conductive paste holding means 13; The end face 4 of the electronic component element 1 held by the electronic component element holding and handling means 11 is immersed in the conductive paste 12 applied to the flat surface 13a of the conductive paste holding means 13 with a predetermined thickness. (FIG. 3 (a), (b)), and pulling up (FIG. 3 (c)), it is possible to attach the conductive paste 12 to the end face 4 of the electronic component element 1. And a conductive paste applying unit 16.

The first conductive paste applying means 16 is also configured to function as the first conductive paste removing means 17 in the electronic component manufacturing apparatus of the present invention.
That is, the first conductive paste applying means 16 includes a flat surface 13a against which the end face 4 of the electronic component element 1 to which the conductive paste 12 is attached (FIGS. 4A and 4B), and holds the electronic component element. Of the conductive paste 12 attached to the end face 4 of the electronic component element 1 by pressing the end face 4 of the electronic component element 1 held by the handling means 11 against the flat surface 13a and then pulling it away (FIG. 4C). The conductive paste 12 attached to the portions excluding the corner portion and the ridge line portion can be transferred to the flat surface 13a, and then the conductive paste attached on the flat surface 13a can be substantially removed by the squeegee 15 (FIG. 1). is there. Further, by removing the conductive paste 12 transferred from the end face 4 of the electronic component element 1 to the flat surface 13a, the electronic component element 1 is also configured to function as a first conductive paste removing means 17 for the next conductive paste application process. ing.

Further, the first conductive paste applying unit 16 is configured to function also as the second conductive paste applying unit 18 in the electronic component manufacturing method of the present invention.
That is, the second conductive paste applying means 18 includes a conductive paste holding means 13 having a flat surface 13a for holding the conductive paste 12 into which the end face 4 on which the external electrode of the electronic component element 1 is to be formed, The electronic component element 1 held by the electronic component element holding / handling means 11 is provided with a conductive paste supplying means 14 for supplying the conductive paste 12 so as to have a predetermined thickness on the flat surface 13a of the conductive paste holding means 13. The conductive paste is immersed in the conductive paste 12 on the flat surface 13a of the conductive paste holding means 13 (FIGS. 5A and 5B) and pulled up (FIG. 5C), so that the conductive paste is applied to the end face 4 of the electronic component element 1. 12 is configured to function also as the second conductive paste applying means 18 configured to be able to adhere 12.

  In addition, the electronic component manufacturing apparatus according to the first embodiment performs the second conductive paste applying step using the second conductive paste applying unit 18, thereby allowing the electronic component element to adhere the conductive paste to the end face 4. The end surface 4 of the electronic component element 1 having the surplus conductive paste removal surface 21 with unevenness formed on the surface to which the end surface 4 of 1 is pressed and having the conductive paste 12 attached in the second conductive paste applying step After pressing against the conductive paste removal surface 21, it is possible to remove the surplus portion including the raised portion 12a of the conductive paste 12 (FIGS. 6A, 6B, and 6C), and Then, the conductive paste 12 (FIG. 6C) transferred from the end face 4 of the electronic component element 1 to the surplus conductive paste removal surface 21 is removed by the squeegee 25 (FIG. 1), whereby the next conductive paste is obtained. And a second conductive paste removal means 22 which is configured to be able to provide for removal step.

  Next, a method for manufacturing an electronic component (a method for forming an external electrode) using the manufacturing apparatus configured as described above will be described.

  (1) First, the electronic component element 1 having a rounded chamfering process at the ridge line portion of the end surface where the external electrode is to be formed is prepared.

  (2) The conductive paste supply means 14 (FIG. 1) supplies the conductive paste 12 on the conductive paste holding means (plate) 13 so as to have a constant thickness, as shown in FIG. At this time, it is desirable that the thickness of the conductive paste 12 is approximately the same as the radius of curvature of the chamfered portion of the ridge line portion of the electronic component element 1. This prevents the thickness of the conductive paste 12 from becoming excessively thick by setting the thickness of the conductive paste 12 to be substantially the same as the radius of curvature of the chamfered portion of the ridge line portion. Thus, it is possible to easily secure the thickness of the external electrode at the corner portion and the ridge line portion of the end face of the electronic component element while suppressing variations in the thickness of the external electrode (coating thickness of the conductive paste).

  (3) Next, as shown in FIG. 3B, the end face 4 of the electronic component element 1 is dipped in the conductive paste 12 applied on the conductive paste holding means (plate) 13 and pulled up (FIG. 3 ( c)) By this, the conductive paste 12 is adhered to the end face 4 of the electronic component element 1 (first conductive paste application step).

(4) Then, the conductive paste 12 on the flat surface 13a of the conductive paste holding means (plate) 13 is removed by the squeegee 15 (FIG. 1), and the conductive paste 12 is removed as shown in FIGS. 4 (a) and 4 (b). The end surface 4 of the electronic component element 1 immediately after the conductive paste 12 is applied in the step (3) is pressed against the flat surface 13a in a state where the metal paste is removed. Then, as shown in FIGS. 4 (c) and 4 (d), by pulling up the electronic component element 1, among the conductive paste 12 attached to the end surface 4 of the electronic component element 1, the corner portion 1 a and the ridge line portion of the end surface 4. The conductive paste 12 attached to the portion excluding 1b is substantially removed (first conductive paste removing step). At this time, the conductive paste 12 attached to the portion of the end face 4 excluding the corner portion 1a and the ridge line portion 1b is transferred onto the flat surface 13a, and the conductive paste 12 attached to the corner portion 1a and the ridge line portion 1b of the end face 4 is almost intact. Remains.
4 (c) shows the state where the conductive paste 12 is attached to the entire end face 4 in order to clearly show the comparison with FIG. 4 (a), the conductive paste is attached only to the corner portion 1a of the end face 3. Actually, the conductive paste is attached not only to the corner portion 1a of the end face 4 but also to the ridge portion 1b at the stage of FIG. 4C.
It should be noted that the main portion of the conductive paste 12 attached to the portion of the end face 4 excluding the corner portion 1a and the ridge line portion 1b can be removed, and there is no problem even if a small amount remains.

  (5) Then, the conductive paste 12 attached to the corner portion 1a and the ridge line portion 1b of the end face 4 is once dried. The drying at this time does not need to completely dry the solvent component in the conductive paste, and may be such that the conductive paste 12 is fixed to the corner portion 1a and the ridge line portion 1b and the fluidity is lost.

  (6) Thereafter, as shown in FIG. 5A, the conductive paste 12 is supplied on the flat surface 13a of the conductive paste holding means (plate) 13 so as to have a constant thickness. It is desirable that the thickness of the conductive paste at this time be a thickness that substantially corresponds to the distance E (see FIG. 2) that needs to go around the side surface of the electronic component element in the product. Then, as shown in FIG. 5B, the end face 4 of the electronic component element 1 in which the conductive paste 12 is previously attached to the corner portion 1a and the ridge line portion 1b in the step (4) is immersed in the conductive paste 12. Then, the conductive paste 12 is attached to the end face 4 by pulling up (FIG. 5C) (second conductive paste applying step).

  (7) Next, in the step (6), the end face 4 of the electronic component element 1 immediately after the application of the conductive paste 12 is uneven as shown in FIGS. 6 (a) and 6 (b). After pressing against the formed surplus conductive paste removal surface 21, as shown in FIG. 6C, the surplus portion including the raised portion 12 a of the conductive paste 12 applied to the end surface is removed by pulling away (the first portion) Step 2 of removing conductive paste of 2).

  Thereby, the corner portion 1a and the ridge line portion 1b of the end face 4 of the electronic component element 1 have a necessary thickness for the conductive paste, and the thickness of the conductive paste 12 is substantially uniform in the central region 1c of the end face 4, and It becomes possible to apply the conductive paste 12 to the end surface 4 of the electronic component element 1 in such a manner as to have a necessary thickness.

  In this way, the electronic component element having the end face 4 coated with the conductive paste for forming the external electrode is heat-treated under a predetermined condition after the conductive paste is dried, and the conductive paste is baked to thereby end the end face of the electronic component element. It is possible to form an external electrode having a necessary thickness at the corner portion and the ridge line portion and excellent in conduction reliability and having high sealing performance.

  Further, according to the electronic component manufacturing method (manufacturing apparatus) of the first embodiment, the positioning operation for inserting the electronic component element inside the jig is not required as in the case of the manufacturing apparatus of Patent Document 1. , Productivity can be improved.

  In the manufacturing apparatus of FIG. 1, the second conductive paste removing means 22 is configured separately from other means. However, as shown in FIG. 7, the second conductive paste removing means 22 is replaced with other means. It is also possible to configure it integrally. In FIG. 7, the parts denoted by the same reference numerals as those in FIG. 1 indicate the same or corresponding parts.

FIG. 8 is a diagram showing a configuration of an electronic component manufacturing apparatus according to another embodiment (second embodiment) of the present invention.
In the first embodiment, the electronic component manufacturing apparatus having the second conductive paste removing means has been described as an example. However, in the present invention, as in the case of the second embodiment, the second As shown in FIG. 8, the electronic component element holding / handling means 11 for holding and moving the electronic component element 1, the first conductive paste applying means 16, and the first conductive paste removing means are not provided. The conductive paste removing means 17 and the second conductive paste applying means 18 may be provided.

  Even in the case of the configuration of the second embodiment, the present invention can form an external electrode having a necessary thickness at the corner portion and the ridge line portion of the end face of the electronic component element and excellent in conduction reliability and sealing performance. Has the basic effect of.

  FIG. 9 is a diagram showing the main part of an electronic component (multilayer ceramic capacitor) manufactured by the method of Example 1, and FIG. 10 is the main part of the electronic component (multilayer ceramic capacitor) manufactured by the method of Example 2. FIG. 11 shows, as a reference example, only the second conductive paste applying step (first conductive paste applying step, first conductive paste removing step, and second conductive paste removing step) FIG. 12 is a diagram showing a main part of a manufactured electronic component (multilayer ceramic capacitor), and FIG. 12 shows a corner portion and a ridge line portion by a conventional method of repeatedly applying a conductive paste without providing a conductive paste removing step. It is a figure which shows the principal part of the electronic component (multilayer ceramic capacitor) manufactured by the method of ensuring the thickness of this.

As shown in FIG. 9, in the electronic component manufactured by the method of the first embodiment, the thickness A of the external electrode at the corner portion and the ridge line portion of the end surface of the electronic component element has a necessary thickness, and the electronic component It was confirmed that an external electrode having a substantially uniform outer electrode thickness B in the central region of the end face of the element and having a high sealing property with excellent conduction reliability was formed.
Here, the thickness A of the external electrode at the corner portion and the ridge line portion is the thickness of the portion (internal electrode lead-out portion) where the outermost layer of the internal electrode 2 is led out to the end face 4 and is literally a corner. It is not the thickness of the external electrode of the part and the ridge line part. However, the thickness A of the external electrode has a correlation with the actual thickness of the external electrode at the corner portion and the ridge line portion, and is an approximate value, and represents the actual thickness of the external electrode at the corner portion and the ridge line portion. It is a usable value.
The thickness of the external electrode of the electronic component (FIG. 9) of Example 1 is 10 to 12 μm at the corners and ridges of the end face, and the maximum thickness B of the external electrode at the center area of the end face. The portion was 25-30 μm.
The thickness A and the thickness B of the external electrode are such that the ceramic element 1 is parallel to the lead-out direction of the internal electrode 2 (the direction of the arrow C in FIG. 9) and perpendicular to the main surface of the internal electrode. The range of the minimum value and the maximum value of the values measured for each cut end surface is shown by cutting at different positions (a plurality of positions) in the width direction.

Also, as shown in FIG. 10, in the electronic component manufactured by the method of Example 2, the thickness B of the external electrode in the central region of the end surface of the electronic component element is somewhat larger than in the case of Example 1 above. It was confirmed that the external electrode thickness A at the corner portion and the ridge line portion of the end face of the electronic component element had a necessary thickness, and an external electrode with high conduction reliability was formed.
In addition, the thickness of the external electrode of the electronic component of Example 2 is 10 to 15 μm at the corners and ridges of the end faces, and the maximum thickness B of the external electrodes at the center area of the end faces is 60 to 60 μm. It was 70 μm.

Further, as shown in FIG. 11, only the second conductive paste applying step is performed (the first conductive paste applying step, the first conductive paste removing step, and the second conductive paste removing step are not performed). In the manufactured electronic component of the reference example, the thickness A of the external electrode at the corner portion and the ridge line portion of the end face is smaller than that in the case of the first and second embodiments, and the sealing is hermetically sealed. It was confirmed that only external electrodes with extremely insufficient properties could be formed.
In addition, the thickness of the external electrode of the electronic component of this reference example is 3 to 8 μm at the corners and ridges of the end face, and 60 to 70 μm at the maximum thickness B of the external electrode in the center area of the end face. Met.

In addition, as shown in FIG. 12, without providing a conductive paste removal step, the manufacturing method is performed by a conventional method configured to ensure the thickness A of the external electrode at the corner portion and the ridge line portion by a method of repeatedly applying the conductive paste. In the electronic component, it was confirmed that the thickness B of the external electrode in the central region of the end face of the electronic component element is remarkably large, and only the external electrode that is not preferable because the thickness of the external electrode is uneven is formed.
In addition, the thickness of the external electrode of the electronic component of this conventional example is 10 to 15 μm for the external electrode at the corner portion and the ridge line portion of the end surface, and the maximum thickness B of the external electrode in the central region of the end surface is 120 μm or more. there were.

Further, regarding another electronic component element manufactured by the same manufacturing method as in Examples 1 and 2, the following X cross section and Y cross section
(1) The thickness of the external electrode that wraps around the side
(2) External electrode thickness at the ridge
(3) External electrode thickness at the outermost internal electrode lead-out part
(4) The thickness of the external electrode in the central region was measured.

The X cross section means that the ceramic element 1 is parallel to the lead-out direction of the internal electrode 2 (the direction of the arrow C in FIG. 9) and perpendicular to the main surface of the internal electrode in the width direction of the internal electrode. It is a cut surface when it is cut at the center, and the Y cross section is parallel to the lead-out direction of the internal electrode 2 (the direction of the arrow C in FIG. 9) and in a direction perpendicular to the main surface of the internal electrode. It is a cut surface when it cut | disconnects in the position of the edge part side of the width direction of an electrode, and the position where the edge part of an internal electrode is cut | disconnected.
The thickness of each part of the external electrode was as shown in Table 1.

  In Table 1, the thickness (average value) of the external electrode in the ridge line portion may be smaller than the thickness (average value) of the external electrode in the internal electrode extraction portion of the outermost layer. If the thickness of the external electrode in the portion is at least a certain level (for example, 10 μm or more), sufficient conduction reliability can be ensured, and the thickness of the external electrode in the ridge line portion is somewhat less than that value (for example, 10 μm). If it is about the extent, it is possible to satisfy the sealing performance required for the external electrode. Therefore, it can be determined from the data in Table 1 that according to the methods of Examples 1 and 2, it is possible to form an external electrode having practically necessary characteristics.

  In the first and second embodiments, the multilayer ceramic capacitor has been described as an example. However, the present invention is not limited to the multilayer ceramic capacitor, and various electronic components including an inductor, a varistor, and other external electrodes are manufactured. It is possible to apply widely when doing.

  The invention of the present application is not limited to the above-described embodiment in other points as well, and the electronic component element holding / handling means, the first conductive paste applying means (first conductive paste applying step), and the first conductive Specifics of paste removing means (first conductive paste removing step), second conductive paste applying means (second conductive paste applying step), and second conductive paste removing means (second conductive paste removing step) Various applications and modifications can be added to the configuration and the like within the scope of the invention.

As described above, according to the present invention, it is necessary for the external electrode in the corner portion and the ridge line portion of the end surface of the electronic component element while suppressing the thickness of the external electrode from becoming too large in the central region of the end surface of the electronic component. It is possible to increase the thickness, and it is possible to efficiently manufacture a highly reliable electronic component including an external electrode having excellent connection reliability and sealing performance.
Therefore, the present invention can be widely applied to the production of various electronic components including external electrodes such as multilayer ceramic capacitors, inductors, and varistors.

It is a figure which shows the structure of the manufacturing apparatus of the electronic component concerning one Example (Example 1) of this invention. It is a figure which shows the structure of the electronic component (multilayer ceramic capacitor) manufactured by the manufacturing method of the electronic component concerning one Example of this invention. (a), (b), (c) is a figure explaining the 1st electrically conductive paste provision process in the manufacturing method of the electronic component concerning one Example of this invention. (a), (b), (c) is a figure explaining the 1st electrically conductive paste removal process in the manufacturing method of the electronic component concerning one Example of this invention, (d) is the corner part of the end surface of an electronic component element It is a figure which shows the state which removed substantially the electrically conductive paste adhering to the part except a ridgeline part. (a), (b), (c) is a figure explaining the 2nd electrically conductive paste provision process in the manufacturing method of the electronic component concerning one Example of this invention. (a), (b), (c) is a figure explaining the 2nd electrically conductive paste removal process in the manufacturing method of the electronic component concerning one Example of this invention. It is a figure which shows the modification of the manufacturing apparatus of the electronic component concerning Example 1 of this invention. It is a figure which shows the structure of the manufacturing apparatus of the electronic component concerning other Example (Example 2) of this invention. FIG. 3 is a diagram illustrating a main part of an electronic component (multilayer ceramic capacitor) manufactured by the method of Example 1. FIG. 6 is a view showing a main part of an electronic component (multilayer ceramic capacitor) manufactured by the method of Example 2. It is a figure which shows the principal part of the electronic component (multilayer ceramic capacitor) of the reference example manufactured by the method provided only with the 2nd electrically conductive paste provision process. It is a figure which shows the principal part of the electronic component (multilayer ceramic capacitor) manufactured by the conventional method of ensuring the thickness of a corner part and a ridgeline part by the method of repeating the application | coating of a conductive paste, without providing the conductive paste removal process. It is a figure which shows the conventional electronic component (multilayer ceramic capacitor). It is a figure which shows the manufacturing method of the conventional electronic component. It is a figure which shows the manufacturing method of the conventional electronic component.

Explanation of symbols

1 Ceramic element (electronic component element)
DESCRIPTION OF SYMBOLS 1a End surface corner 1b End surface ridge 1c End surface central region 2 (2a, 2b) Internal electrode 3 Ceramic layer 4 (4a, 4b) Ceramic element end surface 5 (5a, 5b) External electrode 10 Multilayer ceramic capacitor (electronic parts)
DESCRIPTION OF SYMBOLS 11 Electronic component element holding | maintenance handling means 12 Conductive paste 12a The part which the conductive paste rose 13 Conductive paste holding means (plate)
13a Flat surface 14 Conductive paste supplying means 15 Squeegee 16 First conductive paste applying means 17 First conductive paste removing means 18 Second conductive paste applying means 21 Excess conductive paste removing surface 22 Second conductive paste removing means 25 Squeegee A Thickness of external electrode at corner and ridge line of end face of electronic component element B Thickness of external electrode at central region of end face of electronic component element C Direction of drawing out internal electrode

Claims (9)

In a method of forming an external electrode by applying and baking a conductive paste on a region including an end face of an electronic component element,
(a) a first conductive paste applying step of immersing an end face on which the external electrode of the electronic component element is to be formed in a conductive paste for forming an external electrode, and attaching the conductive paste to the end face of the electronic component element;
(b) After pressing the end surface of the electronic component element to which the conductive paste is attached to a flat surface to which the conductive paste is not applied , the end surface of the electronic component element is separated from the flat surface. A first conductive paste removing step of removing the conductive paste attached to a portion excluding the corner portion and the ridge line portion of the end face among the conductive paste attached to the end face;
(c) An electronic component element in which, in the first conductive paste removing step, the conductive paste attached to a portion excluding the corner portion and the ridge line portion of the end face is removed , and the conductive paste is attached to the corner portion and the ridge line portion of the end face And a second conductive paste applying step of immersing the end face of the conductive paste in a conductive paste to attach the conductive paste to the entire end face.   In the second conductive paste application step, after the conductive paste is attached to the end face of the electronic component element, the second conductive paste removing step of removing the surplus portion including the raised portion of the conductive paste is provided. The method of manufacturing an electronic component according to claim 1, wherein   In the case where the edge portion of the electronic component element where the external electrode is to be formed is chamfered, the immersion depth of the electronic component element in the conductive paste in the first conductive paste application step is as follows. 3. The method of manufacturing an electronic component according to claim 1, wherein a depth of a side surface of the chamfered portion adjacent to an end surface on which the external electrode is to be formed is a depth to a position where the chamfered portion ends. . In the first conductive paste applying step, the conductive paste is applied on the flat surface to have a predetermined thickness, and then the end surface on which the external electrode of the electronic component element is to be formed is immersed in the conductive paste. , Attaching a conductive paste to the end face of the electronic component element,
In the first conductive paste removal step, after removing the conductive paste on the flat surface, after pressing the end surface to which the conductive paste of the electronic component element is attached to the flat surface from which the conductive paste has been removed, By removing the end face of the electronic component element from the flat surface, the conductive paste attached to the portion excluding the corner portion and the ridge line portion of the end face is removed from the conductive paste attached to the end surface of the electronic component element. The manufacturing method of the electronic component in any one of Claims 1-3 characterized by the above-mentioned.   In the second conductive paste removal step, after pressing the end surface of the electronic component element on which the conductive paste is attached in the second conductive paste application step, to the surplus conductive paste removal surface on which irregularities are formed on the surface, The method of manufacturing an electronic component according to any one of claims 2 to 4, wherein an excess portion including a raised portion of the conductive paste is removed by pulling apart. In the first conductive paste application step, the conductive paste transferred to the flat surface is removed to prepare for the next first conductive paste removal step; and
6. The electronic component according to claim 5, wherein in the second conductive paste application step, the conductive paste transferred to the surplus conductive paste removal surface is removed to prepare for the next second conductive paste removal step. Production method. (a) Conductive paste holding means having a flat surface for holding a conductive paste in which an end surface on which an external electrode of an electronic component element is to be formed is immersed, and supplying the conductive paste on the flat surface of the conductive paste holding means A conductive paste supplying means, and the conductive paste is attached to the end face of the electronic component element by immersing the end face of the electronic component element in the conductive paste held on the flat surface of the conductive paste holding means. First conductive paste applying means configured to be capable of:
(b) a flat surface on which the end surface of the electronic component element to which the conductive paste is attached is pressed, and the end surface of the electronic component element is pressed against the flat surface and then pulled away to adhere to the end surface of the electronic component element Of the conductive paste, it is possible to remove the conductive paste attached to the portion excluding the corner portion and the ridge line portion, and by removing the conductive paste transferred from the end surface of the electronic component element to the flat surface, A first conductive paste removing means configured to be prepared for the next conductive paste removing step;
(c) a conductive paste holding means having a flat surface for holding the conductive paste; and a conductive paste supply means for supplying the conductive paste on the flat surface; and a corner portion and a ridge line by the first conductive paste removing means. The end face of the electronic component element from which the conductive paste attached to the portion excluding the portion is removed is immersed in the conductive paste held on the flat surface of the conductive paste holding means, and the conductive paste is attached to the end face of the electronic component element. A second conductive paste applying means configured to be able to be
(d) Second conductive having a surplus conductive paste removal surface with irregularities formed on the surface, on which the end surface of the electronic component element having the conductive paste attached to the end surface using the second conductive paste applying means is pressed. Paste removing means for pressing the end surface of the electronic component element, to which the conductive paste is attached by the second conductive paste applying means, against the surplus conductive paste removing surface, and then pulling it apart to raise the conductive paste. It is possible to remove a surplus portion including a portion, and to prepare for the next step of removing the conductive paste by removing the conductive paste transferred from the end face of the electronic component element to the surplus conductive paste removal surface. A second conductive paste removing means configured to be capable of:
(e) the first conductive paste applying means (a), the first conductive paste removing means (b), the second conductive paste applying means (c), and the second conductive paste applying means (d) An electronic component comprising: an electronic component element holding and handling means for holding and moving the electronic component element in a predetermined path when applying and removing the conductive paste using the conductive paste removing means of Manufacturing equipment.   The electronic component manufacturing apparatus according to claim 7, wherein the first conductive paste applying unit is also used as the second conductive paste applying unit. (a) In the first conductive paste removing means, a removing means for removing the conductive paste that has moved to the flat surface; and
9. The squeegee is used as the removing means for removing the conductive paste transferred to the surplus conductive paste removing surface in the second conductive paste removing means. Electronic component manufacturing equipment.

Images