JP4947076B2 - Manufacturing method of electronic parts - Google Patents

Description

  The present invention relates to a method for manufacturing an electronic component in which an external electrode composed of a baked electrode layer, a resin electrode layer, and a plating electrode layer is formed.

  As an electronic component, an element body and an external electrode formed on the end surface of the element body are provided, and the external electrode is formed so as to completely cover the baking electrode layer formed on the surface of the element body. What consists of the resin electrode layer formed and the plating electrode layer formed on the resin electrode layer is known (for example, refer patent document 1). In the electronic component described in Patent Document 1, by forming a resin electrode layer, stress acting on the element body is relieved and cracks are prevented from occurring in the element body.

JP-A-10-284343

  However, in the electronic component described in Patent Document 1, since the electric resistance of the resin electrode layer is higher than that of the baked electrode layer, the resin electrode layer was not formed so as to completely cover the baked electrode layer. The electrical resistance at the external electrode is increased, and the characteristics of the electronic component may be deteriorated.

  An object of the present invention is to provide an electronic component manufacturing method capable of easily obtaining an electronic component capable of suppressing deterioration of characteristics while reducing the stress acting on the element body and preventing the occurrence of cracks. It is.

  The present invention is a method for manufacturing an electronic component in which an external electrode including a baked electrode layer, a resin electrode layer, and a plated electrode layer is formed, and the baked electrode layer is formed from the end surface to the mounting surface adjacent to the end surface. A step of preparing an element body, a paste holding surface for holding the paste, and an electrode contact surface that is higher than or in the same position as the paste held on the paste holding surface and is in contact with the baking electrode layer A step of forming a resin electrode layer by applying a conductive resin paste containing a conductive material and a resin material to a baked electrode layer using a paste holding member made of an elastic body, and forming a baked electrode layer and a resin electrode layer Forming a plated electrode layer by plating the formed element body, and in the step of forming the resin electrode layer, the conductive resin paste is held on the paste holding surface, and the end face of the element body and the electrode contact are formed. With the baked electrode layer in contact with the electrode contact surface so as to face the surface, the paste holding member is pressed to elastically deform the paste holding member, and the conductive resin paste held on the paste holding surface is baked. It is characterized by being applied to a portion formed on the mounting surface in the electrode layer.

  In the method for manufacturing an electronic component according to the present invention, the baked electrode layer is formed such that the end surface of the element body and the electrode contact surface are opposed to the electrode contact surface that is higher than or in the same position as the paste held on the paste holding surface. In this state, the base body is pressed to elastically deform the paste holding member, and the conductive resin paste held on the paste holding surface is applied to the portion formed on the mounting surface of the baking electrode layer. Therefore, the conductive resin paste does not adhere to the portion of the baking electrode layer that contacts the electrode contact surface, and the resin electrode layer is not formed on the portion. Therefore, when the plating electrode layer is formed by plating, the plating electrode layer is directly formed on the portion of the baking electrode layer that contacts the electrode contact surface, that is, the portion where the resin electrode layer is not formed. The plating electrode layer and the baked electrode layer are connected without intervention. As a result, a current path that does not pass through the resin electrode layer having a relatively high electrical resistance is formed in the external electrode, and deterioration of characteristics of the electronic component can be suppressed.

  In the present invention, the portion formed on the mounting surface in the baked electrode layer is held on the paste holding surface by the elastic deformation of the paste holding member and the height of the electrode contact surface with respect to the paste holding surface being lowered. A conductive electrode paste is applied to form a resin electrode layer. Thereby, the stress which acts on an element body is relieved by the resin electrode layer, and generation | occurrence | production of the crack in an element body can be aimed at.

  In the present invention, by using the paste holding member made of an elastic body having the paste holding surface and the electrode contact surface, the portion where the conductive resin paste is applied on the baking electrode layer and the conductive resin paste are not applied. The part can be easily formed. As a result, it is possible to easily obtain an electronic component capable of suppressing deterioration of characteristics while preventing the occurrence of cracks in the element body.

  Preferably, in the step of forming the resin electrode layer, the paste holding member is elastically deformed so that the entire portion formed on the mounting surface of the baking electrode layer is covered with the conductive resin paste held on the paste holding surface. To grant. In this case, since the resin electrode layer is formed so as to cover the entire portion formed on the mounting surface in the baked electrode layer, the stress acting on the element body is further alleviated.

  Preferably, in the step of forming the resin electrode layer, as the paste holding member, the paste holding surface is positioned so as to surround the entire circumference of the electrode contact surface when viewed from the direction orthogonal to the electrode contact surface. Use members. In this case, the resin electrode layer can be reliably formed on the mounting surface.

  Preferably, in the step of forming the resin electrode layer, a paste holding member in which the area of the electrode contact surface is narrower than the area of the end surface of the element body is used as the paste holding member, and the baking electrode layer is applied to the electrode contact surface. In the contact state, the baked electrode layer is brought into contact with the electrode contact surface so that the entire electrode contact surface is included inside the end surface. In this case, the conductive resin paste is applied to the end surface, and the resin electrode layer is formed so as to go around from the mounting surface to the end surface. For this reason, the connection strength between the resin electrode layer and the baked electrode layer is improved, and peeling of the resin electrode layer can be prevented.

  Preferably, in the step of forming the resin electrode layer, as the paste holding member, a side wall portion positioned so as to surround the entire circumference of the paste holding surface and having the same height as the height from the paste holding surface to the electrode contact surface is provided. A paste holding member is used. In this case, even when the conductive resin paste adheres to the electrode contact surface, the attached conductive resin paste can be easily removed.

  According to the present invention, there is provided an electronic component manufacturing method capable of easily obtaining an electronic component capable of suppressing deterioration of characteristics while reducing the stress acting on the element body and preventing the occurrence of cracks. Can do.

1 is a schematic perspective view of a multilayer capacitor according to an embodiment. 1 is an exploded perspective view of an element body included in a multilayer capacitor according to an embodiment. It is a figure showing the section composition of the multilayer capacitor concerning this embodiment. It is a flowchart for demonstrating the manufacturing process of the multilayer capacitor which concerns on this embodiment. It is a schematic diagram for demonstrating the manufacturing process of the multilayer capacitor which concerns on this embodiment. It is a schematic diagram for demonstrating the manufacturing process of the multilayer capacitor which concerns on this embodiment. It is a schematic diagram for demonstrating the manufacturing process of the multilayer capacitor which concerns on this embodiment. It is a schematic diagram for demonstrating the manufacturing process of the multilayer capacitor which concerns on this embodiment. It is a schematic diagram for demonstrating the manufacturing process of the multilayer capacitor which concerns on this embodiment. It is a schematic diagram for demonstrating the modification of the manufacturing process of the multilayer capacitor which concerns on this embodiment. It is a schematic diagram for demonstrating the modification of the manufacturing process of the multilayer capacitor which concerns on this embodiment. It is a schematic diagram for demonstrating the modification of the manufacturing process of the multilayer capacitor which concerns on this embodiment. It is a schematic diagram for demonstrating the modification of the manufacturing process of the multilayer capacitor which concerns on this embodiment.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  First, the configuration of the multilayer capacitor C1 according to the present embodiment will be described with reference to FIGS. FIG. 1 is a schematic perspective view of the multilayer capacitor in accordance with the present embodiment. FIG. 2 is an exploded perspective view of the element body included in the multilayer capacitor in accordance with the present embodiment. FIG. 3 is a diagram illustrating a cross-sectional configuration of the multilayer capacitor in accordance with the present embodiment.

  In the present embodiment, a multilayer capacitor will be described as an example of an electronic component. As shown in FIG. 1, the multilayer capacitor C <b> 1 includes an element body 1 as a multilayer body and a pair of external electrodes 10.

  The element body 1 has a substantially rectangular parallelepiped shape, a pair of rectangular main surfaces 2 and 3 facing each other, a pair of end surfaces 4 and 5 facing each other, a pair of side surfaces 6 and 7 facing each other, Is included. The pair of end surfaces 4 and 5 extend in the short side direction of the pair of main surfaces 2 and 3 so as to connect the pair of main surfaces 2 and 3. The pair of side surfaces 6 and 7 extend in the long side direction of the pair of main surfaces 2 and 3 so as to connect the pair of main surfaces 2 and 3. Each end surface 4, 5 is adjacent to the pair of main surfaces 2, 3 and the pair of side surfaces 6, 7. One of the pair of main surfaces 2 and 3 is a mounting surface that faces another component on which the multilayer capacitor C1 is mounted.

  In the element body 1, as shown in FIGS. 2 and 3, a plurality of internal electrodes 20 are laminated via a dielectric layer 22. Each dielectric layer 22 is made of a sintered body of a ceramic green sheet containing a dielectric ceramic, for example. The actual multilayer capacitor C1 is integrated so that the boundary between the dielectric layers 22 is not visible.

  The plurality of internal electrodes 20 arranged in the element body 1 are alternately drawn out to a pair of end faces 4 and 5 parallel to the stacking direction of the internal electrodes 20. The internal electrode 20 is made of a conductive material that is usually used as an internal electrode of a laminated electric element. In this embodiment, the internal electrode 20 contains Ni, which is a base metal, as a conductive material.

  The internal electrode 20 drawn out to the end face 4 and the internal electrode 20 drawn out to the end face 5 are partially overlapped when viewed from the stacking direction (opposite direction of the pair of main surfaces 2 and 3). The capacitance of the multilayer capacitor C1 is defined by the overlapping area of the internal electrodes 20 when viewed from the stacking direction and the interval between the internal electrodes 20 (that is, the thickness of the dielectric layer 22).

  The external electrode 10 is disposed on each end face 4, 5 side of the element body 1. The external electrode 10 is formed from the end surfaces 4 and 5 to the pair of main surfaces 2 and 3 and the pair of side surfaces 6 and 7 so as to cover the entire end surfaces 4 and 5. The external electrode 10 includes a baked electrode layer 12, a resin electrode layer 14, and a plating electrode layer 16.

  The baked electrode layer 12 is formed directly on the element body 1. Specifically, the baked electrode layer 12 covers the entire end surfaces 4 and 5 and is formed so as to wrap around the portions near the end surfaces 4 and 5 of the pair of main surfaces 2 and 3 and the pair of side surfaces 6 and 7. Yes. As a result, the baked electrode layer 12 is directly connected to the exposed internal electrode 20 drawn out to the end faces 4 and 5, and the internal electrode 20 and the baked electrode layer 12 are electrically connected.

  The baked electrode layer 12 contains a metal (for example, a base metal material such as Cu or a noble metal material such as Ag) as a main component. The baked electrode layer 12 is formed by applying and baking a conductive paste containing conductive metal powder (for example, Cu powder) and glass powder (for example, glass frit) on the surface of the element body 1. .

  The resin electrode layer 14 is directly formed on the baking electrode layer 12. Specifically, the resin electrode layer 14 covers the vicinity of the edge portion of the portion formed on the end surfaces 4 and 5 in the baking electrode layer 12, and the pair of main surfaces 2 and 3 and the pair of side surfaces 6 in the baking electrode layer 12. , 7 is formed so as to go around the portion formed near the end surfaces 4 and 5. That is, the resin electrode layer 14 is not formed in the central portion of the portion formed on the end faces 4 and 5 in the baked electrode layer 12 and is exposed. The resin electrode layer 14 contains a metal powder as a conductive material, and is a layer formed by curing a resin layer forming composition with a metal powder and a thermosetting resin.

  The plating electrode layer 16 is directly formed on the baking electrode layer 12 and the resin electrode layer 14. Specifically, the resin electrode layer 14 and the baked electrode layer 12 are formed so as to cover portions exposed from the resin electrode layer 14. The plated electrode layer 16 is formed by plating the surfaces of the baked electrode layer 12 and the resin electrode layer 14.

  Subsequently, a manufacturing process of the multilayer capacitor C1 having the above-described configuration will be described with reference to FIGS. FIG. 4 is a flowchart for explaining the manufacturing process of the multilayer capacitor in accordance with this embodiment. 5 to 9 are schematic views for explaining the production process of the multilayer capacitor in accordance with the present embodiment.

  In manufacturing the multilayer capacitor C1, first, a ceramic paste for forming the dielectric layer 22 and an internal electrode paste for forming the internal electrode 20 are prepared.

  The ceramic paste can be obtained by mixing and kneading an organic vehicle or the like with the raw material of the dielectric material constituting the dielectric layer. As a raw material of the dielectric material, for example, when the dielectric material is various composite oxide materials as described above, oxides, carbonates, nitrates, water of each metal atom contained in the composite oxide Combinations of oxides, organometallic compounds, and the like can be given.

  The organic vehicle includes a binder and a solvent. Examples of the binder include ethyl cellulose, polyvinyl butyral, acrylic resin, and the like. Examples of the solvent include organic solvents such as terpineol, butyl carbitol, acetone, toluene, xylene, ethanol, and methyl ethyl ketone.

  In addition to the above, the ceramic paste may contain various dispersants, plasticizers, dielectrics, glass frit, insulators, and the like as necessary.

  The internal electrode paste is obtained by mixing and kneading a conductive powder for forming the internal electrode 20 and an organic vehicle. As the conductive powder, metal powder (for example, Ni powder) is used, and various shapes such as a spherical shape and a scale shape can be applied. An appropriate amount of an inorganic compound may be contained in the internal electrode paste as necessary.

  The organic vehicle includes a binder and a solvent. Examples of the binder include ethyl cellulose, acrylic resin, polyvinyl butyral, polyvinyl acetal, polyvinyl alcohol, polyolefin, polyurethane, polystyrene, and copolymers thereof. Examples of the solvent include terpineol, butyl carbitol, kerosene, acetone and the like.

  A plasticizer may be appropriately contained in the internal electrode paste. As the plasticizer, for example, phthalic acid esters such as benzylbutyl phthalate (BBP), adipic acid, phosphoric acid esters, glycols, and the like can be applied.

  Next, after preparing the above-described ceramic paste and internal electrode paste, first, a ceramic green sheet is formed on a carrier sheet made of PET or the like by a known method such as a doctor blade method (S101). Then, a plurality of internal electrode patterns are formed on the ceramic green sheet by a known method such as a screen printing method (S103).

  Next, the ceramic green sheets on which the internal electrode patterns are formed are stacked in a predetermined size and stacked in a predetermined number, and pressed (pressed) from the stacking direction to form a green stacked body (S105). Then, the green laminate is cut into chips of a predetermined size with a cutting machine to obtain green chips (S107).

Next, after removing the binder contained in each part from the green chip (debinding), the green chip is fired (S109). By this firing, the element body 1 in which the dielectric layer 22 is formed from the ceramic green sheet and the internal electrode 20 is formed from the internal electrode paste layer is obtained. The binder removal can be performed by heating the green chip to about 200 to 600 ° C. in a reducing atmosphere such as air or a mixed gas of N ₂ and H ₂ . Firing can be performed by heating the green chip after removal of the binder to, for example, about 1100 to 1300 ° C. in a reducing atmosphere.

  Next, the baked electrode layer 12 is formed in a predetermined region on the surface of the element body 1 (S111). Here, the conductive material is formed on the predetermined region on the surface of the element body 1, that is, on the entire end surfaces 4 and 5, and on the portions of the pair of main surfaces 2 and 3 and the pair of side surfaces 6 and 7 near the end surfaces 4 and 5. Apply a sex paste. The application of the conductive paste can be performed by a dipping method, a printing method, a transfer method, or the like. In the conductive paste, as described above, a conductive metal powder (for example, a metal powder mainly composed of Cu powder) is mixed with glass powder (for example, glass frit) and an organic vehicle as described above. Use things. Then, a desired heat treatment is performed on the element body 1 to which the conductive paste is applied, and the conductive paste is baked on the element body 1. Thereby, the baked electrode layer 12 is formed on the element body 1. Baking of the conductive paste is performed by heating at a temperature of about 600 to 800 ° C. for about 20 minutes to 40 minutes, for example.

  Next, the resin electrode layer 14 is formed in a predetermined region on the surface of the baked electrode layer 12 (S113). Here, the resin electrode layer 14 is formed using the paste holding member 30 shown in FIG. The paste holding member 30 is made of an elastic body (for example, silicone rubber) and includes an electrode contact portion 32 and a side wall portion 34, and an annular groove 36 formed on one main surface side has an electrode contact. The part 32 and the side wall part 34 are separated. The area of the upper surface 32 a of the electrode contact portion 32 is set to be smaller than the areas of the end surfaces 4 and 5 of the element body 1. 5A shows a perspective view of the paste holding member, and FIG. 5B shows a cross-sectional view of the paste holding member.

  The bottom surface 36a of the groove 36 functions as a paste holding surface that holds the conductive resin paste. Since the groove 36 is formed in an annular shape, the bottom surface 36a functioning as a paste holding surface is positioned so as to surround the entire circumference of the upper surface 32a of the electrode contact portion 32 when viewed from the direction orthogonal to the upper surface 32a. Become. The upper surface 32 a of the electrode contact portion 32 and the upper surface 34 a of the side wall portion 34 are at the same height, and are higher than the bottom surface 36 a of the groove 36.

  First, the conductive resin paste P is filled in the groove 36 of the paste holding member 30 (see FIG. 6). The conductive resin paste P is supplied to the paste holding member 30 so as to overflow from the groove 36 onto the upper surface 32a of the electrode contact portion 32 and the upper surface 34a of the sidewall portion 34, and the upper surface 32a and the sidewall portion of the electrode contact portion 32 are supplied. The conductive resin paste P existing on the upper surface 34 a of 34 is scraped off by the blade B. Thereby, the conductive resin paste P is filled in the groove 36 of the paste holding member 30, and the conductive resin paste P is held on the bottom surface 36a of the groove 36 (see FIG. 7). The upper surface 32 a of the electrode contact portion 32 is at the same height as the conductive resin paste P. Since the conductive resin paste P is scraped off by the blade B on the upper surface 32a of the electrode contact portion 32, the conductive resin paste P hardly adheres.

  The conductive resin paste P includes a conductive material and a resin material. As the conductive material, for example, a metal powder such as Ag which is a noble metal can be used. As the resin material, a thermosetting resin such as a phenol resin, an acrylic resin, a silicon resin, an epoxy resin, or a polyimide resin can be used. The conductive resin paste further contains a solvent as necessary. As the solvent, any known solvent can be used without particular limitation as long as it can dissolve or disperse the thermosetting resin. Specific examples of the solvent include methyl carbitol, ethyl carbitol, butyl carbitol, butyl carbitol acetate, cellosolve, butyl cellosolve, butyl cellosolve acetate, and terpineol.

  Then, the baked electrode layer 12 is brought into contact with the upper surface 32a of the electrode contact portion 32 so that the end faces 4 and 5 of the element body 1 and the upper surface 32a face each other (see FIG. 8A). At this time, the edges of the end faces 4 and 5 of the element body 1 face the groove 36 over the entire circumference, that is, the entire upper surface 32 a of the electrode contact part 32 is included inside the end faces 4 and 5 of the element body 1. Next, the element body 1 is positioned with respect to the electrode contact portion 32.

  The electrode body 1 is pressed in a state where the baked electrode layer 12 is in contact with the upper surface 32a of the electrode contact portion 32, and the electrode contact portion 32 of the paste holding member 30 is elastically deformed (see FIG. 8B). ). In the present embodiment, the electrode contact portion 32 is elastically deformed until the conductive resin paste P covers the entire portion formed on the pair of main surfaces 2 and 3 and the pair of side surfaces 6 and 7 in the baked electrode layer 12. . As a result, it is formed on the portion of the baking electrode layer 12 excluding the portion that is in contact with the upper surface 32a of the electrode contact portion 32, that is, on the pair of main surfaces 2 and 3 and the pair of side surfaces 6 and 7 in the baking electrode layer 12. The conductive resin paste P is applied to the entire portion and the portions formed on the edges of the end faces 4 and 5 of the element body 1 (see FIG. 9). FIG. 9 shows a state in which the conductive resin paste P is applied to the baked electrode layer 12 formed on the end face 5 side.

  Then, after drying the applied conductive resin paste P, it is heated and cured. Thereby, the resin electrode is formed on the entire portion formed on the pair of main surfaces 2 and 3 and the pair of side surfaces 6 and 7 and the portion formed on the edge of the end surfaces 4 and 5 of the element body 1 in the baking electrode layer 12. Layer 14 will be formed. The conductive resin paste P is dried by heating at a temperature of about 80 to 160 ° C. for about 10 to 30 minutes, for example. Curing of the conductive resin paste is performed, for example, by heating at a temperature of about 180 to 220 ° C. for about 30 to 120 minutes.

  Next, the base body 1 on which the baked electrode layer 12 and the resin electrode layer 14 are formed is subjected to a plating process to form a plated electrode layer 16 (S115). Here, a Ni plating layer and a Sn plating layer are formed as the plating electrode layer 16. The Ni plating layer is formed by electroplating so as to cover the baking electrode layer 12 and the resin electrode layer 14, and the Sn plating layer is formed by electroplating so as to cover the Ni plating layer. The Ni plating layer can be formed by a barrel plating method using a Ni plating bath (for example, a Watt bath). The formation of the Sn plating layer can be performed by a barrel plating method using an Sn plating bath (for example, a neutral Sn plating bath).

  Through the process described above, the multilayer capacitor C1 is obtained.

  As described above, in this embodiment, the end surfaces 4, 5 and the upper surface of the element body 1 are formed on the upper surface 32 a of the electrode contact portion 32 at the same height as the conductive resin paste P held on the bottom surface 36 a of the groove 36. The baked electrode layer 12 is brought into contact with the electrode 32a so as to face the electrode 32a. In this state, the element body 1 is pressed to elastically deform the paste holding member 30 (electrode contact portion 32), and the conductive material held on the bottom surface 36a. The conductive resin paste P is applied to portions of the baking electrode layer 12 formed on the pair of main surfaces 2 and 3 and the pair of side surfaces 6 and 7. Therefore, the conductive resin paste P does not adhere to the portion of the baking electrode layer 12 that contacts the upper surface 32a, and the resin electrode layer 14 is not formed on the portion.

  Therefore, when the plating electrode layer 16 is formed by plating, the plating electrode layer 16 is formed on the portion of the baking electrode layer 12 that contacts the upper surface 32a of the electrode contact portion 32, that is, the portion where the resin electrode layer 14 is not formed. Directly formed, the plated electrode layer 16 and the baked electrode layer 12 are connected without the resin electrode layer 14 interposed therebetween. As a result, a current path that does not pass through the resin electrode layer 14 having a relatively high electrical resistance is formed in the external electrode 10, and the ESR (equivalent series resistance) of the multilayer capacitor C1 can be suppressed to a low level.

  In the present embodiment, the electrode contact portion 32 is elastically deformed at the portions formed on the pair of main surfaces 2 and 3 and the pair of side surfaces 6 and 7 in the baked electrode layer 12, and the upper surface of the groove 36 with respect to the bottom surface 36 a. By reducing the height of 32a, the conductive resin paste P held on the bottom surface 36a is applied, and the resin electrode layer 14 is formed. Thereby, the stress which acts on the element body 1 is relieved by the resin electrode layer 14, and the occurrence of cracks in the element body 1 can be prevented.

  In the present embodiment, the conductive resin paste P is applied on the baked electrode layer 12 by using the paste holding member 30 made of an elastic body having the bottom surface 36 a of the groove 36 and the upper surface 32 a of the electrode contact portion 32. The part and the part to which the conductive resin paste P is not applied can be easily formed. As a result, it is possible to easily obtain the multilayer capacitor C1 with a low ESR while preventing the occurrence of cracks in the element body 1.

  In the present embodiment, when the resin electrode layer 14 is formed, the electrode contact portion 32 is elastically deformed so that the conductive resin paste P held on the bottom surface 36 a of the groove 36 is paired with the main surfaces of the baking electrode layer 12. 2 and 3 and a part formed in a pair of side surfaces 6 and 7 are provided so that the whole part may be covered. Accordingly, the resin electrode layer 14 is formed so as to cover the entire portion formed on the pair of main surfaces 2 and 3 and the pair of side surfaces 6 and 7 in the baked electrode layer 12. The stress acting on is further relaxed.

  In the present embodiment, when the resin electrode layer 14 is formed, the groove 36 (bottom surface) is formed so as to surround the entire circumference of the upper surface 32a of the electrode contact portion 32 when viewed from the direction orthogonal to the upper surface 32a of the electrode contact portion 32. The paste holding member 30 in which 36a) is located is used. Thereby, the resin electrode layer 14 can be reliably formed on the pair of main surfaces 2 and 3 and the pair of side surfaces 6 and 7.

  In the present embodiment, when the resin electrode layer 14 is formed, the paste holding member 30 in which the upper surface 32a of the electrode contact portion 32 is narrower than the area of the end surfaces 4 and 5 of the element body 1 is used, and the entire upper surface 32a is the end surface. The baked electrode layer 12 is brought into contact with the upper surface 32a so as to be included in the inner side of 4 and 5. As a result, the conductive resin paste P is also applied to the edge portions of the end faces 4, 5, and the resin electrode layer extends from the pair of main faces 2, 3 and the pair of side faces 6, 7 to the end faces 4, 5. 14 will be formed. As a result, the connection strength between the resin electrode layer 14 and the baked electrode layer 12 is improved, and peeling of the resin electrode layer 14 can be prevented.

  In the present embodiment, the paste holding member 30 including the side wall portion 34 that is positioned so as to surround the entire circumference of the upper surface 32a of the electrode contact portion 32 and has the same height as the height from the bottom surface 36a of the groove 36 to the upper surface 32a. Used. Thereby, even when the conductive resin paste P adheres to the upper surface 32a, the attached conductive resin paste P can be easily removed by the blade B.

  Next, a modification of the paste holding member 30 used when forming the resin electrode layer 14 will be described with reference to FIGS. 10 to 13 are schematic views for explaining modifications of the manufacturing process of the multilayer capacitor in accordance with this embodiment. 11 and 13 show a state where the conductive resin paste P is applied to the baked electrode layer 12 formed on the end face 5 side.

  In the modification shown in FIG. 10, the paste holding member 30 further includes a groove 38 continuous with the groove 36 so as to divide the electrode contact portion 32 into a plurality (in this modification, “2”). Is formed. 10A shows a perspective view of the paste holding member, and FIG. 10B shows a cross-sectional view of the paste holding member. When the paste holding member 30 shown in FIG. 10 is used, the conductive resin paste P has a pair of central portions formed on the end surfaces 4 and 5 of the baked electrode layer 12 as shown in FIG. It is also given to a region extending so as to cross the opposing directions of the main surfaces 2 and 3. In this case, the contact area between the resin electrode layer 14 and the baked electrode layer 12 is large, and the connection strength between the resin electrode layer 14 and the baked electrode layer 12 is further improved.

  In the modification shown in FIG. 12, the paste holding member 30 is formed with a plurality of grooves 36 (in this modification, “4”). 12A shows a perspective view of the paste holding member, and FIG. 12B shows a cross-sectional view of the paste holding member. When the paste holding member 30 shown in FIG. 12 is used, as shown in FIG. 12, the conductive resin paste P includes portions formed at the corners of the end faces 4 and 5 of the baking electrode layer 12 and the baking electrode. The layer 12 is applied to a region excluding a portion formed at the ridge between the main surfaces 2 and 3 and the side surfaces 6 and 7. In this case, the area of the resin electrode layer 14 is reduced, and the contact area between the baked electrode layer 12 and the plating electrode layer 16 is increased, so that ESR can be further reduced.

  The preferred embodiments of the present invention have been described above. However, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

  In the present embodiment, the conductive resin paste P is applied so as to cover the entire portion formed on the pair of main surfaces 2 and 3 and the pair of side surfaces 6 and 7 in the baking electrode layer 12. Not limited. The conductive resin paste P may be applied so that a part of the portions formed on the pair of main surfaces 2 and 3 and the pair of side surfaces 6 and 7 in the baking electrode layer 12 is covered. Moreover, you may provide the conductive resin paste P so that only the part currently formed in the main surface 2 or the main surface 3 which functions as a mounting surface may be covered.

  In the paste holding member 30, the area of the upper surface 32 a of the electrode contact portion 32 may be set larger or the same as the area of the end faces 4 and 5 of the element body 1. However, as described above, in order to prevent the resin electrode layer 14 from peeling off, it is preferable that the upper surface 32 a of the electrode contact portion 32 is set to be narrower than the area of the end surfaces 4 and 5 of the element body 1.

  When filling the groove 36 with the conductive resin paste P, the conductive resin paste P may be filled such that the surface of the conductive resin paste P is positioned lower than the upper surface 32a of the electrode contact portion 32. In this case, since the surface of the conductive resin paste P is lower than the upper surface 32 a of the electrode contact portion 32, the electrode contact portion 32 is greatly elastically deformed to apply the conductive resin paste P onto the baked electrode layer 12. There is a need.

  In the paste holding member 30, the side wall portion 34 may be higher or lower than the electrode contact portion 32. However, as described above, in order to easily remove the conductive resin paste P attached to the upper surface 32a of the electrode contact portion 32, it is preferable that the side wall portion 34 and the electrode contact portion 32 have the same height. .

  In this embodiment, the multilayer capacitor and the manufacturing method thereof have been described as an example of the electronic component. However, the electronic component is not particularly limited as long as it is an electronic component having an element body. For example, the multilayer varistor, the multilayer actuator, or the multilayer It can also be applied to inductors.

DESCRIPTION OF SYMBOLS 1 ... Element body, 2, 3 ... Main surface, 4, 5 ... End surface, 6, 7 ... Side surface, 10 ... External electrode, 12 ... Baking electrode layer, 14 ... Resin electrode layer, 16 ... Plating electrode layer, 30 ... Paste Holding member, 32... Electrode contact portion, 32a... Upper surface, 34... Side wall portion, 34a.

Claims (2)

A method of manufacturing an electronic component in which an external electrode composed of a baked electrode layer, a resin electrode layer, and a plating electrode layer is formed,
Preparing an element body in which the baked electrode layer is formed from an end surface to a mounting surface adjacent to the end surface;
A paste made of an elastic material, having a paste holding surface for holding the paste, and an electrode contact surface that is higher or at the same position as the paste held on the paste holding surface and is in contact with the baked electrode layer Using a holding member, applying a conductive resin paste containing a conductive material and a resin material to the baked electrode layer to form the resin electrode layer;
A step of plating the element body on which the baked electrode layer and the resin electrode layer are formed to form the plated electrode layer, and
In the step of forming the resin electrode layer,
As the paste holding member, the first groove located so as to surround the entire circumference of the electrode contact surface as viewed from the direction orthogonal to the electrode contact surface and the electrode contact surface are divided into a plurality of parts. A second groove continuous with the first groove is formed, and a bottom surface of the first groove and a bottom surface of the second groove function as the paste holding surface, and the electrode contact surface Using a paste holding member whose area is narrower than the area of the end face of the element body,
Hold the conductive resin paste on the paste holding surface,
In a state in which the end surface of the element body and the electrode contact surface are opposed to each other and the electrode contact surface is in contact with the electrode contact surface so that the entire electrode contact surface is included inside the end surface. The mounting surface of the baking electrode layer is formed by pressing the element body and elastically deforming the paste holding member to hold the conductive resin paste held by the paste holding surface on which the bottom surface of the first groove functions. The conductive resin paste held on the paste holding surface, on which the bottom surface of the second groove functions, is applied so that the entire portion formed in the cover is covered . A method of manufacturing an electronic component, characterized by being applied to a portion formed on the end face . In the step of forming the resin electrode layer, the paste holding member is positioned so as to surround the entire circumference of the paste holding surface and has the same height as the height from the paste holding surface to the electrode contact surface. The method for manufacturing an electronic component according to claim 1 , wherein a paste holding member including a side wall portion is used.

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