JP2580045Y2 - External electrode forming jig for electronic components - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for forming a strip-shaped electrode over an end surface of an electronic component and a surface connected thereto.

[0002]

2. Description of the Related Art A method for forming a band-shaped electrode continuously from one surface of an electronic component body to a surface connected thereto is as follows. (1) Conductive paste is applied to a plurality of grooves formed in an elastic flat plate. A method of filling and pressing the end face of the electronic component body against the flat plate (JP-A-2-33908), or (2) a method of forming a slit plate having a slit having a width corresponding to the width of an electrode to be formed. There is known a method in which the paste is placed on a conductive paste bath, the liquid level of the paste bath is raised, and the paste is applied to an end surface of an electronic component body (Japanese Patent Application Laid-Open No. 2-256225).

An outline of the above (1), which is relatively easy to operate, is as follows.

As shown in the perspective view of FIG. 6, a flat plate having a plurality of parallel grooves and having elasticity is prepared, and the width and pitch of these grooves are determined by the external electrodes to be formed on the end face of the electronic component body 1. It corresponds to the width of the terminals and the arrangement interval. The groove of the flat plate is filled with the conductive paste 4 by squeezing, the relative position between the end face of the element body and the groove is adjusted, and the groove is pressed against the end face. A predetermined external electrode is formed by pushing the conductive paste in such a way that the conductive paste wraps around to a surface (side surface) continuous with the electronic component body 1 and then pulls up the electronic component body 1.

The above (2) will be briefly described below with reference to a perspective view of FIG. 7 and a longitudinal sectional view of FIG.

An apparatus used in this method includes a slit plate 5 having slit-like through holes formed at predetermined widths and intervals according to the number and positions of electrodes formed on the electronic component body 1.
It has a container 7 in which a conductive paste is stored and a pressing means 8 provided on the side surface of the container. When the liquid level of the conductive paste of the pressing means 8 is depressed, a part of the conductive paste penetrates. It is extruded from the hole.

After holding the electronic component body 1 with a holder or the like,
It is placed on the slit plate 5 so as to straddle the slit-shaped through-hole, and the liquid level of the conductive paste is raised by the pressing means 8,
When a predetermined height is formed on the slit plate, as shown in FIG. 7, the conductive paste is applied over the end surface of the element body and the surface connected thereto.

Next, after returning the conductive paste on the slit plate 5 to the inside of the container, the element body is removed, and a further baking process is performed. A strip electrode is formed.

[0009]

However, in the above method (1), when the conductive paste is filled into the groove formed on the main surface of the flat plate and the end face of the electronic component body is pressed, first, the elasticity is increased. Is pressed at the end face and dented, the conductive paste filled in the groove of that part contacts the end face,
Excess conductive paste moves to both ends along the groove, and may overflow from the groove at the edge portion of the element body, and as a result, a wide external electrode is formed. This phenomenon is that the width of the conductor on the side surface fluctuates due to the degree of pressing of the element body, which is inconvenient in appearance.

In the above method (2), since the electrode is formed by the conductive paste rising from the through-hole, a portion of the conductive paste that flows around is affected by the viscosity of the conductive paste, and a stable shape is obtained. There was a problem that the product failure rate increased because there was no product.

As described above, in the above methods (1) and (2), the inventors of the present invention have proposed a solution to the problem that the application of the conductive paste is unstable in a portion which goes around from the end face of the electronic component. Filed an application for a utility model registration which improved the method of the above publication.

The method is as follows. That is,
As shown in FIG. 9, electronic components are provided with slit-shaped through holes 3 formed in parallel with each other with a predetermined width and a predetermined interval according to the number and position of electrodes to be formed, and orthogonal to these through holes. A grooved plate 4 having a through hole provided with a groove having a predetermined width or length capable of holding the element body is used as a coating jig.

[0013] In the coating method, the grooved plate is placed on a conductive paste bath, and the portion of the through-hole defined by the end face of the body to be sandwiched and the wall of the through-hole is raised by the conductive paste.
A conductive paste is applied to the end surface of the element and a surface connected thereto.

Although this method solves the problems of the above-mentioned conventional methods (1) and (2), the mechanism for inserting the conductive paste into the groove is complicated, a special machine is required, and the electronic device is required. There has been a problem that another grooved plate must be prepared when the external dimensions, particularly the thickness, of the component body change.

Therefore, an object of the present invention is to uniformly apply a conductive paste to a surface connected to an end face of an electronic component element without depending on the viscosity of the conductive paste, and to supply the conductive paste easily. Accordingly, it is an object of the present invention to provide an external electrode forming jig that can cope with a case where the dimensions of the element body vary.

[0016]

Means for Solving the Problems As a result of research to achieve the above object, the present inventors have found that an elastic plate-shaped body serving as a main body of a jig has a bottom portion corresponding to the thickness of an electronic component body. By providing a concave first groove having a continuously expanding inclined surface formed at the bottom and a plurality of parallel second grooves for filling the conductive paste so as to intersect the concave first groove. In addition, the present inventors have found that the shape applied to the wraparound portion is stable, and that the conductive paste can be easily inserted by ordinary squeezing, and a jig that solves the above-described problem can be obtained, and has reached the present invention.

Accordingly, the present invention provides a jig for forming an external electrode of an electronic component which is used to form an external electrode terminal by applying and baking a conductive paste so as to extend from one surface to an adjacent surface of the electronic component body. And (a) a bottom portion corresponding to the thickness or width of the electronic component and an expanding inclined surface continuously formed on the bottom portion, or the bottom portion is provided on the main surface of the elastic plate-shaped body. The first groove having only the inclined surface that is widened without having, and (b) the first groove intersects at a right angle and is deeper than the first groove, and the number and the position of the electrode to be formed are different. An object of the present invention is to provide a jig for forming an external electrode of an electronic component, wherein a plurality of parallel second grooves each having a predetermined width and a predetermined interval are formed.

[0018]

With the jig of the present invention, the electronic component body is placed at a predetermined position of the first groove so as to straddle the second groove filled with the conductive paste, and the electronic component is pressed when the body is pressed. In the conductive paste moved from the end face of the body, the conductive paste moves along the second groove because both sides of the first groove are gently raised at portions deviating from the side faces of the body. However, there is little overflow from the groove, so that the electrode width does not increase.

Further, since both sides of the first groove are inclined as described above, a mechanism for inserting the conductive paste into the second groove is simple, and a printing machine used for ordinary screen printing is used. Can be used.

That is, as shown in FIG. 3, a squeegee provided with a buffer placed on the main surface of the plate-like body is moved along the first groove in the direction of the arrow, so that the conductive material is transferred to the second groove. The paste is easily filled.

[0021]

FIG. 1 is a perspective view of a jig having two types of grooves which can be used in this embodiment, FIG. 2 is a perspective view of a jig provided with a plurality of jig units of FIG. 1, and FIG. 3 is a squeegee. FIG. 4 is a side view showing a state in which the second groove is filled with a conductive paste by using FIG.
(A) and (b) are cross-sectional views showing the relationship between the element and the conductive paste when the element is placed in the first groove, and FIG. 5 shows another embodiment of the present invention. FIG. 6 is a perspective view of a jig provided with a plurality of units shown in FIG. 5, and will be described below with reference to these drawings. (1) A plate having two types of grooves (a first groove 12 and a second groove 13) having a shape as shown in FIG. 1, for example, a second groove 13 of a plate 9 as shown in FIG. Then, a conductive paste is filled by squeezing in the manner shown in FIG. (2) Then, as shown in FIGS. 4A and 4B, the first
The electronic component body 1 placed at a predetermined position of the groove 12 is pressed down to bring its end face into contact with the conductive paste filled in the second groove 13, and further pressing is applied to the end face of the body and a surface connected thereto. A conductive paste was applied. (3) As described above, the element having the conductive paste applied to the end face and the face connected to the end face is baked at a predetermined temperature to form an external electrode terminal.

When the jig shown in FIG. 5 or FIG. 6 is used instead of the jig shown in FIG. 1 or FIG. This is convenient because electrodes of electronic components having different dimensions can be formed.

[0023]

As described above, according to the jig of the present invention, the mechanism for inserting the conductive paste into the second groove is simple, so that the equipment cost can be reduced and the coated electrode can be used. Since the shape of the wraparound portion is stabilized, the yield in the external electrode coating step is increased. Further, if the jig shown in FIG. 5 is used, there is a convenience that it can be used for many kinds of element bodies.

[Brief description of the drawings]

FIG. 1 is a perspective view of a jig having two types of grooves that can be used in an embodiment of the present invention.

FIG. 2 is a perspective view of a jig provided with a plurality of jig units of FIG.

FIG. 3 shows a second embodiment of the jig of the present invention using a squeegee.
FIG. 5 is a side view showing a state in which a conductive paste is filled in the groove of FIG.

FIG. 4A is a cross-sectional view showing the electronic component element placed in a first groove, and FIG. 4B is a cross-sectional view showing a state in which the element element is pressed.

FIG. 5 is a perspective view of a jig showing another embodiment of the present invention.

FIG. 6 is a perspective view of a jig provided with a plurality of jig units of FIG.

FIG. 7 is a perspective view of a conventional jig provided with a plurality of grooves for filling a conductive paste in a plate having elasticity.

FIG. 8 is a perspective view for explaining a conventional method in which an electronic component element body is placed on a slit plate and a strip-shaped electrode is formed by increasing the liquid level of a conductive paste.

9 is a longitudinal sectional view showing the slit plate and the electronic component body of FIG. 8 set on a container storing a conductive paste.

FIG. 10 is a perspective view of a jig used in a method proposed as an improvement of the conventional method.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electronic component body 2 conductive paste 3 through hole or groove 4 grooved plate having through hole 5 slit plate 6 contact surface 7 container 8 pressurizing means 9 plate 10 buffer part 11 squeegee 12 first groove 13 second Groove

Claims (1)

(57) [Scope of request for utility model registration] An external electrode forming jig for an electronic component used to form an external electrode terminal by applying and baking a conductive paste so as to wrap around from one surface of an electronic component body to an adjacent surface, On the main surface of the elastic plate,
(A) A first groove having a bottom portion corresponding to the thickness or width of the electronic component and a sloping surface that is continuously formed at the bottom portion or a sloping surface that does not have the bottom portion and has only a splaying surface that widens. And (b) a plurality of parallel grooves intersecting at right angles to the first groove, being deeper than the first groove, and having predetermined widths and intervals according to the number and positions of the electrodes to be formed. An external electrode forming jig for an electronic component, wherein the second groove is formed.