JP3312235B2 - Beryllium copper alloy spring material and its manufacturing method - Google Patents
Beryllium copper alloy spring material and its manufacturing methodInfo
- Publication number
- JP3312235B2 JP3312235B2 JP27091995A JP27091995A JP3312235B2 JP 3312235 B2 JP3312235 B2 JP 3312235B2 JP 27091995 A JP27091995 A JP 27091995A JP 27091995 A JP27091995 A JP 27091995A JP 3312235 B2 JP3312235 B2 JP 3312235B2
- Authority
- JP
- Japan
- Prior art keywords
- beryllium
- copper alloy
- spring material
- alloy spring
- beryllium copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、ベリリウム銅合
金ばね材およびその製造方法に関し、さらに詳しくは、
半田付け性を改善することにより良好な耐久性とばね特
性を得られるようにしたベリリウム銅合金ばね材および
その製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a beryllium copper alloy spring material and a method for manufacturing the same.
The present invention relates to a beryllium copper alloy spring material capable of obtaining good durability and spring characteristics by improving solderability, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】図１２は、従来のベリリウム銅合金ばね
材の製造方法の一例を示すフローチャートである。ステ
ップＢ１では、図１３に示す直径が例えば２００μｍで
ベリリウムの平均含有率が９．５〜１３．５at％のベリ
リウム銅合金線１１’に対して引抜き加工を施し、図１
４に示すように直径が例えば１００μｍの線状のベリリ
ウム銅合金ばね材１１ａを得る。あるいは、図１３に示
すベリリウム銅合金線１１’に対して圧延加工を施し、
図１５に示すように厚さが例えば７０μｍで幅が例えば
１０５μｍの箔状のベリリウム銅合金ばね材１１ｂを得
る。ステップＢ２では、ベリリウム銅合金ばね材１１ａ
または１１ｂに対して例えば３５０℃で６０秒の析出硬
化処理を施す。得られたベリリウム銅合金ばね材１１ａ
または１１ｂは、銅合金ばね材の中では最もばね特性が
優れており且つ小型設計が可能であるため、電子部品の
ばね材として広く使われている。2. Description of the Related Art FIG. 12 is a flowchart showing an example of a conventional method for manufacturing a beryllium copper alloy spring material. In step B1, a beryllium copper alloy wire 11 ′ having a diameter of, for example, 200 μm and an average beryllium content of 9.5 to 13.5 at% shown in FIG.
As shown in FIG. 4, a linear beryllium copper alloy spring material 11a having a diameter of, for example, 100 μm is obtained. Alternatively, the beryllium copper alloy wire 11 ′ shown in FIG.
As shown in FIG. 15, a beryllium copper alloy spring material 11b having a thickness of, for example, 70 μm and a width of, for example, 105 μm is obtained. In step B2, beryllium copper alloy spring material 11a
Alternatively, a precipitation hardening treatment is performed on 11b at, for example, 350 ° C. for 60 seconds. The obtained beryllium copper alloy spring material 11a
Or, 11b is widely used as a spring material for electronic components because it has the most excellent spring characteristics among copper alloy spring materials and can be designed in a small size.
【０００３】[0003]
【発明が解決しようとする課題】上記従来のベリリウム
銅合金ばね材１１ａまたは１１ｂは、表面に酸化ベリリ
ウムの薄皮膜を有するため、難半田付け性である。この
ため、強力なフラックスを用いるか又は高温度で半田付
けを行っている。しかし、強力なフラックスを用いた
り，高温度で半田付けすると、ベリリウム銅合金ばね材
が腐食したり，ばね特性を劣化させたりする問題点があ
る。特に、線径または箔厚を０．２ｍｍ以下とすると、
この問題点が顕著となり、十分な耐久性やばね特性が得
られなくなる問題点がある。そこで、この発明の目的
は、強力なフラックスを用いたり，高温度で半田付けを
行ったりする必要がないように半田付け性を改善し、こ
れにより良好な耐久性とばね特性とを得られるようにし
たベリリウム銅合金ばね材およびその製造方法を提供す
ることにある。The conventional beryllium-copper alloy spring material 11a or 11b has a thin film of beryllium oxide on its surface, so that it is difficult to solder. For this reason, a strong flux is used or soldering is performed at a high temperature. However, if a strong flux is used or soldering is performed at a high temperature, there is a problem that the beryllium copper alloy spring material is corroded or the spring characteristics are deteriorated. In particular, if the wire diameter or foil thickness is 0.2 mm or less,
This problem becomes remarkable, and there is a problem that sufficient durability and spring characteristics cannot be obtained. Accordingly, an object of the present invention is to improve the solderability so that it is not necessary to use a strong flux or to perform soldering at a high temperature, thereby obtaining good durability and spring characteristics. And a method of manufacturing the same.
【０００４】[0004]
【課題を解決するための手段】第１の観点では、この発
明は、ベリリウムの平均含有率が９．５〜１３．５at％
であるベリリウム銅合金材の外周面にベリリウムの濃度
が０．０５〜３．０at％であるベリリウム原子希薄銅層
を形成し、そのベリリウム原子希薄銅層の外周面に錫膜
または半田膜を設けたことを特徴とするベリリウム銅合
金ばね材を提供する。上記第１の観点によるベリリウム
銅合金ばね材では、難半田付け性であるベリリウム銅合
金材の外周面にベリリウム原子希薄銅層を形成するが、
このベリリウム原子希薄銅層では酸化ベリリウムによる
難半田付け性は抑制され、銅による良好な半田付け性が
現れる。そして、このように半田付け性を改善したベリ
リウム原子希薄銅層の外周面に錫膜または半田膜を設け
ると、さらに半田付け性を良くすることが出来る。この
結果、強力なフラックスを用いたり，高温度で半田付け
を行ったりする必要がなくなり、線径または箔厚を０．
２ｍｍ以下とした場合でも良好な耐久性とばね特性とを
得られるようになる。なお、ベリリウムの濃度を０．０
５at％より小さくすると、銅の性質が強く現れ過ぎ、ば
ね特性が低下する。また、ベリリウムの濃度を３．０at
％より大きくすると、酸化ベリリウムの性質が強く現れ
過ぎ、半田付け性が低下する。According to a first aspect of the present invention, an average beryllium content is 9.5 to 13.5 at%.
A beryllium atomically diluted copper layer having a beryllium concentration of 0.05 to 3.0 at% is formed on the outer peripheral surface of the beryllium copper alloy material, and a tin film or a solder film is provided on the outer peripheral surface of the beryllium atomically diluted copper layer. A beryllium copper alloy spring material is provided. In the beryllium copper alloy spring material according to the first aspect, a beryllium atom-diluted copper layer is formed on the outer peripheral surface of the beryllium copper alloy material that is difficult to solder.
In this beryllium atomically diluted copper layer, poor solderability due to beryllium oxide is suppressed, and good solderability due to copper appears. When a tin film or a solder film is provided on the outer peripheral surface of the beryllium atom diluted copper layer having improved solderability as described above, the solderability can be further improved. As a result, it is not necessary to use a strong flux or to perform soldering at a high temperature.
Even when the thickness is 2 mm or less, good durability and spring characteristics can be obtained. In addition, the concentration of beryllium was 0.0
If it is less than 5 at%, the properties of copper appear too strongly, and the spring characteristics deteriorate. In addition, the concentration of beryllium was 3.0 at.
%, The properties of beryllium oxide appear too strongly, and the solderability deteriorates.
【０００５】第２の観点では、この発明は、ベリリウム
の平均含有率が９．５〜１３．５at％であるベリリウム
銅合金材の外周面にベリリウムの濃度が０．０５〜３．
０at％であるベリリウム原子希薄銅層を形成したことを
特徴とするベリリウム銅合金ばね材を提供する。上記第
２の観点によるベリリウム銅合金ばね材では、難半田付
け性であるベリリウム銅合金材の外周面にベリリウム原
子希薄銅層を形成するが、このベリリウム原子希薄銅層
では酸化ベリリウムによる難半田付け性は抑制され、銅
による良好な半田付け性が現れる。この結果、強力なフ
ラックスを用いたり，高温度で半田付けを行ったりする
必要がなくなり、線径または箔厚を０．２ｍｍ以下とし
た場合でも良好な耐久性とばね特性とを得られるように
なる。なお、ベリリウムの濃度を０．０５at％より小さ
くすると、銅の性質が強く現れ過ぎ、ばね特性が低下す
る。また、ベリリウムの濃度を３．０at％より大きくす
ると、酸化ベリリウムの性質が強く現れ過ぎ、半田付け
性が低下する。According to a second aspect, the present invention provides a beryllium copper alloy material having an average beryllium content of 9.5 to 13.5 at%, wherein the beryllium concentration is 0.05 to 3.
A beryllium-copper alloy spring material characterized by forming a beryllium atom-diluted copper layer of 0 at%. In the second aspect according to the beryllium copper alloy spring member, forms a beryllium atom dilute copper layer on the outer peripheral surface of the beryllium copper alloy material is hardly solderability, flame soldering with beryllium oxide in this beryllium atom dilute copper layer Performance is suppressed, and good solderability with copper appears. As a result, there is no need to use a strong flux or to perform soldering at a high temperature, so that good durability and spring characteristics can be obtained even when the wire diameter or the foil thickness is 0.2 mm or less. Become. If the concentration of beryllium is smaller than 0.05 at%, the properties of copper appear too strongly, and the spring characteristics deteriorate. On the other hand, when the concentration of beryllium is higher than 3.0 at%, the properties of beryllium oxide appear too strongly, and the solderability deteriorates.
【０００６】第３の観点では、この発明は、ベリリウム
の平均含有率が９．５〜１３．５at％のベリリウム銅合
金線の外周面に電着銅薄膜を形成し、次に引抜き加工ま
たは圧延加工を施して線径または箔厚を０．２ｍｍ以下
とすると共に前記電着銅薄膜の代りにベリリウムの濃度
が０．０５〜３．０at％であるベリリウム原子希薄銅層
を形成し、次に溶融めっきにより厚さ０．５μｍ以下の
錫膜または半田膜を形成することを特徴とするベリリウ
ム銅合金ばね材の製造方法を提供する。上記第３の観点
によるベリリウム銅合金ばね材の製造方法では、ベリリ
ウム銅合金線の外周面上に電着銅薄膜を形成した後、引
抜き加工または圧延加工を施して線径または箔厚を０．
２ｍｍ以下とするが、この引抜き加工または圧延加工に
より、ベリリウム銅合金と薄膜状電着銅とが相互拡散
し、前記電着銅薄膜の代りにベリリウムの濃度が０．０
５〜３．０at％であるベリリウム原子希薄銅層が形成さ
れる。このベリリウム原子希薄銅層では酸化ベリリウム
による難半田付け性が抑制され、銅による良好な半田付
け性が現れる。そして、このように半田付け性を改善し
たベリリウム原子希薄銅層の外周面に錫膜または半田膜
を設けると、さらに半田付け性を良くすることが出来
る。この結果、強力なフラックスを用いたり，高温度で
半田付けを行ったりする必要がなくなり、線径または箔
厚を０．２ｍｍ以下とした場合でも良好な耐久性とばね
特性とを得られるようになる。なお、錫膜または半田膜
の厚さを０．５μｍより厚くすると、錫または半田の性
質が強く現れ過ぎ、ばね特性が低下する。In a third aspect, the present invention provides a method for forming an electrodeposited copper thin film on the outer peripheral surface of a beryllium copper alloy wire having an average beryllium content of 9.5 to 13.5 at%, followed by drawing or rolling. A beryllium atom-diluted copper layer having a wire diameter or foil thickness of 0.2 mm or less and a beryllium concentration of 0.05 to 3.0 at% instead of the electrodeposited copper thin film is formed, A method for producing a beryllium copper alloy spring material, characterized in that a tin film or a solder film having a thickness of 0.5 μm or less is formed by hot-dip plating. In the method for producing a beryllium copper alloy spring material according to the third aspect, an electrodeposited copper thin film is formed on the outer peripheral surface of the beryllium copper alloy wire, and then subjected to drawing or rolling to reduce the wire diameter or the foil thickness to 0.1 mm.
By this drawing or rolling, the beryllium copper alloy and the thin-film electrodeposited copper interdiffuse, and the concentration of beryllium becomes 0.02 instead of the electrodeposited copper thin film.
A beryllium atomically diluted copper layer of 5 to 3.0 at% is formed. In this beryllium atomically diluted copper layer, the poor solderability due to beryllium oxide is suppressed, and good solderability due to copper appears. When a tin film or a solder film is provided on the outer peripheral surface of the beryllium atom diluted copper layer having improved solderability as described above, the solderability can be further improved. As a result, it is no longer necessary to use a strong flux or to perform soldering at a high temperature, so that good durability and spring characteristics can be obtained even when the wire diameter or the foil thickness is 0.2 mm or less. Become. If the thickness of the tin film or the solder film is larger than 0.5 μm, the properties of the tin or the solder appear too strongly, and the spring characteristics deteriorate.
【０００７】第４の観点では、この発明は、ベリリウム
の平均含有率が９．５〜１３．５at％のベリリウム銅合
金線の外周面に電着銅薄膜を形成し、次に引抜き加工ま
たは圧延加工を施して線径または箔厚を０．２ｍｍ以下
とすると共に前記電着銅薄膜の代りにベリリウム濃度が
０．０５〜３．０at％であるベリリウム原子希薄銅層を
形成することを特徴とするベリリウム銅合金ばね材の製
造方法を提供する。上記第４の観点によるベリリウム銅
合金ばね材の製造方法では、ベリリウム銅合金線の外周
面上に電着銅薄膜を形成した後、引抜き加工または圧延
加工を施して線径または箔厚を０．２ｍｍ以下とする
が、この引抜き加工または圧延加工により、ベリリウム
銅合金と薄膜状電着銅とが相互拡散し、前記電着銅薄膜
の代りにベリリウム濃度が０．０５〜３．０at％である
ベリリウム原子希薄銅層が形成される。このベリリウム
原子希薄銅層では酸化ベリリウムによる難半田付け性が
抑制され、銅による良好な半田付け性が現れる。この結
果、強力なフラックスを用いたり，高温度で半田付けを
行ったりする必要がなくなり、線径または箔厚を０．２
ｍｍ以下とした場合でも良好な耐久性とばね特性とを得
られるようになる。According to a fourth aspect, the present invention provides a method for forming an electrodeposited copper thin film on the outer peripheral surface of a beryllium copper alloy wire having an average beryllium content of 9.5 to 13.5 at%, followed by drawing or rolling. Forming a beryllium atomically diluted copper layer having a wire diameter or foil thickness of 0.2 mm or less and a beryllium concentration of 0.05 to 3.0 at% in place of the electrodeposited copper thin film. The present invention provides a method for producing a beryllium copper alloy spring material. In the method of manufacturing a beryllium copper alloy spring material according to the fourth aspect, after forming an electrodeposited copper thin film on the outer peripheral surface of the beryllium copper alloy wire, the wire diameter or the foil thickness is reduced to 0. The drawing or rolling process causes the beryllium copper alloy and the thin-film electrodeposited copper to interdiffuse, and the beryllium concentration is 0.05 to 3.0 at% instead of the electrodeposited copper thin film. A beryllium atomically diluted copper layer is formed. In this beryllium atomically diluted copper layer, the poor solderability due to beryllium oxide is suppressed, and good solderability due to copper appears. As a result, it is not necessary to use a strong flux or to perform soldering at a high temperature.
Even if it is less than mm, good durability and spring characteristics can be obtained.
【０００８】[0008]
【発明の実施の形態】以下、図に示すこの発明の実施形
態に基づいてこの発明をさらに詳しく説明する。なお、
これによりこの発明が限定されるものではない。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail based on embodiments of the present invention shown in the drawings. In addition,
This does not limit the present invention.
【０００９】−第１の実施形態− 図１は、この発明の第１の実施形態にかかるベリリウム
銅合金ばね材の製造方法のフローチャートである。ステ
ップＶ１では、図２に示すように、ベリリウムの平均含
有率が９．５〜１３．５at％のベリリウム銅合金線１
１’の外周面に電着銅薄膜１２を形成し、被加工材１０
とする。ステップＶ２では、被加工材１０に対して引抜
き加工を施し、図３に示すような線状のベリリウム銅合
金ばね材２０を得る。ステップＶ３では、前記ベリリウ
ム銅合金ばね材２０に対して析出硬化処理を施し、ばね
特性を向上させる。ステップＶ４では、図４に示すよう
に、前記ベリリウム銅合金ばね材２０の外周面に厚さ
０．２μｍの錫膜または半田膜１４を溶融めっきにより
形成し、線状のベリリウム銅合金ばね材２１を得る。な
お、このステップＶ４は必須の工程ではない。First Embodiment FIG. 1 is a flowchart of a method for manufacturing a beryllium copper alloy spring material according to a first embodiment of the present invention. In step V1, as shown in FIG. 2, beryllium copper alloy wire 1 having an average beryllium content of 9.5 to 13.5 at% was used.
An electrodeposited copper thin film 12 is formed on the outer peripheral surface of
And In step V2, the workpiece 10 is subjected to a drawing process to obtain a linear beryllium copper alloy spring material 20 as shown in FIG. In step V3, the beryllium copper alloy spring material 20 is subjected to a precipitation hardening treatment to improve spring characteristics. In step V4, as shown in FIG. 4, a tin film or solder film 14 having a thickness of 0.2 μm is formed on the outer peripheral surface of the beryllium copper alloy spring material 20 by hot-dip plating, and a linear beryllium copper alloy spring material 21 is formed. Get. This step V4 is not an essential step.
【００１０】[0010]
【実施例】直径が２００μｍでベリリウムの平均含有率
が１３．５at％のベリリウム銅合金線１１’を巻枠から
引き出し、非鉄系用ノーキレート型電解脱脂剤水溶液
（キザイ株式会社製マックスクリーンＢＧ−３２００の
２％水溶液）を満たした電解脱脂槽中に導きながら１Ｖ
の電圧を印加して、ベリリウム銅合金線１１’の外周面
に付着している油脂類を除去した。次に、そのベリリウ
ム銅合金線１１’を５％硫酸槽中に導いて中和させた
後、水洗した。次に、硫酸銅２００ｇ／Ｌを含む硫酸溶
液を満たした電気めっき槽中に１０ｍ／分の速度で走行
させながら１Ａの定電流によって厚さが１μｍの電着銅
薄膜１２を形成し、被加工材１０として巻枠に巻き取っ
た。次に、巻枠から被加工材１０を引き出し、３００ｍ
／分の速度で走行させながら連続伸線装置により７５％
の加工度を与えて、直径が１００μｍの線状のベリリウ
ム銅合金ばね材２０を得た。次に、ベリリウム銅合金ば
ね材２０に対して、３５０℃で６０秒の析出硬化処理を
施した。このベリリウム銅合金ばね材２０の表面のベリ
リウムの濃度をオージェ電子分光分析法（ＡＥＳ）によ
り測定したところ、２．４８at％であった。EXAMPLE A beryllium copper alloy wire 11 'having a diameter of 200 .mu.m and an average beryllium content of 13.5 at% was pulled out from a bobbin, and was used as a non-ferrous non-chelate electrolytic degreasing agent aqueous solution (MacScreen BG- 3V 2% aqueous solution) while introducing into an electrolytic degreasing tank filled with 1V
To remove the oils and fats attached to the outer peripheral surface of the beryllium copper alloy wire 11 '. Next, the beryllium copper alloy wire 11 ′ was introduced into a 5% sulfuric acid bath to neutralize it, and then washed with water. Next, an electrodeposited copper thin film 12 having a thickness of 1 μm is formed with a constant current of 1 A while running at a speed of 10 m / min in an electroplating bath filled with a sulfuric acid solution containing 200 g / L of copper sulfate. The material 10 was wound on a bobbin. Next, the workpiece 10 is pulled out from the bobbin, and 300 m
75% with a continuous wire drawing machine while running at a speed of
To obtain a linear beryllium copper alloy spring material 20 having a diameter of 100 μm. Next, the beryllium copper alloy spring material 20 was subjected to a precipitation hardening treatment at 350 ° C. for 60 seconds. The beryllium concentration on the surface of the beryllium copper alloy spring material 20 was measured by Auger electron spectroscopy (AES) and found to be 2.48 at%.
【００１１】また、電着銅薄膜１２の厚さを０．８μｍ
に変え、その他は上記と同様にして、ベリリウムの濃度
が３．０１at％のベリリウム銅合金ばね材２０を得た。
また、電着銅薄膜１２の厚さを１．２μｍに変え、その
他は上記と同様にして、ベリリウムの濃度が２．０５at
％のベリリウム銅合金ばね材２０を得た。また、ベリリ
ウムの濃度が２．４８at％のベリリウム銅合金ばね材２
０の外周面に溶融めっきにより厚さ０．２μｍの半田膜
１４を形成したベリリウム銅合金ばね材２１を得た。The thickness of the electrodeposited copper thin film 12 is 0.8 μm
In the same manner as described above, a beryllium copper alloy spring material 20 having a beryllium concentration of 3.01 at% was obtained.
Further, the thickness of the electrodeposited copper thin film 12 was changed to 1.2 μm, and the other conditions were the same as above, and the concentration of beryllium was 2.05 at.
% Beryllium copper alloy spring material 20 was obtained. In addition, beryllium copper alloy spring material 2 having a beryllium concentration of 2.48 at%
Thus, a beryllium copper alloy spring material 21 having a 0.2 μm thick solder film 14 formed on the outer peripheral surface by hot-dip plating was obtained.
【００１２】また、比較のため、従来例としてベリリウ
ムの平均含有率が１３．５at％である従来のベリリウム
銅合金ばね材（図１４に示す１１ａ）を用意した。ま
た、参考例としてリン青銅ばね材を用意した。As a conventional example, a conventional beryllium copper alloy spring material (11a shown in FIG. 14) having an average beryllium content of 13.5 at% was prepared for comparison. Further, a phosphor bronze spring material was prepared as a reference example.
【００１３】以上の各試料についてメニスコグラフ法に
より半田付け性試験を行った。試験条件は、半田浴組成
が６０％Ｓｎ−残Ｐｂ，浴温２６０℃，浸漬時間７秒，
フラックスはロジン３５％イソプロピルアルコール（is
opropyle alcohol）溶液を使用した。図５に試験結果を
示す。なお、試験結果は１０個のサンプルの平均値であ
る。図５から判るように、この発明のベリリウム銅合金
ばね材２０，２１の半田濡れ時間は、銅合金の中で半田
付け性が最も優れているリン青銅ばね材の半田濡れ時間
と同程度かそれよりも短くなっている。Each of the above samples was subjected to a solderability test by a meniscograph method. The test conditions were as follows: the solder bath composition was 60% Sn-residual Pb, the bath temperature was 260 ° C., the immersion time was 7 seconds,
The flux is rosin 35% isopropyl alcohol (is
opropyle alcohol) solution. FIG. 5 shows the test results. The test results are average values of 10 samples. As can be seen from FIG. 5, the solder wetting time of the beryllium copper alloy spring materials 20 and 21 of the present invention is about the same as the solder wetting time of the phosphor bronze spring material having the best solderability among the copper alloys. It is shorter than.
【００１４】また、上記各試料の機械的特性を測定し
た。その測定結果を図６に示す。なお、測定結果は１０
個のサンプルの平均値である。図６から判るように、こ
の発明のベリリウム銅合金ばね材２０，２１のヤング
率，引き張り強さ，伸びは、銅合金の中でもばね特性が
最も優れている従来のベリリウム銅合金ばね材（図１４
に示す１１ａ）と同程度である。Further, the mechanical properties of each of the above samples were measured. FIG. 6 shows the measurement results. The measurement result was 10
This is the average of the samples. As can be seen from FIG. 6, the Young's modulus, tensile strength and elongation of the beryllium copper alloy spring materials 20 and 21 of the present invention are the same as those of the conventional beryllium copper alloy spring material (FIG. 14
11a) shown in FIG.
【００１５】上記ベリリウム銅合金ばね材２０，２１に
よれば、強力なフラックスを用いたり，高温度で半田付
けを行ったりする必要がなくなり、線径を０．２ｍｍ以
下とした場合でも良好な耐久性とばね特性とを得られる
ようになる。According to the beryllium copper alloy spring materials 20 and 21, it is not necessary to use a strong flux or to perform soldering at a high temperature, and good durability can be obtained even when the wire diameter is 0.2 mm or less. Properties and spring characteristics can be obtained.
【００１６】−第２の実施形態− 図７は、この発明の第２の実施形態にかかるベリリウム
銅合金ばね材の製造方法のフローチャートである。ステ
ップＳ１では、図８に示すように、ベリリウムの平均含
有率が９．５〜１３．５at％のベリリウム銅合金線１
１’の外周面に電着銅薄膜１２を形成し、被加工材１０
とする。ステップＳ２では、被加工材１０に対して引抜
き加工を施し、図９に示すような線状の第２の被加工材
２０’を得る。ステップＳ３では、第２の被加工材２
０’に対して圧延加工を施し、図１０に示すような箔状
のベリリウム銅合金ばね材４０を得る。ステップＳ４で
は、前記ベリリウム銅合金ばね材４０に対して析出硬化
処理を施し、ばね特性を向上させる。ステップＳ５で
は、図１１に示すように、前記ベリリウム銅合金ばね材
４０の外周面に厚さ０．２μｍの錫膜または半田膜１４
を溶融めっきにより形成し、箔状のベリリウム銅合金ば
ね材４１を得る。なお、このステップＳ５は必須の工程
ではない。Second Embodiment FIG. 7 is a flowchart of a method for manufacturing a beryllium copper alloy spring material according to a second embodiment of the present invention. In step S1, as shown in FIG. 8, beryllium copper alloy wire 1 having an average beryllium content of 9.5 to 13.5 at% is used.
An electrodeposited copper thin film 12 is formed on the outer peripheral surface of
And In step S2, the workpiece 10 is subjected to a drawing process to obtain a linear second workpiece 20 'as shown in FIG. In step S3, the second workpiece 2
Rolling is performed on 0 ′ to obtain a beryllium copper alloy spring material 40 in a foil shape as shown in FIG. In step S4, the beryllium copper alloy spring material 40 is subjected to a precipitation hardening treatment to improve spring characteristics. In step S5, as shown in FIG. 11, a tin film or solder film 14 having a thickness of 0.2 μm is formed on the outer peripheral surface of the beryllium copper alloy spring material 40.
Is formed by hot-dip plating to obtain a beryllium copper alloy spring material 41 in the form of a foil. This step S5 is not an essential step.
【００１７】[0017]
【実施例】直径が１８０μｍでベリリウムの平均含有率
が１３．５at％のベリリウム銅合金線１１’を巻枠から
引き出し、非鉄系用ノーキレート型電解脱脂剤水溶液
（キザイ株式会社製マックスクリーンＢＧ−３２００の
２％水溶液）を満たした電解脱脂槽中に導きながら１Ｖ
の電圧を印加して、ベリリウム銅合金線１１’の外周面
に付着している油脂類を除去した。次に、そのベリリウ
ム銅合金線１１’を５％硫酸槽中に導いて中和させた
後、水洗した。次に、硫酸銅１００ｇ／Ｌを含む硫酸溶
液を満たした電気めっき槽中に１０ｍ／分の速度で走行
させながら０．９Ａの定電流によって厚さが１μｍの電
着銅薄膜１２を形成し、被加工材１０として巻枠に巻き
取った。次に、巻枠から被加工材１０を引き出し、３０
０ｍ／分の速度で走行させながら連続伸線装置により７
５％の加工度を与えて、直径が９２μｍの線状の第２の
被加工材２０’を得て巻枠に巻き取った。次に、巻枠か
ら第２の被加工材２０’を引き出し、２５ｍ／分の速度
で走行させながら４段圧延装置により厚さが７０μｍ，
幅が１０５μｍの箔状のベリリウム銅合金ばね材４０を
得た。次に、このベリリウム銅合金ばね材４０に対し
て、３５０℃で６０秒の析出硬化処理を施した。このベ
リリウム銅合金ばね材４０の表面のベリリウムの濃度を
オージェ電子分光分析法（ＡＥＳ）により測定したとこ
ろ、２．８５at％であった。EXAMPLE A beryllium copper alloy wire 11 'having a diameter of 180 .mu.m and an average beryllium content of 13.5 at% was pulled out from a bobbin, and an aqueous solution of a non-ferrous type non-ferrous type electrolytic degreasing agent (MacScreen BG- manufactured by Kizai Co., Ltd.) 3V 2% aqueous solution) while introducing into an electrolytic degreasing tank filled with 1V
To remove the oils and fats attached to the outer peripheral surface of the beryllium copper alloy wire 11 '. Next, the beryllium copper alloy wire 11 ′ was introduced into a 5% sulfuric acid bath to neutralize it, and then washed with water. Next, a 1 μm-thick electrodeposited copper thin film 12 was formed with a constant current of 0.9 A while running at a speed of 10 m / min in an electroplating bath filled with a sulfuric acid solution containing 100 g / L of copper sulfate, The workpiece 10 was wound on a bobbin. Next, the workpiece 10 is pulled out from the bobbin,
While running at a speed of 0 m / min, 7
By giving a workability of 5%, a linear second workpiece 20 ′ having a diameter of 92 μm was obtained and wound on a bobbin. Next, the second workpiece 20 ′ is pulled out from the bobbin, and is run at a speed of 25 m / min.
A beryllium copper alloy spring material 40 having a width of 105 μm was obtained. Next, the beryllium copper alloy spring material 40 was subjected to a precipitation hardening treatment at 350 ° C. for 60 seconds. The beryllium concentration on the surface of the beryllium copper alloy spring material 40 was measured by Auger electron spectroscopy (AES) and found to be 2.85 at%.
【００１８】上記ベリリウム銅合金ばね材４０，４１に
よれば、強力なフラックスを用いたり，高温度で半田付
けを行ったりする必要がなくなり、箔厚を０．２ｍｍ以
下とした場合でも良好な耐久性とばね特性とを得られる
ようになる。According to the beryllium copper alloy spring materials 40 and 41, it is not necessary to use a strong flux or to perform soldering at a high temperature, and good durability can be obtained even when the foil thickness is 0.2 mm or less. Properties and spring characteristics can be obtained.
【００１９】[0019]
【発明の効果】この発明のベリリウム銅合金ばね材およ
びその製造方法によれば、ベリリウムの平均含有率が
９．５〜１３．５at％であるベリリウム銅合金ばね材の
優れたばね特性を維持したままで半田付け性を改善でき
る。このため、強力なフラックスを用いたり，高温度で
半田付けを行ったりする必要がなくなり、腐食やばね特
性の劣化の問題がなくなる。従って、線径または箔厚を
０．２ｍｍ以下とした場合でも良好な耐久性とばね特性
とを得られるようになる。According to the beryllium copper alloy spring material and the method of manufacturing the same of the present invention, the beryllium copper alloy spring material having an average beryllium content of 9.5 to 13.5 at% maintains the excellent spring characteristics. Can improve the solderability. For this reason, it is not necessary to use a strong flux or to perform soldering at a high temperature, and problems such as corrosion and deterioration of spring characteristics are eliminated. Therefore, good durability and spring characteristics can be obtained even when the wire diameter or the foil thickness is 0.2 mm or less.
【図１】この発明の第１の実施形態にかかる線状のベリ
リウム銅合金ばね材の製造方法のフローチャートであ
る。FIG. 1 is a flowchart of a method for manufacturing a linear beryllium copper alloy spring material according to a first embodiment of the present invention.
【図２】被加工材の断面図である。FIG. 2 is a sectional view of a workpiece.
【図３】この発明による線状のベリリウム銅合金ばね材
の断面図である。FIG. 3 is a cross-sectional view of a linear beryllium copper alloy spring material according to the present invention.
【図４】この発明による別の線状のベリリウム銅合金ば
ね材の断面図である。FIG. 4 is a cross-sectional view of another linear beryllium copper alloy spring material according to the present invention.
【図５】この発明による線状のベリリウム銅合金ばね材
の半田付け性試験結果を示す図表である。FIG. 5 is a table showing the results of a solderability test of a linear beryllium copper alloy spring material according to the present invention.
【図６】この発明による線状のベリリウム銅合金ばね材
の機械的特性測定結果を示す図表である。FIG. 6 is a table showing measurement results of mechanical properties of a linear beryllium copper alloy spring material according to the present invention.
【図７】この発明の第２の実施形態にかかる箔状のベリ
リウム銅合金ばね材の製造方法のフローチャートであ
る。FIG. 7 is a flowchart of a method for manufacturing a foil-shaped beryllium copper alloy spring material according to the second embodiment of the present invention.
【図８】被加工材の断面図である。FIG. 8 is a sectional view of a workpiece.
【図９】第２の被加工材の断面図である。FIG. 9 is a sectional view of a second workpiece.
【図１０】この発明による箔状のベリリウム銅合金ばね
材の断面図である。FIG. 10 is a sectional view of a foil-shaped beryllium copper alloy spring material according to the present invention.
【図１１】この発明による別の箔状のベリリウム銅合金
ばね材の断面図である。FIG. 11 is a cross-sectional view of another foil-shaped beryllium copper alloy spring material according to the present invention.
【図１２】従来のベリリウム銅合金ばね材の製造方法の
一例のフローチャートである。FIG. 12 is a flowchart of an example of a conventional method for manufacturing a beryllium copper alloy spring material.
【図１３】被加工材の断面図である。FIG. 13 is a sectional view of a workpiece.
【図１４】従来の線状のベリリウム銅合金ばね材の断面
図である。FIG. 14 is a sectional view of a conventional linear beryllium copper alloy spring material.
【図１５】従来の箔状のベリリウム銅合金ばね材の断面
図である。FIG. 15 is a cross-sectional view of a conventional foil-shaped beryllium copper alloy spring material.
２０，２１，４０，４１ ベリリウム銅合金ば
ね材 １０ 被加工材 ２０’ 第２の被加工材 １３ ベリリウム原子希薄層 １４ 錫膜または半田膜20, 21, 40, 41 Beryllium copper alloy spring material 10 Work material 20 'Second work material 13 Beryllium atom diluted layer 14 Tin film or solder film
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) C22C 9/00 - 9/10 F16F 1/02 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) C22C 9/00-9/10 F16F 1/02
Claims (4)
３．５at％であるベリリウム銅合金材の外周面にベリリ
ウムの濃度が０．０５〜３．０at％であるベリリウム原
子希薄銅層を形成し、そのベリリウム原子希薄銅層の外
周面に錫膜又は半田膜を設けたことを特徴とするベリリ
ウム銅合金ばね材。An average beryllium content of 9.5 to 1
The concentration of beryllium forms a beryllium atom dilute copper layer is 0.05～3.0At% on an outer peripheral surface of the beryllium copper alloy material is 3.5 at%, Suzumaku or on the outer peripheral surface of the beryllium atoms dilute copper layer Beryllium copper alloy spring material characterized by having a solder film.
３．５at％であるベリリウム銅合金材の外周面にベリリ
ウムの濃度が０．０５〜３．０at％であるベリリウム原
子希薄銅層を形成したことを特徴とする被覆ベリリウム
銅合金ばね材。2. An average beryllium content of 9.5 to 1
Coated beryllium copper alloy spring material concentration of beryllium in the outer peripheral surface of the beryllium copper alloy material is 3.5 at% is characterized by the formation of the beryllium atoms dilute copper layer is 0.05~3.0at%.
３．５at％のベリリウム銅合金線の外周面に電着銅薄膜
を形成し、次に引抜き加工または圧延加工を施して線径
または箔厚を０．２ｍｍ以下とすると共に前記電着銅薄
膜の代りにベリリウムの濃度が０．０５〜３．０at％で
あるベリリウム原子希薄銅層を形成し、次に溶融めっき
により厚さ０．５μｍ以下の錫膜または半田膜を形成す
ることを特徴とするベリリウム銅合金ばね材の製造方
法。3. An average beryllium content of 9.5 to 1
An electrodeposited copper thin film is formed on the outer peripheral surface of a 3.5 at% beryllium copper alloy wire, and then subjected to a drawing process or a rolling process to reduce the wire diameter or the foil thickness to 0.2 mm or less and to reduce the thickness of the electrodeposited copper thin film. Instead, a beryllium atomically diluted copper layer having a beryllium concentration of 0.05 to 3.0 at% is formed, and then a tin film or a solder film having a thickness of 0.5 μm or less is formed by hot-dip plating. Manufacturing method of beryllium copper alloy spring material.
３．５at％のベリリウム銅合金線の外周面に電着銅薄膜
を形成し、次に引抜き加工または圧延加工を施して線径
または箔厚を０．２ｍｍ以下とすると共に前記電着銅薄
膜の代りにベリリウムの濃度が０．０５〜３．０at％で
あるベリリウム原子希薄銅層を形成することを特徴とす
るベリリウム銅合金ばね材の製造方法。4. An average beryllium content of 9.5 to 1
An electrodeposited copper thin film is formed on the outer peripheral surface of a 3.5 at% beryllium copper alloy wire, and then subjected to a drawing process or a rolling process to reduce the wire diameter or the foil thickness to 0.2 mm or less and to reduce the thickness of the electrodeposited copper thin film. A method for producing a beryllium-copper alloy spring material, comprising forming a beryllium atom-diluted copper layer having a beryllium concentration of 0.05 to 3.0 at% instead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27091995A JP3312235B2 (en) | 1995-10-19 | 1995-10-19 | Beryllium copper alloy spring material and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27091995A JP3312235B2 (en) | 1995-10-19 | 1995-10-19 | Beryllium copper alloy spring material and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09111374A JPH09111374A (en) | 1997-04-28 |
| JP3312235B2 true JP3312235B2 (en) | 2002-08-05 |
Family
ID=17492825
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|---|---|---|---|
| JP27091995A Expired - Fee Related JP3312235B2 (en) | 1995-10-19 | 1995-10-19 | Beryllium copper alloy spring material and its manufacturing method |
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| CN103714981B (en) * | 2013-12-20 | 2015-08-05 | 宁波赛特勒电子有限公司 | A kind of relay |
| CN103707573B (en) * | 2013-12-20 | 2015-07-15 | 宁波赛特勒电子有限公司 | Double-layer spring leaf composite material of relay and application thereof |
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1995
- 1995-10-19 JP JP27091995A patent/JP3312235B2/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
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