JP3286020B2 - Manufacturing method of single crystal wafer - Google Patents
Manufacturing method of single crystal waferInfo
- Publication number
- JP3286020B2 JP3286020B2 JP14738593A JP14738593A JP3286020B2 JP 3286020 B2 JP3286020 B2 JP 3286020B2 JP 14738593 A JP14738593 A JP 14738593A JP 14738593 A JP14738593 A JP 14738593A JP 3286020 B2 JP3286020 B2 JP 3286020B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- single crystal
- crystal wafer
- outer peripheral
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、単結晶ウェーハの製造
方法に関する。The present invention relates to a method for manufacturing a single crystal wafer.
【０００２】[0002]
【従来の技術】弾性表面波装置のような表面波デバイス
は、圧電性を呈する LiTaO3 単結晶ウェーハや LiNbO3
単結晶ウェーハ等を基板とし、このような基板の一主面
にインターデジタル形状のトランスジューサを設けるこ
とによって構成されている。このような構成において
は、トランスジューサで弾性表面波を励受信する形とな
っているが、同時にバルク波等の不要波（障害波）も励
受信し、周波数特性におけるスプリアス妨害を引き起こ
してしまう。そこで、表面波デバイス用の単結晶ウェー
ハにおいては、粗い研磨材による研磨やホーニング加工
等によって、裏面全面を粗している。2. Description of the Related Art A surface acoustic wave device such as a surface acoustic wave device includes a LiTaO 3 single crystal wafer exhibiting piezoelectricity and a LiNbO 3
It is configured by using a single crystal wafer or the like as a substrate and providing an interdigital transducer on one principal surface of such a substrate. In such a configuration, the surface acoustic wave is excited and received by the transducer, but at the same time, unnecessary waves (obstacle waves) such as bulk waves are also excited and received, causing spurious interference in the frequency characteristics. Therefore, in a single crystal wafer for a surface acoustic wave device, the entire back surface is roughened by polishing with a rough abrasive, honing, or the like.
【０００３】上記したような表面波デバイス用の単結晶
ウェーハは、従来、単結晶ボールをスライス加工してウ
ェーハ状とし、このウェーハの両面をラップ加工した
後、上述した裏面粗し加工を行い、さらに表面の鏡面加
工を行って作製していた。また、単結晶ウェーハの外周
面には、スライス工程やラップ工程等により微小なクラ
ックが生じると共に、熱歪みが残留しており、その後の
製造工程におけるウェーハの割れ要因となるため、通
常、単結晶ウェーハの外周面には面取り加工を施してい
る。従来の単結晶ウェーハの製造工程において、上記外
周面取り加工は、スライス工程またはラップ工程を行っ
た後に実施していた。Conventionally, a single crystal wafer for a surface acoustic wave device as described above is sliced from a single crystal ball to form a wafer, and both sides of the wafer are wrapped and then the above-described back surface roughening is performed. Furthermore, it was manufactured by performing mirror finishing on the surface. In addition, a small crack is generated on the outer peripheral surface of the single crystal wafer by a slicing step, a lapping step, and the like, and thermal distortion remains, which causes a wafer crack in a subsequent manufacturing process. The outer peripheral surface of the wafer is chamfered. In a conventional single crystal wafer manufacturing process, the outer peripheral chamfering process is performed after performing a slicing process or a lapping process.
【０００４】[0004]
【発明が解決しようとする課題】ところで、上述したよ
うな外周面取り加工を、スライス加工工程またはラップ
加工工程の後に行った従来の単結晶ウェーハは、その後
裏面粗し加工工程、表面鏡面加工工程、さらにはデバイ
ス化工程に供されるが、このような従来の単結晶ウェー
ハは、デバイス化工程等で割れ率が常に 5〜6%程度発生
するという問題を有していた。By the way, the conventional single crystal wafer obtained by performing the outer peripheral chamfering process after the slicing process or the lapping process as described above is subjected to a back surface roughening process, a front surface mirroring process, Further, the conventional single-crystal wafer is subjected to a device-forming process. However, such a conventional single-crystal wafer has a problem that a crack rate always occurs at about 5 to 6% in a device-forming process or the like.
【０００５】本発明は、このような課題に対処するため
になされたもので、デバイス化工程等による割れ率の低
減を図ることを可能にした単結晶ウェーハの製造方法を
提供することを目的としている。SUMMARY OF THE INVENTION The present invention has been made to address such a problem, and an object of the present invention is to provide a method of manufacturing a single crystal wafer which can reduce a cracking rate due to a device-forming step or the like. I have.
【０００６】[0006]
【課題を解決するための手段】本発明者は、上記目的を
達成するために、単結晶ウェーハの各製造工程について
詳細に検討した結果、裏面粗し加工により、ウェーハ外
周部は大きなダメージを受けて、外周面や裏面側角部に
クラックが発生したり、また面取り形状が変形し、これ
らがその後の工程における割れの発生要因となることを
見出した。In order to achieve the above object, the present inventor has studied in detail each manufacturing process of a single crystal wafer, and as a result, the outer peripheral portion of the wafer has been greatly damaged by back surface roughening. As a result, it has been found that cracks are generated on the outer peripheral surface and the corners on the back side, and the chamfered shape is deformed, and these become factors for generating cracks in the subsequent steps.
【０００７】本発明は、上記知見に基いて成されたもの
で、本発明の単結晶ウェーハの製造方法は、単結晶ボー
ルをスライス加工する工程と、前記スライス加工により
作製されたウェーハの両面をラップ加工する工程と、前
記ラップ加工されたウェーハの裏面を粗し加工する工程
と、前記ウェーハの表面を鏡面研磨加工する工程とを有
する単結晶ウェーハの製造方法において、前記裏面粗し
加工工程後に、前記ウェーハの外周面取り加工を行うこ
とを特徴としている。The present invention has been made on the basis of the above findings. The method for producing a single crystal wafer according to the present invention comprises a step of slicing a single crystal ball, and a method for slicing both surfaces of the wafer produced by the slicing. Lapping step, a step of roughening the backside of the lapped wafer, and a method of manufacturing a single crystal wafer having a step of mirror polishing the front side of the wafer, after the backside roughening step In addition, an outer peripheral chamfering process of the wafer is performed.
【０００８】本発明の単結晶ウェーハの製造方法につい
て、図１を参照して、より詳細に説明する。本発明の製
造方法においては、まず単結晶ボールを所定の厚さにス
ライス加工（図１-101）してウェーハ状とし、このウェ
ーハの両面をラップ加工（図１-102）する。このスライ
ス加工とラップ加工は、従来と同様に行えばよい。次い
で、ラップ加工したウェーハの裏面に対して、比較的粗
い遊離砥粒を用いて研磨したり、また遊離砥粒を直接吹
き付ける等によって、例えば中心線平均粗さＲa が2.0
μm 以上となるように粗し加工（図１-103）を施す。The method for manufacturing a single crystal wafer of the present invention will be described in more detail with reference to FIG. In the manufacturing method of the present invention, first, a single crystal ball is sliced into a predetermined thickness (FIG. 1-101) to form a wafer, and both sides of the wafer are lapped (FIG. 1-102). The slicing and lapping may be performed in the same manner as in the related art. Then, the back surface of the lapped wafer is polished with relatively coarse free abrasive grains, or by directly blowing the free abrasive grains, for example, so that the center line average roughness Ra is 2.0.
Roughing is performed (Fig. 1-103) so that the thickness is at least μm.
【０００９】ここで、図２に示すように、ラップ加工後
のウエーハ１は、単結晶ボールの外周丸め加工、スライ
ス加工およびラップ加工時の加工ダメージを受け、その
外周面１ａには微小なクラック２ａ（例えば 5〜10μm
程度の深さのクラック）が多数発生する。また、図３に
示すように、裏面（１ｂ）粗し加工後のウエーハ１は、
砥粒のダメージを受けて、その外周面１ａや裏面１ｂ側
角部１ｃに、例えば50〜 100μm 程度の深さのクラック
２ｂが多数発生する。Here, as shown in FIG. 2, the wafer 1 after lapping is subjected to processing damage during rounding, slicing and lapping of the outer periphery of a single crystal ball, and a small crack is formed on the outer peripheral surface 1a. 2a (for example, 5 to 10 μm
Many cracks having a depth of about several degrees occur. Also, as shown in FIG. 3, the wafer 1 after the back surface (1b) roughening process
Due to the damage of the abrasive grains, a large number of cracks 2b having a depth of, for example, about 50 to 100 μm are formed on the outer peripheral surface 1a and the corner 1c on the back surface 1b.
【００１０】よって、本発明の製造方法においては、上
記裏面粗し加工工程後に、ウエーハ外周面１ａの面取り
加工（図１-104）を行い、その後ウエーハ表面１ｄの鏡
面研磨加工（図１-105）を行う。外周面取り加工は、外
周面１ａからの加工量が 0.1mm以上となるように行うこ
とが好ましく、さらに好ましくは 0.2mm以上である。こ
の加工量があまり少ないと、上記裏面粗し加工によるク
ラック２ｂを十分に除去することができない。面取り加
工の形状は、特に限定されるものではなく、Ｒ形状やＣ
面取り形状等を適用することができる。Therefore, in the manufacturing method of the present invention, after the back surface roughening step, the outer peripheral surface 1a of the wafer is chamfered (FIG. 1-104), and then the wafer surface 1d is mirror-polished (FIG. 1-105). )I do. The outer peripheral chamfering is preferably performed so that the processing amount from the outer peripheral surface 1a is 0.1 mm or more, and more preferably 0.2 mm or more. If the processing amount is too small, the crack 2b due to the back surface roughening cannot be sufficiently removed. The shape of the chamfering is not particularly limited, and may be an R shape or a C shape.
A chamfered shape or the like can be applied.
【００１１】このように、裏面粗し加工工程後に、ウエ
ーハ外周面１ａの面取り加工を行うことによって、より
大きなダメージを及ぼす裏面粗し加工の影響を排除する
ことができ、ウェーハ外周面１ａのクラックや割れ、さ
らには面取り形状の変形等のない健全な単結晶ウェーハ
を得ることが可能となる。逆に、ウエーハの外周面取り
加工を行った後に、裏面粗し加工を行うと、裏面粗し加
工に伴うクラック等がそのまま残った単結晶ウェーハと
なってしまう。As described above, by performing the chamfering process on the outer peripheral surface 1a of the wafer after the back surface roughening process, it is possible to eliminate the influence of the rear surface roughening process which causes more damage, and to crack the outer peripheral surface 1a of the wafer. It is possible to obtain a sound single crystal wafer free from cracks and deformation of the chamfered shape. Conversely, if the back surface roughening is performed after the outer peripheral chamfering of the wafer, a single crystal wafer having cracks and the like accompanying the back surface roughening as it is remains.
【００１２】本発明の単結晶ウェーハの製造方法は、裏
面粗し加工を必要とする種々の単結晶ウェーハに適用す
ることができ、例えば LiTaO3 単結晶ウェーハや LiNbO
3 単結晶ウェーハ等の製造に好適である。The method for producing a single crystal wafer of the present invention can be applied to various single crystal wafers that require back surface roughening, such as a LiTaO 3 single crystal wafer and a LiNbO
3 Suitable for manufacturing single crystal wafers and the like.
【００１３】[0013]
【作用】本発明の単結晶ウェーハの製造方法において
は、裏面粗し加工工程後にウエーハの外周面取り加工を
行っているため、裏面粗し加工に起因するクラック等も
含めて、外周面取り加工によって、外周面のクラックや
熱歪み等を除去することができる。よって、ウェーハ外
周面にクラックや割れ等がなく、また面取り形状の変形
等もない健全な単結晶ウェーハを得ることが可能とな
る。これによって、その後のデバイス化工程等における
ウェーハの割れ率を最小限に抑えることができる。In the method for producing a single crystal wafer of the present invention, since the outer peripheral chamfering process is performed after the back surface roughening process, the outer peripheral chamfering process including the cracks caused by the back surface roughening process is performed. Cracks, thermal distortion, and the like on the outer peripheral surface can be removed. Therefore, it is possible to obtain a sound single crystal wafer having no cracks or cracks on the outer peripheral surface of the wafer and no deformation of the chamfered shape. As a result, it is possible to minimize the cracking rate of the wafer in the subsequent device forming step and the like.
【００１４】[0014]
【実施例】以下、本発明の実施例について説明する。Embodiments of the present invention will be described below.
【００１５】実施例 まず、 LiTaO3 単結晶ボールをスライス加工してウェー
ハ状とした後、このウェーハの両面をラップ加工した。
次いで、粒径60〜 120μm の溶融アルミナ砥粒を用い
て、上記ウェーハの裏面がＲa =2.2μm となるように粗
し加工を施した。この裏面粗し加工を行った厚さ 395μ
m の LiTaO3 ウェーハの外周面取り加工を行った。外周
面取り加工は、Ｒ形砥石（半径:0.125mm、テーパ角度：
22°、番定：＃ 800）を用いて、ウェーハ径が 200μm
除去されるように行った。この後、ウェーハ表面の鏡面
研磨加工を行って、 LiTaO3 単結晶ウェーハを得た。Example First, a LiTaO 3 single crystal ball was sliced into a wafer, and both sides of the wafer were wrapped.
Then, the wafer was roughened using fused alumina abrasive grains having a particle size of 60 to 120 μm so that the back surface of the wafer became Ra = 2.2 μm. Thickness of 395μ
The outer peripheral chamfering of the LiTaO 3 wafer of m m was performed. Outer chamfering is performed using an R-shaped grindstone (radius: 0.125 mm, taper angle:
22 °, number: # 800), the wafer diameter is 200μm
Performed to be removed. Thereafter, the wafer surface was mirror-polished to obtain a LiTaO 3 single crystal wafer.
【００１６】このようにして得た LiTaO3 単結晶ウェー
ハの外周面およびその断面を観察したところ、図４に示
すように、図３で示した50〜 100μm 程度の深さのクラ
ックはなく、端部形状（面取り形状）も均一であった。
また、上記 LiTaO3 単結晶ウェーハをデバイス化工程に
供した結果、ウェーハの割れ率は0.1%と良好な値を示し
た。When the outer peripheral surface and the cross section of the LiTaO 3 single crystal wafer thus obtained were observed, as shown in FIG. 4, there was no crack having a depth of about 50 to 100 μm shown in FIG. The part shape (chamfered shape) was also uniform.
Further, as a result of subjecting the LiTaO 3 single crystal wafer to a device forming process, the crack rate of the wafer showed a favorable value of 0.1%.
【００１７】比較例 LiTaO3 単結晶ボールをスライス加工してウェーハ状と
した後、このウェーハの両面を粒径 5.9〜 7.1μm の炭
化ケイ素遊離砥粒を用いて、厚さ 400μm となるように
ラップ加工した。次いで、上記ウェーハの外周面取り加
工を、実施例１と同一条件で行った。この後、粒径60〜
120μm の溶融アルミナ砥粒を用いて、上記ウェーハの
裏面がＲa =2.2μm となるように粗し加工を施し、さら
にウェーハ表面の鏡面研磨加工を行って、 LiTaO3 単結
晶ウェーハを得た。Comparative Example After slicing a LiTaO 3 single crystal ball into a wafer, both surfaces of the wafer were wrapped to a thickness of 400 μm using silicon carbide free abrasive grains having a particle size of 5.9 to 7.1 μm. processed. Next, the outer peripheral chamfering of the wafer was performed under the same conditions as in Example 1. After this, the particle size is 60 ~
Using a 120 μm fused alumina abrasive grain, the wafer was roughened so that the back surface of the wafer became Ra = 2.2 μm, and the wafer surface was further mirror-polished to obtain a LiTaO 3 single crystal wafer.
【００１８】このようにして得た LiTaO3 単結晶ウェー
ハの外周面およびその断面を観察したところ、図５に示
すように、ウエーハ１の裏面側角部１ｃに欠けが生じる
等によって面取り形状は大きく変形し、さらに深さ30〜
50μm 程度のクラック２が多数生じていた。また、上記
LiTaO3 単結晶ウェーハをデバイス化工程に供した結
果、ウェーハの割れ率は5%であった。When the outer peripheral surface and the cross section of the LiTaO 3 single crystal wafer thus obtained were observed, as shown in FIG. 5, the chamfered shape was large due to the occurrence of chipping at the back side corner 1c of the wafer 1 and the like. Deforms, further depth 30 ~
Many cracks 2 of about 50 μm were formed. Also,
As a result of subjecting the LiTaO 3 single crystal wafer to a device forming process, the crack rate of the wafer was 5%.
【００１９】[0019]
【発明の効果】以上説明したように本発明によれば、ク
ラックや面取り形状の変形等のない健全な単結晶ウェー
ハが得られる。このような単結晶ウェーハを用いること
によって、その後のデバイス化工程等における割れ率を
大幅に低下させることが可能となる。As described above, according to the present invention, a sound single crystal wafer free from cracks and deformation of the chamfered shape can be obtained. By using such a single crystal wafer, it is possible to greatly reduce the cracking rate in the subsequent device forming step and the like.
【図１】 本発明による単結晶ウェーハの製造工程を示
す図である。FIG. 1 is a diagram showing a manufacturing process of a single crystal wafer according to the present invention.
【図２】 ラップ加工後の単結晶ウェーハの状態を示す
断面図である。FIG. 2 is a cross-sectional view showing a state of a single crystal wafer after lapping.
【図３】 裏面粗し加工後の単結晶ウェーハの状態を示
す断面図である。FIG. 3 is a cross-sectional view showing a state of a single crystal wafer after a back surface roughening process.
【図４】 本発明の一実施例で作製した単結晶ウェーハ
の状態を示す断面図である。FIG. 4 is a cross-sectional view showing a state of a single crystal wafer manufactured in one example of the present invention.
【図５】 従来法により作製した単結晶ウェーハの状態
を示す断面図である。FIG. 5 is a cross-sectional view showing a state of a single crystal wafer manufactured by a conventional method.
１………単結晶ウエーハ １ａ……外周面 １ｂ……裏面 １ｃ……裏面側角部 １ｄ……表面 ２………クラック 1 Single crystal wafer 1a Outer peripheral surface 1b Back surface 1c Back surface corner 1d Front surface 2 Crack
Claims (1)
と、前記スライス加工により作製されたウェーハの両面
をラップ加工する工程と、前記ラップ加工されたウェー
ハの裏面を粗し加工する工程と、前記ウェーハの表面を
鏡面研磨加工する工程とを有する単結晶ウェーハの製造
方法において、 前記裏面粗し加工工程後に、前記ウェーハの外周面取り
加工を行うことを特徴とする単結晶ウェーハの製造方
法。A step of slicing a single crystal ball; a step of lapping both sides of a wafer produced by the slicing; a step of roughening a back surface of the lapped wafer; A mirror polishing process for the front surface of the wafer, wherein after the back surface roughening process, an outer peripheral chamfering process is performed on the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14738593A JP3286020B2 (en) | 1993-06-18 | 1993-06-18 | Manufacturing method of single crystal wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14738593A JP3286020B2 (en) | 1993-06-18 | 1993-06-18 | Manufacturing method of single crystal wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH076984A JPH076984A (en) | 1995-01-10 |
| JP3286020B2 true JP3286020B2 (en) | 2002-05-27 |
Family
ID=15429065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14738593A Expired - Fee Related JP3286020B2 (en) | 1993-06-18 | 1993-06-18 | Manufacturing method of single crystal wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3286020B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3516203B2 (en) * | 1999-11-08 | 2004-04-05 | 株式会社日鉱マテリアルズ | Compound semiconductor wafer |
| DE10004578C1 (en) * | 2000-02-03 | 2001-07-26 | Wacker Siltronic Halbleitermat | Production of a semiconductor wafer comprises polishing the edges of the wafer with a cloth with the continuous introduction of an alkaline polishing agent using polishing plates, wetting with a film and cleaning and drying |
| JP2001332949A (en) * | 2000-05-19 | 2001-11-30 | Toshiba Corp | Method for manufacturing surface acoustic wave element |
| JP4671220B2 (en) * | 2005-01-26 | 2011-04-13 | 東日本旅客鉄道株式会社 | AC voltage regulator |
-
1993
- 1993-06-18 JP JP14738593A patent/JP3286020B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH076984A (en) | 1995-01-10 |
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