JP3225501U - Processing equipment - Google Patents

Abstract

An apparatus for chemically or electrochemically processing through holes in a circuit board having a high aspect ratio. The processing apparatus includes an electroplating tank, a chemical storage tank, a positioning frame that sandwiches a circuit board, and is positioned inside the electroplating tank; A liquid supply pipe drawn from the liquid storage area of the electroplating tank to the suction tank, a suction hood positioned inside the suction area of the electroplating tank with respect to the positioning frame, and a suction hood, and the suction pump sucks the chemical solution W. And a suction pipe through which the through hole passes. The electroplating tank is divided into a chemical storage area 11 and a suction area 12 by a positioning frame and a circuit board. Thus, a negative pressure is generated by suction to generate a drainage action, and thus, there is an effect that a processing effect of a through hole of a circuit board having a high aspect ratio is improved. [Selection diagram] FIG.

Description

  The present invention relates to a chemical processing or electrochemical processing apparatus for through holes of a circuit board having a high aspect ratio, and more particularly, to generate a negative pressure by suction to continuously flow a chemical solution through a high aspect ratio through hole. Related design.

  With the continuous development and innovation of electronic products and technology, the design concept of electronic products is gradually becoming lighter, thinner and shorter, and the design of printed circuit boards is also small hole diameter, high density, multilayer, fine pitch Has developed in the direction of. As the number of layers increases and the hole diameter decreases, the aspect ratio of the through hole of the product also increases significantly.

  However, as shown in FIG. 1A, the conventional chemical or electrochemical treatment retains a favorable treatment effect on the through hole 41a having a general aspect ratio (T1 / d1). On the other hand, as shown in FIG. 1B, the conventional chemical treatment or electrochemical treatment is such that a chemical solution is applied to the inside of the through hole 41b for the through hole 41b having a high aspect ratio (T2 / d2) (that is, a deep hole). Since it is difficult to enter, the electroplating layer 42 is provided only on the inner diameter adjacent to the hole, and it is difficult to form an electroplating treatment effect at an intermediate position of the through hole 41b, and therefore, a preferable chemical treatment or electric treatment is performed. No chemical treatment effect was obtained.

  In view of such a conventional situation, an object of the present invention is to provide a chemical processing or electrochemical processing apparatus for through holes of a circuit board having a high aspect ratio. By generating a negative pressure by suction to generate a drainage action, an effect of improving a through-hole processing effect having a high aspect ratio is obtained.

  In order to solve the above-mentioned problem, a chemical treatment or electrochemical treatment apparatus for a through hole of a circuit board having a high aspect ratio according to an embodiment of the present invention includes an electroplating tank, a chemical solution storage tank, and a circuit board. A positioning frame positioned inside the electroplating tank, a liquid supply pipe through which the chemical is drawn from the chemical storage tank to the chemical storage area of the electroplating tank, and a positioning frame positioned inside the suction area of the electroplating tank with respect to the positioning frame. A suction hood connected to the suction hood, and a suction pipe for generating a negative pressure by suction to allow the chemical solution to pass through the through hole of the circuit board and suck the chemical solution to the chemical solution storage tank. The electroplating tank is divided by the positioning frame and the circuit board into a chemical storage area and a suction area.

  The liquid supply pipe draws a chemical from a chemical storage tank into a chemical storage area of the electroplating tank by a pump. The suction pipe allows the chemical liquid to pass through the through hole of the circuit board by the suction pump and sucks the chemical liquid to the chemical liquid storage tank. Further, a positioning table for the positioning frame is provided inside the electroplating tank.

  Thus, after the positioning frame and the circuit board are positioned inside the electroplating tank, the liquid supply pipe starts supplying the chemical to the chemical storage area of the electroplating tank. When the chemical reaches the working liquid level, the suction pipe sucks with the suction hood, the sucked chemical is sent to the chemical storage tank, and the liquid is supplied to the chemical storage area of the electroplating tank by the liquid supply pipe, and the chemical is used for circulation. Then, the chemical solution or the electrochemical process is performed by continuously flowing the chemical solution through the through hole of the circuit board by the suction of the suction pipe.

FIG. 3 is a schematic view showing the effect of a chemical or electrochemical treatment of a through hole having a normal aspect ratio. FIG. 3 is a schematic diagram showing the effect of a chemical or electrochemical treatment of a through hole having a high aspect ratio. 1 is an external perspective view illustrating a processing apparatus according to an embodiment of the present invention. FIG. 3 is a partial perspective view illustrating a processing apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view illustrating a processing apparatus according to an embodiment of the present invention. FIG. 2 is a longitudinal sectional view illustrating a processing apparatus according to an embodiment of the present invention. FIG. 4 is a schematic view of the present invention in which a chemical solution is continuously sucked and flows through a through hole of a circuit board. It is the elements on larger scale of seven parts shown in FIG.

  Hereinafter, an embodiment for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the embodiments described below.

(One embodiment)
First, the present invention will be described in more detail with reference to FIGS. The processing apparatus according to one embodiment of the present invention includes an electroplating tank 10, a chemical storage tank 20, a positioning frame 30, a liquid supply pipe 50, a suction hood 60, and a suction pipe 70.

  The electroplating tank 10 has a positioning table 13 inside. The positioning frame 30 is positioned on the positioning table 13 inside the electroplating tank 10 while holding the circuit board 40 therebetween. The electroplating tank 10 is divided into a chemical solution storage area 11 and a suction area 12 by a positioning frame 30 and a circuit board 40. In the liquid supply pipe 50, the chemical W is pumped from the chemical storage tank 20 to the chemical storage area 11 of the electroplating tank 10 by the pump 51. The suction hood 60 is positioned inside the suction area 12 of the electroplating tank 10 with respect to the positioning frame 30. The suction pipe 70 is connected to the suction hood 60, and generates a negative pressure inside the suction hood 60 by the suction pump 71 to cause the chemical solution W to pass through the through hole of the circuit board 40 and to be sucked to the chemical solution storage tank 20.

  As shown in FIGS. 6 and 7, in the present embodiment, after the positioning frame 30 and the circuit board 40 are positioned inside the electroplating tank 10, the liquid supply pipe 50 is connected to the chemical solution storage area 11 of the electroplating tank 10. Start supplying the chemical solution. When the chemical solution W reaches the operating liquid level, the suction pipe 70 performs suction with the suction hood 60, the sucked chemical solution W is sent to the chemical solution storage tank 20, and the chemical solution W is sent to the chemical plating tank 10 by the liquid supply pipe 50. The chemical solution W is supplied to the storage area 11 and circulated, and the chemical solution W is continuously circulated through the through-hole 41b by the suction of the suction pipe 70 to perform a chemical treatment or an electrochemical treatment. For this reason, in the present embodiment, by generating a negative pressure by suction and continuously flowing the chemical solution through the through hole 41b having a high aspect ratio, the hole diameter (d2) of the through hole 41b having a high aspect ratio (T2 / d2) is obtained. Even if the shape of ()) is very long and thin, the “drainage action” occurs due to the suction by the negative pressure, so that the chemical solution W smoothly and continuously flows through the inside of the through hole 41b. Therefore, as shown in FIG. 7, the electroplating layer 42 having a very fine hole diameter (d2) is also very uniform inside the hole diameter (d2), and the prior art shown in FIG. 1B has a high aspect ratio (T2 / With respect to the through hole 41b of d2), the problem that the electroplating layer 42 is provided only in the inner diameter close to the hole is improved. Therefore, the present invention uses a technical means for generating a "chemical liquid drainage action" by suction using a negative pressure, thereby surely causing a breakthrough and enhancing a high aspect ratio through-hole processing effect.

  As described above, the embodiments of the present invention have been described in detail with reference to the drawings. However, the specific configuration is not limited to the embodiments, and includes a design change or the like without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 10 Electroplating tank 11 Chemical storage area 12 Suction area 13 Positioning table 20 Chemical storage tank 30 Positioning frame 40 Circuit board 41a, 41b Through hole 42 Electroplating layer 50 Liquid supply pipe 51 Pump 60 Suction hood 70 Suction pipe 71 Suction pump W Chemical

Claims (3)

An electroplating tank,
A chemical storage tank,
A positioning frame for holding the circuit board and positioning the inside of the electroplating tank;
A liquid supply pipe from which a chemical is drawn from the chemical storage tank to a chemical storage area of the electroplating tank;
A suction hood positioned inside the suction area of the electroplating tank with respect to the positioning frame,
A suction pipe connected to the suction hood, to generate a negative pressure by suction, to pass a chemical solution through a through hole of a circuit board, and to suction the chemical solution to the chemical solution storage tank;
With
The electroplating tank is divided into a chemical solution storage area and a suction area by the positioning frame and the circuit board,
After the positioning frame and the circuit board are positioned inside the electroplating tank, the liquid supply pipe starts supplying a chemical to a chemical storage area of the electroplating tank, and when the chemical reaches the operating liquid level, The suction pipe performs suction by the suction hood, the sucked chemical is sent to the chemical storage tank, and a chemical is supplied to the chemical storage area of the electroplating tank by the liquid supply pipe, and is circulated for use. A processing apparatus wherein chemical treatment or electrochemical treatment is performed by continuously flowing a chemical solution through a through hole of a circuit board by suction of a pipe. The liquid supply pipe pumps a chemical solution from the chemical solution storage tank to a chemical solution storage area of the electroplating tank by a pump,
2. The processing apparatus according to claim 1, wherein the suction pipe allows a chemical solution to pass through the through hole of the circuit board by a suction pump and sucks the chemical solution to the chemical solution storage tank. 3.   The processing apparatus according to claim 2, wherein a positioning table for the positioning frame is provided inside the electroplating tank.

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