JP3221126B2 - Oxidation treatment equipment - Google Patents
Oxidation treatment equipmentInfo
- Publication number
- JP3221126B2 JP3221126B2 JP01433793A JP1433793A JP3221126B2 JP 3221126 B2 JP3221126 B2 JP 3221126B2 JP 01433793 A JP01433793 A JP 01433793A JP 1433793 A JP1433793 A JP 1433793A JP 3221126 B2 JP3221126 B2 JP 3221126B2
- Authority
- JP
- Japan
- Prior art keywords
- processing
- bottom plate
- shielding plate
- space
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003647 oxidation Effects 0.000 title claims description 9
- 238000007254 oxidation reaction Methods 0.000 title claims description 9
- 239000007788 liquid Substances 0.000 claims description 28
- 238000001914 filtration Methods 0.000 claims description 15
- 239000012535 impurity Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 7
- 239000005751 Copper oxide Substances 0.000 description 7
- 239000000356 contaminant Substances 0.000 description 7
- 229910000431 copper oxide Inorganic materials 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Chemical Treatment Of Metals (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板の銅表
面に酸化銅皮膜を形成するための装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for forming a copper oxide film on a copper surface of a printed wiring board.
【０００２】[0002]
【従来の技術】多層プリント配線板は、内層板と内層板
との間、及び内層板と外層板との間に接着用プリプレグ
を挟み、加熱加圧して各構成材を接着一体化して製造す
る。構成材特に内層板と接着用プリプレグとの接着強度
を高めるために、内層板の銅はく面をアルカリ系の酸化
剤を用いて酸化して酸化皮膜を形成している。2. Description of the Related Art A multilayer printed wiring board is manufactured by sandwiching an adhesive prepreg between an inner layer board and an inner layer board and between an inner layer board and an outer layer board, and applying heat and pressure to bond and integrate respective components. . In order to increase the adhesive strength between the constituent material, particularly the inner layer plate and the bonding prepreg, the copper foil surface of the inner layer plate is oxidized using an alkaline oxidizing agent to form an oxide film.
【０００３】また、酸化処理を行う前に、過硫酸アンモ
ニウム、過硫酸ナトリウムなどでプリント回路板の銅は
く表面を数μｍエッチングしている。このエッチングに
よって溶解した銅が硫酸銅や水酸化銅となって銅はく表
面に付着したり、空気との接触によって銅はく表面に錆
が発生したりする。これらの付着物は、水洗浄によって
除去できず、プリント回路板表面にこれらが付着したま
ま処理槽に浸漬されると、プリント回路板から離れて処
理液中に浮遊し、又は、沈でんして酸化銅結晶となって
堆積する。これらの夾雑物は、酸化処理の際のプリント
回路板の出入りによって酸化処理液が撹拌されて浮遊
し、プリント回路板の銅はく表面に形成された酸化銅皮
膜の上に付着してしまう。このような付着物が酸化処理
の初期にプリント回路板の表面にあると、その部分には
酸化銅皮膜が形成されず、処理むらの原因となる。[0005] Before the oxidation treatment, the copper foil surface of the printed circuit board is etched by a few μm with ammonium persulfate, sodium persulfate or the like. The copper dissolved by this etching becomes copper sulfate or copper hydroxide and adheres to the copper foil surface, or rust is generated on the copper foil surface by contact with air. These deposits cannot be removed by washing with water, and if they are immersed in the processing tank while they adhere to the surface of the printed circuit board, they will separate from the printed circuit board and float in the processing solution, or will settle and oxidize. Deposits as copper crystals. These contaminants are agitated and floated by the oxidizing solution when the printed circuit board enters and exits during the oxidation process, and adheres to the copper oxide film formed on the copper foil surface of the printed circuit board. If such deposits are present on the surface of the printed circuit board at the beginning of the oxidation process, a copper oxide film is not formed on that portion, causing unevenness of the process.
【０００４】このため、従来は、処理槽１に処理液中の
夾雑物を除去するための濾過装置２を併設し、処理液を
処理槽１から濾過装置２を通し処理槽にポンプ３で循環
するようにし、連続的または間欠的に処理液を濾過して
循環するようにしていた（図２参照）。For this reason, conventionally, a filtering device 2 for removing contaminants in the processing liquid is provided in the processing tank 1 and the processing liquid is circulated from the processing tank 1 through the filtering device 2 to the processing tank by the pump 3. The treatment liquid is continuously or intermittently filtered and circulated (see FIG. 2).
【０００５】[0005]
【発明が解決しようとする課題】ところが、濾過した処
理液は、処理槽に液面から戻すようにされており（図２
参照）、戻された処理液によって、処理槽１内の処理液
がかきまぜられ、沈降した夾雑物が浮遊して、濾過装置
に入らず、処理液内を循環してプリント回路板の銅はく
表面に付着してしまうという欠点があった。本発明は、
このような課題を解決するもので、ポンプで吸引し濾過
処理した処理液を処理槽１に戻しても、処理液がかきま
ぜられず、したがって、沈降した夾雑物が浮遊すること
なく濾過装置に吸引される酸化処理装置を提供すること
を目的とするものである。However, the filtered processing liquid is returned to the processing tank from the liquid level (FIG. 2).
The treatment liquid in the treatment tank 1 is stirred by the returned treatment liquid, and the settled impurities float, and do not enter the filtration device, but circulate in the treatment liquid to remove the copper on the printed circuit board. There is a drawback that it adheres to the surface. The present invention
In order to solve such a problem, even if the processing liquid that has been suctioned and filtered by the pump is returned to the processing tank 1, the processing liquid is not stirred, and thus the settled impurities are sucked into the filtration device without floating. It is an object of the present invention to provide an oxidation treatment apparatus that can be used.
【０００６】[0006]
【課題を解決するための手段】本発明は、処理槽１と、
処理液中の夾雑物を除去するための濾過装置２及び処理
液を処理槽１から濾過装置２を通し処理槽１に循環させ
るポンプ３とを備え、処理槽１の底部に処理槽１の底板
５との間に空間を持たせて遮蔽板４を設け、遮蔽板４と
底板５との間の空間から抜取って濾過装置２を通した処
理液を、遮蔽板４と底板５との間の空間に戻すようにし
てなる酸化処理装置である。According to the present invention, there is provided a processing tank, comprising:
A filtering device for removing impurities in the processing solution; and a pump for circulating the processing solution from the processing bath to the processing bath through the filtering device, and a bottom plate of the processing bath on the bottom of the processing bath. 5, a shielding plate 4 is provided with a space between the shielding plate 4 and the bottom plate 5, and the processing liquid extracted from the space between the shielding plate 4 and the bottom plate 5 and passed through the filtering device 2 is passed between the shielding plate 4 and the bottom plate 5. This is an oxidation treatment apparatus that returns to the space of FIG.
【０００７】また、請求項２記載の発明は、処理槽１の
底板５及び遮蔽板４を傾斜させ、底板１の最も低い部分
に凹み６を設け、処理液をこの凹み６から抜き取るよう
にして夾雑物の分離効率を高めたことを特徴とするもの
である。Further, according to the second aspect of the present invention, the bottom plate 5 and the shielding plate 4 of the processing tank 1 are inclined, and a recess 6 is provided in the lowest portion of the bottom plate 1 so that the processing liquid is drained from the recess 6. It is characterized in that the efficiency of separating contaminants is increased.
【０００８】[0008]
【作用】被処理材１０がある空間と、処理液を戻す空間
とは遮蔽板４で隔てられており、処理槽に戻される処理
液によって被処理材１０がある空間内の処理液がかきま
ぜられない。したがって、沈降した夾雑物が浮遊して被
処理材１０に付着しない。 また、底板５及び遮蔽板４
を傾斜させたので、夾雑物は底板５及び遮蔽板４に沿っ
て沈み、凹み６に溜り、、ポンプによる吸いだしが容易
となる。The space in which the material to be processed 10 is located is separated from the space in which the processing liquid is returned by the shielding plate 4, and the processing liquid in the space in which the material to be processed is located is stirred by the processing liquid returned to the processing tank. Absent. Therefore, the settled impurities do not float and adhere to the processing target material 10. In addition, the bottom plate 5 and the shielding plate 4
The contaminants sink along the bottom plate 5 and the shielding plate 4 and accumulate in the dents 6, so that they can be easily sucked out by the pump.
【０００９】[0009]
【実施例】以下図１にしたがって本発明をさらに説明す
る。本発明になる酸化処理装置は、処理槽１と、処理液
中の夾雑物を除去するための濾過装置２及び処理液を処
理槽１から濾過装置２を通し処理槽１に循環させるポン
プ３とを備えている。そして、処理槽１の底部に処理槽
１の底板５との間に空間を持たせて遮蔽板４を設け、遮
蔽板４と底板５との間の空間から抜取って濾過装置２を
通した処理液を、遮蔽板４と底板５との間の空間に戻す
ようにしている。底板５及び遮蔽板４は傾斜しており、
底板１の最も低い部分に凹み６を設け、処理液をこの凹
み６から抜き取るようにしている。底板５及び遮蔽板４
の傾斜部は平行であり、傾斜角θは４５〜６０度であ
る。遮蔽板４は処理槽１の壁側の端に折り返し部を設
け、中央側に垂下部を設けてある。遮蔽板４は左右対称
に設けられ、処理槽１の被処理材１０がある空間と遮蔽
板４と底板５との間の空間とは、処理槽１の側壁と遮蔽
板４の折り返しとの間及び遮蔽板４，４の間でつながっ
ている。BRIEF DESCRIPTION OF THE DRAWINGS FIG. The oxidation treatment apparatus according to the present invention comprises a treatment tank 1, a filtration device 2 for removing impurities in the treatment liquid, and a pump 3 for circulating the treatment liquid from the treatment tank 1 through the filtration device 2 to the treatment tank 1. It has. A shielding plate 4 is provided at the bottom of the processing tank 1 with a space between the bottom plate 5 of the processing tank 1 and a space between the shielding plate 4 and the bottom plate 5. The processing liquid is returned to the space between the shielding plate 4 and the bottom plate 5. The bottom plate 5 and the shielding plate 4 are inclined,
A recess 6 is provided in the lowest portion of the bottom plate 1 so that the processing liquid is extracted from the recess 6. Bottom plate 5 and shielding plate 4
Are parallel, and the inclination angle θ is 45 to 60 degrees. The shielding plate 4 is provided with a folded portion at the end on the wall side of the processing tank 1 and a hanging portion at the center. The shielding plate 4 is provided symmetrically, and the space between the processing material 1 in the processing tank 1 and the space between the shielding plate 4 and the bottom plate 5 is defined between the side wall of the processing tank 1 and the folded back of the shielding plate 4. And the shielding plates 4 and 4 are connected.
【００１０】処理槽１の底の凹み６からポンプ３によっ
て吸いだされた処理液は、濾過装置２によって夾雑物を
除去され、遮蔽板４と底板５との間の空間の上の方か
ら、底板５の傾斜に沿って処理槽１に戻される。これに
よって、処理液は図の矢印に示すように流れ、循環す
る。被処理材１０から離脱した夾雑物は、この流れに乗
って沈降する。処理液の流れに乗って被処理材１０があ
る空間に入る夾雑物もあるが、遮蔽板４，４の間を抜け
たところで流速が小さくなるので、沈降し、遮蔽板４に
沿って落下する。The processing liquid sucked by the pump 3 from the recess 6 at the bottom of the processing tank 1 is subjected to removal of contaminants by the filtration device 2, and from above the space between the shielding plate 4 and the bottom plate 5. It is returned to the processing tank 1 along the inclination of the bottom plate 5. Thereby, the processing liquid flows and circulates as shown by arrows in the figure. The contaminants separated from the material to be treated 10 settle down along with this flow. Some impurities may enter the space where the material to be treated 10 is located along the flow of the processing liquid. However, the flow velocity becomes small when the material passes through the space between the shielding plates 4, 4, so that the material sinks down and falls along the shielding plate 4. .
【００１１】遮蔽板４の一番高い場所と被処理材１０の
一番低い部分との距離は、１５ｃｍ以上離すのが好まし
い。また、底板５と遮蔽板４との距離も１５ｃｍ以上離
すのが好ましい。It is preferable that the distance between the highest part of the shielding plate 4 and the lowest part of the workpiece 10 is 15 cm or more. Further, it is preferable that the distance between the bottom plate 5 and the shielding plate 4 is also 15 cm or more.
【００１２】銅張り積層板を被処理材とし、凹み６に集
められた夾雑物と共に処理液をポンプ３で吸いだし、１
〜５μｍのフィルターを有する濾過装置２で濾過した処
理液を、１〜２ｍ／分の流速で処理槽１に戻した。図２
に示す従来の装置を用いた外は同じ条件で、同じ銅張り
積層板を酸化処理した。A copper-clad laminate is used as a material to be processed, and the processing liquid is sucked out by the pump 3 together with the contaminants collected in the dents 6 and
The treatment liquid filtered by the filtration device 2 having a filter of ５5 μm was returned to the treatment tank 1 at a flow rate of 1 to 2 m / min. FIG.
The same copper-clad laminate was oxidized under the same conditions except for using the conventional apparatus shown in FIG.
【００１３】そして、銅はく表面に酸化銅皮膜が形成さ
れずに発生する処理むら及び酸化銅結晶の付着程度を調
べた。その結果を表１に示す。[0013] Then, the process unevenness that occurs without forming a copper oxide film on the copper foil surface and the degree of adhesion of copper oxide crystals were examined. Table 1 shows the results.
【００１４】[0014]
【表１】 [Table 1]
【００１５】[0015]
【発明の効果】本発明によれば、沈降した夾雑物が、浮
遊して被処理材に再付着しないので、処理むらをなく
し、かつ酸化銅皮膜表面に酸化銅結晶を付着させること
なく酸化銅皮膜を形成させることができる。According to the present invention, the settled impurities float and do not adhere again to the material to be treated, thereby eliminating unevenness in treatment and preventing copper oxide crystals from adhering to the surface of the copper oxide film. A film can be formed.
【図１】本発明の一実施例になる装置の概略図でああ
る。FIG. 1 is a schematic view of an apparatus according to an embodiment of the present invention.
【図２】従来の装置の概略図である。FIG. 2 is a schematic view of a conventional device.
１ 処理槽 ２ 濾過装置 ３ ポンプ ４ 遮蔽板 ５ 底板 ６ 凹み １０ 被処理材 DESCRIPTION OF SYMBOLS 1 Processing tank 2 Filtration device 3 Pump 4 Shield plate 5 Bottom plate 6 Depression 10 Material to be processed
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) C23C 22/00 - 22/86 H05K 3/38 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) C23C 22/00-22/86 H05K 3/38
Claims (2)
ための濾過装置、及び、処理液を処理槽から濾過装置を
通し処理槽に循環させるポンプとを備え、処理槽の底部
に処理槽の底板との間に空間を持たせて遮蔽板を設け、
遮蔽板と底板との間の空間から抜取って濾過装置を通し
た処理液を、遮蔽板と底板との間の空間に戻すようにし
てなる酸化処理装置。1. A processing tank, a filtration device for removing impurities in the processing liquid, and a pump for circulating the processing liquid from the processing tank through the filtering device to the processing tank. A shielding plate is provided with a space between the bottom plate of the processing tank and
An oxidation treatment apparatus wherein the processing liquid extracted from the space between the shielding plate and the bottom plate and passed through the filtration device is returned to the space between the shielding plate and the bottom plate.
板の最も低い部分に凹みを設け、処理液をこの凹みから
抜き取るようにしてなる請求項１記載の酸化処理装置。2. The oxidation treatment apparatus according to claim 1, wherein the bottom plate and the shielding plate of the treatment tank are inclined, and a recess is provided in the lowest portion of the bottom plate, and the processing liquid is drawn out of the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01433793A JP3221126B2 (en) | 1993-02-01 | 1993-02-01 | Oxidation treatment equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01433793A JP3221126B2 (en) | 1993-02-01 | 1993-02-01 | Oxidation treatment equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06228767A JPH06228767A (en) | 1994-08-16 |
| JP3221126B2 true JP3221126B2 (en) | 2001-10-22 |
Family
ID=11858257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01433793A Expired - Fee Related JP3221126B2 (en) | 1993-02-01 | 1993-02-01 | Oxidation treatment equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3221126B2 (en) |
-
1993
- 1993-02-01 JP JP01433793A patent/JP3221126B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06228767A (en) | 1994-08-16 |
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