JP2000332409A - Oxidation method and apparatus for use in the method - Google Patents
Oxidation method and apparatus for use in the methodInfo
- Publication number
- JP2000332409A JP2000332409A JP11144190A JP14419099A JP2000332409A JP 2000332409 A JP2000332409 A JP 2000332409A JP 11144190 A JP11144190 A JP 11144190A JP 14419099 A JP14419099 A JP 14419099A JP 2000332409 A JP2000332409 A JP 2000332409A
- Authority
- JP
- Japan
- Prior art keywords
- tank
- processing
- wiring board
- printed wiring
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 230000003647 oxidation Effects 0.000 title claims abstract description 19
- 238000007254 oxidation reaction Methods 0.000 title claims abstract description 19
- 239000002244 precipitate Substances 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 238000004062 sedimentation Methods 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 239000007864 aqueous solution Substances 0.000 claims description 8
- 230000001590 oxidative effect Effects 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 4
- 239000000243 solution Substances 0.000 claims description 4
- 238000001914 filtration Methods 0.000 abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 238000007598 dipping method Methods 0.000 abstract 1
- 230000001376 precipitating effect Effects 0.000 abstract 1
- 239000013049 sediment Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 2
- 229960002218 sodium chlorite Drugs 0.000 description 2
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板の
銅表面に酸化皮膜を形成するための酸化処理方法とその
方法に用いる酸化処理装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an oxidation treatment method for forming an oxide film on a copper surface of a printed wiring board and an oxidation treatment apparatus used for the method.
【０００２】[0002]
【従来の技術】多層プリント配線板は、内層回路板と内
層回路板との間、及び内層回路板と外層銅箔との間に接
着用プリプレグを挟み、加熱・加圧して積層一体化して
製造している。このときに、内層回路板と接着用プリプ
レグとの接着強度を高めるために、内層回路板の回路銅
箔の表面を、亜塩素酸ナトリウムや過硫酸カリウム等の
酸化剤を含むアルカリ性水溶液を用いて酸化処理し、表
面に微細な凹凸を形成している。また、酸化処理を行う
前には、表面の汚れを除去するために、過硫酸アンモニ
ウム、過硫酸ナトリウムなどでの銅箔表面ごと数μｍエ
ッチング除去している。しかし、このエッチング除去に
よって溶解した銅は、硫酸銅や水酸化銅となって銅箔表
面に付着する。この付着物は、水洗浄によって除去でき
ないので、プリント回路板表面に付着したまま処理槽に
浸漬されると、プリント回路板から離れて処理液中に浮
遊したり、又は、沈殿して酸化銅の結晶となって堆積す
る。この浮遊物や堆積物が、プリント配線板が処理槽に
出入りすることによって、処理槽中の処理液が攪拌され
ることによって移動し、プリント配線板の銅表面に付着
し、その部分には、酸化処理が行われず、処理むらとな
る。これを避けるために、従来では、図２に示すよう
に、処理槽から処理液の一部を取り出し、濾過装置で浮
遊物や堆積物を除去して、元の処理槽に戻すようにして
いた。2. Description of the Related Art A multilayer printed wiring board is manufactured by sandwiching an adhesive prepreg between an inner layer circuit board and an inner layer circuit board and an outer layer copper foil, and heating and pressing to laminate and integrate. are doing. At this time, in order to increase the adhesive strength between the inner circuit board and the adhesive prepreg, the surface of the circuit copper foil of the inner circuit board is treated with an alkaline aqueous solution containing an oxidizing agent such as sodium chlorite or potassium persulfate. Oxidation treatment forms fine irregularities on the surface. Before performing the oxidation treatment, the surface of the copper foil is etched and removed with ammonium persulfate, sodium persulfate or the like by several μm in order to remove dirt on the surface. However, the copper dissolved by this etching removal becomes copper sulfate or copper hydroxide and adheres to the copper foil surface. Since this adhered substance cannot be removed by washing with water, if it is immersed in the processing tank while adhering to the surface of the printed circuit board, it separates from the printed circuit board and floats in the processing solution, or precipitates and becomes a copper oxide. It is deposited as crystals. When the printed wiring board enters and exits the processing tank, the processing liquid in the processing tank is agitated and moves, and the floating substances and deposits adhere to the copper surface of the printed wiring board. Oxidation is not performed, resulting in uneven processing. In order to avoid this, conventionally, as shown in FIG. 2, a part of the processing liquid was taken out from the processing tank, suspended matter and sediment were removed by a filtration device, and then returned to the original processing tank. .
【０００３】[0003]
【発明が解決しようとする課題】ところが、濾過した処
理液は、処理槽に液面から戻すようにされているので、
処理槽の表面近くで処理液がかきまぜられ、沈降した浮
遊物や堆積物が移動して、処理槽内を循環してプリント
配線板の銅表面に付着してしまうという課題があった。However, since the filtered processing liquid is returned to the processing tank from the liquid level,
There has been a problem that the processing liquid is stirred near the surface of the processing tank, and the suspended suspended solids and deposits move and circulate in the processing tank and adhere to the copper surface of the printed wiring board.
【０００４】本発明は、処理むらのない酸化処理が行え
る酸化処理方法とその方法に用いる酸化処理装置を提供
することを目的とする。[0004] It is an object of the present invention to provide an oxidizing method capable of performing an oxidizing process without unevenness of the process and an oxidizing apparatus used for the method.
【０００５】[0005]
【課題を解決するための手段】本発明の酸化処理方法
は、プリント配線板をアルカリ性水溶液を蓄えた処理槽
に浸漬し、その銅表面を酸化処理しながら、その処理に
よって発生する沈殿物を強制的に排除し、濾過して沈殿
物を濾した処理液を、プリント配線板に当てることなく
処理槽に戻すことを特徴とする。According to the oxidation treatment method of the present invention, a printed wiring board is immersed in a treatment tank in which an alkaline aqueous solution is stored, and while the copper surface is oxidized, precipitates generated by the treatment are forcibly removed. The method is characterized in that the treatment liquid that has been removed by filtration and the precipitate is filtered is returned to the treatment tank without hitting the printed wiring board.
【０００６】また、本発明の酸化処理装置は、プリント
配線板の銅表面を酸化処理するアルカリ性水溶液を蓄え
る処理槽と、その処理槽の底に設けられた沈殿槽と、沈
殿槽の底から処理液を排出するポンプと、ポンプによっ
て排出された処理液を濾過する濾過装置と、濾過された
処理液を処理槽に戻す配管とからなり、処理槽に濾過さ
れた処理液を戻す配管の開口部からの処理液が、より多
く沈殿槽に導かれるように、遮蔽板を設けたことを特徴
とする。The oxidation treatment apparatus of the present invention comprises a treatment tank for storing an alkaline aqueous solution for oxidizing a copper surface of a printed wiring board, a sedimentation tank provided at the bottom of the treatment tank, A pump for discharging the liquid, a filtration device for filtering the processing liquid discharged by the pump, and a pipe for returning the filtered processing liquid to the processing tank, and an opening of the pipe for returning the processing liquid filtered to the processing tank A shielding plate is provided so that a larger amount of the processing solution is supplied to the settling tank.
【０００７】[0007]
【発明の実施の形態】本発明に用いるプリント配線板に
は、通常のプリント配線板であればどのようなものでも
使用でき、エポキシ樹脂含浸ガラス布銅張り積層板、エ
ポキシ樹脂銅張り積層板、ポリイミド樹脂銅張り積層板
等、多層プリント配線板の内層回路板に用いるものであ
ることが好ましい。DESCRIPTION OF THE PREFERRED EMBODIMENTS As a printed wiring board used in the present invention, any ordinary printed wiring board can be used, and an epoxy resin-impregnated glass cloth copper-clad laminate, an epoxy resin copper-clad laminate, It is preferably used for an inner circuit board of a multilayer printed wiring board such as a polyimide resin copper-clad laminate.
【０００８】その銅表面を酸化処理するアルカリ性水溶
液としては、亜塩素酸ナトリウム、過硫酸カリウムなど
の酸化剤を含むアルカリ性水溶液であればどのようのも
のでも使用できる。As the alkaline aqueous solution for oxidizing the copper surface, any alkaline aqueous solution containing an oxidizing agent such as sodium chlorite and potassium persulfate can be used.
【０００９】処理槽と、その処理槽の底に設けられた沈
殿槽とは、同一の材料であることが好ましく、材料とし
ては、上記酸化処理液に耐えることができればどのよう
なものでもよく、ポリプロピレン等のプラスチックや、
ステンレスなどの金属でもよく、条件によっては硬質塩
化ビニルでもよい。処理槽の底板は、沈降した浮遊物や
堆積物が移動しないよう、沈殿槽に向かって低くなるよ
うに斜めに設けられ、その最も低い部分に沈殿槽が設け
られていることが好ましい。このとき、底板の傾斜角度
θを４５〜６０度とすることが好ましい。このようにす
ることで、処理液は、プリント配線板にその流れを当て
ることなく循環することができる。したがって、プリン
ト配線板１０から離脱した浮遊物や堆積物は、この流れ
に乗って沈降する。遮蔽板の一番高い場所とプリント配
線板の一番低い部分との距離は、１５ｃｍ以上離すのが
好ましい。また、底板と遮蔽板との距離も１５ｃｍ以上
離すのが好ましい。The treatment tank and the sedimentation tank provided at the bottom of the treatment tank are preferably made of the same material, and any material may be used as long as it can withstand the oxidation treatment solution. Plastics such as polypropylene,
A metal such as stainless steel may be used, and hard vinyl chloride may be used depending on conditions. It is preferable that the bottom plate of the treatment tank is provided obliquely so as to be lowered toward the sedimentation tank so that the suspended suspended matter and sediment do not move, and the sedimentation tank is provided at the lowest part thereof. At this time, it is preferable that the inclination angle θ of the bottom plate be 45 to 60 degrees. By doing so, the processing liquid can be circulated without applying the flow to the printed wiring board. Therefore, the suspended matter and the sediment separated from the printed wiring board 10 sink along with this flow. It is preferable that the distance between the highest part of the shield plate and the lowest part of the printed wiring board be 15 cm or more. In addition, it is preferable that the distance between the bottom plate and the shielding plate is 15 cm or more.
【００１０】沈殿槽の底から処理液を排出するポンプ
と、ポンプによって排出された処理液を濾過する濾過装
置とは、特に順序は、ポンプ−濾過装置でなくともよ
く、濾過装置−ポンプであってもよい。濾過装置には、
１〜５μｍのフィルターを用いることが好ましい。沈殿
槽とポンプとの間に配管の途中に、分岐菅を設け、その
分岐菅にバルブとバルブに接続し空気に解放された配管
を有することによって、処理液を循環させながらそのバ
ルブを開き、空気を取り込みながら循環させて配管の壁
に堆積している浮遊物や堆積物をはがすことができ、よ
り好ましい。The pump for discharging the processing liquid from the bottom of the sedimentation tank and the filtration device for filtering the processing liquid discharged by the pump are not necessarily in the order of the pump-filtration device, but are in the order of the filtration device-pump. You may. In the filtration device,
It is preferable to use a filter of 1 to 5 μm. By providing a branch pipe in the middle of the pipe between the sedimentation tank and the pump, and having a pipe connected to a valve and a valve in the branch pipe and opened to the air, the valve is opened while circulating the processing liquid, It is more preferable to circulate while taking in air to remove suspended matters and deposits deposited on the pipe wall.
【００１１】[0011]
【実施例】図１に示すように、プリント配線板１０の銅
表面を酸化処理するアルカリ性水溶液１１を蓄える処理
槽１と、その処理槽１の底に設けられた沈殿槽６と、沈
殿槽６の底から処理液１１を排出するポンプ３と、ポン
プ３によって排出された処理液１１を濾過する濾過装置
２と、濾過された処理液１１を処理槽１に戻す配管とか
らなり、処理槽１に濾過された処理液１１を戻す配管の
開口部からの処理液１１が、より多く沈殿槽６に導かれ
るように、遮蔽板４を設けたものとした。このとき、底
板５及び遮蔽板４の傾斜部は平行であり、傾斜角度θを
４５とした。遮蔽板４には、処理槽１の壁側の端に折り
返し部を設け、中央側に垂下部を設けた。この遮蔽板４
を、左右対称に設け、処理槽１のプリント配線板近辺の
空間と、遮蔽板４と底板５との間の空間とは、処理槽１
の側壁と遮蔽板４の折り返しとの間及び２つの遮蔽板４
の間でつながっている。処理槽１の底の沈殿槽６からポ
ンプ３によって吸い出された処理液１１は、濾過装置２
によって浮遊物や堆積物を除去され、遮蔽板４と底板５
との間の空間の上の方から、底板５の傾斜に沿って処理
槽１に戻される。これによって、処理液は図の矢印に示
すように流れ、循環する。プリント配線板１０から離脱
した浮遊物や堆積物は、この流れに乗って沈降する。処
理液１１の流れに乗ってプリント配線板１０の近辺の空
間に入る浮遊物や堆積物もあるが、２つの遮蔽板４の間
を抜けたところで流速が小さくなるので、沈降し、遮蔽
板４に沿って落下する。遮蔽板４の一番高い場所と被処
理材１０の一番低い部分との距離は、３０ｃｍ離した。
また、底板５と遮蔽板４との距離は２０ｃｍ離した。沈
殿槽６に集められた夾雑物と共に処理液をポンプ３で吸
い出し、１μｍのフィルターを有する濾過装置２で濾過
した処理液を、１ｍ／分の流速で処理槽１に戻した。DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 1, a processing tank 1 for storing an alkaline aqueous solution 11 for oxidizing the copper surface of a printed wiring board 10, a sedimentation tank 6 provided at the bottom of the processing tank 1, and a sedimentation tank 6 A pump 3 for discharging the processing liquid 11 from the bottom of the container, a filtration device 2 for filtering the processing liquid 11 discharged by the pump 3, and a pipe for returning the filtered processing liquid 11 to the processing tank 1. The shielding plate 4 is provided so that the treatment liquid 11 from the opening of the pipe that returns the treatment liquid 11 filtered to the sedimentation tank 6 is guided to the precipitation tank 6 more. At this time, the inclined portions of the bottom plate 5 and the shielding plate 4 were parallel, and the inclination angle θ was 45. The shielding plate 4 was provided with a folded portion at an end on the wall side of the processing tank 1 and a hanging portion at the center. This shielding plate 4
Are provided symmetrically, and the space between the processing tank 1 near the printed wiring board and the space between the shielding plate 4 and the bottom plate 5 is the processing tank 1
Between the side wall of the shield plate and the folded back of the shield plate 4 and the two shield plates 4
Are connected between The processing liquid 11 sucked by the pump 3 from the sedimentation tank 6 at the bottom of the processing tank 1 is
The floating material and sediment are removed by the shielding plate 4 and the bottom plate 5.
Is returned to the processing tank 1 along the inclination of the bottom plate 5 from above the space between the two. As a result, the processing liquid flows and circulates as shown by arrows in the figure. Floating matter and sediment separated from the printed wiring board 10 sink along with this flow. There are also suspended matters and deposits entering the space near the printed wiring board 10 along with the flow of the processing liquid 11, but the flow velocity becomes small when passing between the two shielding plates 4, so that the sedimentation occurs and the Fall along. The distance between the highest part of the shielding plate 4 and the lowest part of the workpiece 10 was 30 cm.
The distance between the bottom plate 5 and the shielding plate 4 was 20 cm. The processing liquid was sucked out by the pump 3 together with the contaminants collected in the precipitation tank 6, and the processing liquid filtered by the filtration device 2 having a 1 μm filter was returned to the processing tank 1 at a flow rate of 1 m / min.
【００１２】図２に示す従来の装置を用いた外は、同じ
条件で、同じプリント配線板を酸化処理した。The same printed wiring board was oxidized under the same conditions except that the conventional apparatus shown in FIG. 2 was used.
【００１３】そして、銅表面の処理むらを調べた結果、
実施例のものが、処理むらがなかったのに比べ、比較例
では、前銅の表面積の１．２１％に処理むらがあった。
その処理むらのあった箇所には、酸化銅の結晶が付着し
ていた。[0013] Then, as a result of examining the processing unevenness of the copper surface,
In the case of the example, there was no processing unevenness, whereas in the comparative example, 1.21% of the surface area of the copper had unevenness.
Copper oxide crystals adhered to the portions where the treatment was uneven.
【００１４】[0014]
【発明の効果】以上に説明したとおり、本発明によっ
て、処理むらの抑制に優れた酸化処理方法とその方法に
用いる酸化処理装置を提供することができる。As described above, according to the present invention, it is possible to provide an oxidation treatment method excellent in suppressing the unevenness of treatment and an oxidation treatment apparatus used in the method.
【図１】本発明の一実施例を示す概略図である。FIG. 1 is a schematic diagram showing one embodiment of the present invention.
【図２】従来例を示す概略図である。FIG. 2 is a schematic view showing a conventional example.
１．処理槽 ２．濾過装置 ３．ポンプ ４．遮蔽板 ５．底板 ６．沈殿槽 １０．プリント配線板 １１．処理液 １２．バルブ １３．空気配管 1. Processing tank 2. 2. Filtration device Pump4. Shield plate 5. Bottom plate 6. Settling tank 10. Printed wiring board 11. Treatment liquid 12. Valve 13. Air piping
フロントページの続き (72)発明者 大久保 雅夫 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館工場内 Ｆターム(参考） 5E343 AA15 AA17 AA18 BB24 CC43 CC46 EE52 FF30 Continuation of the front page (72) Inventor Masao Okubo 1500 Ogawa, Oji, Shimodate-shi, Ibaraki F-term in Hitachi Chemical Industry Co., Ltd. Shimodate Plant (reference) 5E343 AA15 AA17 AA18 BB24 CC43 CC46 EE52 FF30
Claims (4)
た処理槽に浸漬し、その銅表面を酸化処理しながら、そ
の処理によって発生する沈殿物を強制的に排除し、濾過
して沈殿物を濾した処理液を、プリント配線板に当てる
ことなく処理槽に戻すことを特徴とする酸化処理方法。1. A printed wiring board is immersed in a treatment tank storing an alkaline aqueous solution, and while the copper surface is oxidized, the precipitate generated by the treatment is forcibly removed, and the precipitate is filtered. An oxidation treatment method, comprising returning the treated solution to a treatment tank without contacting the printed circuit board.
ルカリ性水溶液を蓄える処理槽と、その処理槽の底に設
けられた沈殿槽と、沈殿槽の底から処理液を排出するポ
ンプと、ポンプによって排出された処理液を濾過する濾
過装置と、濾過された処理液を処理槽に戻す配管とから
なり、処理槽に濾過された処理液を戻す配管の開口部か
らの処理液が、より多く沈殿槽に導かれるように、遮蔽
板を設けたことを特徴とする酸化処理装置。2. A processing tank for storing an alkaline aqueous solution for oxidizing a copper surface of a printed wiring board, a sedimentation tank provided at the bottom of the processing tank, a pump for discharging a processing liquid from the bottom of the sedimentation tank, and a pump. And a pipe for returning the filtered processing liquid to the processing tank, and more processing liquid from the opening of the pipe for returning the processing liquid filtered to the processing tank. An oxidation treatment apparatus, wherein a shielding plate is provided so as to be guided to a sedimentation tank.
るように斜めに設けられ、その最も低い部分に沈殿槽が
設けられていることを特徴とする請求項２に記載の酸化
処理装置。3. The oxidation treatment according to claim 2, wherein the bottom plate of the treatment tank is provided obliquely so as to become lower toward the sedimentation tank, and the sedimentation tank is provided at the lowest part thereof. apparatus.
岐菅を設け、その分岐菅にバルブとバルブに接続し空気
に解放された配管を有することを特徴とする請求項２ま
たは３に記載の酸化処理装置。4. A branch pipe is provided between a settling tank and a pump in the middle of a pipe, and the branch pipe has a valve and a pipe connected to the valve and opened to the air. 4. The oxidation treatment apparatus according to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11144190A JP2000332409A (en) | 1999-05-25 | 1999-05-25 | Oxidation method and apparatus for use in the method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11144190A JP2000332409A (en) | 1999-05-25 | 1999-05-25 | Oxidation method and apparatus for use in the method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000332409A true JP2000332409A (en) | 2000-11-30 |
Family
ID=15356308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11144190A Pending JP2000332409A (en) | 1999-05-25 | 1999-05-25 | Oxidation method and apparatus for use in the method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000332409A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008153640A (en) * | 2006-11-24 | 2008-07-03 | Shinko Electric Ind Co Ltd | Regeneration process of alkaline permanganate etching solution or desmear liquid and unit therefor |
| JP2009084652A (en) * | 2007-10-01 | 2009-04-23 | Hitachi Chem Co Ltd | Oxidation treatment method and oxidation treatment liquid for metal |
-
1999
- 1999-05-25 JP JP11144190A patent/JP2000332409A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008153640A (en) * | 2006-11-24 | 2008-07-03 | Shinko Electric Ind Co Ltd | Regeneration process of alkaline permanganate etching solution or desmear liquid and unit therefor |
| JP2009084652A (en) * | 2007-10-01 | 2009-04-23 | Hitachi Chem Co Ltd | Oxidation treatment method and oxidation treatment liquid for metal |
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