JPH05121392A - Treating tank for etching and the like - Google Patents

Abstract

PURPOSE:To eliminate irregularities in an etching effect and a cleaning effect, to improve treating capacity and accuracy of etching a printed circuit board, semiconductor, etc., in a manufacturing step or cleaning an electronic component, and to improve yield of a product. CONSTITUTION:A porous feed water tube 4 communicating with an overflowing tank 2 through a circulation passage 7 is provided at one inner side of a treating tank body provided adjacently with the tank 2, and a straightening lattice 3 for straightening is provided at its one side. A second circulation passage 6 is provided between the tube 4 and the body 1. Thus, lateral and upward flowing effects are operated on the surface of a component.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing tank used for etching processing and cleaning of electronic parts in the manufacturing process of printed wiring boards, semiconductors and the like.

[0002]

2. Description of the Related Art Conventionally, a processing tank of this type is provided in a processing tank main body 1 provided with an overflow tank 2 as shown in FIG.
A processing / cleaning solution such as an etching solution is supplied from a supply pipe 8 communicating with the bottom of the overflow tank 2, and the liquid overflowing into the overflow tank 2 is passed through a circulation path 12 communicating with the bottom of the overflow tank 2 and a filter provided in the middle thereof. The foreign matter is removed by 12a, and then it is returned to the inside of the processing tank main body 1 again.
The surface of the electronic component 1 held in the liquid by the fixing jig 5 is etched and washed.

In the figure, reference numeral 3 is a rectifying grid, 12b is a liquid circulation pump provided in the circulation passage 12, and 8a is a valve of the supply pipe 8. Reference numerals 9 and 10 denote a discharge pipe communicating with the processing tank main body 1 and a discharge pipe communicating with the overflow tank 2, and 9a and 10a denote valves of the discharge pipes 9 and 10, respectively.

[0004]

In the above-mentioned conventional processing bath, since the liquid flows from the lower part to the upper part in the main body of the processing bath, slag generated at the time of etching and dust adhered to the surface of parts are removed. The small pieces (hereinafter referred to as particle particles) easily diffuse, and there is a problem that a large amount of liquid must be circulated in order to overflow the particle particles. In addition, the distribution of the flow in the tank is highly likely to be non-uniform at the bottom and the top, and there is a problem that the cleaning effect and the etching effect may vary above and below the component to be processed. It was

[0005]

According to the present invention, a perforated water supply pipe for circulating a liquid such as an overflowing cleaning liquid is provided by being dipped into one side of the treatment tank main body, and a rectifying grid is provided on the side of the perforated water supply pipe. By immersing the same in the same manner, the overflow tank and the porous water supply pipe are communicated with each other through the first circulation path, and the treatment tank and the porous water supply tube are communicated with each other through the second circulation path. The conventional problem was solved.

[0006]

The perforated water supply pipe and the rectifying grid, which are provided by being dipped on one side in the main body of the processing tank, act to send out the liquid as a laminar flow into the main body of the processing tank, and the two circulation paths are the laminar flow It works smoothly so that it can be filtered more appropriately according to the condition of liquid stains.

[0007]

FIG. 1 is a simplified cross-sectional view of an embodiment. An overflow bath 2 is attached to a processing bath main body 1 into which an electronic component 11 is immersed, and an etching bath is attached to the processing bath main body 1 as in the conventional case. A supply pipe 8 for supplying a treatment / cleaning liquid such as a solution, chlorofluorocarbon, and pure water, and a discharge pipe 9 for discharging the same are provided, and the overflow tank 2 is also provided with a similar discharge pipe 10.

Here, in the present invention, as shown in the drawing, the perforated water supply pipe 4 communicating with the overflow tank 2 via the first circulation path 7 is provided on one side in the processing tank body 1 by immersion. A rectifying grid 3 for rectifying is similarly dipped and provided on one side of the porous water supply pipe 4. Also, the perforated water supply pipe 4
And the processing tank body 1 are communicated with each other via the second circulation path 6.

In the figure, reference numerals 6a and 7a denote filters provided in the circulation paths 6 and 7, reference numerals 6b and 7b denote reflux pumps also provided in the circulation paths 6 and 7, and 8a and 9a, respectively.
Reference numeral 10a denotes each valve of the supply pipe 8 and the discharge pipes 9 and 10.

In the processing tank of the present invention having the above-mentioned structure, the processing tank main body 1 is provided with a fixing jig 5 for holding a component 11 such as a printed circuit board or a semiconductor which requires processing as shown in the figure in an inclined state. Set inside and pump 6b, 7b
The liquid in the processing tank main body 1 and the liquid overflowing the overflow tank 2 are sent to the perforated water supply pipe 4 through the circulation paths 6 and 7, respectively, and the turbulent liquid ejected from the perforated water supply pipe 4 is rectified by a rectifying grid. By rectifying at 3 and passing it from the side of the component 11 in a laminar flow state as shown by the arrow in the figure, the surface of the component 11 is subjected to processing such as etching and cleaning. At this time, relatively light particle particles such as dust mixed in the liquid overflowing the overflow tank 2 are removed by the filter 7a provided in the circulation path 7, and etching wastes and the like precipitated below the processing tank 1 are removed. The relatively heavy particle particles of the filter 6a installed in the circulation path 6
Will be removed.

As described above, in the treatment tank of the present invention, the liquid flows in a laminar state from the side of the component obliquely arranged in the treatment tank, so that the effect of side flow and upflow are exerted on the surface of the component. The above-mentioned effects work together to obtain high processing effects such as cleaning.

The fixing jig may have a shape capable of holding the component obliquely, but it is more preferable if it is formed in a lattice shape so as not to impede the water flow.

[0013]

As described above, in the processing tank for etching or the like of the present invention, the liquid flows as a laminar flow from one side of the component held obliquely in the tank, so that the side flow effect and the effect on the surface of the component are improved. The effect of the flow acts, the variation of the cleaning effect and the etching effect as in the past is not seen, the uniform and high processing effect is obtained, and the product yield is improved. Further, since the upper layer liquid and the lower layer liquid are filtered with separate filters, an appropriate filter can be used according to the diameter of the mixed particle particles, and the filtering ability and efficiency are improved. Further, compared to the conventional method of removing particle particles only by overflow, the amount of liquid to be circulated may be small, the device can be downsized, and the equipment cost and running cost can be reduced. Play.

[Brief description of drawings]

FIG. 1 is a piping system diagram of an example.

FIG. 2 is a piping system diagram of a conventional example.

[Explanation of symbols]

 1 Processing tank main body 2 Overflow tank 3 Rectifying grid 4 Perforated water supply pipe 6,7 Circulation path 6a, 7a Filter 6b, 7b Pump

Claims (2)

[Claims] 1. A porous water supply pipe communicating with the overflow tank via a first circulation path is provided by immersing the inside of a processing tank main body additionally provided with an overflow tank, and A processing tank for etching or the like, characterized in that a rectifying grid for rectifying a water flow is similarly provided by immersion, and the perforated water supply pipe and the processing tank main body are communicated with each other through a second circulation path. 2. A processing tank for etching or the like, characterized in that parts are obliquely arranged in the processing tank.