CN117693127A - Pattern transfer equipment based on photoetching technology and technology thereof - Google Patents

Abstract

The invention belongs to the technical field of circuit boards, and particularly relates to a pattern transfer device and a pattern transfer process based on a photoetching process. The pattern transfer equipment based on the photoetching process comprises a pattern transfer piece, an etching component, a cleaning component, a reaction component made of an anti-corrosion material, a protection component made of the anti-corrosion material and a disturbance mechanism made of the anti-corrosion material, wherein the etching component comprises a partition piece and a supporting plate, the reaction component comprises two reaction pieces, the protection component comprises two protection pieces, and the disturbance mechanism comprises two disturbance components. The guard piece is used for accelerating the etching rate of copper-clad plate, and the disturbance piece can disturb the reaction liquid in the reaction piece, and then accelerates the etching rate of copper-clad plate, and simultaneously the disturbance piece can also change the velocity of flow of reaction liquid automatically, and then makes the reaction liquid can strike the guard piece for the guard piece reciprocates, clean the surface of copper-clad plate, prevents that the pollutant after the corruption from attaching on the copper-clad plate, and then influences the quality of copper-clad plate.

Description

Pattern transfer equipment based on photoetching technology and technology thereof

Technical Field

The invention relates to the technical field of circuit boards, in particular to pattern transfer equipment based on a photoetching process and a process thereof.

Background

Pattern transfer is typically accomplished using a photolithographic process where the circuit board is coated with a photoresist and the photoresist is exposed to a specific uv pattern, which will cure some areas of the photoresist while others are not. The photoresist is then developed and the uncured portions are removed, leaving behind a pattern of cured photoresist alone. After that, a chemical is deposited on the pattern, creating a circuit board with a material such as resin or copper. The etching rate in the pattern conversion step at this stage is too slow to remove the uncured portions well.

Disclosure of Invention

Based on this, there is a need to provide a pattern transferring apparatus based on a photolithography process and a process thereof, so as to solve at least one of the above-mentioned technical problems.

The utility model provides a pattern transfer equipment based on photoetching technology, including the pattern transfer piece, etching subassembly, the reaction subassembly that cleaning subassembly, the anticorrosive material made, the disturbance mechanism that protective component and anticorrosive material made, pattern transfer piece and etching subassembly all place subaerial, and etching subassembly is located one side of pattern transfer piece, etching subassembly internally mounted has accommodation space, cleaning subassembly and reaction subassembly all install in accommodation space, protective component installs in reaction subassembly's inside, disturbance mechanism installs in reaction subassembly's bottom, etching subassembly includes separator and backup pad, separator and backup pad are all installed in accommodation space, and the separator is located cleaning subassembly and reaction subassembly's below, the backup pad is located the below of separator, reaction subassembly includes two reaction pieces, two reaction pieces all insert and locate in the separator, protective component is including two protective components, two protective components are installed respectively in the inside of two reaction pieces, disturbance mechanism includes two disturbance subassemblies, two disturbance subassemblies are installed respectively in the bottom of two reaction pieces, every disturbance subassembly includes the suction pump, water pipe and disturbance piece, the suction pump is installed in reaction piece's bottom, the suction pipe is located in the suction pipe, the disturbance sleeve.

The pattern transfer piece is used for exposing the copper-clad plate, the separation piece is used for separating and washs subassembly and reaction subassembly, the reaction piece can be to the copper-clad plate etching, the protection piece is used for accelerating the etching rate of copper-clad plate, the suction pump can provide the reaction liquid for the reaction piece, the disturbance piece can disturb the reaction liquid in the reaction piece, and then accelerate the etching rate of copper-clad plate, simultaneously the disturbance piece can also change the velocity of flow of reaction liquid automatically, and then make the reaction liquid can strike the protection piece, make the protection piece reciprocate, clean the surface of copper-clad plate, prevent that the pollutant after the corruption from attaching on the copper-clad plate, and then influence the quality of copper-clad plate.

In one embodiment, the graphic transfer member comprises four supporting feet, a housing, a warning lamp, an operating panel and an opening and closing door, wherein the bottom of the housing is fixedly connected with the tops of the four supporting feet, the warning lamp is mounted at one end of the top of the housing, the operating panel is mounted at one end of the side wall of the housing, and the opening and closing door is mounted in the middle of the side wall of the housing.

In one embodiment, the etching assembly further comprises an etching body, two waste liquid observation doors and two reaction liquid observation doors, wherein the two waste liquid observation doors and the two reaction liquid observation doors are all installed on the side wall of the etching body, and the two waste liquid observation doors are located above the two reaction liquid observation doors.

In one embodiment, the partition member comprises a horizontal partition plate and a vertical partition plate, the horizontal partition plate is mounted in the middle of the accommodating space, the vertical partition plate is vertically connected with the horizontal partition plate, the bottom of the vertical partition plate is fixedly connected with the top of the supporting plate, and a plurality of overflow holes are formed in the top of the horizontal partition plate.

In one embodiment, a waste liquid collecting groove is formed between the vertical partition plate and the side wall of the etching body adjacent to one side wall of the two waste liquid observing doors, and a waste discharge pipe is arranged on the side wall of the etching body and communicated with the waste liquid collecting groove.

In one embodiment, a reaction liquid tank is formed between the support plate and the bottom of the etching body, the reaction liquid is contained in the reaction liquid tank, a supplement port is formed in the side wall of the etching body, the supplement port is located on the side wall of the reaction liquid tank, and the supplement port is located below the waste discharge pipe.

In one embodiment, the cleaning assembly comprises two cleaning tanks, the top of which is arranged at the top of the horizontal separation plate, the two cleaning tanks are positioned at one side of the two waste liquid observation doors, clean water is contained in the two cleaning tanks, the two reaction parts are all inserted into the horizontal separation plate and made of anti-corrosion materials, each reaction part comprises two supporting blocks, a reaction box, two connecting columns and a baffle plate, the lower ends of the two supporting blocks are fixedly connected with the top of the supporting plate, the two side walls of the reaction box are respectively connected with the upper ends of the two supporting blocks, the bottoms of the two connecting columns are respectively connected with the bottom plate inside the reaction box, the baffle plate is fixedly arranged at the top of the two connecting columns, a plurality of liquid inlets are formed in the top of the baffle plate, and a top outflow port is formed in the top of the reaction box.

In one embodiment, two protection pieces are respectively installed in the interiors of two reaction boxes, and each protection piece is made of anti-corrosion materials, each protection piece comprises a T-shaped fixed supporting rod and a sliding block, the bottom of the fixed supporting rod is fixedly connected with a baffle, the sliding block is slidingly sleeved in the fixed supporting rod, a plurality of liquid inlets are all located right below the sliding block, two side walls of the sliding block are all connected with anti-corrosion brushes, a disturbance piece comprises an annular air bag, a lower connecting pipe, a hollow fixed column, a first one-way valve and a second one-way valve, the top of the air bag is sleeved at the bottom of the pumping pipe, the top of the lower connecting pipe is inserted at the bottom of the air bag, the fixed column is sleeved at the top of the pumping pipe and the top of the lower connecting pipe, the first one-way valve and the second one-way valve are fixedly connected with the inner wall of the pumping pipe, and the first one-way valve is located below the second one-way valve, and the volume of the first one-way valve is larger than that of the second one-way valve.

In one embodiment, the bottom of the fixed support rod can be hinged with the top of the baffle, the copper-clad plate frame is inserted in the fixed support rod, and the copper-clad plate is installed on the copper-clad plate frame, so that when the reaction liquid flows in the reaction box, the reaction liquid can impact the bottom of the sliding block and the brush, the fixed support rod can shake in the reaction box and impact the copper-clad plate frame, and the pollutants attached to the surface of the copper-clad plate can fall.

The invention also provides a pattern transfer process based on the photoetching process, which adopts the pattern transfer equipment based on the photoetching process, and comprises the following steps:

step S1: and (3) cutting, rounding, edge planing, drilling, copper deposition and film pressing are carried out on the copper-clad plate, and then the copper-clad plate is placed into a pattern transfer piece.

Step S2: and (3) exposing the copper-clad plate in the pattern transfer part, and then performing development, electrolytic copper, electrolytic tin, film stripping and etching.

Step S3: the copper-clad plate is placed in the reaction box, the copper-clad plate frame is inserted in the fixed supporting rod, the water suction pump is started, the reaction liquid is pumped out from the reaction liquid tank, enters the air bag through the lower connecting pipe, and enters the reaction box after passing through the air bag.

Step S4: the water pump continues to draw water, be formed with through the interval between first check valve and the suction pipe inner wall, be insufficient for supporting the pumping speed of suction pump through the intermittent space, the reaction liquid will block up in connecting pipe below and the gasbag, make the gasbag inflation, connecting pipe below and gasbag pressure rise extremely, first check valve opens, the reaction liquid release part of gasbag inside storage, reaction liquid release part forms first impact liquid flow through intermittent space and first check valve, first impact liquid flow will strike the sliding block, make the sliding block upwards slide, so that the brush can follow the sliding block and upwards move, clean the copper-clad plate in the copper-clad plate frame.

Step S5: the water pump continuously pumps water, the through space is insufficient to support the water pumping speed of the water pump after the intermittent space and the first one-way valve are opened, the pressure of the lower connecting pipe and the air bag rises to the extreme, so that the pressure of the lower connecting pipe and the air bag pushes against the second one-way valve to be opened, the reaction liquid stored in the air bag is completely released, the reaction liquid is completely released to form second impact liquid flow through the intermittent space, the first one-way valve and the second one-way valve, the second impact liquid flow impacts the sliding block, the sliding block continuously slides upwards, the hairbrush can move upwards along with the sliding block, and the copper-clad plate in the copper-clad plate frame is cleaned.

Step S6: and (5) after the etched copper-clad plate is subjected to film stripping, manufacturing a required pattern circuit.

According to the invention, the fixed support rod is arranged, the copper-clad plate frame is placed in the reaction box, the copper-clad plate frame is inserted in the fixed support rod, the copper-clad plate frame is prevented from shaking and striking the copper-clad plate, the water suction pump is started, reaction liquid is pumped out from the reaction liquid tank, enters the air bag through the lower connecting pipe, enters the water suction pipe after passing through the air bag, the reaction liquid entering the water suction pipe after passing through the intermittent mode is formed between the first one-way valve and the inner wall of the water suction pipe, enters the bottom of the reaction box after passing through the intermittent mode, and enters the upper part of the baffle plate from the plurality of liquid inlets after filling the bottom of the reaction box, and the exposed part after the explosion development of the copper-clad plate is corroded through a chemical solution method, so that a design pattern is formed. Through setting up the disturbance piece, the suction pump continuously draws water, the pumping speed of supporting the suction pump is not enough through intermittent type space, the reaction liquid will block up in lower connecting pipe and the gasbag, make the gasbag inflation, when gasbag inflation butt on the fixed column, lower connecting pipe and gasbag pressure rise extremely, so that the pressure of lower connecting pipe and gasbag will push up first check valve and open, the inside reaction liquid release part of storing of gasbag, reaction liquid release part forms first impact liquid flow through intermittent type space and first check valve, first impact liquid flow enters into the below of baffle, first impact liquid flow enters into the reaction box through the inlet in the below of baffle, wherein first impact liquid flow is when passing through the inlet, first impact liquid flow will strike the sliding block, make the sliding block upwards slide, so that the brush can follow the copper-clad plate frame upwards, clean the copper-clad plate frame, accelerate the corrosion rate on copper-clad plate frame surface. After the first impact liquid flow impacts the sliding block, the sliding block can swing up and down all the time to clean the copper-clad plate in the copper-clad plate frame due to the instability of the first impact liquid flow, so that the corrosion speed of the surface of the copper-clad plate is accelerated. After the first impact liquid flow enters the reaction box, the liquid level in the reaction box rises, the height of the top outflow opening can be reached, and the corroded pollutants flow out through the top outflow opening, so that the pollutants are prevented from being attached to the copper-clad plate, and the corrosion speed is influenced. Through setting up the second check valve, the suction pump continuously draws water, the through space after opening through intermittent space and first check valve is insufficient to support the pumping speed of suction pump, the reaction liquid will continue to block up in connecting pipe below and the gasbag, when the gasbag inflation butt is on the fixed column, connecting pipe below and gasbag pressure rise extremely, so that the pressure of connecting pipe below and gasbag will push up the second check valve and open, the reaction liquid of gasbag inside storage is all released, the reaction liquid is all released and is formed the second and assaults the liquid flow through intermittent space, first check valve and second check valve, the second assaults the liquid flow and enters into the below of baffle, the second assaults the liquid flow and enters into the reaction box through the inlet in the below of baffle, wherein the second assaults the liquid flow when passing through the inlet, the second assaults the liquid flow and will assaults the sliding block, make the sliding block continue upwards slide, so that the brush can follow the sliding block and upwards move, clean the copper-clad plate frame in the copper-clad plate surface corrosion speed is accelerated. After the reaction liquid in the air bag is completely released, the pressure of the lower connecting pipe and the air bag is reduced, the first one-way valve and the second one-way valve are closed, the sliding block slides downwards, the copper-clad plate in the copper-clad plate frame is cleaned, and the corrosion speed of the surface of the copper-clad plate is accelerated. The sliding block is blocked below the liquid inlet, so that the expansion speed of the air bag can be increased, the generation of first impact liquid and second impact liquid flow is further increased, the reaction liquid is further disturbed, and the corrosion speed of the surface of the copper-clad plate is further increased. After all the reaction liquid in the air bag is released, the liquid level in the reaction box continuously rises, the reaction liquid overflows the height of the reaction box, the corroded pollutants on the upper layer of the reaction liquid and the corroded pollutants piled at the bottom of the reaction box overflow from the top of the reaction box, and flow down into the waste liquid collecting tank through a plurality of overflow holes, so that the pollutants are prevented from being attached to the copper-clad plate, and the corrosion speed is prevented from being influenced. The invention has smart structure, can well accelerate the manufacturing speed of the copper-clad plate, improves the yield, ensures the quality of the copper-clad plate surface and reduces defective products.

Drawings

FIG. 1 is a schematic plan view of a graphics transfer member of an embodiment.

FIG. 2 is a schematic perspective view of an exemplary etching assembly.

Fig. 3 is a schematic perspective view of an embodiment after removing a portion of the etching body.

FIG. 4 is a schematic plan view of an embodiment after removing a portion of the etching body.

FIG. 5 is a schematic cross-sectional view of an etch assembly according to one embodiment.

Fig. 6 is an enlarged schematic view at a in fig. 5 according to an embodiment.

FIG. 7 is a schematic cross-sectional view of a perturbation of an embodiment.

Fig. 8 is a schematic perspective view of an embodiment with a portion of the housing removed.

In the figure: 10. a pattern transfer member; 11. supporting feet; 12. a housing; 13. a warning light; 14. an operation panel; 15. opening and closing the door; 120. a refill port; 20. an etching assembly; 21. an accommodation space; 22. a partition; 23. a support plate; 24. an etching body; 25. a waste liquid observation gate; 26. a reaction liquid observation door; 220. a horizontal partition plate; 221. a vertical partition plate; 222. an overflow aperture; 223. a waste liquid collection tank; 224. a waste discharge pipe; 230. a reaction liquid tank; 30. cleaning the assembly; 31. a cleaning tank; 40. a reaction assembly; 41. a reaction member; 42. a support block; 43. a reaction cassette; 44. a connecting column; 45. a baffle; 430. a top outflow port; 450. a liquid inlet; 50. a protective assembly; 51. a guard; 52. fixing the support rod; 53. a sliding block; 54. a brush; 60. a disturbance mechanism; 61. a perturbation component; 62. a water pump; 63. a water pumping pipe; 64. a disturbance member; 640. an air bag; 641. a lower connecting pipe; 642. fixing the column; 643. a first one-way valve; 644. and a second one-way valve.

Detailed Description

In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

An embodiment of the present invention is shown in fig. 1 to 8, and is a pattern transferring apparatus based on a photolithography process, which includes a pattern transferring member 10, an etching member 20, a cleaning member 30, a reaction member 40 made of an anti-corrosion material, a shielding member 50 made of an anti-corrosion material, and a disturbing mechanism 60 made of an anti-corrosion material, wherein the pattern transferring member 10 and the etching member 20 are all placed on the ground, and the etching member 20 is located at one side of the pattern transferring member 10, an accommodating space 21 is installed inside the etching member 20, the cleaning member 30 and the reaction member 40 are all installed in the accommodating space 21, the shielding member 50 is installed inside the reaction member 40, the disturbing mechanism 60 is installed at the bottom of the reaction member 40, the etching member 20 includes a partition 22 and a supporting plate 23, the partition member 22 and the supporting plate 23 are both installed in the accommodating space 21, the partition member 22 is located below the cleaning assembly 30 and the reaction assembly 40, the supporting plate 23 is located below the partition member 22, the reaction assembly 40 comprises two reaction members 41, the two reaction members 41 are both inserted into the partition member 22, the protection assembly 50 comprises two protection members 51, the two protection members 51 are respectively installed in the two reaction members 41, the disturbance mechanism 60 comprises two disturbance assemblies 61, the two disturbance assemblies 61 are respectively installed at the bottoms of the two reaction members 41, each disturbance assembly 61 comprises a water suction pump 62, a water suction pipe 63 and a disturbance member 64, the water suction pump 62 is installed at the bottom of the reaction member 41, the water suction pipe 63 is inserted into the water suction pump 62, and the disturbance member 64 is sleeved in the water suction pipe 63.

The pattern transfer member 10 is used for exposing a copper-clad plate (not shown), the separation member 22 is used for separating the cleaning assembly 30 and the reaction assembly 40, the reaction member 41 can be used for etching the copper-clad plate, the protection member 51 is used for accelerating the etching speed of the copper-clad plate, the water suction pump 62 can provide reaction liquid for the reaction member 41, the disturbance member 64 can disturb the reaction liquid in the reaction member 41, and further accelerate the etching speed of the copper-clad plate, meanwhile, the disturbance member 64 can also automatically change the flow speed of the reaction liquid, and further enable the reaction liquid to impact the protection member 51, enable the protection member 51 to move up and down, clean the surface of the copper-clad plate, prevent the corroded pollutants from being attached to the copper-clad plate, and further influence the quality of the copper-clad plate.

As shown in fig. 1, the graphic transfer unit 10 includes four supporting legs 11, a housing 12, warning lamps 13, an operation panel 14, and an opening/closing door 15, wherein the bottom of the housing 12 is fixedly connected with the tops of the four supporting legs 11, the warning lamps 13 are mounted at one end of the top of the housing 12, the operation panel 14 is mounted at one end of the side wall of the housing 12, and the opening/closing door 15 is mounted at the middle of the side wall of the housing 12.

As shown in fig. 2, the etching assembly 20 further includes an etching body 24, two waste liquid observing doors 25 and two reaction liquid observing doors 26, wherein the two waste liquid observing doors 25 and the two reaction liquid observing doors 26 are mounted on the side wall of the etching body 24, and the two waste liquid observing doors 25 are located above the two reaction liquid observing doors 26.

As shown in fig. 3, the partition 22 includes a horizontal partition plate 220 and a vertical partition plate 221, the horizontal partition plate 220 is installed at the middle of the receiving space 21, the vertical partition plate 221 is vertically connected with the horizontal partition plate 220, and the bottom of the vertical partition plate 221 is fixedly connected with the top of the support plate 23, and a plurality of overflow holes 222 are opened at the top of the horizontal partition plate 220.

As shown in fig. 3 and 4, a waste liquid collecting tank 223 is formed between the vertical partition plate 221 and the side wall of the etching body 24 adjacent to the two waste liquid observing doors 25, and a waste discharge pipe 224 is mounted on the side wall of the etching body 24, the waste discharge pipe 224 communicating with the waste liquid collecting tank 223.

As shown in fig. 4 to 6, a reaction liquid tank 230 is formed between the support plate 23 and the bottom of the etching body 24, a reaction liquid (not shown) is contained in the reaction liquid tank 230, a replenishment port 120 is provided on the sidewall of the etching body 24, the replenishment port 120 is located on the sidewall of the reaction liquid tank 230, and the replenishment port 120 is located below the waste pipe 224.

As shown in fig. 3 to 5, the cleaning assembly 30 includes two cleaning tanks 31, the upper ends of the two cleaning tanks 31 are opened at the top of the horizontal partition plate 220, the two cleaning tanks 31 are located at one side far away from the two waste liquid observing doors 25, cleaning water (not shown) is contained in the two cleaning tanks 31, two reaction pieces 41 are all inserted into the horizontal partition plate 220, each reaction piece 41 is made of anti-corrosion material, each reaction piece 41 includes two support blocks 42, a reaction box 43, two connecting columns 44 and a baffle 45, the lower ends of the two support blocks 42 are fixedly connected with the top of the support plate 23, two side walls of the reaction box 43 are respectively connected with the upper ends of the two support blocks 42, the bottoms of the two connecting columns 44 are respectively connected with the bottom plate inside the reaction box 43, the baffle 45 is fixedly mounted at the top of the two connecting columns 44, a plurality of liquid inlets 450 are opened at the top of the baffle 45, and a top outlet 430 is opened at the top of the reaction box 43.

As shown in fig. 3 to 6, two protection pieces 51 are respectively installed inside two reaction boxes 43, each protection piece 51 is made of anti-corrosion materials, each protection piece 51 comprises a T-shaped fixed support rod 52 and a sliding block 53, the bottom of the fixed support rod 52 is fixedly connected with a baffle 45, the sliding block 53 is slidably sleeved in the fixed support rod 52, a plurality of liquid inlets 450 are all located right below the sliding block 53, anti-corrosion brushes 54 are connected to two side walls of the sliding block 53, a disturbance piece 64 comprises an annular air bag 640, a lower connecting pipe 641, a hollow fixing column 642, a first one-way valve 643 and a second one-way valve 644, the top of the air bag 640 is sleeved at the bottom of the water pumping pipe 63, the top of the lower connecting pipe 641 is inserted at the bottom of the air bag 640, the fixing column 642 is sleeved at the bottom of the water pumping pipe 63 and the top of the lower connecting pipe 641, the first one-way valve 643 and the second one-way valve 644 are fixedly connected with the inner wall of the water pumping pipe 63, the first one-way valve 643 is located below the second one-way valve 644, and the volume of the first one-way valve 643 is larger than that of the second one-way valve 644.

As shown in fig. 7, the bottom of the fixed support rod 52 may be hinged to the top of the baffle 45, and a copper-clad plate frame (not shown) is inserted into the fixed support rod 52, and the copper-clad plate is mounted on the copper-clad plate frame, so that when the reaction liquid flows in the reaction box 43, the reaction liquid can impact on the bottom of the sliding block 53 and the brush 54, so that the fixed support rod 52 shakes in the reaction box 43 and impacts on the copper-clad plate frame, and the pollutants attached on the surface of the copper-clad plate drop.

The invention also provides a pattern transfer process based on the photoetching process, which adopts the pattern transfer equipment based on the photoetching process, and comprises the following steps:

step S1: the copper-clad plate is subjected to material cutting, round corner, edge planing, drilling, copper deposition and film pressing and then is placed into the pattern transferring piece 10.

Step S2: after exposure in the pattern transfer member 10, the copper-clad plate is subjected to development, electrolytic copper, electrolytic tin, film stripping and etching.

Step S3: the copper-clad plate is put into the reaction box 43, the copper-clad plate frame is inserted into the fixed support rod 52, the water suction pump 62 is started, the reaction liquid is pumped out from the reaction liquid tank 230, enters the air bag 640 through the lower connecting pipe 641, and enters the reaction box 43 after passing through the air bag 640.

Step S4: the water pump 62 continues to pump water, a passing interval (not shown) is formed between the first one-way valve 643 and the inner wall of the water pump 63, the intermittent space is insufficient to support the water pumping speed of the water pump 62, the reaction liquid is blocked in the lower connecting pipe 641 and the air bag 640, the air bag 640 is inflated, the pressure of the lower connecting pipe 641 and the air bag 640 rises to the maximum, the first one-way valve 643 is opened, a part of reaction liquid stored in the air bag 640 is released, a part of reaction liquid is released to form a first impact liquid flow with the first one-way valve 643 through the intermittent space, the first impact liquid flow impacts the sliding block 53, and the sliding block 53 slides upwards, so that the brush 54 can move upwards along with the sliding block 53, and the copper clad laminate in the copper clad plate frame is cleaned.

Step S5: the water pump 62 continuously pumps water, the passing space after the intermittent space and the first one-way valve 643 are opened is insufficient to support the water pumping speed of the water pump 62, the pressure of the lower connecting pipe 641 and the air bag 640 rises to the extreme, so that the pressure of the lower connecting pipe 641 and the air bag 640 pushes against the second one-way valve 644 to be opened, the reaction liquid stored in the air bag 640 is completely released, the reaction liquid is completely released to form second impact liquid flow through the intermittent space, the first one-way valve 643 and the second one-way valve 644, the second impact liquid flow impacts the sliding block 53, the sliding block 53 continues to slide upwards, and the hairbrush 54 can move upwards along with the sliding block 53 to clean the copper-clad plate in the copper-clad plate frame.

Step S6: and (5) after the etched copper-clad plate is subjected to film stripping, manufacturing a required pattern circuit.

When in installation: the cleaning assembly 30 and the reaction assembly 40 are both installed in the accommodating space 21, the protection assembly 50 is installed in the reaction assembly 40, the disturbance mechanism 60 is installed at the bottom of the reaction assembly 40, the partition 22 and the supporting plate 23 are both installed in the accommodating space 21, the two protection pieces 51 are respectively installed in the two reaction pieces 41, the two disturbance assemblies 61 are respectively installed at the bottoms of the two reaction pieces 41, the water suction pump 62 is installed at the bottom of the reaction pieces 41, the warning lamp 13 is installed at one end of the top of the shell 12, the operating panel 14 is installed at one end of the side wall of the shell 12, and the opening and closing door 15 is installed at the middle part of the side wall of the shell 12. The two waste liquid observation doors 25 and the two reaction liquid observation doors 26 are both installed on the side wall of the etching body 24, the horizontal partition plate 220 is installed in the middle of the accommodating space 21, the baffle 45 is fixedly installed at the tops of the two connecting posts 44, and the two protection pieces 51 are respectively installed inside the two reaction boxes 43.

When in use, the utility model is characterized in that: 1. the copper-clad plate after exposure and development is placed on an anti-corrosion copper-clad plate frame, the copper-clad plate frame is placed in a reaction box 43, the copper-clad plate frame is inserted in a fixed supporting rod 52, the copper-clad plate frame is prevented from shaking and striking the copper-clad plate, a water suction pump 62 is started, reaction liquid is pumped out from a reaction liquid tank 230, enters an air bag 640 through a lower connecting pipe 641, enters a water suction pipe 63 through the air bag 640, a reaction liquid entering the water suction pipe 63 after passing through the intermittent operation is formed between a first one-way valve 643 and the inner wall of the water suction pipe 63, enters the bottom of the reaction box 43 after passing through the intermittent operation, the reaction liquid fills the bottom of the reaction box 43 and enters the upper part of a baffle 45 from a plurality of liquid inlets 450, and exposed parts after exposure and development are corroded by a chemical solution method, so that a design pattern is formed.

2. The water pump 62 continues to pump water, the intermittent space is insufficient to support the water pumping speed of the water pump 62, the reaction liquid is blocked in the lower connecting pipe 641 and the air bag 640, so that the air bag 640 is inflated, when the air bag 640 is inflated and abutted against the fixed column 642, the pressure of the lower connecting pipe 641 and the air bag 640 is raised to the extreme, so that the pressure of the lower connecting pipe 641 and the air bag 640 pushes against the first one-way valve 643 to be opened, a part of reaction liquid stored in the air bag 640 is released, the reaction liquid releases, a part of reaction liquid forms a first impact liquid flow with the first one-way valve 643 through the intermittent space, the first impact liquid flow enters the lower part of the baffle 45, the first impact liquid flow enters the reaction box 43 through the liquid inlet 450, the first impact liquid flow impacts the sliding block 53 when passing through the liquid inlet 450, the sliding block 53 slides upwards, so that the brush 54 can move upwards along the sliding block 53, the copper-clad plate in the copper-clad plate frame is cleaned, and the corrosion speed of the surface of the copper-clad plate is accelerated. After the first impact liquid flow impacts the sliding block 53, the sliding block 53 can swing up and down all the time to clean the copper-clad plate in the copper-clad plate frame due to the instability of the first impact liquid flow, so that the corrosion speed of the surface of the copper-clad plate is accelerated. After the first impact liquid flow enters the reaction box 43, the liquid level in the reaction box 43 rises, the height of the top outlet 430 can be reached, and the corroded pollutants flow out through the top outlet 430, so that the pollutants are prevented from being attached to the copper-clad plate, and the corrosion speed is prevented from being influenced.

3. The water pump 62 continuously pumps water, the intermittent space and the passing space after the first one-way valve 643 are opened are insufficient to support the water pumping speed of the water pump 62, the reaction liquid is continuously blocked in the lower connecting pipe 641 and the air bag 640, when the air bag 640 is expanded and abutted on the fixed column 642, the pressure of the lower connecting pipe 641 and the air bag 640 rises to the extreme, so that the pressure of the lower connecting pipe 641 and the air bag 640 is enabled to push the second one-way valve 644 to be opened, the reaction liquid stored in the air bag 640 is completely released, the reaction liquid is completely released to form second impact liquid flow through the intermittent space, the first one-way valve 643 and the second one-way valve 644, the second impact liquid flow enters the lower part of the baffle 45 and enters the reaction box 43 through the liquid inlet 450, the second impact liquid flow is enabled to impact the sliding block 53 when the second impact liquid flow passes through the liquid inlet 450, the sliding block 53 is enabled to continuously slide upwards, the brush 54 is enabled to follow the sliding block 53 to upwards move, the copper-clad plate in the copper-clad plate is cleaned, and the corrosion speed of the surface of the copper-clad plate is accelerated. After the reaction solution in the air bag 640 is completely released, the pressure of the lower connecting pipe 641 and the air bag 640 is reduced, the first one-way valve 643 and the second one-way valve 644 are closed, the sliding block 53 slides downwards, the copper-clad plate in the copper-clad plate frame is cleaned, and the corrosion speed of the surface of the copper-clad plate is accelerated. The sliding block 53 is blocked below the liquid inlet 450, so that the expansion speed of the air bag 640 can be increased, and the generation of the first impact liquid and the second impact liquid flow is further increased, so that the reaction liquid is disturbed, and the corrosion speed of the surface of the copper-clad plate is further increased. After the reaction liquid in the air bag 640 is released completely, the liquid level in the reaction box 43 continues to rise, the reaction liquid overflows the height of the reaction box 43, and the corroded pollutants on the upper layer of the reaction liquid and the corroded pollutants piled up at the bottom of the reaction box 43 overflow from the top of the reaction box 43 and flow down into the waste liquid collecting tank 223 through the overflow holes 222, so that the pollutants are prevented from adhering to the copper-clad plate and affecting the corrosion speed.

4. In another embodiment, the bottoms of the two connecting columns 44 are hinged to the bottom plate inside the reaction box 43 respectively, so that when the connecting columns 44 are impacted by the first impact liquid flow and the second impact liquid flow, the middle and upper parts of the connecting columns 44 can shake inside the reaction box 43, and then the connecting columns 44 can strike the copper-clad plate frame, so that the copper-clad plate frame shakes, and further the waste on the copper-clad plate falls, the corrosion speed of the surface of the copper-clad plate is accelerated, and meanwhile, due to the shaking of the connecting columns 44, the turbulence speed of the reaction liquid in the reaction box 43 is also accelerated, and the corrosion speed of the surface of the copper-clad plate is accelerated.

According to the invention, the fixed support rods 52 are arranged, the copper-clad plate frame is placed in the reaction box 43, the copper-clad plate frame is inserted in the fixed support rods 52, the copper-clad plate frame is prevented from shaking and striking the copper-clad plate, the water suction pump 62 is started, reaction liquid is pumped out from the reaction liquid tank 230 and enters the air bag 640 through the lower connecting pipe 641, the reaction liquid enters the water suction pipe 63 after passing through the air bag 640, a passing interval is formed between the first one-way valve 643 and the inner wall of the water suction pipe 63, the reaction liquid entering the water suction pipe 63 enters the bottom of the reaction box 43 after passing through the interval, the reaction liquid fills the bottom of the reaction box 43 and enters the upper part of the baffle 45 from the plurality of liquid inlets 450, and the exposed part of the copper-clad plate after the light explosion development is corroded by a chemical solution method, so that a design pattern is formed. By arranging the disturbance member 64, the water pump 62 continuously pumps water, the intermittent space is insufficient to support the water pumping speed of the water pump 62, the reaction liquid is blocked in the lower connecting pipe 641 and the air bag 640, so that the air bag 640 is inflated, when the air bag 640 is inflated and abutted on the fixed column 642, the pressure of the lower connecting pipe 641 and the air bag 640 is raised to the extreme, so that the pressure of the lower connecting pipe 641 and the air bag 640 is enabled to push against the first one-way valve 643 to be opened, a part of the reaction liquid stored in the air bag 640 is released, a part of the reaction liquid is released to form a first impact liquid flow through the intermittent space and the first one-way valve 643, the first impact liquid flow enters the lower part of the baffle 45 and enters the reaction box 43 through the liquid inlet 450, the first impact liquid flow is impacted on the sliding block 53 when the first impact liquid flow passes through the liquid inlet 450, the sliding block 53 is enabled to slide upwards, so that the brush 54 can move upwards along with the sliding block 53 to clean the copper-clad copper plate in the copper-clad plate, and the corrosion speed of the surface of the copper-clad plate is accelerated. After the first impact liquid flow impacts the sliding block 53, the sliding block 53 can swing up and down all the time to clean the copper-clad plate in the copper-clad plate frame due to the instability of the first impact liquid flow, so that the corrosion speed of the surface of the copper-clad plate is accelerated. After the first impact liquid flow enters the reaction box 43, the liquid level in the reaction box 43 rises, the height of the top outlet 430 can be reached, and the corroded pollutants flow out through the top outlet 430, so that the pollutants are prevented from being attached to the copper-clad plate, and the corrosion speed is prevented from being influenced. By arranging the second one-way valve 644, the water pump 62 continuously pumps water, the through space after the intermittent space and the first one-way valve 643 are opened is insufficient to support the water pumping speed of the water pump 62, the reaction liquid continuously blocks in the lower connecting pipe 641 and the air bag 640, when the air bag 640 is expanded and abutted on the fixed column 642, the pressure of the lower connecting pipe 641 and the air bag 640 rises to the extreme, so that the pressure of the lower connecting pipe 641 and the air bag 640 pushes the second one-way valve 644 to open, the reaction liquid stored in the air bag 640 is completely released, the reaction liquid is completely released to form second impact liquid flow through the intermittent space, the first one-way valve 643 and the second one-way valve 644, the second impact liquid flow enters the lower part of the baffle 45 and enters the reaction box 43 through the liquid inlet 450, the second impact liquid flow impacts the sliding block 53 when the second impact liquid flow passes through the liquid inlet 450, the sliding block 53 continuously slides upwards, so that the sliding block 54 can move upwards along the sliding block 53, the copper-clad plate can clean the copper-clad plate, and the surface of the copper-clad plate is corroded by the speed is accelerated. After the reaction solution in the air bag 640 is completely released, the pressure of the lower connecting pipe 641 and the air bag 640 is reduced, the first one-way valve 643 and the second one-way valve 644 are closed, the sliding block 53 slides downwards, the copper-clad plate in the copper-clad plate frame is cleaned, and the corrosion speed of the surface of the copper-clad plate is accelerated. The sliding block 53 is blocked below the liquid inlet 450, so that the expansion speed of the air bag 640 can be increased, and the generation of the first impact liquid and the second impact liquid flow is further increased, so that the reaction liquid is disturbed, and the corrosion speed of the surface of the copper-clad plate is further increased. After the reaction liquid in the air bag 640 is released completely, the liquid level in the reaction box 43 continues to rise, the reaction liquid overflows the height of the reaction box 43, and the corroded pollutants on the upper layer of the reaction liquid and the corroded pollutants piled up at the bottom of the reaction box 43 overflow from the top of the reaction box 43 and flow down into the waste liquid collecting tank 223 through the overflow holes 222, so that the pollutants are prevented from adhering to the copper-clad plate and affecting the corrosion speed. The invention has smart structure, can well accelerate the manufacturing speed of the copper-clad plate, improves the yield, ensures the quality of the copper-clad plate surface and reduces defective products.

All possible combinations of the technical features in the above embodiments are described, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above embodiments represent only a few embodiments of the present invention, which are described in more detail and are not to be construed as limiting the scope of the present invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (10)

1. The pattern transfer equipment based on the photoetching process comprises a pattern transfer piece (10), an etching component (20), a cleaning component (30) and a reaction component (40) made of anti-corrosion materials, and is characterized by further comprising a protection component (50) made of anti-corrosion materials and a disturbance mechanism (60) made of anti-corrosion materials, wherein the pattern transfer piece (10) and the etching component (20) are both arranged on the ground, the etching component (20) is positioned at one side of the pattern transfer piece (10), an accommodating space (21) is arranged in the etching component (20), the cleaning component (30) and the reaction component (40) are both arranged in the accommodating space (21), the protection component (50) is arranged in the reaction component (40), the disturbance mechanism (60) is arranged at the bottom of the reaction component (40), the etching component (20) comprises a partition piece (22) and a supporting plate (23), the partition piece (22) and the supporting plate (23) are both arranged in the accommodating space (21), the partition piece (22) is positioned below the cleaning component (30) and the reaction component (40), the supporting plate (23) is positioned below the partition piece (22), the two reaction components (41) are arranged in the reaction component (41), the protection component (50) comprises two protection pieces (51), the two protection pieces (51) are respectively arranged in the two reaction pieces (41), the disturbance mechanism (60) comprises two disturbance components (61), the two disturbance components (61) are respectively arranged at the bottoms of the two reaction pieces (41), each disturbance component (61) comprises a water suction pump (62), a water suction pipe (63) and a disturbance piece (64), the water suction pump (62) is arranged at the bottom of the reaction piece (41), the water suction pipe (63) is inserted into the water suction pump (62), and the disturbance piece (64) is sleeved in the water suction pipe (63).

2. The lithographic-process-based pattern transfer apparatus according to claim 1, wherein: the pattern transfer piece (10) comprises four supporting legs (11), a shell (12), warning lamps (13), an operating panel (14) and an opening and closing door (15), wherein the bottom of the shell (12) is fixedly connected with the tops of the four supporting legs (11), the warning lamps (13) are arranged at one end of the top of the shell (12), the operating panel (14) is arranged at one end of the side wall of the shell (12), and the opening and closing door (15) is arranged in the middle of the side wall of the shell (12).

3. The lithographic-process-based pattern transfer apparatus according to claim 2, wherein: the etching assembly (20) further comprises an etching body (24), two waste liquid observation doors (25) and two reaction liquid observation doors (26), wherein the two waste liquid observation doors (25) and the two reaction liquid observation doors (26) are all arranged on the side wall of the etching body (24), and the two waste liquid observation doors (25) are located above the two reaction liquid observation doors (26).

4. A lithographic-process-based pattern transfer apparatus according to claim 3, wherein: the partition piece (22) comprises a horizontal partition plate (220) and a vertical partition plate (221), wherein the horizontal partition plate (220) is installed in the middle of the accommodating space (21), the vertical partition plate (221) is vertically connected with the horizontal partition plate (220), the bottom of the vertical partition plate (221) is fixedly connected with the top of the supporting plate (23), and a plurality of overflow holes (222) are formed in the top of the horizontal partition plate (220).

5. The lithographic-process-based pattern transferring apparatus according to claim 4, wherein: a waste liquid collecting groove (223) is formed between the vertical partition plate (221) and the side wall of the etching body (24) adjacent to one side wall of the two waste liquid observing doors (25), a waste discharge pipe (224) is arranged on the side wall of the etching body (24), and the waste discharge pipe (224) is communicated with the waste liquid collecting groove (223).

6. The lithographic-process-based pattern transferring apparatus according to claim 5, wherein: a reaction liquid groove (230) is formed between the supporting plate (23) and the bottom of the etching body (24), reaction liquid is accommodated in the reaction liquid groove (230), a supplementing opening (120) is formed in the side wall of the etching body (24), the supplementing opening (120) is located on the side wall of the reaction liquid groove (230), and the supplementing opening (120) is located below the waste discharge pipe (224).

7. The lithographic-process-based pattern transfer apparatus according to claim 6, wherein: the cleaning assembly (30) comprises two cleaning tanks (31), the top of a horizontal separation plate (220) is arranged at the upper ends of the two cleaning tanks (31), the two cleaning tanks (31) are located at one side away from two waste liquid observation doors (25), cleaning water is contained in the two cleaning tanks (31), two reaction pieces (41) are all inserted into the horizontal separation plate (220), the two reaction pieces (41) are made of anti-corrosion materials, each reaction piece (41) comprises two supporting blocks (42), a reaction box (43), two connecting columns (44) and a baffle (45), the lower ends of the two supporting blocks (42) are fixedly connected with the top of the supporting plate (23), two side walls of the reaction box (43) are respectively connected with the upper ends of the two supporting blocks (42), the bottoms of the two connecting columns (44) are respectively connected with the bottom plate inside the reaction box (43), the baffle (45) is fixedly arranged at the top of the two connecting columns (44), a plurality of liquid inlets (450) are formed in the top of the baffle (45), and a plurality of top outlet openings (430) are formed in the top of the reaction box (43).

8. The lithographic-process-based pattern transfer apparatus according to claim 7, wherein: two shields (51) are installed respectively in the inside of two reaction boxes (43), and every shield (51) is made by anti-corrosion material, every shield (51) includes fixed bracing piece (52) and sliding block (53) of T font, the bottom and the baffle (45) of fixed bracing piece (52) are fixed link to each other, sliding block (53) are slidingly overlapped in fixed bracing piece (52), a plurality of inlet (450) all are located under sliding block (53), both sides wall of sliding block (53) all are connected with anticorrosive brush (54), perturbation piece (64) include annular gasbag (640), below connecting pipe (642), hollow fixed column (642), first check valve (643) and second check valve (644), the bottom of drinking-water pipe (63) is located to the top cover of below connecting pipe (641), the bottom of drinking-water pipe (63) is located at the top of below connecting pipe (642) in the top of inserting of below connecting pipe (641), first check valve (643) and second check valve (643) are located the inner wall of first check valve (643) and second check valve (643) are located the second check valve (643) is big.

9. The lithographic-process-based pattern transfer apparatus according to claim 8, wherein: the bottom of fixed bracing piece (52) can be articulated mutually with baffle (45) top, and fixed bracing piece (52) interpolation is equipped with the copper-clad plate frame, and the copper-clad plate is installed to the copper-clad plate frame for when reaction liquid trickles in reaction box (43), the reaction liquid can strike in the bottom of sliding block (53) and brush (54), makes fixed bracing piece (52) rock in reaction box (43) to strike in the copper-clad plate frame, so that the attached pollutant in copper-clad plate surface drops.

10. A pattern transfer process based on a photolithography process, wherein the pattern transfer apparatus based on a photolithography process as claimed in claim 9 is used, the process comprising the steps of:

step S1: the copper-clad plate is subjected to material cutting, round corner, edge planing, drilling, copper deposition and film pressing and then is placed into a pattern transfer piece (10);

step S2: after exposing the copper-clad plate in the pattern transfer piece (10), developing, electrifying copper, electrifying tin, and etching after film stripping;

step S3: putting the copper-clad plate into a reaction box (43), inserting the copper-clad plate frame into a fixed supporting rod (52), starting a water suction pump (62), extracting reaction liquid from a reaction liquid tank (230), entering an air bag (640) through a lower connecting pipe (641), and entering the reaction box (43) after passing through the air bag (640);

step S4: the water suction pump (62) continues to pump water, a first one-way valve (643) and the inner wall of the water suction pipe (63) are formed between the intermittent space and the inner wall of the water suction pipe (63), the water suction speed of the water suction pump (62) is insufficient to be supported through the intermittent space, the reaction liquid is blocked in the lower connecting pipe (641) and the air bag (640) so that the air bag (640) is expanded, the pressure of the lower connecting pipe (641) and the air bag (640) is increased to be almost the same, the first one-way valve (643) is opened, a part of the reaction liquid stored in the air bag (640) is released, a part of the reaction liquid forms a first impact liquid flow with the first one-way valve (643) through the intermittent space, the first impact liquid flow impacts the sliding block (53), the sliding block (53) upwards slides, and the brush (54) can upwards move along with the sliding block (53) to clean the copper-clad plate in the copper-clad plate frame;

step S5: the water suction pump (62) continuously pumps water, the passing space after the intermittent space and the first one-way valve (643) are opened is insufficient to support the water suction speed of the water suction pump (62), the pressure of the lower connecting pipe (641) and the air bag (640) rises to be extremely high, so that the pressure of the lower connecting pipe (641) and the air bag (640) pushes against the second one-way valve (644) to be opened, the reaction liquid stored in the air bag (640) is completely released, the reaction liquid is completely released to form second impact liquid flow through the intermittent space, the first one-way valve (643) and the second one-way valve (644), the second impact liquid flow impacts the sliding block (53), the sliding block (53) continuously slides upwards, and the brush (54) can move upwards along with the sliding block (53) to clean copper-clad plates in the copper-clad plate frames;

step S6: and (5) after the etched copper-clad plate is subjected to film stripping, manufacturing a required pattern circuit.